CN1670488A - Temperature, wind speed, wind direction and air pressure integration sensor - Google Patents
Temperature, wind speed, wind direction and air pressure integration sensor Download PDFInfo
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- CN1670488A CN1670488A CN 200510038840 CN200510038840A CN1670488A CN 1670488 A CN1670488 A CN 1670488A CN 200510038840 CN200510038840 CN 200510038840 CN 200510038840 A CN200510038840 A CN 200510038840A CN 1670488 A CN1670488 A CN 1670488A
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Abstract
This invention relates to temperature, wind speed, direction and gas pressure integration sensor, which comprises the following parts: silicon pad, multiple crystal silicon bar with four as heating elements, central temperature sensor, at least four temperature sensor to detect wind direction and piezoresistance, wherein, the bars are distributed along regular polygon; the center temperature sensor is located in the regular polygon; the temperature sensor to test wind is located besides the multiple silicon bars to form similar distribution; the above multiple silicon bars, center temperature sensor located on the silicon pad.
Description
Technical field
The present invention is wind speed, wind direction, temperature and the baroceptor that a kind of microelectromechanical systems is used, and relates in particular to a kind of temperature, wind speed, the gentle pressure integration sensor of wind direction.
Background technology
Wind gage, thermometer, barometer are commonly employed in meteorology, traffic and outwork field.The independently encapsulation separately of these sensors comparatively commonly, and adopt circuit separately to carry out Signal Processing respectively.Because wind speed wind direction sensor, temperature sensor, baroceptor can adopt cmos compatible technology to make, and be aided with postprocessing working procedures and realize last sensor construction, so the integrated possibility that becomes of the monolithic of these sensors and cmos circuit.
Summary of the invention
The invention provides a kind of gentle pressure integration sensor of miniaturization temperature, wind speed, wind direction that can realize that wind speed, wind direction, temperature and air pressure detect and helps reducing cost, have the advantage of high conformity.
The present invention adopts following technical scheme:
A kind ofly be used to measure wind, the temperature of the correlation parameter of temperature and pressure, wind speed, the gentle pressure integration sensor of wind direction, by silicon chip, article at least four, as the polysilicon strip of heating element, the central temperature sensor, at least four are used for temperature sensor and the pressure drag composition that wind direction is measured, polysilicon strip is pressed regular polygon and is arranged, the central temperature sensor is positioned at the regular polygon that polysilicon strip constitutes, the temperature sensor that is used for wind direction mensuration is positioned at outside the polysilicon strip and according to the similar figures of polysilicon strip formation regular polygon to be arranged, above-mentioned polysilicon strip, the central temperature sensor, the temperature sensor and the pressure drag that are used for wind direction mensuration are located at silicon chip, described central temperature sensor is the pn diode, and the temperature sensor that is used for wind direction mensuration is a thermoelectric pile.
Compared with prior art, have following advantage:
1, the present invention can integrate the measurement of wind speed, wind direction, temperature and air pressure.The present invention sets up a temperature field by well heater at chip surface, and the central temperature sensor can be measured the medial temperature in this temperature field.When wind is blown over from the surface, will take away the heat of part from chip surface, the medial temperature that causes the central temperature sensor to measure descends, and this temperature descends and can reflect the size of wind speed.The temperature sensor difference output that is used for wind direction mensuration is the variation of thermograde, has reflected the variation of wind direction.When well heater was not worked, what the central temperature sensor reflected was exactly environment temperature.At the other end of chip, designed the baroceptor of a pressure resistance type, adopt the structure of pressure resistance type to guarantee the interface of sensor and integrated circuit, and can adopt the CMOS standard technology to make.Encapsulating structure is made of jointly thin layer pottery and base.Flip chip bonding between pottery and the chip (flip-chip) structure realizes chip and extraneous electric interconnection; Open two holes on the base, can be inducted into the surface of sensor to guarantee pressure, one of them hole contacts with the environment in the external world, and vacuum is pumped in another hole, and the film that Pneumatic pipe cleaner is crossed in the vacuum cavity is responded to.The variation of pressure drag then can be measured by wheatstone bridge circuits.Can infer the variation of knowing air pressure according to the variation of pressure drag at last.
2, wind speed, wind direction, temperature and baroceptor are integrated on the same chip, compare with individual packages separately, and total area significantly reduces, and helps reducing cost.
3, can adopt on the CMOS technology of standard and the sheet treatment circuit together to make, guarantee the consistance of sensor.
4, the front of sensor adopts stupalith to encapsulate, and can avoid sensor to contact with the direct of measurement environment, has protected treatment circuit on the sheet;
5, the pneumatic conveying mouth of pressure transducer is drawn from the back side of encapsulation, can avoid the influence to the distinguished and admirable body in front;
6, the aftertreatment technology of sensor has reduced the influence of aftertreatment processing to testing circuit from silicon chip back, helps improving yield rate.
Description of drawings
Fig. 1 is a front view of the present invention.
Fig. 2 is a sectional view of the present invention.
Embodiment
A kind ofly be used to measure wind, the temperature of the correlation parameter of temperature and pressure, wind speed, the gentle pressure integration sensor of wind direction, by silicon chip 105, article at least four, as the polysilicon strip 1011 of heating element, 1012,1013,1014, central temperature sensor 102, at least four are used for the temperature sensor 1031 that wind direction is measured, 1032,1033,1034 and pressure drag form, polysilicon strip is pressed regular polygon and is arranged, central temperature sensor 102 is positioned at the regular polygon that polysilicon strip constitutes, the temperature sensor that is used for wind direction mensuration is positioned at outside the polysilicon strip and according to the similar figures of polysilicon strip formation regular polygon to be arranged, above-mentioned polysilicon strip, central temperature sensor 102, the temperature sensor and the pressure drag that are used for wind direction mensuration are located at silicon chip 105, described central temperature sensor 102 is the pn diode, the temperature sensor that is used for wind direction mensuration is a thermoelectric pile, above-mentioned polysilicon strip can be arranged by regular pentagon, regular hexagon is arranged or octagon is arranged, in the present embodiment, by silicon chip 105, article four, as the polysilicon strip 1011 of heating element, 1012,1013,1014, central temperature sensor 102, four are used for the temperature sensor 1031 that wind direction is measured, 1032,1033,1034 and pressure drag 104 form four polysilicon strips 1011,1012,1013,1014 are square arrangement; Adopt four pressure drags 1041,1042,1043,1044 and these four pressure drags 1041,1042,1043,1044 press electric bridge connects, on the silicon chip 105 and below that is positioned at polysilicon strip and temperature sensor is provided with thermal resistance hole 1052, at silicon chip 105, polysilicon strip, be provided with base 108 outside temperature sensor and the pressure drag, below pressure drag, be provided with pressure bullport 1051, on base 108 and the lower zone that is positioned at pressure bullport 1051 be provided with through hole 1081, at polysilicon strip, the top of temperature sensor and pressure drag 104 is provided with ceramic seal gasket 107, at pressure drag, be provided with cavity 1083 and this cavity 1083 between ceramic seal gasket 107 and the base 108 and be vacuum cavity, pressure bullport 1051 is a vacuum hole.
The present invention a kind ofly can carry out single chip integrated scheme with temperature, wind speed, wind direction, baroceptor.Wind speed and direction and temperature sensor are by heating element polysilicon strip, central temperature sensor and be used for the temperature sensor that wind direction measures and constitute, central temperature sensor and be used for the temperature sensor that wind direction measures and can be realized by pn diode or thermoelectric pile.Three kinds of sensors are worked at times.When the heating element polysilicon strip was not worked with the temperature sensor B103 that is used for wind direction mensuration, the central temperature sensor promptly can measures ambient temperature.When polysilicon strip heats, the central temperature sensor measurement be the medial temperature of chip after the heating.Under the environment of wind, the control by on-chip circuit realizes this temperature constant, the anti-size that pushes away wind speed of change in voltage at the two ends that this moment can be by measuring fire-bar.Mutually perpendicular four temperature sensors can be tried to achieve wind direction by the temperature difference of measuring on mutually perpendicular both direction.Baroceptor then can be measured the variation of pressure drag by the mode of Wheatstone bridge, thereby tries to achieve the size of air pressure.The above sensitive element and the realization of heating element all can adopt the CMOS technology of standard to realize.Silicon chip 105 back sides can adopt KOH or TMAH or EDP corrosive liquid to realize that thereby the anisotropic corrosion forms film 106.For wind speed, wind direction and temperature sensor, this film is the supporting construction of sensor, and the below of film is a cavity.Because silicon is the good conductor of heat, and air is not, therefore this structure can improve the efficient of heat, reduce the power consumption of sensor, the precision of improve measuring, this film is one deck sensitive membrane for pressure transducer, the variation that the variation of the pressure drag resistance on this sensitive membrane can reaction pressure.Packaged type (flip-chip) of pottery 107 is adopted in the front of this chip, makes that sensor and the circuit on the chip can interconnect with external circuit.Simultaneously, potsherd is also realized wind speed, wind direction and temperature sensor and extraneous isolation.Therefore because pottery is the good conductor of heat, can reduces the amplitude of output, and can not impact the measurement range of sensor, precision etc.Base 108 parts have pressure bullport 1081, can import to the surface of pressure transducer to guarantee pressure.The opposite side of base has aspirating hole, realizes that the sensitive element of chip surface is under the state of vacuum 1083.Pressure in the pressure bullport changes promptly can be measured next.Last signal output can be by drawing to the mode of base pin 109 welding.
Claims (7)
1, a kind ofly be used to measure wind, the temperature of the correlation parameter of temperature and pressure, wind speed, the gentle pressure integration sensor of wind direction, it is characterized in that by silicon chip (105), article at least four, as the polysilicon strip (1011 of heating element, 1012,1013,1014), central temperature sensor (102), at least four are used for the temperature sensor (1031 that wind direction is measured, 1032,1033,1034) and pressure drag form, polysilicon strip is pressed regular polygon and is arranged, central temperature sensor (102) is positioned at the regular polygon that polysilicon strip constitutes, the temperature sensor that is used for wind direction mensuration is positioned at outside the polysilicon strip and according to the similar figures of polysilicon strip formation regular polygon to be arranged, above-mentioned polysilicon strip, central temperature sensor (102), the temperature sensor and the pressure drag that are used for wind direction mensuration are located at silicon chip (105), described central temperature sensor (102) is the pn diode, and the temperature sensor that is used for wind direction mensuration is a thermoelectric pile.
2, according to the described temperature of claim 1, wind speed, the gentle pressure integration sensor of wind direction, it is characterized in that being made up of silicon chip (105), four polysilicon strips as heating element (1011,1012,1013,1014), central temperature sensor (102), four temperature sensor (1031,1032,1033,1034) and pressure drags (104) that are used for wind direction mensuration, four polysilicon strips (1011,1012,1013,1014) are square arrangement.
3,, it is characterized in that adopting four pressure drags (1041,1042,1043,1044) and this four pressure drags (1041,1042,1043,1044) to press electric bridge and connect according to claim 1 or 2 described temperature, wind speed, the gentle pressure integration sensor of wind direction.
4,, it is characterized in that going up and the below that is positioned at polysilicon strip and temperature sensor is provided with thermal resistance hole (1052) at silicon chip (105) according to the described temperature of claim 3, wind speed, the gentle pressure integration sensor of wind direction.
5,, it is characterized in that outside silicon chip (105), polysilicon strip, temperature sensor and pressure drag, being provided with base (108) according to the described temperature of claim 4, wind speed, the gentle pressure integration sensor of wind direction.
6, according to the described temperature of claim 5, wind speed, the gentle pressure integration sensor of wind direction, it is characterized in that below pressure drag, being provided with pressure bullport (1051), go up and the lower zone that is positioned at pressure bullport (1051) is provided with through hole (1081) at base (108).
7, according to the described temperature of claim 6, wind speed, the gentle pressure integration sensor of wind direction, it is characterized in that being provided with ceramic seal gasket (107) in the top of polysilicon strip, temperature sensor and pressure drag (104), be provided with cavity (1083) and this cavity (1083) and be vacuum cavity between pressure drag, ceramic seal gasket (107) and base (108), pressure bullport (1051) is a vacuum hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CNB2005100388408A CN1325879C (en) | 2005-04-13 | 2005-04-13 | Temperature, wind speed, wind direction and air pressure integration sensor |
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| Application Number | Priority Date | Filing Date | Title |
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| CNB2005100388408A CN1325879C (en) | 2005-04-13 | 2005-04-13 | Temperature, wind speed, wind direction and air pressure integration sensor |
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| CN1670488A true CN1670488A (en) | 2005-09-21 |
| CN1325879C CN1325879C (en) | 2007-07-11 |
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| CNB2005100388408A Expired - Fee Related CN1325879C (en) | 2005-04-13 | 2005-04-13 | Temperature, wind speed, wind direction and air pressure integration sensor |
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| CN100460875C (en) * | 2007-05-11 | 2009-02-11 | 东南大学 | Cross structure two-D wind speed wind direction sensor and its preparation method |
| CN101294977B (en) * | 2007-04-25 | 2010-06-23 | 中国科学院电子学研究所 | Silicon piezoresistance type wind velocity and wind direction sensor based on micro-electromechanical technology |
| CN101329361B (en) * | 2008-05-30 | 2011-06-15 | 无锡市纳微电子有限公司 | Minitype silicon accelerometer having functions of measuring pressure intensity and temperature variation and its machining method |
| CN101923101B (en) * | 2010-05-12 | 2012-08-15 | 西安交通大学 | Digital crosswind sensor for monitoring wind speed and wind direction of crosswind |
| CN102749473A (en) * | 2012-06-30 | 2012-10-24 | 东南大学 | Two-dimensional hot-film wind speed and direction sensor and preparation method thereof |
| CN103163323A (en) * | 2011-12-14 | 2013-06-19 | 中国科学技术大学 | Two-dimensional wind direction and wind speed measurement method based on temperature sensor array |
| CN104390667A (en) * | 2014-12-17 | 2015-03-04 | 哈尔滨理工大学 | Environment parameter integrated sensor capable of adjusting heating temperature of B-infiltration semiconductor |
| CN104482964A (en) * | 2014-12-17 | 2015-04-01 | 哈尔滨理工大学 | Integrated high-accuracy boronized semiconductor heating wind speed and direction sensor |
| CN104807558A (en) * | 2014-01-24 | 2015-07-29 | 西门子瑞士有限公司 | Temperature sensing device |
| CN105699687A (en) * | 2016-01-22 | 2016-06-22 | 北京至感传感器技术研究院有限公司 | Wind speed and direction detection device |
| CN106443056A (en) * | 2016-09-21 | 2017-02-22 | 东南大学 | Wafer level packaging based MEMS wind speed and wind direction sensor structure and packaging method |
| CN107064549A (en) * | 2017-05-10 | 2017-08-18 | 太原中北新缘科技中心 | Wind speed wind direction sensor |
| CN107705529A (en) * | 2017-09-28 | 2018-02-16 | 河南汇纳科技有限公司 | A kind of mine wireless data acquisition device based on LoRa |
| CN107907707A (en) * | 2017-12-28 | 2018-04-13 | 东南大学 | A kind of wind speed wind direction sensor and detection method based on double-deck thermopile structure |
| CN108169509A (en) * | 2017-12-20 | 2018-06-15 | 东南大学 | Wind speed wind direction sensor based on octagon thermopile structure and preparation method thereof |
| CN108226568A (en) * | 2017-12-20 | 2018-06-29 | 东南大学 | Wind speed wind direction sensor based on octagon thermistor structure and preparation method thereof |
| CN109001486A (en) * | 2018-06-21 | 2018-12-14 | 东南大学 | A kind of wide-range air velocity transducer and preparation method thereof |
| CN109188015A (en) * | 2018-06-21 | 2019-01-11 | 东南大学 | A kind of highly sensitive silicon two-D wind speed meter and preparation method thereof |
| CN109374158A (en) * | 2018-12-14 | 2019-02-22 | 华景传感科技（无锡）有限公司 | A kind of pressure sensor |
| CN113884701A (en) * | 2021-09-28 | 2022-01-04 | 东南大学 | Wind speed and direction sensor for improving measurement range and full-range precision |
Family Cites Families (4)
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|---|---|---|---|---|
| CN2079768U (en) * | 1990-07-17 | 1991-06-26 | 李嘉骏 | Antenna synchronism timer capable of indicating meteorological condition |
| JPH077769A (en) * | 1993-06-17 | 1995-01-10 | Miharu Tsushin Kk | Meteorological information obtaining method utilizing interactive catv system and weather forecasting method based on the meteorological information |
| CN1141585C (en) * | 2002-01-11 | 2004-03-10 | 东南大学 | Integrated anemometer using polysilicon temp diode and its preparing process |
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-
2005
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| CN101294977B (en) * | 2007-04-25 | 2010-06-23 | 中国科学院电子学研究所 | Silicon piezoresistance type wind velocity and wind direction sensor based on micro-electromechanical technology |
| CN100460875C (en) * | 2007-05-11 | 2009-02-11 | 东南大学 | Cross structure two-D wind speed wind direction sensor and its preparation method |
| CN101329361B (en) * | 2008-05-30 | 2011-06-15 | 无锡市纳微电子有限公司 | Minitype silicon accelerometer having functions of measuring pressure intensity and temperature variation and its machining method |
| CN101923101B (en) * | 2010-05-12 | 2012-08-15 | 西安交通大学 | Digital crosswind sensor for monitoring wind speed and wind direction of crosswind |
| CN103163323A (en) * | 2011-12-14 | 2013-06-19 | 中国科学技术大学 | Two-dimensional wind direction and wind speed measurement method based on temperature sensor array |
| CN103163323B (en) * | 2011-12-14 | 2014-11-05 | 中国科学技术大学 | Two-dimensional wind direction and wind speed measurement method based on temperature sensor array |
| CN102749473A (en) * | 2012-06-30 | 2012-10-24 | 东南大学 | Two-dimensional hot-film wind speed and direction sensor and preparation method thereof |
| US10107693B2 (en) | 2014-01-24 | 2018-10-23 | Siemens Schweiz Ag | Temperature sensing apparatus and method of measuring a temperature outside a housing |
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| CN104807558A (en) * | 2014-01-24 | 2015-07-29 | 西门子瑞士有限公司 | Temperature sensing device |
| CN104482964B (en) * | 2014-12-17 | 2017-02-22 | 哈尔滨理工大学 | Integrated high-accuracy boronized semiconductor heating wind speed and direction sensor |
| CN104390667A (en) * | 2014-12-17 | 2015-03-04 | 哈尔滨理工大学 | Environment parameter integrated sensor capable of adjusting heating temperature of B-infiltration semiconductor |
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| CN104390667B (en) * | 2014-12-17 | 2017-03-22 | 哈尔滨理工大学 | Environment parameter integrated sensor capable of adjusting heating temperature of B-infiltration semiconductor |
| CN105699687A (en) * | 2016-01-22 | 2016-06-22 | 北京至感传感器技术研究院有限公司 | Wind speed and direction detection device |
| CN106443056A (en) * | 2016-09-21 | 2017-02-22 | 东南大学 | Wafer level packaging based MEMS wind speed and wind direction sensor structure and packaging method |
| CN107064549A (en) * | 2017-05-10 | 2017-08-18 | 太原中北新缘科技中心 | Wind speed wind direction sensor |
| CN107705529A (en) * | 2017-09-28 | 2018-02-16 | 河南汇纳科技有限公司 | A kind of mine wireless data acquisition device based on LoRa |
| CN108169509A (en) * | 2017-12-20 | 2018-06-15 | 东南大学 | Wind speed wind direction sensor based on octagon thermopile structure and preparation method thereof |
| CN108226568A (en) * | 2017-12-20 | 2018-06-29 | 东南大学 | Wind speed wind direction sensor based on octagon thermistor structure and preparation method thereof |
| CN107907707A (en) * | 2017-12-28 | 2018-04-13 | 东南大学 | A kind of wind speed wind direction sensor and detection method based on double-deck thermopile structure |
| CN109001486A (en) * | 2018-06-21 | 2018-12-14 | 东南大学 | A kind of wide-range air velocity transducer and preparation method thereof |
| CN109188015A (en) * | 2018-06-21 | 2019-01-11 | 东南大学 | A kind of highly sensitive silicon two-D wind speed meter and preparation method thereof |
| CN109374158A (en) * | 2018-12-14 | 2019-02-22 | 华景传感科技（无锡）有限公司 | A kind of pressure sensor |
| CN113884701A (en) * | 2021-09-28 | 2022-01-04 | 东南大学 | Wind speed and direction sensor for improving measurement range and full-range precision |
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Assignee: Nanjing GaoHua Technology Co., Ltd. Assignor: Southeast University Contract record no.: 2010320001077 Denomination of invention: Temperature, wind speed, wind direction and air pressure integration sensor Granted publication date: 20070711 License type: Exclusive License Open date: 20050921 Record date: 20100809 |
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Granted publication date: 20070711 Termination date: 20110413 |