CN1678770A - 电化学处理槽 - Google Patents

电化学处理槽 Download PDF

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CN1678770A
CN1678770A CNA038200554A CN03820055A CN1678770A CN 1678770 A CN1678770 A CN 1678770A CN A038200554 A CNA038200554 A CN A038200554A CN 03820055 A CN03820055 A CN 03820055A CN 1678770 A CN1678770 A CN 1678770A
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M·X·杨
D·卢博米尔斯基
Y·N·多尔迪
S·辛格
S·塔尔施百格瓦勒
N·科瓦斯基
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Abstract

本发明实施例一般提供了一种小容量电化学电镀槽。电镀槽一般包括一个用来容纳电镀液的液池，此液池具有一个大致水平的堰。电镀槽还包括一个位于液池底部的阳极，此阳极具有多条贯穿形成的平行沟槽；和用于放置阳极的底部部件，且底部部件在放置阳极的表面上有多条狭槽，每条狭槽终止于一个环形排液槽。隔板支撑组件被设计成用来定位直接在阳极上方的隔板，隔板所在方位相对于阳极表面大致平面取向，隔板支撑组件上有多条沟槽和孔。

Description

电化学处理槽
相关申请的交叉参考
本申请要求2002年7月24日提交的美国60/398345号临时专利申请的优先权，该申请在此并入作为参考。
技术领域
本发明的实施例一般涉及小容量电化学处理槽以及将导电材料以电化学方式沉积到衬底上的方法。
背景技术
亚1/4微米大小的部件的金属化是现在和未来的集成电路制造工艺的基本技术。尤其是，在比如超大规模集成类型的器件中，也就是具有超过百万的逻辑门的集成电路的器件，位于这些器件中心的多层互连一般是通过用导电材料比如铜或铝填充高纵横比(例如大于4∶1)的互连部件形成的。传统上，沉积技术比如化学气相沉积(CVD)和物理气相沉积(PVD)一直被用于填充这些互连部件。但是，随着互连件尺寸的减小和纵横比的增大，通过传统的金属化技术的无空隙互连部件填充变得越加困难。因此，出现了(电)镀技术，也就是电化学镀(ECP)和化学镀技术作为用于集成电路制造工艺中亚1/4微米大小的高纵横比互连部件的无空隙填充的有前途的工艺。
在ECP工艺中，例如，组成衬底表面(或者沉积于其上的绝缘层)的亚1/4微米大小的高纵横比部件被导电材料比如铜有效地填充。ECP电镀工艺一般是两阶段工艺，其中种子层(seed layer)首先在衬底的表面部件上形成，然后衬底的表面部件暴露于电解液，并同时在种子层和在电解液内的铜阳极之间进行电偏置。所述电解液一般含有要镀到衬底的表面上的离子，因此，电偏置的应用使这些离子被从电解液中驱赶出并被镀到种子层上。
传统化学镀槽一般使用水平放置的镀槽及枢轴支承式(pivot-type)衬底浸入过程。然而，已知在枢轴支承式浸入过程中可由枢轴支承浸入装置的浸入角度的变化引起衬底表面上气泡的产生。已知这些气泡可引起镀层均匀度问题，因此，气泡的最小化是所期望的。此外，在传统电镀槽的枢轴支承式浸入过程中衬底表面不与电镀槽的阳极相平行，因此，电场不是以恒量跨越衬底表面的，这也可导致均匀度问题。
因此，需要一种改进的电化学镀槽，将其设计成在浸入和电镀过程中保持衬底以一个不变浸入角度浸入。
发明内容
本发明实施例一般提供了一种小容量电化学电镀槽。电镀槽一般包括一个用来容纳电镀液的液池，此液池具有一个大致水平的堰。电镀槽还包括一个位于液池下部的阳极，此阳极具有多条贯通其本身的平行沟槽；底部部件，其具有多个形成进阳极接收表面的多条沟槽，每条沟槽终止于一个环形排液槽。隔板支撑组件被设计成用来定位直接在阳极上方的隔板，相对于阳极表面，隔板基本平面取向，隔板支撑组件上有很多沟槽和孔。
本发明实施例可进一步提供一个隔板支撑组件，此隔板支撑组件部分区域具有从上表面穿过的多个通孔及部分区域具有从下表面穿过的多条沟槽。隔板支撑组件被设计成用来支撑直接在阳极上方的隔板，此阳极大体上平面取向，同时也可允许隔板在其沟槽部位有轻微变形，这样，气泡及其它较轻液体可驱赶到隔板周边然后从阳极室排出。
本发明实施例可进一步提供用来放置阳极装置的底部部件。底部部件一般包括一个被设计成放置阳极的凹槽部分。凹槽壁上有多条液体流通沟槽。此外，凹槽底部有一个环形排液沟槽及多条沟槽，此多条沟槽穿过底部并且其两端终止于排液沟槽。
本发明实施例可进一步提供一个用来将金属以电化学方式镀到衬底上的装置。此装置一般有一个用来容纳电镀液的液池，此液池有一个大体上水平的上堰；一个位于液池内圆周的隔板，隔板用来将位于液池上部的阴极室与位于液池下部的阳极室隔离开；一个被设计成将阴极电解液供给到阴极室的第一进液口；一个被设计成将阳极电解液供给到阳极室的第二进液口；阴极电解液和阳极电解液为不同溶液，阳极位于阳极室，阳极有一个大体上水平的上表面，此上表面以相对于基本为平面的上堰成一定的角度设置。
本发明实施例可进一步提供一种小容量电化学电镀槽。电化学电镀槽一般包括一个用来容纳电镀液的液池；一个位于液池中的阳极；一个位于阳极上方并且跨过液池的隔板；一个位于隔板上方且跨过液池的扩散板(diffusion plate)，扩散板和阳极互相平行且相对于电镀液上表面成一倾斜角放置。
附图说明
通过参考实施例，其中的一些实施例在附图中进行了图示说明，可以更详细地理解本发明的上面描述的特征，特别是可以获得本发明的上面概述的更细节的描述。但是应该注意到，附图仅仅说明了本发明的典型实施例，因此并不被认为是限制其范围，因为本发明可包括其它具有相同功效的实施例。
图1所示为本发明的示例性电化学小电镀槽的部分剖面透视图。
图2所示为本发明的阳极基盘的透视图。
图3所示为其上设置有阳极的本发明的示例性阳极基盘的透视图。
图4所示为本发明的示例性隔板支撑组件分解透视图。
图5所示为本发明的电镀槽的一侧的部分剖视图。
具体实施方式
本发明一般提供了一种被设计成使用小容量槽将金属镀到半导体衬底上的电化学电镀槽，也就是说，槽堰自身容量容纳少于4升的电解液，优选在1到3升之间，另有约2到8升电解溶液在相邻的与槽液体相通的供给箱里。这些操作本发明的槽所需的少量液体使得电镀槽可在预定衬底范围内使用，即100-200衬底范围内使用。然后溶液可被扔掉或被新溶液替换。电化学电镀槽一般被设计成通过一个位于欲镀衬底和电镀槽的阳极之间的阳离子隔板来对电镀槽的阳极和阴极或电镀槽的镀层电极进行液体上的隔离。此外，本发明的电镀槽一般被设计成供给第一种溶液给阳极室，也就是阳极上表面和隔板下表面之间的容量；供给第二种溶液(一种电镀液)给阴极室，也就是隔板上表面以上的液体容量。电镀槽的阳极上一般有多条狭槽，这些沟槽互相平行且被设计成在电镀过程中使浓稠的流体动力学牛顿流体层从阳极室表面流走。隔板支撑组件的第一侧上有多条狭槽或沟槽，以及位于隔板支撑组件第二侧的多个孔，其中多个孔可与隔板支撑组件另一侧的狭槽进行液体流通。
图1所示为本发明的一种示例性的电化学电镀槽100的透视和部分剖视图。电镀槽100一般包括外池101和位于外池内的内池102。内池102一般被设计成容纳电镀溶液，此电镀溶液用来在电化学电镀工艺中将例如为铜的金属镀到衬底上。在电镀过程中，一般是将电镀液不断地供给内池102(例如，以约1加仑/分的速度供给10升的电镀槽)，因此，电镀液从内池102最高点不断溢出并进入外池101。溢出的电镀液由外池101收集起来并从其中排出以便再次循环到内池102中。如图1所示，电镀槽100一般以某一倾角放置，即电镀槽100的框架部件103一般有一侧略高，以便电镀电解液100部件的倾角约在3°和30°之间。因此，为在实施电镀中保证内池102中的电镀液具有适当的深度，内池102的最高点可沿电镀槽100的一侧向上延伸，以便内池102的最高点可大体保持水平且可使电镀液沿内池102的周边不断溢出。
电镀槽100的框架部件103一般包括一个固定于框架部件103上的环形底部部件104。由于框架部件103有一侧略高，底部部件104上表面与水平面成一夹角，此夹角与框架部件103相对于水平面的倾角一致。底部部件104包括一个环形或盘状的凹槽，此环形凹槽用来放置盘状的阳极部件105。底部部件104还包括位于其底面的多个进/出液口109。每个进/出液口109一般被设计成分别将一种液体供给电镀槽100的阳极室或阴极室，或把一种液体从电镀槽100的阳极室或阴极室排出。阳极部件105上一般有多条贯通其本身的狭槽107，而这些狭槽107一般互相平行地分布在阳极105表面。互相平行取向使得阳极表面产生的浓稠液体可以向下经阳极表面流入到一个狭槽107中。电镀槽100还包括一个隔板支撑组件106。隔板支撑组件106一般固定于底部部件104的外部边缘，其包括可用来使液体通过一系列相对设置的狭槽和孔从其中流过的内部区域108。隔板支撑组件可包括位于隔板周边附近的O形环密封件，其中所述密封件被设计成阻止液体从隔板的固定于隔板支撑组件106的一侧流到另一侧。
图2所示为底部部件104的透视图。底部部件104的上表面一般包括一个被设计成放置盘状阳极105的环形凹槽201。此外，环形凹槽201上一般有多条沟槽202。每条沟槽202大体上相互平行且终止于凹槽区域201的边缘。此外，凹槽区域201的边缘也有一个环绕其边缘的环形排液沟槽203。每条平行设置的沟槽202的两端都终止于环形排液沟槽203。因此，沟槽202可从阳极沟槽302接收浓稠液体然后将其通过沟槽202输送到排液沟槽203。形成凹槽区域201的直壁一般包括位于其上的多条狭槽204。每条狭槽204一般互相平行，而且，一般与位于凹槽区域201较低表面上的沟槽202相平行。底部部件104还至少包括一个被设计成将液体分配到电镀槽100的阳极区域的液体供给导管205，以及一个被设计成将电镀液分配到电镀槽100的阴极室的电镀液供给导管206。两个互相独立的供给导管205和206一般与至少一个位于底部部件104下表面的液体供给管线109来进行液体流通，如图1所示。底部部件104一般包括多个导管(未示出)，其中这些导管被设计成将每条液体供给管线109所收集到的液体分别输送给电镀槽100的阴极室和阳极室。
图3所示为具有盘状阳极105的底部部件104的透视图。阳极105一般是一个盘状的铜部件，也就是说，一般用一个可溶解型铜制阳极来进行电化学镀铜操作，铜部件上一般有多条狭槽302。狭槽302一般贯通阳极105的内部且与阳极105的上下表面均有液体流通。同样地，狭槽302允许液体由上表面到下表面通过阳极105的内部。狭槽302相互平行。然而，如图3所示，当阳极105位于底部部件104的环形凹槽201中时，阳极105的平行狭槽302一般与底部部件104的狭槽204和沟槽202正交。此外，狭槽302在阳极105的上表面上一般是不连续的。而是，狭槽302被截断成较长子段303和较短子段304，两子段中间有间隔305，此间隔可使从一端到其另一端通过阳极105的流路径(current path)变长。此外，相邻狭槽302间的间隔305在阳极上表面的相对侧设置。从阳极较低端到阳极较高端的流路径一般包括一条在沟槽302之间通过间隔305的往复型路径。此外，沟槽302和间隔305的布置可以使浓稠的牛顿流体从阳极105表面更彻底地流走，由于沟槽302的设置为浓稠液体流到沟槽302中提供了一个最短的可能流动距离。此特征是重要的，因为浓稠液体一般流动缓慢，因此，这是所希望的特征。
图4所示为示例性的本发明中隔板支撑组件106的分解透视图。隔板支撑组件106一般包括一个上部的环形支撑部件401、一个中部的隔板支撑部件400及一个下部支撑部件402。上部和下部的支撑部件401和402一般被设计成给中部隔板支撑部件400提供结构上的支持，也就是说，当下部支撑部件402上放置了中部隔板支撑部件400时，上部支撑部件401用来将中部隔板支撑部件400固定到下部支撑部件402上。中部隔板支撑部件400一般包括一个基本平坦的上表面，表面的部分区域上形成有许多贯通的孔。中部隔板支撑部件400的下表面一般包括一个锥形的外部部分403和一个基本平坦的内部隔板结合面404。下部支撑部件402的上表面可包括一个相应的锥形部分被设计用来容纳中部隔板支撑部件400的锥形部分403。隔板结合面404上一般包括多条平行设置/定向的沟槽(未示出)。形成进中部隔板支撑部件400的下表面上的每条沟槽至少与一个通过平坦的上表面部分区域形成的孔进行液体流通。沟槽可使位于隔板支撑组件中的隔板在沟槽区域略微向上变形，这样可为阴极室中的气泡和低浓度液体提供一条流动路径，以使其可移动到隔板的周边并从阳极室排出。
操作中，本发明的电镀槽100提供了可用于例如电化学镀铜工艺的小容量(电解液容量)处理槽。如图1所示，电镀槽100可水平或倾斜放置，也就是说，电镀槽一侧在垂直方向升高且高于电镀槽的另一侧。如果电镀槽100为倾斜放置，那么可用一倾斜的头组件和衬底支撑部件以一个不变的角度浸没衬底，也就是说，衬底与电解液上表面之间的角度在浸入过程中不改变。此外，浸入速度可以是变化的，也就是说，以渐增的速度将衬底浸入到电解液中。不变的浸入角度与可变的浸入速度结合可以消除衬底表面的气泡。
假设采用倾斜放置，那么衬底首先浸入到内池102中的电镀液里。电镀液一般包括硫酸铜、氯以及一种或多种用来控制电镀参数的有机镀添加剂(匀平剂、抑制剂、催化剂等)，一旦衬底浸入到电镀液中，就在衬底上的种子层和位于电镀槽100下部的阳极105之间施加电镀电偏置(electrical plating bias)。电镀电偏置一般可使电镀液中的金属离子沉积在阴极衬底表面。供给内池102的电镀液通过进/出液口109在内池102内不断循环。更特别的是，电镀液可通过进液口109进入电镀槽100。溶液可以穿过底部部件104下表面并向上通过一个液孔206。然后，电镀液可通过形成进电镀槽100的沟槽进入阴极室，其中电镀槽100的沟槽在隔板支撑106上方的一点与阴极室相通。类似地，电镀液可通过隔板支撑106上方的排液管从阴极室排出，其中排液口与位于底部部件104的下表面的一个排液管109进行液体流通。例如，底部部件104包括位于底部部件104相对的两侧之上的第一和第二液孔206。位置相对的液孔206可分别用来使电镀液在预定方向上进出阴极室，这同样可使流动方向受到控制。流动方向控制可以控制在隔板下表面上的较轻液体的的排出以及气泡从阳极室的排出，且可帮助浓稠或较重液体通过底部部件104上的沟槽202从阳极表面流走。
一旦电镀液流入阴极室，电镀液将向上流过扩散板110。扩散板110一般为陶瓷或其它多孔的盘状部件，一般用来作为液流限流器以使液体平稳地流过衬底表面。此外，扩散板110可用来以电阻方式(resistively damp)减小在阳极或阳离子隔板表面的电化学发生区域上的电性变化(electrical variation)，众所周知此电性变化可降低镀层均匀度。此外，本发明的实施例考虑可用亲水性塑料部件来代替，例如，精选聚乙烯部件、聚偏氟乙稀部件、聚丙烯部件或其它现有的多孔且具有陶瓷可提供的以电阻方式减小电性变化的特征的其它材料。然而，进入阴极室的电镀液一般为阴极电镀液，也就是带添加剂的电镀液，不容许其通过位于隔板支撑组件106的下表面404上的隔板(未示出)进入阳极室，因为阳极室与阴极室被隔板的液性隔开(fluidly separate)。阳极室包括各自独立的液体供给和排出的液源，此液源被设计成给阳极室供给阳极电解液。供给阳极室的溶液只在阳极室内循环且不扩散或流到阴极室，此溶液在电化学镀铜系统中一般为硫酸铜，因为位于隔板支撑组件106上的隔板在两个方向都不可渗透。
此外，控制进入到阳极室的流体溶液流动(阳极电解液，也就是，不含添加剂的电镀液，这里指的是类似于一种原溶液)的方向以使电镀参数最大化。例如，阳极电解液可通过其中一个进液口109进入阳极室。进液口109可与底部部件104下部上的液体沟槽进行液体流通，且液体沟槽可使阳极电解液流入到一个孔205中。密封件位于孔205的径向外围且与周围构件相协作，引导阳极电解液向上流出孔205并进入狭槽204。然后，阳极电解液一般流经阳极105的上表面到达底部部件104的另一侧，在底部部件104被设计成倾斜放置的情况下，所此侧一般为电镀槽100的较高一侧。阳极电解液流经阳极的表面，阳极位于直接在其上的隔板之下。一旦阳极电解液到达阳极105的另一侧，其将流入相应的液体沟槽204然后从电镀槽104排出以继续循环。
在进行电镀操作过程中，阳极和阴极之间的电镀电偏置一般会使阳极室中的阳极电解液分解。更特别地是，此电镀偏置可在阳极室中产生多层硫酸铜溶液的流体动力学层或牛顿层。这些流体动力学层一般包括临近阳极的浓硫酸铜层，中间的正常硫酸铜层，临近隔板的较轻的顶部的稀硫酸铜层。稀硫酸铜层一般为比最初供给阳极室的硫酸铜浓度低且较轻的硫酸铜层，而浓稠层一般为较浓较重的硫酸铜层且粘度均匀。临近阳极的农稠层的浓度均匀可在无狭槽302的阳极上产生电导率问题(或被称作阳极钝化)。然而，狭槽302与电镀槽100的倾斜方向相协作可接收硫酸铜的浓粘度层并使其从阳极表面流走，这样就可消除电导率的变化。此外，电镀槽100一般有一侧向上倾斜或垂直位于另一侧之上，因此，阳极105表面一般也为倾斜平面。此倾斜一般可使产生于阳极表面的浓硫酸铜层在重力作用下向下流。随着浓硫酸铜层向下流，被接收到一个狭槽302之中并从阳极表面流走。如上所述，狭槽302一般互相平行且与沟槽204垂直。因此，狭槽302也垂直于沟槽200，并在底部部件104下表面中形成。同样地，每条狭槽302或最终与数条沟槽202相交。这种设计使得浓硫酸铜可进入狭槽302并流入一条或多条沟槽202中。其后，浓硫酸铜可通过沟槽202流入到位于凹槽201中的环形排液沟槽203之中。与沟槽202相通的排液沟槽203一般可贯穿基盘104并返回到中央的阳极电解液供给箱，从阳极表面流走的浓硫酸铜可在此处与一定体积的用作阳极电解液的储存硫酸铜进行重新溶合。
类似地，阳极室上部产生一层靠近隔板的稀硫酸铜层。如图5所示，稀硫酸铜层可通过排气孔/排液管501从阳极室流走。排气孔/排液管501可包括多个端口，其一般位于电化学电镀槽100的上端，因此，即可用来排出在阳极室内截获的气泡又可用来排出隔板表面上产生的稀硫酸铜。排气孔501一般可与前述阳极电解液箱进行液体流通，因此，可将接收到的稀硫酸铜送回阳极电解液箱，稀硫酸铜可在其中与通过狭槽302流进的浓硫酸铜进行重新溶合以在阳极电解液箱中形成所需浓度的硫酸铜。被排气孔501截获的气泡也可从阴极室排出到空气中或者只是滞留在阳极电解液箱里而不再循环到阴极室中。
虽然前述是根据本发明实施例进行描述的，在没有超出本发明基本范围的情况下可以设计其它更多的本发明实施例，本发明范围由所附权利要求确定。

Claims (24)

1.一种半导体处理槽，包括：
用于容纳电镀液的液池；
位于所述液池底部的阳极室；
位于所述液池上部的阴极室，所述阳极室通过横跨液池的离子隔板与所述阴极室隔离；
位于所述阳极室的阳极并且其具有一个与水平面成一定角度放置的上表面。
2.根据权利要求1所述的半导体处理槽，其中所述阳极包括大体为盘状的盘状部件，所述盘状部件用将要在电化学电镀槽中被用作镀层的金属制造，所述盘状部件上具有在其上贯通形成的互相平行的多条狭槽。
3.根据权利要求2所述的半导体处理槽，其中所述多条沟槽包括多条较长子段和较短子段，每个较长子段都与一个较短子段纵向邻接，并且其间由阳极的剩余部分隔开。
4.根据权利要求2所述的半导体处理槽，进一步包括，一个阳极底部部件，所述阳极底部部件包括：
下部部件与从所述下部部件延伸出的竖壁形成的环形凹槽，所述环形凹槽被设计成放置阳极；
所述下部部件上形成的多条沟槽，所述多条沟槽中的每条终止于环绕下表面的环形排液槽。
5.根据权利要求4所述的半导体处理槽，其中所述阳极底部部件进一步包括形成进所述环形凹槽的环形竖壁上的多条壁沟槽。
6.根据权利要求1所述的半导体处理槽，其中与水平面形成的所述夹角大约在5°和35°之间。
7.根据权利要求6所述的半导体处理槽，其中所述阳极上表面、所述离子隔板、和一扩散部件大体上平行定位。
8.根据权利要求1所述的半导体处理槽，进一步包括位于所述液池中的扩散部件，所述扩散部件有一个与所述阳极上表面大体平行的上表面。
9.根据权利要求1所述的半导体处理槽，其中所述离子隔板与水平面成另一角度放置。
10.一种将金属镀到衬底上的装置，包括：
用于容纳电镀液的液池；
横跨所述液池内圆周设置的离子隔板，所述离子隔板用于隔离位于所述液池上部的阴极室与位于所述液池底部的阳极室；
位于所述阳极室的阳极，至少部分所述阳极上表面与水平面成一角度；和
位于所述离子隔板上方且横跨所述液池的可渗透液体的扩散部件，以便至少部分所述扩散部件的上表面与所述阳极上表面平行设置。
11.根据权利要求10所述的装置，其中所述可渗透液体扩散部件包括陶瓷盘状部件。
12.根据权利要求10所述的装置，其中所述离子隔板包括阳离子隔板。
13.根据权利要求12所述的装置，其中所述阳离子隔板与所述阳极上表面平行。
14.根据权利要求10所述的装置，其中所述阳极包括一个其上贯穿形成有多条狭槽的盘状部件，所述多条狭槽之间互相平行设置。
15.根据权利要求14所述的装置，其中所述多条狭槽包括多条短子段和长子段，所述多条短子段的每条都与一个长子段纵向邻接设置，并且其间由导电的间隔部分隔开。
16.根据权利要求10所述的装置，进一步包括用来放置所述阳极的阳极基盘，所述阳极基盘包括：
用于放置所述阳极的环形凹槽；
形成于所述环形凹槽下表面的多条沟槽，所述多条沟槽的每条都终止于环绕所述环形凹槽周边的环形排液槽；
形成于所述环形凹槽的环形竖壁上的多条狭槽，所述多条狭槽被被设计成用来引导液体流过所述阳极表面。
17.根据权利要求16所述的装置，其中所述多条沟槽被被设计成可与形成于所述阳极上的多条阳极狭槽进行液体流通以形成一个排液路径。
18.根据权利要求10所述的装置，其中所述隔板、扩散部件与至少部分所述阳极上表面之间大体上互相平行。
19.根据权利要求18所述的装置，其中所述角度大约在5°和35°之间。
19.一种小容量电化学电镀槽，包括：
具有大体上为圆柱形壁的液池，所述圆柱形壁形成液体处理空间；
位于所述液体处理空间下部的阳极，一般至少部分所述阳极的上表而与所述圆柱形壁垂直；
跨越所述液体处理空间且在阳极上方的隔板，其一般与所述圆柱形壁垂直；
跨越所述液体处理空间且在隔板之上方的扩散板，其一般与所述圆柱形壁垂直。
其中所述圆柱形壁与竖直方向偏离成一夹角。
20.根据权利要求19所述的电镀槽，进一步包括一个阳极基盘，所述阳极基盘具有被设计成放置所述阳极的环形凹槽，形成于所述基盘的下表面上的多条沟槽，所述多条沟槽的每条终止于在环绕所述下表面的环形排液槽。
21.根据权利要求20所述的电镀槽，其中所述隔板包括一个被设计成将所述液池中的阳极室和阴极室隔开的离子隔板。
22.根据权利要求21所述的电镀槽，进一步包括，一个被设计成向所述阴极室供给阴极电解液的第一进液口和一个向所述阳极室供给阳极电解液的第二进液口。
23.根据权利要求19所述的电镀槽，其中与水平面形成的所述夹角大约在5°和35°之间。
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CN103849919A (zh) * 2012-11-30 2014-06-11 应用材料公司 具有薄隔膜支撑件的电镀处理器

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US20060237307A1 (en) 2006-10-26
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KR20050025990A (ko) 2005-03-14

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