TWI250458B - Apparatus for measuring coefficient of thermal conductivity - Google Patents

Apparatus for measuring coefficient of thermal conductivity Download PDF

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Publication number
TWI250458B
TWI250458B TW93104249A TW93104249A TWI250458B TW I250458 B TWI250458 B TW I250458B TW 93104249 A TW93104249 A TW 93104249A TW 93104249 A TW93104249 A TW 93104249A TW I250458 B TWI250458 B TW I250458B
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Taiwan
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heat
thermal conductivity
sample
metal block
measuring
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TW93104249A
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Chinese (zh)
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TW200529089A (en
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Wen-Jeng Huang
Wei-Hsiang Weng
Chuan-De Huang
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Hon Hai Prec Ind Co Ltd
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Abstract

The present invention relates to an apparatus for measuring coefficient of thermal conductivity. The apparatus includes a heat-insulated housing which defining an inner space and a vacuum pump connected to the housing for vacuating the inner space. A heat source, two metal plates, a specimen and a cooling unit are accommodated in the space. The housing is made from aluminum oxide ceramic embedded with carbon nanotubes by a spark-plasma sintering process, wherein the carbon nanotubes are perpendicular to a direction of the heat transfer such that heat can be reflected back by the carbon nanotubes. Thus, heat insulation property of the apparatus is improved.

Description

1250458 五、發明說明(1) . 【發明所屬之技術領域】 本發明係關於材料導熱係數之測量裝置,特別係關於 具有良好絕熱效果之導熱係數測量裝置。 【先前技術】 在開發功能材料過程中,經常需要測量該功能材料之 導熱性能,特別係對於導熱材料,例如導熱膠,其導熱係 數影響最終產品之導熱性能。在電子元件散熱裝置之設計 過程中,需要預先計算、模擬其導熱性能,精確測量導熱 材料之導熱係數可減少試驗次數,降低開發成本,因而成 為開發設計之關鍵。 ϋ m 目前測置材料之導熱係數主要有以下二種方法· 第十種方法係雷射閃爍法,該方法採兩高能雷射作為 熱源,短時間内迅速將一定熱量沈積於樣品一表面,並測 量樣品另一表面之溫度變化,測得樣品之熱擴散率,再通 過公式計算得出該樣品材料之導熱係數。該方法測量儀器 昂貴,成本較高,且因材料之密度變化使得測量之誤差較 大。 第二種方法係溫度梯度法,該方法將待測樣品置於一 熱源與一低溫熱沈之間,測量其間形成之溫度梯度從而計 算得到材料之導熱係數。該方法較為簡單,易操作,易實❶ 現。 理想狀態下,熱源之所有熱量應通過待測樣品傳遞至 低溫熱沈,但實際上不可避免會有一部份熱量從其他方向 散發,從而導致測量誤差。故,上述方法之測量精度主要1250458 V. INSTRUCTION DESCRIPTION OF THE INVENTION (1) Technical Field The present invention relates to a measuring device for thermal conductivity of a material, and more particularly to a thermal conductivity measuring device having a good heat insulating effect. [Prior Art] In the development of functional materials, it is often necessary to measure the thermal conductivity of the functional material, particularly for thermally conductive materials, such as thermal conductive adhesives, whose thermal conductivity affects the thermal conductivity of the final product. In the design process of the heat dissipation device of the electronic component, it is necessary to pre-calculate and simulate the thermal conductivity of the electronic component. Accurate measurement of the thermal conductivity of the thermal conductive material can reduce the number of tests and reduce the development cost, thus becoming the key to development and design. ϋ m Currently, there are two main methods for measuring the thermal conductivity of materials. The tenth method is laser scintillation method. This method uses two high-energy lasers as a heat source to quickly deposit a certain amount of heat on the surface of the sample. The temperature change of the other surface of the sample is measured, the thermal diffusivity of the sample is measured, and the thermal conductivity of the sample material is calculated by a formula. This method is expensive and costly, and the measurement error is large due to the density of the material. The second method is a temperature gradient method in which a sample to be tested is placed between a heat source and a low temperature heat sink, and a temperature gradient formed therebetween is measured to calculate a thermal conductivity of the material. The method is relatively simple, easy to operate, and easy to implement. Ideally, all of the heat from the heat source should pass through the sample to be tested to the low temperature heat sink, but in reality it is inevitable that some of the heat will be dissipated from other directions, resulting in measurement errors. Therefore, the measurement accuracy of the above method is mainly

1250458_ 五、發明說明(2) 取決於測量設備所用絕熱層之絕熱性能,一般絕熱層會使 用絕熱材料,如氧化鋁陶瓷等,將熱源與外界環境隔絕, 盡量減少熱量損失。惟,部份熱量仍會通過氧化銘陶瓷向 外傳導。 請參見第七圖,2 0 0 0年9月2 0日公告之中國大陸專利 第9 3 1 1 5 0 7 6. 0號揭露一種測量材料導熱係數之方法及其裝 置。該裝置9包括外殼1 3,其内填充有絕熱材料形成一絕 熱罩14 ; 一熱源15,其功率為P; —加熱盤10,其面積為 S,係緊貼熱源1 5設置;待測材料1 2,其厚度為L,其一表 面與加熱盤10表面緊密接觸,另一表面與一受熱盤11緊密 接觸;加熱盤1 0與受熱盤1 1分別設置有一溫度感測器1 6, 用以分別感測加熱盤1 0與受熱盤11之溫度。1為提高測量精 度,加熱盤1 0與受熱盤1 1之徑向尺寸需遠遠大於待測材料 12之厚度L。 測量待測材料1 2之導熱係數時^僅需利用溫度感測器 1 6分別測得加熱盤1 0及受熱盤1 1之溫度T1及T2,並將待測 材料12之厚度L、加熱盤10之面積S、熱源15之功率P代入 導熱方程式:1250458_ V. INSTRUCTIONS (2) Depending on the thermal insulation properties of the insulation layer used in the measuring equipment, the general insulation layer uses insulation materials such as alumina ceramics to isolate the heat source from the external environment and minimize heat loss. However, some of the heat will still be conducted outside through the oxidized ceramic. Please refer to the seventh figure, the mainland China patent published on September 20, 2000. No. 9 3 1 1 5 0 7 6. No. 0 discloses a method for measuring the thermal conductivity of a material and a device thereof. The device 9 includes a casing 13 filled with a heat insulating material to form a heat insulating cover 14; a heat source 15 having a power P; a heating plate 10 having an area S disposed close to the heat source 15; the material to be tested 1 2, the thickness of which is L, one surface is in close contact with the surface of the heating plate 10, and the other surface is in close contact with a heat receiving plate 11; the heating plate 10 and the heat receiving disk 1 1 are respectively provided with a temperature sensor 16 The temperature of the heating plate 10 and the heated disk 11 is sensed separately. 1 In order to improve the measurement accuracy, the radial dimension of the heating plate 10 and the heated disk 1 1 is much larger than the thickness L of the material 12 to be tested. When measuring the thermal conductivity of the material to be tested 12, it is only necessary to measure the temperatures T1 and T2 of the heating plate 10 and the heated disk 1 by the temperature sensor 16 respectively, and the thickness L of the material to be tested 12, the heating plate 10 area S, heat source 15 power P into the heat conduction equation:

P=kS(Tl-T2)/L 即可得出導熱係數k值。其中,熱源1 5可為電加熱, 則其功率p可用p= I V求得,I為流過熱源1 5之電流,V為熱 源1 5之電壓。 上述專利揭露之方法及裝置使用方便,測量成本亦較 低,惟,其尚具有以下缺點:首先,該裝置9内部不可避P = kS (Tl - T2) / L can get the thermal conductivity k value. Wherein, the heat source 15 can be electrically heated, and the power p can be obtained by using p = I V , I is the current flowing through the heat source 15 , and V is the voltage of the heat source 15 . The method and device disclosed in the above patent are convenient to use and have low measurement cost. However, it has the following disadvantages: First, the device 9 is inevitable inside.

第6頁 1250458 五、發明說明(3) 免會遺留有 物或多孔性 體’這樣不 確測量,造 習知技術絕 不能滿足更 充外殼1 3之 器1 6及加熱 這種設計不 有鑒於 rv 作、絕熱性 為必要。 【内容】 為克服 種可測量膠 導熱係數之 空氣, 物體時 僅帶入 成現有 熱材料 高測量 内以形 盤1 0預 利於熱此,提 優良且 影響測量 ,例如導 氣體,而 測量裝置 如氧化鋁 精度之要 成於絕熱 先包覆於 源1 5及溫 供一種可 測量精度 精度,尤其 熱膠,樣品 且樣品厚度 對此類樣品 陶瓷,其絕 求;再次, 罩1 4,並將 絕熱罩1 4内 度感測器1 6 測量膠狀或 更高之測量 當測試 内部含 因氣體 無能為 熱性能 其需將 熱源1 5 以防止 之安裝 多孔性 導熱係 樣品係 有大量 存在無 力;其 仍有不 絕熱材 、溫度 熱量散 、檢修 樣品、 數之裝 膠狀 氣 法準 次, 足, 料填 感測 失, 〇 易操 置實 習知技術 狀或多孔 裝置。 本發明測量導熱 熱源; 第 其係緊貼該 待測樣品設 一金屬塊 第一金屬 置;一冷 該第一、第二金屬塊 備而成,其形成有一 測樣品及冷卻裝置係 與該絕熱裝置相連, 之上述 性樣品 係數之 ,其係 塊設置 卻裝置 之溫度 内部空 可容納 並可將 缺點,本發明之目的係提供一 、易操作、絕熱性優良之測量 裝置包括:一用以產生熱量之 緊貼熱源設置;一待測樣品, ;一第二金屬塊,其係緊貼該 ;複數溫度感測器,用以測量 ;一絕熱裝置係由絕熱材料製 間,上述熱源、二金屬塊、待 於該内部空間;一抽真空系統 其内部空間抽真空;另夕卜,一Page 6 1250458 V. Description of the invention (3) It is not possible to leave a material or a porous body. This is not a true measurement. The knowledge of the technology must not meet the requirements of a more abundant housing. Rv, heat insulation is necessary. [Contents] In order to overcome the air that can measure the thermal conductivity of the glue, the object is only brought into the high measurement of the existing thermal material. The shape of the disk is prevailing for the heat, which is good and affects the measurement, such as conducting gas, and the measuring device is as The accuracy of alumina is to be adiabatic to be first coated on the source 1 5 and the temperature is supplied with a measurable precision, especially for hot glue, sample and sample thickness for such sample ceramics, which is absolutely demanding; again, cover 1 4 and Insulation cover 1 4 internal sensor 1 6 measurement of gel-like or higher measurement When the test contains internal gas due to the inability of the thermal performance, it is necessary to heat the source 1 5 to prevent the installation of the porous thermal conductivity sample system has a large amount of weakness; There are still hot materials, temperature heat dissipation, maintenance samples, and the number of rubber-filled gas methods are accurate, and the materials are filled and sensed, and the internship knows technical or porous devices. The invention measures a heat-conducting heat source; the first system is disposed adjacent to the sample to be tested, and a first metal piece is formed; and the first and second metal blocks are cooled, and a sample and a cooling device are formed and the heat is formed The device is connected to the above-mentioned sample coefficient, the block is disposed, but the temperature of the device is internal and can be accommodated and can be disadvantageous. The object of the present invention is to provide a measuring device which is easy to operate and has excellent heat insulation, including: The heat is closely attached to the heat source; a sample to be tested; a second metal block, which is attached to the same; a plurality of temperature sensors for measuring; a heat insulating device is made of a heat insulating material, the heat source and the second metal Block, to be in the internal space; a vacuum system, its internal space is vacuumed;

1250458 五、發明說明(4) 壓力器可施加預定 中’ g玄絕熱材料係 基體材料中,經電 成,且奈米碳管係 為5〜10%。 與習知技術相 内部之氣體抽走, 除空氣或其他氣體 準確度及可靠性; 傳遞至奈#碳管之 能,使得熱量僅能 量精度ώ另外,本 作性亦大為提高。 【實施方式】 下面結合附圖 說明。 請首先參閱第 實施方式之立體示 1 0 0及一壓力_ 2 0 0 其具有一可活動之 便將物品放入或取 器1 0 0之外壁1 0 2, 一端與抽真空裝置 真空。 壓力將容納於内部空間之元件壓緊;其 由奈米碳管有序排列分散於氧化鋁陶瓷 漿燒結(spark-plasma sintering)而 垂直熱量傳遞之方向排列,其質量含量 較,本發明利用抽真空系統將測量裝置 既可確保樣品厚度之測量,又可完全排 對測量精度之不良影響,從而提高測量 又因奈米碳管徑向不導熱之特性,使得 熱量反射回去,提高測量裝置之絕熱性 向預定方向傳遞,可進一步提高最終測 發明測量裝置容易開啟:關閉,其可操 及具體實施方式對本發明作進一步詳細 一圖,本發明導熱係數測量裝置9 0第一 意圖。該測量裝置9 0包括一絕熱容器 。該絕熱容器1 0 0係一方形密封容器, 上蓋1 0 4,該上蓋1 0 4可打開或關合,以 出。另外,一抽氣管1 0 6穿透該絕熱容 使得其一端延伸至絕熱容器1 0 0内,另 (圖未示)相連,可將絕熱容器1 0 0内抽1250458 V. INSTRUCTIONS (4) The pressure device can be applied to a predetermined medium-weighted thermal insulation material, which is electroformed and has a carbon nanotube system of 5 to 10%. Gas extraction inside the conventional technology, in addition to the accuracy and reliability of air or other gases; the ability to pass to the carbon nanotubes, so that the heat can only be accurate, and the nature is greatly improved. [Embodiment] Hereinafter, description will be made with reference to the drawings. Please first refer to the stereoscopic display of the first embodiment 100 and a pressure _ 2 0 0 which has an activity to put the article into or out of the outer wall 1 0 0 of the heater 100, one end and the vacuum of the vacuuming device. The pressure compresses the components housed in the inner space; it is arranged in an orderly arrangement of the carbon nanotubes in the spark-plasma sintering and arranged in the direction of vertical heat transfer, and the mass content is higher, and the present invention utilizes vacuuming. The system will measure the thickness of the sample and ensure the adverse effect of the measurement accuracy, thus improving the measurement and the non-thermal conductivity of the carbon nanotubes, so that the heat is reflected back and the thermal insulation of the measuring device is improved. The predetermined direction transfer can further improve the final measurement of the invention. The measuring device is easy to open: closed, which can be operated in a detailed manner. The thermal conductivity measuring device of the present invention is first intended. The measuring device 90 comprises an insulated container. The heat insulating container 100 is a square sealed container, and the upper cover 104 is opened or closed to be discharged. In addition, an air suction pipe 106 penetrates the heat insulating capacity such that one end thereof extends into the heat insulating container 100, and the other (not shown) is connected, and the heat insulating container can be evacuated.

1250458 五、發明說明(5) 請參閱第二圖,絕熱容器丨〇 〇具有雙層結構,裡層係 絕熱性保溫層11 〇,外層係防護性外壁丨〇 2,可防止磨損。 保溫層1 1 0包括絕熱側壁丨丨4及一絕熱底壁丨丨6,一起圍人。 形成一上端開口之方形内部空間,絕熱板丨丨5之形狀與^ 開口形狀相配,並可上下移動。壓力器2 〇 〇與該絕熱板1 1 5 相連’並可施加標準壓力至該絕熱板1 1 5。 <1 絕熱容器1 0 〇内部,一冷卻裝置丨4 〇設置於該内部空間 之底端,即靠近該絕熱底壁116處。一銅塊126、待測^二 1 3 0及銅塊1 2 4順序堆壘於冷卻裝置1 4 〇上,這樣,使得待 樣品U0今於二銅塊i Μ、;[ μ之間。其中,上述二鋼塊、 、土已1以及待測樣品具有相同截面積A,並且該截面尺寸 於待測樣品1 3 〇之厚度Η。一熱源1 2 〇設,置於銅塊1 2 4與 :熱板115之間,而前述壓力器2〇〇施加標準壓力至該絕埶 5 ’將上述各物件緊壓。 抽氣管1 0 6設置於一絕熱側壁丨丨4中部,最好設 應待測揭〇 1 q η ^ 抽 & σ° 1 3 0南度處,這樣可有利於將待測樣品之氣體 可’尤其係測量膠狀或多孔性樣品時,先將氣體抽走方 性Υ確測里其厚度’從而確保測量結果之準確性及可靠 4丄士 真空裝·置(圖未示)通過抽氣管1 0 6將絕熱容器1 0 0内 精^ ^曼’可排除空氣對測量結果之不利影響,提高測量 銅為減小界面熱阻,銅塊126與樣品130之接觸表面、及 ‘ 1 24與樣品1 30之接觸表面均應拋光,使接觸面平整光 滑為佳。1250458 V. INSTRUCTIONS (5) Please refer to the second figure. The insulated container 丨〇 has a double-layer structure, the inner layer is a heat-insulating insulation layer 11 〇, and the outer layer is a protective outer wall 丨〇 2 to prevent wear. The insulating layer 110 includes a heat insulating side wall 丨丨4 and a heat insulating bottom wall 丨丨6, together with the person. A square inner space having an open upper end is formed, and the shape of the heat insulating plate 丨丨 5 matches the shape of the opening and can be moved up and down. The pressure vessel 2 〇 is connected to the heat insulating plate 1 15 ' and a standard pressure can be applied to the heat insulating plate 1 15 . <1 Inside the heat insulating container 10, a cooling device 丨4 〇 is disposed at the bottom end of the inner space, that is, near the heat insulating bottom wall 116. A copper block 126, a test piece 2 130 and a copper block 1 2 4 are sequentially stacked on the cooling device 14 4 such that the sample U0 is between the two copper blocks i Μ; Wherein, the above two steel blocks, the soil 1 and the sample to be tested have the same cross-sectional area A, and the cross-sectional dimension is the thickness 1 of the sample to be tested 1 3 Η. A heat source 1 2 is disposed between the copper block 1 24 and the hot plate 115, and the aforementioned pressure device 2 〇〇 applies a standard pressure to the insulating plate 5 ′ to press the above-mentioned articles. The exhaust pipe 1 0 6 is disposed in the middle of an adiabatic side wall 丨丨4, preferably set to be measured by 1 q η ^ pumping & σ ° 1 3 0 south, which is beneficial to the gas of the sample to be tested 'In particular, when measuring a colloidal or porous sample, the gas is first removed and the thickness is determined. This ensures the accuracy of the measurement results and is reliable. 4 gentleman vacuum installation (not shown) through the suction pipe 1 0 6 The heat-insulating container 1 0 0 can eliminate the adverse effect of air on the measurement results, improve the measurement of copper to reduce the interface thermal resistance, the contact surface of the copper block 126 and the sample 130, and '1 24 The contact surfaces of sample 1 30 should be polished to make the contact surface smooth and smooth.

1250458 五、發明說明(6) 上述絕熱側壁1 1 4、底壁1 1 6及絕熱板1 1 5均係由氧化 鋁陶瓷1 1 3及奈米碳管1 1 2形成之複合材料製成,該複合材 料係以氧化鋁陶瓷1 1 3為基體,奈米碳管1 1 2為填充物經電 漿燒結(spark-plasma sintering)而成。其中奈米碳管 1 1 2係垂直於熱傳遞方向排佈,本實施方式中,奈米碳管 1 1 2係垂直於絕熱側壁1 1 4、底壁1 1 6及絕熱板1 1 5之厚度方 向而排列,奈米碳管1 1 2之質量含量為5〜1 0 %。 奈米碳管1 1 2係由石墨層碳原子捲曲而成的管狀材 料,其直徑一般為幾奈米到幾十奈米,可為連續排列,亦 可不連續排列。奈米碳管1 1 2具有獨特導熱性能,其軸向 導熱性極優異,但徑向不導熱,故,當熱量垂直奈米碳管 1 1 2傳遞'時,不會沿其徑向傳遞,奈米碳管i 1 2將熱量反射 回去。故,本發明使用之絕熱容器1 0 0具有優良之絕熱性 能,較傳統之氧化鋁陶瓷具有更高絕熱效果,可確保熱源 1 2 0產生之熱量僅能沿銅塊1 2 4向樣品1 3 0方向傳遞,並且 避免熱量在傳遞過程中透過絕熱側壁11 4散發到絕熱容器 1 0 0外面。覆蓋於絕熱側壁1 1 4外層之外壁1 0 2起保護作 用,可防止外力對絕熱側壁1 1 4之破壞或磨損。 請一併參_見第三圖及第四圖,當上述複合材料製成方 形之絕熱側壁1 1 4、底壁1 1 6或絕熱板11 5時,其中奈米碳 管1 1 2可以有二種排佈方式。第一種係沿X軸方向,即絕熱 側壁1 1 4寬度方向排佈,第二種係沿y軸方向,即絕熱側壁 1 1 4長度方向排佈。如此,當熱量沿z轴方向,即絕熱側壁 1 1 4之厚度方向傳遞時,因奈米碳管1 1 2徑向不導熱特性,1250458 V. INSTRUCTION DESCRIPTION (6) The above-mentioned heat insulating side wall 1 14 , bottom wall 1 16 and insulating plate 1 15 are both made of a composite material formed of alumina ceramic 1 13 and carbon nanotube 1 1 2 , The composite material is made of alumina ceramics 1 1 3 and the carbon nanotubes 1 1 2 is a filler which is sintered by spark-plasma sintering. The carbon nanotubes 1 1 2 are arranged perpendicular to the heat transfer direction. In the present embodiment, the carbon nanotubes 1 1 2 are perpendicular to the adiabatic sidewalls 1 1 4 , the bottom wall 1 16 and the heat insulating plates 1 1 5 Arranged in the thickness direction, the mass content of the carbon nanotubes 1 1 2 is 5 to 10%. The carbon nanotubes 1 1 2 are tubular materials obtained by crimping carbon atoms of graphite layers, and generally have a diameter of several nanometers to several tens of nanometers, and may be arranged continuously or discontinuously. Nano carbon tube 1 1 2 has unique thermal conductivity, its axial thermal conductivity is excellent, but it is not thermally conductive in the radial direction. Therefore, when the heat is perpendicular to the carbon nanotubes 1 12, it will not transmit along its radial direction. The carbon nanotube i 1 2 reflects the heat back. Therefore, the insulated container 100 used in the present invention has excellent heat insulating performance, and has higher heat insulating effect than the conventional alumina ceramic, and ensures that the heat generated by the heat source 120 can only be along the copper block 1 2 4 to the sample 1 3 . The 0 direction is transmitted, and heat is prevented from being radiated to the outside of the heat insulating container 100 through the heat insulating side wall 11 4 during the transfer. Covering the outer wall of the outer wall of the insulating wall 1 1 4 protects against damage or wear of the insulating sidewall 1 14 by external force. Please refer to the third and fourth figures together. When the composite material is made into a square insulating sidewall 1 14 , a bottom wall 1 16 or a heat insulating plate 11 5 , the carbon nanotubes 1 1 2 may have Two ways of arrangement. The first type is arranged along the X-axis direction, i.e., the width direction of the heat insulating side wall 1 1 4, and the second type is arranged along the y-axis direction, that is, the longitudinal direction of the heat insulating side wall 1 1 4 . Thus, when heat is transferred in the z-axis direction, that is, the thickness direction of the adiabatic side wall 1 14 , the carbon nanotubes 1 1 2 are not thermally conductive,

第10頁 1250458 五、發明說明(7) 熱量被反射回去,從而達到保溫絕熱之優異效果。 當然,因絕熱容器1 0 0亦可為其他形狀,如常用圓柱 形測量裝置來測量表面為圓形之樣品,這種情況下,絕熱 容器1 0 0係由一圓柱形絕熱側壁及圓形底壁及絕熱板構 成。 請參見第五圖,係本發明第二實施例之圓柱形絕熱側 壁1 1 7之剖面示意圖,其中奈米碳管1 1 9係沿圓柱之軸向方 向排佈,亦即垂直於圓柱之徑向方向。圓柱形絕熱壁1 1 7 需與圓形底壁(圖未標示)及圓形絕熱板(圖未標示)配合使 用,可由第一實施例之底壁1 1 6及絕熱板1 1 5製成尺寸相配 之圓形即可。當熱量由圓柱内向外傳遞時,因奈米碳管 1 1 9之徑响不導熱特性,將熱量反射回去,k而達到保溫 絕熱之優異效果。 請一併參見第二圖及第六圖,本發明導熱係數測量裝 置9 0使用時,順序將冷卻裝置1 1 6、銅塊1 2 6、待測樣品 1 3 0、銅塊1 2 4及熱源1 2 0放入絕熱容器1 0 0内部並密合封 閉。其中該冷卻裝置1 1 6可包括冷卻水管等,熱源1 2 0可為 電加熱,如此在熱源1 2 0與冷卻裝置1 1 6之間形成一溫度梯 度場。利用壓力器2 0 0施加一標準壓力至該絕熱板1 1 5,壓 力器2 0 0施加之壓力一般為2 0〜2 5 1 b ί範圍内,利用抽真空 裝置(圖未示)經抽氣管1 0 6將絕熱容器1 0 0抽真空,即可開 始測量。 在銅塊1 2 4 —側面,距離樣品1 3 0上表面a 1、a 2、a 3距 離處分別設置溫度感測點D 1、D 2、D 3,利用溫度感測裝置Page 10 1250458 V. Description of the invention (7) The heat is reflected back to achieve the excellent effect of thermal insulation. Of course, since the heat insulating container 100 can also have other shapes, such as a commonly used cylindrical measuring device to measure a sample having a circular surface, in this case, the heat insulating container 100 is composed of a cylindrical insulating sidewall and a circular bottom. Wall and insulation board. Referring to FIG. 5, it is a schematic cross-sectional view of a cylindrical insulating sidewall 1 17 according to a second embodiment of the present invention, wherein the carbon nanotubes 1 19 are arranged along the axial direction of the cylinder, that is, perpendicular to the diameter of the cylinder. Direction. The cylindrical heat insulating wall 1 1 7 needs to be used together with a circular bottom wall (not shown) and a circular heat insulating plate (not shown), and can be made of the bottom wall 1 16 of the first embodiment and the heat insulating plate 1 1 5 . The size of the circle can be matched. When the heat is transferred from the inside to the outside of the cylinder, the heat of the carbon nanotubes is not reflected by the diameter of the carbon nanotubes, and the heat is reflected back to the k to achieve the excellent effect of heat insulation. Referring to FIG. 2 and FIG. 6 together, when the thermal conductivity measuring device 90 of the present invention is used, the cooling device 1 16 , the copper block 1 2 6 , the sample to be tested 1 30 , the copper block 1 2 4 and The heat source 120 is placed inside the insulated container 100 and tightly closed. The cooling device 161 may include a cooling water pipe or the like, and the heat source 120 may be electrically heated, so that a temperature gradient field is formed between the heat source 120 and the cooling device 1 16 . Applying a standard pressure to the heat insulating plate 1 15 by the pressure device 2000, the pressure applied by the pressure device 2000 is generally in the range of 2 0~2 5 1 b ί, and is pumped by a vacuuming device (not shown). The air tube 1 0 6 evacuates the adiabatic container 100 to start measuring. On the side of the copper block 1 2 4 - a temperature sensing point D 1 , D 2 , D 3 is respectively disposed from the upper surface a 1 , a 2 , a 3 of the sample 1 3 0, and the temperature sensing device is used.

1250458 ____ 五、發明說明(8) (圖未標示)可測得此三點位置之溫度ΤΙ、T2、T3,溫度感 測裝置包括熱電偶等。同樣,在銅塊1 2 6 —側面,距離樣 品1 3 0下表面s 1、s 2、s 3距離處分別設置溫度感測點Μ 1、 M2、M3,利用溫度感測裝置可測得該三點之溫度Τ4、Τ5、 Τ6 〇 根據傅利葉公式:1250458 ____ V. Description of the invention (8) (not shown) The temperature ΤΙ, T2, T3 of the three-point position can be measured, and the temperature sensing device includes a thermocouple. Similarly, on the side of the copper block 1 2 6 , a temperature sensing point Μ 1, M2, M3 is respectively disposed at a distance from the lower surface s 1 , s 2 , s 3 of the sample 1 3 0, and the temperature sensing device can measure the distance. The temperature of three points Τ4, Τ5, Τ6 〇 according to the Fourier formula:

Q^-kA ΔΤ/ AD 上式中A為樣品1 3 0表面積,△ D為熱量流過樣品1 3 0之 距離,即樣品1 3 0之厚度。要測得樣品1 3 0之導熱係數K 值,需要表確定通過樣品130之熱通量Q值及其上下表面溫 度差: ΔΤ-Tlow-Tup 1 即上表面溫度Tup及下表面溫度T low之差值。 因絕熱容器1 0 0之絕熱側壁1 1 4及絕熱板丨丨5不能傳遞 熱量,故,熱量只能夠從熱源1 2 〇向冷卻裝置丨丨6傳遞,且 傳遞過私中沒有熱量散失。如此,從Μ流至的熱通量 Q32、從D2流至D1的熱通量Q21、流過樣品之熱通量q、從 流至M2的熱通量Q12,以及從Μ2流至⑽的熱通量Q23均相 等,如此僅需.求得任何一個熱通量即可得知樣品13〇的熱 通量。而銅塊124、126之導熱係數u為已知值,則根據傅 利茱公式,可得流過銅塊124、136之熱通量值q。 —根據銅塊1 24之各點溫度呈線性關係,^第六圖所 :可由D 3 D 2 D1點之溫度T1、T 2、T 3求得樣品1 3 0上 、面度Tup同理’由銅塊1 26上三點Ml、M2、M3之溫度Q^-kA ΔΤ/ AD where A is the surface area of sample 1 3 0, and Δ D is the distance that heat flows through sample 1 3 0, that is, the thickness of sample 130. To measure the thermal conductivity K value of sample 130, a table is required to determine the heat flux Q value through sample 130 and the difference in temperature between the upper and lower surfaces: ΔΤ-Tlow-Tup 1 ie upper surface temperature Tup and lower surface temperature T low Difference. Since the heat insulating side wall 1 1 4 of the heat insulating container 100 and the heat insulating plate 5 cannot transfer heat, heat can only be transferred from the heat source 12 to the cooling device 6 and no heat is dissipated. Thus, the heat flux Q32 from turbulence, the heat flux Q21 flowing from D2 to D1, the heat flux q flowing through the sample, the heat flux Q12 flowing from M2, and the heat flowing from Μ2 to (10) The flux Q23 is equal, so only need to find any heat flux to know the heat flux of the sample 13〇. The thermal conductivity u of the copper blocks 124, 126 is a known value, and the heat flux value q flowing through the copper blocks 124, 136 can be obtained according to the Fourier formula. - According to the temperature of each point of the copper block 1 24, the sixth figure: the temperature of the D 3 D 2 D1 point T1, T 2, T 3 can be obtained on the sample 1 3 0, the face Tup is the same as ' The temperature of the three points M1, M2, M3 from the copper block 1 26

第12頁 1250458 五、發明說明(9) T4、T5、T6可求得樣品下表面溫度Tlow。將上述熱通量及 溫度T u p及T 1 〇 w代入公式即可得出樣品1 3 0導熱係數。 所屬領域人員應明白,本發明利用奈米碳管1 1 2之徑 向不導熱性,使得絕熱容器1 〇 〇絕熱性能大為提高,使得 熱量僅能向預定方向傳遞;而抽氣管1 0 6及抽真空裝置可 將絕熱容器1 0 0内抽真空,排除空氣影響,可進一步提高 最終測量精度;而熱源1 2 0並不限於電加熱,其他能夠提 供足夠熱量之方式均可適用,另外,冷卻裝置1 4 0亦不限 於冷卻水管,液氮等其他冷卻方式亦可適用本發明,銅塊 1 2 4、1 2 6亦可用其他金屬代替,其目的僅在於根據現有已 知導熱係數之材料來測得熱通ϊ及樣品130表面溫度Tup及 T 1 〇 w 〇 ; 綜上所述,本發明確已符合發明專利之要件,遂依法 提出專利申請。惟,以上所述者僅為本發明之較佳實施 例,自不能以此限制本案之申請專利範圍。舉凡熟悉本案 技藝之人士援依本發明之精神所作之等效修飾或變化,皆 應涵盖於以下申請專利範圍内。 ΦPage 12 1250458 V. INSTRUCTIONS (9) The lower surface temperature Tlow of the sample can be obtained from T4, T5 and T6. By substituting the above heat flux and temperature T u p and T 1 〇 w into the formula, the thermal conductivity of the sample 130 can be obtained. It should be understood by those skilled in the art that the present invention utilizes the radial non-thermal conductivity of the carbon nanotubes 112, so that the thermal insulation performance of the heat insulating container 1 is greatly improved, so that heat can only be transmitted to a predetermined direction; and the exhaust pipe 1 0 6 And the vacuuming device can vacuum the insulated container 100 to eliminate the influence of air, which can further improve the final measurement accuracy; and the heat source 120 is not limited to electric heating, and other methods capable of providing sufficient heat can be applied. The cooling device 140 is not limited to the cooling water pipe, and other cooling methods such as liquid nitrogen can also be applied to the present invention. The copper blocks 1 2 4 and 1 2 6 can also be replaced by other metals, and the purpose thereof is only based on the material having the known thermal conductivity. The surface temperature Tup and T 1 〇w 〇 of the heat pass and the sample 130 are measured; in summary, the invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the present invention are intended to be included within the scope of the following claims. Φ

第13頁 1250458_ 圖式簡單說明 第一圖係本發明之導熱係數測量裝置之立體示意圖。 第二圖係本發明導熱係數測量裝置去除上蓋之内部示意 圖。 第三圖係本發明導熱係數測量裝置之方形絕熱側壁示意 圖。 第四圖係本發明導熱係數測量裝置之方形絕熱側壁示意 圖。 第五圖係本發明導熱係數測量裝置之圓柱形絕熱側壁示 意圖。 第六圖係熱電偶測得銅金屬之溫度與距離關係圖。 第七圖係習知技術導熱係數測量裝置之示意圖。 【主要元件符號說明】 1 測 量 裝 置 90 絕 敎 容器 100 外 壁 102 上 蓋 104 抽 氣 管 106 保 溫 層 110 奈 米 碳 管 112, 119 氧 化 鋁陶瓷 113 絕 敎 广、、 側 壁 114, 117 絕 軌 板 115 底 壁 116 敎 源 120 銅 塊 124, 126 樣 品 130 冷 卻 裝 置 140 壓 力 器 200Page 13 1250458_ BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a perspective view of a thermal conductivity measuring device of the present invention. The second figure is an internal schematic view of the thermal conductivity measuring device of the present invention for removing the upper cover. The third figure is a schematic view of a square insulating sidewall of the thermal conductivity measuring device of the present invention. The fourth figure is a schematic view of a square insulating sidewall of the thermal conductivity measuring device of the present invention. The fifth drawing is a schematic view of the cylindrical adiabatic side wall of the thermal conductivity measuring device of the present invention. The sixth figure is a graph showing the relationship between temperature and distance of copper metal measured by a thermocouple. The seventh figure is a schematic diagram of a conventional thermal conductivity measuring device. [Main component symbol description] 1 Measuring device 90 Insulation container 100 Outer wall 102 Upper cover 104 Exhaust pipe 106 Insulation layer 110 Carbon nanotubes 112, 119 Alumina ceramic 113 Absolutely wide, side wall 114, 117 End plate 115 bottom wall 116 敎源120 copper block 124, 126 sample 130 cooling device 140 pressure 200

第14頁Page 14

Claims (1)

1250458 六、申請專利範圍 1. 一種測量導熱係數之裝置,其包括: 一熱源,其可產生熱量; 一第一金屬塊,其係緊貼該熱源設置; 一待測樣品,其係緊貼該金屬塊設置; 一第二金屬塊,其係緊貼該待測樣品設置; 一冷卻裝置,緊貼於該第二金屬塊;及 一絕熱裝置,係由絕熱材料製成,其形成有一内部 空間,上述熱源、第一金屬塊、待測樣品、第二金屬 塊及冷卻裝置係可容納於該内部空間; 一,抽真空系統,其可將所述絕熱裝置形成之内部空 間抽真空。 2. 如申請專利範圍第1項所述之測量導熱係1數之裝置,其 中該絕熱材料係含有奈米碳管,且該等奈米碳管係垂 直於熱量傳遞之方向排佈。 3. 如申請專利範圍第2項所述之測量導熱係數之裝置,其 中該絕熱材料係以氧化鋁陶瓷係作為基體材料,奈米 碳管有序排列分散於基體材料中。 4. 如申請專利範圍第3項所述之測量導熱係數之裝置,其 中該絕熱户才料係將氧化鋁陶瓷與奈米碳管經電漿繞結 製成。 5. 如申請專利範圍第4項所述之測量導熱係數之裝置,其 中奈米碳管之質量含量為5〜1 0 %。 6. 如申請專利範圍第1項所述之測量導熱係數之裝置,其 中該熱源係電加熱。1250458 VI. Patent Application Range 1. A device for measuring thermal conductivity, comprising: a heat source capable of generating heat; a first metal block attached to the heat source; and a sample to be tested, the system being closely attached thereto a metal block disposed; a second metal block disposed against the sample to be tested; a cooling device attached to the second metal block; and a heat insulating device formed of a heat insulating material to form an internal space The heat source, the first metal block, the sample to be tested, the second metal block and the cooling device can be accommodated in the internal space; and a vacuuming system can evacuate the internal space formed by the heat insulating device. 2. The apparatus for measuring the number of heat conduction systems according to claim 1, wherein the heat insulating material contains carbon nanotubes, and the carbon nanotubes are arranged perpendicular to the direction of heat transfer. 3. The apparatus for measuring thermal conductivity as described in claim 2, wherein the insulating material is an alumina ceramic system as a matrix material, and the carbon nanotubes are arranged in an ordered arrangement and dispersed in the matrix material. 4. The apparatus for measuring thermal conductivity as described in claim 3, wherein the adiabatic household material is formed by plasma-sealing alumina ceramics and carbon nanotubes. 5. The apparatus for measuring thermal conductivity as described in claim 4, wherein the mass of the carbon nanotubes is 5 to 10%. 6. The apparatus for measuring thermal conductivity as recited in claim 1, wherein the heat source is electrically heated. 第〗5頁 1250458 六、申請專利範圍 7. 如申請專利範圍第1項所述之測量導熱係數之裝置,其 中該第一金屬塊包括銅。 8. 如申請專利範圍第1項所述之測量導熱係數之裝置,其 中該第二金屬塊包括銅。 9. 如申請專利範圍第1項所述之測量導熱係數之裝置,其 中該第一金屬塊、第二金屬塊以及待測樣品具有相同 截面積。 1 0.如申請專利範圍第1項所述之測量導熱係數之裝置,其 中該裝置進一步包括複數溫度感測器,用以測量金屬 塊之岸度。 11.如申請專利範圍第1項所述之測量導熱係數之裝置,其 中該裝置進一步包括一可移動之絕熱七及一壓力器, 該壓力器可施加預定壓力於該絕熱板。 1 2.如申請專利範圍第1項所述之測量導熱係數之裝置,其 中該抽真空系統包括一抽氣管及一抽氣裝置,所述抽 氣管係延伸至絕熱裝置之内部空間。 1 3. —種測量導熱係數之裝置,其包括: 一絕熱裝置,其係由複數絕熱保溫壁、一底壁及一 可移動之舞熱板圍合而成,形成一閉合空間; 一熱源,二金屬塊,待測樣品及冷卻裝置係容納於 該空間内; 一壓力器,其可施加預定壓力於該頂壁; 一抽真空系統與該絕熱裝置相連,其可將該絕熱裝 置之閉合空間抽成真空;P. </ RTI> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; 8. The apparatus for measuring thermal conductivity as set forth in claim 1, wherein the second metal block comprises copper. 9. The apparatus for measuring thermal conductivity according to claim 1, wherein the first metal block, the second metal block, and the sample to be tested have the same cross-sectional area. A device for measuring thermal conductivity as recited in claim 1, wherein the device further comprises a plurality of temperature sensors for measuring the shore of the metal block. 11. The apparatus for measuring thermal conductivity as set forth in claim 1, wherein the apparatus further comprises a movable adiabatic seven and a pressure vessel that applies a predetermined pressure to the insulating panel. 1 2. The apparatus for measuring thermal conductivity according to claim 1, wherein the evacuation system comprises an exhaust pipe and an air suction device, the exhaust pipe system extending to an inner space of the heat insulating device. 1 3. A device for measuring thermal conductivity, comprising: an adiabatic device, which is formed by enclosing a plurality of insulating thermal insulation walls, a bottom wall and a movable dance hot plate to form a closed space; a heat source, a metal block, the sample to be tested and the cooling device are housed in the space; a pressure device that applies a predetermined pressure to the top wall; and a vacuum system connected to the heat insulating device, which can close the space of the heat insulating device Vacuuming 第16頁 1250458_ 六、申請專利範圍 其中,該等保溫壁、底壁及絕熱板係由複數奈米碳 管有序排列於氧化铭陶曼基體材料中燒結而成’且該 等奈米碳管係垂直於熱量傳遞之方向。 1 4.如申請專利範圍第1 3項所述之測量導熱係數之裝置, 其中該熱源係貼靠該絕熱板設置,該待測樣品係夾於 所述二金屬塊中間,該冷卻裝置係貼靠該底壁設置。 1 5.如申請專利範圍第1 4項所述之測量導熱係數之裝置, 其中該二金屬係銅金屬製成。 1 6.如申請專利範圍第1 4項所述之測量導熱係數之裝.置, 其中進一步設置溫度感測裝置用以感測該金屬塊之溫 rv 度。 1 7 .如申'請專利範圍第1 3項所述之測量導熱、數之裝置, 其中該壓力器施加之壓力為20〜251bf範圍。 1 8.如申請專利範圍第1 3項所述之測量導熱係數之裝置, 其中熱源係電加熱提供熱量。 1 9.如申請專利範圍第1 3項所述之測量導熱係數之裝置, 其中該奈米碳管之質量含量為5〜1 0 %。Page 16 1250458_ VI. Patent application scope, wherein the heat insulating wall, the bottom wall and the heat insulating plate are formed by sequentially arranging a plurality of carbon nanotubes in an oxidized Ming Tauman matrix material and forming the carbon nanotubes It is perpendicular to the direction of heat transfer. 1 . The device for measuring thermal conductivity according to claim 13 , wherein the heat source is disposed adjacent to the heat insulation plate, and the sample to be tested is sandwiched between the two metal blocks, and the cooling device is attached. Set by the bottom wall. 1 5. The apparatus for measuring thermal conductivity as described in claim 14, wherein the two metal is made of copper metal. 1 6. The device for measuring the thermal conductivity as described in claim 14 is further provided with a temperature sensing device for sensing the temperature rv of the metal block. 1 7 . The device for measuring heat conduction and number described in claim 13 of the patent application, wherein the pressure applied by the pressure device is in the range of 20 to 251 bf. 1 8. The apparatus for measuring thermal conductivity as recited in claim 13 wherein the heat source is electrically heated to provide heat. 1 9. The device for measuring thermal conductivity according to claim 13 of the patent application, wherein the carbon nanotube has a mass content of 5 to 10%. 第17頁Page 17
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