CN100452450C - 光学表面安装技术封装件 - Google Patents
光学表面安装技术封装件 Download PDFInfo
- Publication number
- CN100452450C CN100452450C CNB200510005131XA CN200510005131A CN100452450C CN 100452450 C CN100452450 C CN 100452450C CN B200510005131X A CNB200510005131X A CN B200510005131XA CN 200510005131 A CN200510005131 A CN 200510005131A CN 100452450 C CN100452450 C CN 100452450C
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- Prior art keywords
- tube core
- packaging part
- cofferdam
- optics
- package substrate
- Prior art date
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- 230000003287 optical effect Effects 0.000 title claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 239000004065 semiconductor Substances 0.000 claims abstract description 4
- 238000004806 packaging method and process Methods 0.000 claims description 42
- 239000000565 sealant Substances 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 16
- 239000003822 epoxy resin Substances 0.000 claims description 10
- 229920000647 polyepoxide Polymers 0.000 claims description 10
- 239000000919 ceramic Substances 0.000 claims description 4
- 230000008021 deposition Effects 0.000 claims description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 3
- 230000009974 thixotropic effect Effects 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims 2
- 239000008393 encapsulating agent Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- QHZSDTDMQZPUKC-UHFFFAOYSA-N 3,5-dichlorobiphenyl Chemical compound ClC1=CC(Cl)=CC(C=2C=CC=CC=2)=C1 QHZSDTDMQZPUKC-UHFFFAOYSA-N 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
Images
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- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
- H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
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- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48471—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02218—Material of the housings; Filling of the housings
- H01S5/02234—Resin-filled housings; the housings being made of resin
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- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
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- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Light Receiving Elements (AREA)
- Led Device Packages (AREA)
- Semiconductor Lasers (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
Claims (22)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/841,897 | 2004-05-06 | ||
US10/841,897 US7064424B2 (en) | 2004-05-06 | 2004-05-06 | Optical surface mount technology package |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1694270A CN1694270A (zh) | 2005-11-09 |
CN100452450C true CN100452450C (zh) | 2009-01-14 |
Family
ID=34679475
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB200510005131XA Expired - Fee Related CN100452450C (zh) | 2004-05-06 | 2005-01-28 | 光学表面安装技术封装件 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7064424B2 (zh) |
JP (1) | JP2005322916A (zh) |
CN (1) | CN100452450C (zh) |
GB (1) | GB2413896A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107492786A (zh) * | 2017-08-08 | 2017-12-19 | 温惟善 | 一种smd小型化封装的vcsel制造工艺 |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7800121B2 (en) | 2002-08-30 | 2010-09-21 | Lumination Llc | Light emitting diode component |
DE60330023D1 (de) | 2002-08-30 | 2009-12-24 | Lumination Llc | Geschichtete led mit verbessertem wirkungsgrad |
US10340424B2 (en) | 2002-08-30 | 2019-07-02 | GE Lighting Solutions, LLC | Light emitting diode component |
US8786165B2 (en) * | 2005-09-16 | 2014-07-22 | Tsmc Solid State Lighting Ltd. | QFN/SON compatible package with SMT land pads |
US8044412B2 (en) | 2006-01-20 | 2011-10-25 | Taiwan Semiconductor Manufacturing Company, Ltd | Package for a light emitting element |
US7842960B2 (en) | 2006-09-06 | 2010-11-30 | Lumination Llc | Light emitting packages and methods of making same |
TWI369540B (en) * | 2007-06-01 | 2012-08-01 | Delta Electronics Inc | Liquid crystal display and its backlight module and light-emitting module |
US8049237B2 (en) | 2007-12-28 | 2011-11-01 | Nichia Corporation | Light emitting device |
US8247827B2 (en) * | 2008-09-30 | 2012-08-21 | Bridgelux, Inc. | LED phosphor deposition |
TWI447893B (en) * | 2009-06-24 | 2014-08-01 | Led package structure for increasing light-emitting efficiency and controlling light-projecting angle and method for manufacturing the same | |
JP5396215B2 (ja) * | 2009-09-24 | 2014-01-22 | スタンレー電気株式会社 | 半導体発光装置の製造方法、半導体発光装置および液晶表示装置 |
US9018074B2 (en) | 2009-10-01 | 2015-04-28 | Excelitas Canada, Inc. | Photonic semiconductor devices in LLC assembly with controlled molding boundary and method for forming same |
US8791492B2 (en) | 2009-10-01 | 2014-07-29 | Excelitas Canada, Inc. | Semiconductor laser chip package with encapsulated recess molded on substrate and method for forming same |
US8431951B2 (en) * | 2009-10-01 | 2013-04-30 | Excelitas Canada, Inc. | Optoelectronic devices with laminate leadless carrier packaging in side-looker or top-looker device orientation |
US8593040B2 (en) | 2009-10-02 | 2013-11-26 | Ge Lighting Solutions Llc | LED lamp with surface area enhancing fins |
DE102010012604A1 (de) * | 2010-03-24 | 2011-09-29 | Osram Opto Semiconductors Gmbh | Halbleiterlaserlichtquelle |
JP5481277B2 (ja) * | 2010-06-04 | 2014-04-23 | シャープ株式会社 | 発光装置 |
TWI442540B (zh) * | 2010-10-22 | 2014-06-21 | Paragon Sc Lighting Tech Co | 直接電性連接於交流電源之多晶封裝結構 |
EP2448028B1 (en) | 2010-10-29 | 2017-05-31 | Nichia Corporation | Light emitting apparatus and production method thereof |
EP2600168A1 (de) * | 2011-12-01 | 2013-06-05 | Leica Geosystems AG | Entfernungsmesser |
US9500355B2 (en) | 2012-05-04 | 2016-11-22 | GE Lighting Solutions, LLC | Lamp with light emitting elements surrounding active cooling device |
KR20150106488A (ko) | 2014-03-11 | 2015-09-22 | 삼성디스플레이 주식회사 | 백라이트 유닛 및 이의 제조 방법 |
US11128100B2 (en) | 2017-02-08 | 2021-09-21 | Princeton Optronics, Inc. | VCSEL illuminator package including an optical structure integrated in the encapsulant |
DE102017106407A1 (de) * | 2017-03-24 | 2018-09-27 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung von optoelektronischen Halbleiterbauteilen |
US20190067901A1 (en) * | 2017-08-30 | 2019-02-28 | Lumentum Operations Llc | Integrated package for laser driver and laser diode |
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CN107492786B (zh) * | 2017-08-08 | 2019-04-30 | 温惟善 | 一种smd小型化封装的vcsel制造工艺 |
Also Published As
Publication number | Publication date |
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GB0509064D0 (en) | 2005-06-08 |
CN1694270A (zh) | 2005-11-09 |
US7064424B2 (en) | 2006-06-20 |
GB2413896A (en) | 2005-11-09 |
JP2005322916A (ja) | 2005-11-17 |
US20050248008A1 (en) | 2005-11-10 |
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