CN1328581C - Device for measuring heat coductivity coefficient - Google Patents
Device for measuring heat coductivity coefficient Download PDFInfo
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- CN1328581C CN1328581C CNB2003101125203A CN200310112520A CN1328581C CN 1328581 C CN1328581 C CN 1328581C CN B2003101125203 A CNB2003101125203 A CN B2003101125203A CN 200310112520 A CN200310112520 A CN 200310112520A CN 1328581 C CN1328581 C CN 1328581C
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- heat
- derby
- measuring device
- heat conducting
- coefficient measuring
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Abstract
The present invention provides a device for measuring heat conduction coefficients. The present invention comprises a sealed heat insulating device of which the interior can contain a heat source, two metal blocks, a sample to be measured, a cooling device, etc., wherein the heat insulating device is formed by orderly arranging and distributing carbon nanotubes in aluminum oxide ceramic base materials, and the carbon nanotubes are arranged in a direction perpendicular to a heat transferring direction. Heat quantity transferred to the carbon nanotubes is reflected back by utilizing the characteristic of no heat conduction of the carbon nanotubes in a radial direction, which improves the heat-insulating property of the measuring device, transfers heat quantity only towards preset directions, and can enhance the precision of final measurement. Moreover, the present invention has no need of filling other heat insulating materials and also has the advantage of convenient use and maintenance.
Description
[technical field]
The invention relates to the measurement mechanism of material thermal conductivity, particularly about having the heat conducting coefficient measuring device of well insulated effect.
[background technology]
In the development function materials process, often need measure the heat conductivility of material, Heat Conduction Material particularly, its coefficient of heat conductivity influences the heat conductivility of final products.In the design process of heat radiator for electronic equipment, need calculate, simulate its heat dispersion in advance, the coefficient of heat conductivity of accurately measuring Heat Conduction Material becomes the successful key point of design.
The coefficient of heat conductivity of measuring material at present mainly contains following two kinds of methods:
First method is the laser scintigraphy, this method adopts superlaser as thermal source, rapidly certain heat is deposited on the surface of sample in the short time, and another surface temperature change of measuring samples, record the thermal diffusivity of sample, calculate the coefficient of heat conductivity of this specimen material again by formula.This method surveying instrument costliness, cost is higher, and makes that the error of measuring is bigger because of the variable density of material.
Second method is a temperature gradient method, this method with testing sample place a thermal source and a low temperature heat sink between, measure the thermograde that forms therebetween, thereby calculate the coefficient of heat conductivity of material.This method is comparatively simple, and is easy to operate, easily realizes.
Under the perfect condition, it is heat sink that all heats of thermal source should be passed to low temperature by testing sample, distributes from other direction but in fact unavoidably understand some heat, thereby cause measuring error.So the measuring accuracy of said method depends primarily on the heat-insulating property of the used heat insulation layer of measuring equipment, general heat insulation layer can use thermal insulation material, as aluminium oxide ceramics etc., thermal source and external environment is completely cut off, and reduces thermal loss as far as possible.But partly heat still can outwards conduct by aluminium oxide ceramics.
See also Fig. 7, on September 20th, 2000, the Chinese patent of bulletin disclosed a kind of method and device thereof of measuring material thermal conductivity No. 93115076.0.This device 9 comprises shell 13, is filled with thermal insulation material in it and forms a heat screen 14; One thermal source 15, its power are P; One heating plate 10, its area is S, is to be close to thermal source 15 to be provided with; Detected materials 12, its thickness are L, and surface thereof and heating plate 10 surfaces closely contacts, and another is surperficial and one be heated and coil 11 and closely contact; Heating plate 10 is respectively arranged with a temperature sensor 16 with the dish 11 that is heated, in order to the temperature with the dish 11 that is heated of sensing heating plate 10 respectively.For improving measuring accuracy, the radial dimension of the heating plate 10 and the dish 11 that is heated need be far longer than the thickness L of detected materials 12.
When measuring the coefficient of heat conductivity of detected materials 12, only need utilize temperature sensor 16 to record heating plate 10 respectively and the temperature T 1 and the T2 of the dish 11 that is heated, and with the thickness L of detected materials 12, the area S of heating plate 10, the power P substitution heat conduction equation formula of thermal source 15:
P＝kS(T1-T2)/L
Can draw coefficient of heat conductivity k value.Wherein, thermal source 15 can be electrical heating, and then its power P can be tried to achieve with P=IV, and I is the electric current that flows through thermal source 15, and V is the voltage of thermal source 15.
The method that above-mentioned patent discloses and install easy to use, it is also lower to measure cost, yet, this device needs thermal insulation material is filled shell 13 the insides to be formed at heat screen 14, and thermal source 15, temperature sensor 16 and heating plate 10 be coated in the heat screen 14 in advance to prevent heat dissipation, this design is unfavorable for installation, the maintenance of thermal source 15 and temperature sensor 16; And the thermal insulation material of prior art such as aluminium oxide ceramics, its heat-insulating property still has deficiency, can not satisfy the more requirement of high measurement accuracy.
In view of this, provide a kind of heat conducting coefficient measuring device easy to operate, that thermal insulation is good and measuring accuracy is higher real for necessary.
[summary of the invention]
For overcoming the above-mentioned shortcoming of prior art, the object of the present invention is to provide a kind of easy to operate, heat conducting coefficient measuring device that thermal insulation is good.
Heat conducting coefficient measuring device of the present invention comprises: one in order to produce the thermal source of heat; One first derby is close to the thermal source setting; One testing sample is close to this first derby setting; One second derby is close to this testing sample setting; One cooling device; A plurality of temperature sensors are in order to measure the temperature of this first, second derby; One adiabatic apparatus, this adiabatic apparatus comprise a diapire, sidewall and a top cover, and described diapire, sidewall and top cover are formed with the obturator of inner space, and above-mentioned thermal source, two derbies, testing sample and cooling device can be contained in this inner space; It is characterized in that this diapire, sidewall and top cover are to be arranged to be scattered in the aluminium oxide ceramics matrix material in order by carbon nano-tube to form, and carbon nano-tube is the direction arrangement of vertical heat transferred.
With respect to prior art, the present invention utilizes the radially athermanous characteristic of carbon nano-tube, makes the reflect heat that is passed to carbon nano-tube go back, and improves the heat-insulating property of measurement mechanism, makes heat only can improve final measuring accuracy to the predetermined direction transmission; And need not to fill other thermal insulation material, conveniently use and overhaul.
[description of drawings]
Fig. 1 is the schematic perspective view of heat conducting coefficient measuring device of the present invention.
Fig. 2 is the inner structure synoptic diagram of heat conducting coefficient measuring device of the present invention.
Fig. 3 is the square sidewall synoptic diagram of heat conducting coefficient measuring device of the present invention.
Fig. 4 is the square sidewall synoptic diagram of heat conducting coefficient measuring device of the present invention.
Fig. 5 is the cylindrical side wall synoptic diagram of heat conducting coefficient measuring device of the present invention.
Fig. 6 is the graph of a relation that thermopair records the temperature and the distance of copper metal.
Fig. 7 is the synoptic diagram of prior art heat conducting coefficient measuring device.
[embodiment]
Below in conjunction with reaching embodiment the present invention is described in further detail.
Please consult Fig. 1 and Fig. 2 together, the schematic perspective view of heat conducting coefficient measuring device first embodiment of the present invention and inner structure synoptic diagram thereof.This measurement mechanism comprises an adiabatic apparatus 100, and this adiabatic apparatus 100 is square structures, is surrounded by heat-insulation layer 110 to form, and the top has a top cover 115 moving up and down, and this top cover 115 is also had a heat insulation effect; In addition, top cover 115 tops are provided with a pressure device 200, in order to apply a normal pressure to this top cover 115.
The adiabatic apparatus 100 of present embodiment, its heat-insulation layer 110 comprise four sidewalls 114 and a diapire 116, surround the square inner space that formation one has opening together, and the shape of top cover 115 and this opening shape match, and can move up and down.One cooling device 140 is arranged at this bottom, inner space, promptly near these diapire 116 places.One copper billet 126, testing sample 130 and copper billet 124 sequential piles are built on cooling device 140, like this, make and treat that sample 130 is clipped between two copper billets 126,124.Wherein, above-mentioned two copper billets 126,124 and testing sample have the long-pending A of same cross-sectional, and this sectional dimension is much larger than the thickness H of testing sample 130.One thermal source 120 is arranged between copper billet 124 and the top cover 115, and aforementioned pressure device 200 applies a normal pressure to this top cover 115, and above-mentioned each assembly is pressed.
For reducing interface resistance, the surface in contact of copper billet 126 and sample 130, and the surface in contact of copper billet 124 and sample 130 all should polish, make surface of contact smooth smooth for good.
Above-mentioned sidewall 114, diapire 116 and top cover 115 all are to be made by the compound substance that aluminium oxide ceramics 113 and carbon nano-tube 112 form, this compound substance is to be matrix with aluminium oxide ceramics 113, carbon nano-tube 112 is a filling material, forms through electricity slurry sintering (spark-plasma sintering).Wherein carbon nano-tube 112 is perpendicular to direction of heat transfer and arranges, and in the present embodiment, carbon nano-tube 112 is thickness directions of vertical sidewall 114, diapire 116 and top cover 115 and arranging, and the mass content of carbon nano-tube 112 is 5～10%.
Carbon nano-tube 112 is the tubular materials that curled and formed by the graphite linings carbon atom, and its diameter is generally several nanometers to tens nanometers, can be continuous arrangement, also can discontinuously arrange.Carbon nano-tube 112 has unique heat conductivility, and its axial thermal conductivity is extremely excellent, but radially not heat conduction when heat vertical carbon nanotube 112 transmits, can radially not transmit along it, and carbon nano-tube 112 is gone back reflect heat.So, the adiabatic apparatus 100 that the present invention uses has good heat-insulating property, more traditional aluminium oxide ceramics has higher insulation effect, can guarantee that heat that thermal source 120 produces only can be along copper billet 124 to sample 130 direction transmission, and avoid heat in transmittance process, to see through sidewall 114 being dispersed into adiabatic apparatus 100 outsides.
Please together referring to Fig. 3 and Fig. 4, when above-mentioned compound substance was made square sidewall 114, diapire 116 or top cover 115, wherein carbon nano-tube 112 can have two kinds of arrangement modes.First kind is along the x direction of principal axis, and promptly sidewall 114 Widths are arranged, and second kind is along the y direction of principal axis, and promptly sidewall 114 length directions are arranged.So, when heat along the z direction of principal axis, when promptly the thickness direction of sidewall 114 transmitted, because of carbon nano-tube 112 thermal conduction characteristic not radially, heat was reflected back, thereby reaches the adiabatic excellent effect of insulation.
Certainly, because of adiabatic apparatus 100 also can be other shape, coming surface measurements as cylindrical measurement mechanism commonly used is circular sample, and in this case, adiabatic apparatus 100 is to be made of a cylindrical side wall and circular bottom wall and top cover.
See also Fig. 5, the diagrammatic cross-section of the cylindrical side wall 117 of second embodiment of the invention, wherein carbon nano-tube 119 is to arrange along the axial direction of cylinder, that is perpendicular to the radial direction of cylinder.Cylindrical side wall 117 needs be used with circular bottom wall (figure indicates) and circular top cover (figure indicates), can make the circle that size matches by the diapire 116 of first embodiment and top cover 115 and get final product.When heat by cylinder in during to outer transmission, the radially thermal conduction characteristic not because of carbon nano-tube 119 goes back reflect heat, thereby reaches the adiabatic excellent effect of insulation.
Please in the lump referring to Fig. 2 and Fig. 6, when heat conducting coefficient measuring device of the present invention is used, order is put into adiabatic apparatus 100 inside with cooling device 116, copper billet 126, testing sample 130, copper billet 124 and thermal source 120, and with after top cover 115 driving fits, utilize pressure device 200 to apply a normal pressure to this top cover 115, wherein this cooling device 116 can comprise cooling water pipe etc., and thermal source 120 can be electrical heating, so forms a temperature gradient field between thermal source 120 and cooling device 116.Pressure device 200 applied pressures are generally in 20～25lbf scope.
In addition, in copper billet 124 1 sides, apart from sample 130 upper surface a1, a2, a3 distance temperature sensing point D1, D2, D3 are set respectively, utilize temperature-sensing device (figure does not indicate) can record temperature T 1, T2, the T3 of these 3 positions, temperature-sensing device comprises thermopair etc.Equally,, temperature sensing point M1, M2, M3 are set respectively, utilize temperature-sensing device can record this temperature T of 34, T5, T6 apart from sample 130 lower surface s1, s2, s3 distance in copper billet 126 1 sides.
According to Fu Li leaf formula:
Q＝-kAΔT/ΔD
A is sample 130 surface areas in the following formula, and Δ D is the distance that heat flows through sample 130, i.e. the thickness of sample 130.Record the coefficient of heat conductivity K value of sample 130, need definite earlier thermoflux Q value and upper and lower surface temperature difference thereof by sample 130:
ΔT＝Tlow-Tup
It is the difference of upper surface temperature T up and underlaying surface temperature Tlow.
Because of the sidewall 114 and the top cover 115 of adiabatic apparatus 100 can not transmit heat, heat is merely able to transmit to cooling device 116 from thermal source 120, and does not have heat dissipation in the transmittance process.So, from D3 flow to D2 thermoflux Q32, from D2 flow to D1 thermoflux Q21, flow through the thermoflux Q of sample, flow to the thermoflux Q12 of M2 from M1, and equate all that from the thermoflux Q23 that M2 flow to M3 so only demand gets the thermoflux that any one thermoflux can be learnt sample 130.And the coefficient of heat conductivity k1 of copper billet 124,126 is a given value, then according to Fu Li leaf formula, can flow through the thermoflux value Q of copper billet 124,136.
Each point temperature according to copper billet 124 is linear, as shown in Figure 6, sample 130 upper surface temperature T up can be tried to achieve by temperature T 1, T2, the T3 that D3, D2, D1 are ordered, in like manner, sample underlaying surface temperature Tlow can be tried to achieve at 3 by M1, M2, the temperature T 4 of M3, T5, T6 on the copper billet 126.Above-mentioned thermoflux and temperature T up and Tlow substitution formula can be drawn sample 130 coefficient of heat conductivity.
Under the field personnel should understand that the present invention utilizes the radially thermal conductivity not of carbon nano-tube 112, makes adiabatic apparatus 100 heat-insulating properties greatly improve, and makes heat only can improve final measuring accuracy to the predetermined direction transmission; And thermal source 120 is not limited to electrical heating, other can provide the mode of enough heats all applicable, in addition, cooling device 140 also is not limited to cooling water pipe, the also applicable the present invention of other type of cooling such as liquid nitrogen, copper billet 124,126 also available other metals replace, and its purpose only is to record thermoflux and sample 130 surface temperature Tup and Tlow according to the material of existing known coefficient of heat conductivity.
Claims (9)
1. heat conducting coefficient measuring device, it comprises: a thermal source, it can produce heat; One first derby is close to this thermal source setting; One testing sample is close to this first derby setting; One second derby is close to this testing sample setting; A plurality of temperature sensors are in order to measure the temperature of this first, second derby; One cooling device is close to this second derby; An and adiabatic apparatus, this adiabatic apparatus comprises a diapire, sidewall and a top cover, described diapire, sidewall and top cover are formed with the obturator of inner space, and above-mentioned thermal source, first derby, testing sample, second derby and cooling device can be contained in this inner space; It is characterized in that this diapire, sidewall and top cover comprise a plurality of carbon nano-tube, and the direction that described a plurality of carbon nano-tube is perpendicular to heat transferred is arranged.
2. heat conducting coefficient measuring device as claimed in claim 1 is characterized in that this thermal source is electrical heating.
3. heat conducting coefficient measuring device as claimed in claim 1 is characterized in that this first derby is a copper.
4. heat conducting coefficient measuring device as claimed in claim 1 is characterized in that this second derby is a copper.
5. heat conducting coefficient measuring device as claimed in claim 1, it is long-pending to it is characterized in that this first derby, second derby and testing sample have same cross-sectional.
6. heat conducting coefficient measuring device as claimed in claim 1, it is characterized in that this adiabatic apparatus be with aluminium oxide ceramics as matrix material, described carbon nano-tube is arranged in order and is scattered in the described matrix material.
7. heat conducting coefficient measuring device as claimed in claim 6 is characterized in that this adiabatic apparatus is that described aluminium oxide ceramics and described carbon nano-tube are made through plasma sintering.
8. heat conducting coefficient measuring device as claimed in claim 6, the mass content that it is characterized in that described carbon nano-tube is 5～10%.
9. heat conducting coefficient measuring device as claimed in claim 1 is characterized in that this device further comprises a pressure device, and this pressure device can apply predetermined pressure in described top cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2003101125203A CN1328581C (en) | 2003-12-05 | 2003-12-05 | Device for measuring heat coductivity coefficient |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2003101125203A CN1328581C (en) | 2003-12-05 | 2003-12-05 | Device for measuring heat coductivity coefficient |
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| CN1624466A CN1624466A (en) | 2005-06-08 |
| CN1328581C true CN1328581C (en) | 2007-07-25 |
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| CNB2003101125203A Expired - Fee Related CN1328581C (en) | 2003-12-05 | 2003-12-05 | Device for measuring heat coductivity coefficient |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101561194B (en) * | 2008-04-18 | 2010-12-29 | 清华大学 | Solar energy heat collector |
| CN102053101B (en) * | 2009-11-06 | 2012-12-26 | 国家纳米科学中心 | Method for measuring thermal conductivity of single semiconductor nanowire material |
| CN101949873A (en) * | 2010-10-11 | 2011-01-19 | 华东师范大学 | Device for measuring solid material heat conductivity |
| CN102879424B (en) * | 2012-10-10 | 2015-01-14 | 信阳天意节能技术有限公司 | Measurement method for thermal performance of phase change building heat-insulation material |
| CN105806889B (en) * | 2016-05-19 | 2018-10-23 | 东北石油大学 | A kind of thermal insulation material test device of thermal conductivity coefficient |
| CN110907495A (en) * | 2019-12-12 | 2020-03-24 | 河南科技大学 | System and method for detecting thermal conductivity of composite material containing adhesive layer |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1003395B (en) * | 1986-08-18 | 1989-02-22 | 同济大学 | Hot plate high-temp. conductometer with double-sample protection |
| CN2058990U (en) * | 1989-11-29 | 1990-07-04 | 东南大学 | Low temp. plane thermo transmitting device |
| CN1351256A (en) * | 2000-10-26 | 2002-05-29 | 日清纺绩株式会社 | Method and device for determining thermal conductivity, and manufacture of thermal isolating parts |
| WO2003013199A2 (en) * | 2001-07-27 | 2003-02-13 | Eikos, Inc. | Conformal coatings comprising carbon nanotubes |
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2003
- 2003-12-05 CN CNB2003101125203A patent/CN1328581C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1003395B (en) * | 1986-08-18 | 1989-02-22 | 同济大学 | Hot plate high-temp. conductometer with double-sample protection |
| CN2058990U (en) * | 1989-11-29 | 1990-07-04 | 东南大学 | Low temp. plane thermo transmitting device |
| CN1351256A (en) * | 2000-10-26 | 2002-05-29 | 日清纺绩株式会社 | Method and device for determining thermal conductivity, and manufacture of thermal isolating parts |
| WO2003013199A2 (en) * | 2001-07-27 | 2003-02-13 | Eikos, Inc. | Conformal coatings comprising carbon nanotubes |
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