CN1657923A - Device for measuring thermal coefficient - Google Patents
Device for measuring thermal coefficient Download PDFInfo
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- CN1657923A CN1657923A CN 200410015458 CN200410015458A CN1657923A CN 1657923 A CN1657923 A CN 1657923A CN 200410015458 CN200410015458 CN 200410015458 CN 200410015458 A CN200410015458 A CN 200410015458A CN 1657923 A CN1657923 A CN 1657923A
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Abstract
The invention discloses a heat conducting coefficient measuring device which consists of a sealed heat insulation device and a vacuum system. The heat insulation device consists of heat source, two metal blocks, samples, a cooling device. The heat insulation device is made by spark-plasma sintering the aluminum oxide ceramic basal material with carbon nanometer tube uniformly arranged in with a intensity of 5 to 10 percent. The carbon nanometer tube distributes along the direction perpendicular to the direction which the heat travels. By pumping out the inner gas with the vacuum system, the adverse effect of the gas is eliminated which the carbon nanometer tube reflect the heat back in consequence that the carbon nanometer tube is radial heat insulation.
Description
[technical field]
The invention relates to the measurement mechanism of coefficient of heat conductivity, especially in regard to heat conductivity measuring device with well insulated effect.
[background technology]
In the development function materials process, often need to measure the heat conductivility of this Heat Conduction Material, particularly for Heat Conduction Material, heat-conducting glue for example, its coefficient of heat conductivity influences the heat conductivility of final products.In the design process of heat radiator of electronic element, need calculate, simulate its heat conductivility in advance, the coefficient of heat conductivity of accurately measuring Heat Conduction Material can reduce test number (TN), reduces cost of development, thereby becomes the key of development and Design.
The coefficient of heat conductivity of measuring material at present mainly contains following two kinds of methods:
One, radium-shine scintigraphy.This method adopts high energy radium-shine as thermal source, rapidly certain heat is deposited on sample one surface in the short time, and another surface temperature change of measuring samples, records the thermal diffusivity of sample, calculates the coefficient of heat conductivity of this specimen material again by formula.This method surveying instrument costliness, cost is higher, and because the variable density of material makes measuring error bigger.
Two, temperature gradient method.This method be with testing sample place a thermal source and a low temperature heat sink between, measure the thermograde that forms therebetween, thereby calculate the coefficient of heat conductivity of material.This method is comparatively simple, and is easy to operate, also is easy to realize.
Under the perfect condition, it is heat sink that all heats of thermal source are passed to low temperature by testing sample, distributes from other directions but in fact unavoidably understand some heat, thereby cause measuring error.Therefore, the measuring accuracy of said method depends primarily on the heat-insulating property of the used heat insulation layer of measuring equipment, and general heat insulation layer can use thermal insulation material, as aluminium oxide ceramics etc., in order to thermal source and external environment are completely cut off, reduces the loss of heat as far as possible.But, still have the part heat and outwards conduct by aluminium oxide ceramics.
See also Fig. 7, on September 20th, 2000, the Chinese patent of bulletin disclosed a kind of method and device thereof of measuring material thermal conductivity No. 93115076.0.This device 9 comprises shell 13, is filled with the heat screen 14 that thermal insulation material forms in it; One thermal source 15, its power are P; One heating plate 10, its area are S, are provided with for being close to thermal source 15; Detected materials 12, its thickness are L, and surface thereof and heating plate 10 surfaces closely contacts, and another is surperficial and one be heated and coil 11 and closely contact; Heating plate 10 is respectively arranged with a temperature-sensitive sticker 16 with the dish 11 that is heated, and is used for the temperature of sensing heating plate 10 and the dish 11 that is heated respectively.For improving measuring accuracy, the radial dimension of the heating plate 10 and the dish 11 that is heated is far longer than the thickness L of detected materials 12.
When measuring the coefficient of heat conductivity of detected materials 12, only need utilize temperature-sensitive sticker 16 to record heating plate 10 respectively and the temperature T 1 and the T2 of the dish 11 that is heated, and with the power P substitution heat conduction equation formula of the area S thermal source 15 of the thickness L of detected materials 12, heating plate 10:
P＝kS(T1-T2)/L
Can draw coefficient of heat conductivity k value.Wherein, thermal source 15 can be electrical heating, and then its power P can be tried to achieve with P=IV, and I is the electric current that flows through thermal source 15, and V is the voltage of thermal source 15.
The method that above-mentioned patent discloses and install easy to use, it is also lower to measure cost, but following shortcoming is arranged: at first, this installs 9 inside unavoidably can leave air, influences measuring accuracy, especially when specimen is jelly or poriness object, heat-conducting glue for example, sample interior contains a large amount of gases, so not only brings gas into, and thickness of sample can't accurately measure because of gas exists, and causes existing measurement mechanism powerless to this type of sample; Secondly, thermal insulation material such as aluminium oxide ceramics in the known techniques, its heat-insulating property still has deficiency, can not satisfy the more requirement of high measurement accuracy; Once more, it needs thermal insulation material is filled into shell 13 the insides to form heat screen 14, and thermal source 15, temperature-sensitive sticker 16 and heating plate 10 be coated in the heat screen in advance in case heat dissipation, this design is unfavorable for thermal source 15 and estimates installation, the maintenance of sensor 16.
In view of this, the invention provides a kind ofly measure glue or poriness sample, heat conducting coefficient measuring device easy to operate, that thermal insulation is good and measuring accuracy is higher is real in necessary.
[summary of the invention]
For overcoming the above-mentioned shortcoming that exists in the prior art, the object of the present invention is to provide a kind of glue or poriness sample, easy to operate, thermal insulation is good and measuring accuracy is higher heat conducting coefficient measuring device measured.
For achieving the above object, the invention provides a kind of heat conducting coefficient measuring device, it comprises: one is used for producing the thermal source of heat; One first derby, it is close to the thermal source setting; One testing sample, it is close to this first derby setting; One second derby, it is close to this testing sample setting; One cooling device; Temperature-sensitive sticker is used for measuring the temperature of this first, second derby; One adiabatic apparatus of making by thermal insulation material, it is formed with an inner space, and above-mentioned thermal source, two derbies, testing sample and cooling devices all are contained in this inner space; One pumped vacuum systems links to each other with this adiabatic apparatus, and its inner space can be vacuumized; In addition, a pressure device can apply the element that predetermined pressure will be contained in its inner space and compresses; Wherein, this thermal insulation material is to be arranged in order by carbon nano-tube to be dispersed in the aluminium oxide ceramics matrix material, form through plasma sintering, and carbon nano-tube arranges perpendicular to the direction of heat transferred, and its mass content is 5～10%.
Compared with prior art, the present invention utilizes pumped vacuum systems that internal gas is taken away, both can guarantee the measurement of thickness of sample, deaeration or other gas harmful effect that measuring accuracy is caused fully again, thus improve accuracy of measurement and reliability; Because of the radially athermanous characteristic of carbon nano-tube, make the heat that is delivered to carbon nano-tube be reflected back again, improve the heat-insulating property of measurement mechanism, make heat can further improve final measuring accuracy to the predetermined direction transmission.In addition, measurement mechanism of the present invention opens easily, cuts out, and its operability also greatly improves.
[description of drawings]
Fig. 1 is a heat conductivity measuring device schematic perspective view of the present invention;
Fig. 2 is the schematic internal view that heat conductivity measuring device of the present invention is removed loam cake;
Fig. 3 is the square insulated side wall synoptic diagram of heat conductivity measuring device of the present invention;
Fig. 4 is the square insulated side wall synoptic diagram of heat conductivity measuring device of the present invention;
Fig. 5 is the cylindrical insulated side wall synoptic diagram of heat conductivity measuring device of the present invention;
Fig. 6 is temperature and the distance relation figure that thermopair records metal;
Fig. 7 is the heat conductivity measuring device synoptic diagram of prior art.
[embodiment]
Below in conjunction with accompanying drawing the present invention is described in further detail.
See also Fig. 1, the schematic perspective view of heat conductivity measuring device 90 first embodiments promptly provided by the present invention.This device comprises an adiabatic apparatus 100, one pressure devices 200.This thermally insulated container 100 is a quad seal container, and it has a mobilizable loam cake 104, and this loam cake can be opened or be closed, so that article are put into or taken out.In addition, an exhaust tube 106 penetrates the outer wall 102 of this thermally insulated container 100, makes the one end extend in the thermally insulated container 100, and the other end links to each other with vacuum extractor (figure does not show).Can will vacuumize in the thermally insulated container 100.
See also Fig. 2, thermally insulated container 100 has double-decker, and nexine is a thermal insulation heat-insulation layer 110, and skin is a containment wall 102, provide protection against wear.Heat-insulation layer 110 comprises an insulated side wall 114 and an adiabatic diapire 116, surrounds the square inner space that forms a upper end open together, and the shape of heat-insulating shield 115 and this opening shape match, and can move up and down.Pressure device 200 links to each other with this heat-insulating shield 115, and can apply normal pressure on this heat-insulating shield 115.
Thermally insulated container 100 inside, a cooling device 140 is located at the bottom of this inner space, promptly near this thermal insulation diapire 116.One copper billet 126, testing sample 130 and copper billet 124 sequence stacks like this, make testing sample 130 be clipped between two copper billets 126,124 on cooling device 140.Wherein, above-mentioned two copper billets 126,124 and testing sample have the long-pending A of same cross-sectional, and this sectional dimension is far longer than the thickness H of testing sample 130.One thermal source 120 is arranged between copper billet 124 and the heat-insulating shield 115, and aforementioned pressure device 200 applies normal pressure to this heat-insulating shield 115, and above-mentioned each object is pressed.
For reducing interface resistance, the surface of contact of copper billet 126 and sample 130 and copper billet 124 all should polish with the surface of contact of sample 130 so that surface of contact smooth smooth be good.
Above-mentioned insulated side wall 114, diapire 116 and heat-insulating shield 115 are made by the compound substance that aluminium oxide ceramics 113 and carbon nano-tube 112 forms, and this compound substance is to be matrix with aluminium oxide ceramics 113, and carbon nano-tube 112 forms through plasma sintering for filling material.Wherein carbon nano-tube 112 is perpendicular to direction of heat transfer and arranges, and in the present embodiment, carbon nano-tube 112 is perpendicular to the thickness direction of insulated side wall 114, diapire 116 and heat-insulating shield 115 and arranges, and the mass content of carbon nano-tube 112 is 5～10%.
Carbon nano-tube 112 is a kind of tubular materials that curled and formed by the graphite linings carbon atom, and its diameter is generally several nanometers to tens nanometers, can be continuous arrangement, also can be discontinuous arrangement.Carbon nano-tube 112 has unique heat conductivility, and its axial thermal conductivity is extremely excellent, but therefore radially not heat conduction, when heat vertical carbon nanotube 112 transmits, can radially not transmit along it, and carbon nano-tube 112 is gone back reflect heat.Therefore, the thermally insulated container 100 that the present invention uses has good heat-insulating property, more traditional aluminium oxide ceramics has higher insulation effect, can guarantee that the heat that thermal source 120 produces only can transmit to sample direction 130 along copper billet 124, and avoid heat in transmittance process, to be dispersed into thermally insulated container 100 outsides through insulated side wall 114.The outer wall 102 that is covered in insulated side wall 114 plays a protective role, and can prevent destruction or the wearing and tearing of external force to insulated side wall 114.
See also Fig. 3 and Fig. 4, when above-mentioned compound substance was made square insulated side wall 114, diapire 116 or heat-insulating shield 115, wherein carbon nano-tube 112 can have two kinds of arrangement modes.First kind is along the x direction of principal axis, and promptly insulated side wall 114 Widths are arranged, and second kind is along the y direction of principal axis, and promptly insulated side wall 114 length directions are arranged.So, when heat along the z direction of principal axis, when promptly insulated side wall 114 thickness directions transmitted, because of carbon nano-tube 112 thermal conduction characteristic not radially, heat was reflected back, thereby reaches the adiabatic excellent effect of insulation.
Certainly, thermally insulated container 100 is other shapes also, and coming surface measurements as cylindrical measurement mechanism commonly used is circular sample, and in this case, thermally insulated container 100 just is made of a cylindrical insulated side wall and circular bottom wall and heat-insulating shield.
See also the 5th figure, be the sectional view of the cylindrical thermally insulated container 117 of second embodiment of the invention, wherein, carbon nano-tube 119 is along the axial arranging of cylinder, promptly perpendicular to the radial direction of cylinder.Cylindrical adiabatic wall 117 needs to be used with circular bottom wall and the adiabatic diapire of circle (figure does not show) and circular heat-insulating shield (figure does not show), can make the circle that size matches by diapire among first embodiment 116 and heat-insulating shield 115 and get final product.When heat by cylinder in during to outer transmission, the radially thermal conduction characteristic not because of carbon nano-tube 119 goes back reflect heat, thereby reaches the adiabatic excellent effect of insulation.
See also Fig. 2 and Fig. 6, when heat conductivity measuring device 90 of the present invention used, order was put into thermally insulated container 100 inner and driving fit sealings with cooling device 140, copper billet 126, testing sample 130, copper billet 124 and thermal source 120.Wherein this cooling device 140 can comprise cooling water pipe etc., and thermal source 120 can be electrical heating, so forms a temperature gradient field between thermal source 120 and cooling device 140.Utilize pressure device 200 to apply a normal pressure to this heat-insulating shield 115, the pressure that pressure device 200 is exerted pressure is generally in 20～251bf scope, utilizes vacuum extractor through exhaust tube 106 thermally insulated container 100 to be vacuumized, and can begin to measure.
In copper billet 124 1 sides, apart from sample 130 upper surface a1, a2, a3 place temperature sensing point D1, D2, D3 are set respectively, utilize temperature-sensing device (figure does not show) can record temperature T 1, T2, the T3 of these 3 positions, temperature-sensing device comprises thermopair etc.Equally,, temperature sensing point M1, M2, M3 are set respectively, utilize temperature-sensing device can record temperature T 4, T5, the T6 of these 3 positions apart from sample lower surface s1, s2, s3 place in copper billet 126 1 sides.
According to Fu Li leaf formula:
Q＝-kAΔT/ΔD
A is sample 130 surface areas in the following formula, and Δ D is the distance that heat flows through sample 130, i.e. the thickness of sample 130.Therefore, the coefficient of heat conductivity k value of sample 130 be record, definite earlier thermoflux Q value and upper and lower surface temperature difference thereof needed by sample 130:
ΔT＝T
low-T
up
It is the upper surface temperature T
UpAnd underlaying surface temperature T
LowDifference.
Because of the insulated side wall 114 and the heat-insulating shield 115 of thermally insulated container 100 can not transmit heat, therefore, heat is merely able to transmit to cooling device 140 from thermal source 120, and does not have heat dissipation in the transmittance process.So, flow to the thermoflux Q32 of D2, flow to the thermoflux Q21 of D1 from D2 from D3, flow through sample thermoflux Q, flow to the thermoflux Q12 of M2, the thermoflux Q23 that flow to M3 from M2 from M1 and equate that all so only demand gets the thermoflux that any one thermoflux can be learnt sample 130.And the coefficient of heat conductivity k1 of copper billet 124,126 is a given value, then according to Fu Li leaf formula, can flow through the thermoflux value Q of copper billet 124,126.
See also Fig. 6,, then can try to achieve sample 130 upper surface temperature T according to temperature T 1, T2, the T3 of 3 of D1, D2, the D3 of copper billet 124 for thermopair records the each point temperature and the distance relation figure of copper billet
Up, in like manner, can try to achieve sample 130 underlaying surface temperature T by the temperature of 3 of the M1 on the copper billet 126, M2, M3
LowWith above-mentioned thermoflux and temperature T
UpAnd T
LowThe substitution formula can be tried to achieve the coefficient of heat conductivity of sample 130.
Those of ordinary skills should understand, the present invention utilizes the radially thermal conduction characteristic not of carbon nano-tube 112, makes thermally insulated container 100 heat-insulating properties greatly improve, and makes that also heat only can be to the predetermined direction transmission; And exhaust tube 106 and vacuum extractor can will vacuumize in the thermally insulated container 100, and the deaeration influence can further improve final measuring accuracy; And thermal source 120 is not limited to electrical heating, other can provide the mode of enough heats all applicable, in addition, cooling device 140 also is not limited to cooling water pipe, the also applicable the present invention of other types of cooling such as liquid nitrogen, copper billet 124,126 also available other metals replace, and its purpose only is to record thermoflux and sample 130 surface temperature T according to existing known coefficient of heat conductivity material
LowAnd T
Up
Claims (10)
1. heat conducting coefficient measuring device, it comprises movable pressure device, the adiabatic apparatus and the temperature-sensitive sticker of sealing, this adiabatic apparatus is by the adiabatic heat-insulation wall, one adiabatic diapire, but the heat-insulating cover of a mobilizable heat-insulating shield and a folding surrounds, this adiabatic apparatus inside accommodates a thermal source, one is close to first derby of this thermal source, one is close to the testing sample of this first derby, second derby and one of being close to this testing sample is close to the cooling device of this second derby, it is characterized in that: this heat insulation wall, diapire, heat-insulating shield and heat-insulating cover comprise the alumina ceramic composite material of carbon nanotubes, and this measurement mechanism also comprises a pumped vacuum systems that links to each other with this adiabatic apparatus.
2. heat conducting coefficient measuring device as claimed in claim 1 is characterized in that this compound substance is to be arranged in order by carbon nano-tube to be dispersed in the aluminium oxide ceramics matrix, forms through plasma sintering.
3. heat conducting coefficient measuring device as claimed in claim 2 is characterized in that the direction that this carbon nano-tube is perpendicular to heat transferred is arranged in the aluminium oxide ceramics matrix.
4. heat conducting coefficient measuring device as claimed in claim 1, the mass content that it is characterized in that carbon nano-tube in this compound substance is 5～10%.
5. heat conducting coefficient measuring device as claimed in claim 1 is characterized in that this pumped vacuum systems comprises exhaust tube and air extractor, and exhaust tube extends to the inner space of thermally insulated container.
6. heat conducting coefficient measuring device as claimed in claim 1 is characterized in that this thermal source is close to this heat-insulating shield setting, and this cooling device is close on this thermal insulation diapire.
7. heat conducting coefficient measuring device as claimed in claim 1 is characterized in that this first derby, second derby and testing sample have identical sectional area.
8. heat conducting coefficient measuring device as claimed in claim 1 is characterized in that this pressure device is to apply predetermined pressure on heat-insulating shield.
9. heat conducting coefficient measuring device as claimed in claim 1 is characterized in that this temperature-sensitive sticker is the temperature that is used for measuring first derby and second derby.
10. heat conducting coefficient measuring device as claimed in claim 1 is characterized in that this thermal source is electrical heating.
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| CNB2004100154580A CN100412533C (en) | 2004-02-21 | 2004-02-21 | Device for measuring thermal coefficient |
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| CNB2004100154580A CN100412533C (en) | 2004-02-21 | 2004-02-21 | Device for measuring thermal coefficient |
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| CN100412533C CN100412533C (en) | 2008-08-20 |
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