CN1601706A - 连接粘合带的方法和装置 - Google Patents
连接粘合带的方法和装置 Download PDFInfo
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Abstract
在用于连接粘合带到物体表面的粘合带连接方法中,沿物体外部周边切割粘合带,并且然后收集已经切割的不需要粘合带,不需要粘合带是如此卷绕和收集,使粘合带的切割部分在宽度方向不收缩。
Description
技术领域
本发明涉及在半导体晶片表面上连接保护性粘合带的方法和装置,在该表面上已形成图案。
背景技术
在传统生产半导体晶片的过程中,半导体晶片(今后,简单地称为“晶片”)的背面采用诸如磨光法或抛光法等机械方法加工,或者利用刻蚀法等化学方法加工,并且晶片的厚度被相应减少。当晶片采用这些方法加工时,为保护形成在表面上的图案,在其表面应连接保护性粘合带。
就是说,晶片被转移到背面磨光过程,而其表面(有图案表面)被吸住并被卡盘台夹住用砂轮磨光。在此,由于磨光操作而在晶片表面形成应力,以至存在不利的可能性使图案被破坏或污染。因此,需要有保护性粘合带连接在表面上。
当粘合带连接在晶片的情况,一般粘合带从其一端通过滚筒的旋转而连接到晶片上,并且然后晶片的外周边缘用切割工具沿晶片切割。
近年来,晶片逐渐趋向于减薄。按照这样的趋向,晶片的强度和刚性被恶化,并且当晶片加工或转移时,容易损坏。此外,由于晶片的弯曲或翘曲,它的处理变得困难。因此,有一种采用较厚、坚硬和刚硬粘合带的趋向以便增加晶片强度并压制其翘曲(见JP-A 2003-209084)。
近年来采用上述出版物中所述厚而刚硬的粘合带对于加强晶片是有利的。不过,当粘合带连接于晶片表面并且沿外周边缘切割之后而不需要的粘合带将被卷绕时,不需要粘合带的切割部分按照卷绕力的大小集中在其中间部分,并且粘合带在其宽度方向收缩。结果,卷绕的粘合带,其中间部分互相在卷绕滚筒上重叠,使其宽度变化不定并且产生皱纹。如果粘合带在这样状态下连接在晶片上,就产生一个问题,即在粘合带和晶片之间产生气泡,或者由于粘合带的弯曲使连续加工过程不能继续下去。
发明概要
本发明考虑上述情况,并且本发明目的是提供一种连接粘合带在诸如晶片之类物体表面的方法和装置,并切割不需要的粘合带,然后卷绕和收集不需要的粘合带,使不需要的粘合带不在宽度方向收缩。
为达到上述目的,本发明具有下列配置。
就是说,本发明提供一种连接粘合带在物体表面的方法,并且沿物体外周边缘切除粘合带,然后收集已经切割的不需要粘合带,该方法包括下列步骤:
卷绕并收集不需要的粘合带,使切割部分不在宽度方向收缩;因此,不需要的粘合带宽度不变。此外,当被卷绕在滚筒上时,不需要的粘合带在卷绕中不弯曲和不产生皱纹。相应地,就有可能将粘合带连续地连接于物体。
在本发明粘合带的连接方法中,较佳地,不需要粘合带是在宽度方向施加张力下进行卷绕和收集。
按照这样的方法,不需要粘合带可以如此卷绕和收集,使其切割部分不在宽度方向收缩;因此,不需要的粘合带宽度不变。此外,当卷绕在滚筒上时,不需要的粘合带在卷绕中不弯曲或者产生皱纹之类。相应地,就有可能将粘合带连续地连接于物体。
在本发明粘合带的连接方法中,较佳地,不需要的粘合带至少是在一个中间厚的圆柱形滚筒上卷绕和收集,使其切割部分不在宽度方向收缩。
按照这样的方法,中间厚的圆柱形卷绕滚筒用来卷绕已经切割的不需要粘合带;因此,就有可能卷绕不需要的粘合带使其通过一系列加工过程而在宽度方向不收缩。
为达到上述目的,本发明具有下列配置。
就是说,本发明提供一种连接粘合带在物体表面的装置,并且沿物体外周边缘切除粘合带,然后收集已经切割的不需要粘合带,该装置包括:
用于包含物体的容器;
用于从容器中运输该物体的运输装置;
用于安装被运输装置运输的物体和使物体定位的定位装置;
夹持定位的物体用的物体夹持器;
粘合带供应单元,用来向安装在物体夹持器上的物体供应粘合带;
释放机构,用来从释放衬垫释放粘合带;
衬垫卷绕单元,用来卷绕被释放机构释放的释放衬垫;
连接机构,用来连接从粘合带供应单元供应的粘合带到物体表面;
粘合带切割装置,用来沿物体的外周边缘切割连接于物体的粘合带;和
不需要粘合带卷绕单元,用来卷绕已经被切除的不需要粘合带,其中
不需要粘合带卷绕单元至少设置一个中间厚的圆柱形滚筒,不需要的粘合带围绕在该滚筒上,使其不至于在宽度方向收缩。
按照本发明的粘合带连接装置,不需要的粘合带如此卷绕和收集,使其中间部分不在宽度方向收缩;因此,不需要的粘合带宽度不变。此外,当卷绕在滚筒上时,不需要的粘合带在卷绕中不弯曲或者产生皱纹之类。相应地,就有可能将粘合带连续地连接于物体。此外,通过改变卷绕滚筒形状成为中间厚的圆柱形形状,不需要粘合带可以在卷绕中不在宽度方向收缩。因此,有可能采用传统的粘合带连接装置而不必对其规格进行主要改变。
在此,中间厚的圆柱形卷绕滚筒的例子可以包括运输和引导不需要粘合带的引导滚筒、卷绕和收集不需要粘合带的收集卷轴等等,它们组成不需要的粘合带卷绕单元。
在本发明粘合带卷绕装置中,中间厚的圆柱形卷绕滚筒在其周边侧面具有从其旋转轴两端向旋转轴中心部分弯曲的曲率半径,其范围在1,000到100,000mm。在此,曲率半径R较佳地为1,000到80,000mm,更佳为约1,500mm。按照这样的配置,在卷绕已经沿物体的外部周边切割的不需要的粘合带以后,轴的较厚部分进入粘合带的切割部分,使不需要粘合带可以在卷绕中不至于在宽度方向收缩。
在此,卷绕滚筒可以用,例如,金属、树脂之类制造。
附图简要说明
为阐明本发明的情况,在附图中显示几种目前较佳的形式,不过应该理解,本发明不限于所显示确定的布置和手段。
图1为按照本发明实施例粘合带连接装置一个例子的示意立体图;
图2为按照本发明实施例粘合带连接装置一个例子主要部件的示意立体图;
图3为按照本发明实施例粘合带连接装置一个例子主要部件的示意立体图;
图4阐明粘合带连接装置的一系列操作;和
图5为卷绕滚筒平面图。
具体的实施方式
在此以后,本发明实施例的描述将参照附图进行。
如图1所示,按照本实施例的粘合带连接装置1主要包括用于包含晶片2(即连接粘合带的物体)的晶片容器11a、11b;作为从各晶片容器11a、11b运输晶片2的运输手段的机械手12;用于安装被机械手12运输和定位的晶片2的对准站14;作为用于夹持定位晶片2的物体夹持器的卡盘台3;用于供应粘合带4到安装在卡盘台3上的晶片2的粘合带供应单元5;用于从释放衬垫6释放粘合带4的释放机构,用于卷绕被释放机构7释放的释放衬垫6的衬垫卷绕单元8,用于将从粘合带供应单元5供应的粘合带4连接到晶片2的连接机构9;用于沿晶片2外周边缘切割连接到晶片2的粘合带4的粘合带切割装置10;和用于卷绕不需要的粘合带4的不需要粘合带卷绕单元15。不需要粘合带卷绕单元15设置有一个中间厚的圆柱形卷绕滚筒16。
晶片容器11a、11b可以在其中容纳并安装在多个台上的多个晶片2。在此,各晶片2处于水平姿态,此时其图案表面向上。
机械手12由驱动机构(未示)转动。机械手在其尖端设置马蹄形晶片夹持器17。晶片夹持器17设置有吸孔(未示),使晶片2从背面被真空吸住。
就是,机械手12的晶片夹持器17向后在容纳在晶片容器11a、11b中在多个台上的晶片2之间移动,并且从其背面吸住和夹住晶片。被吸住和夹住的晶片2依次运输到作为定位手段的对准台14,卡盘台3和晶片2容器11a、11b。
对准台14在方位平面等的基础上使装上的晶片2定位。
卡盘台3使装上的晶片2根据方位平面之类定位,并且覆盖晶片2的整个背面和用真空吸住晶片2。就是说,卡盘台3在其外部周边区域和中心区域设置吸孔。
卡盘台3上设置多个凹槽。粘合带切割装置10的刀20(将在以后描述)插入在凹槽中,而粘合带4沿晶片2的外部周边的切割。按照晶片2的不同尺寸凹槽具有不同的外形。粘合带切割装置10的刀20所插入凹槽的最初位置在宽度上是较宽的,该宽度设置在卡盘台3的半径方向,并且所有凹槽互相连接。
如图3所示,粘合带供应单元5与释放衬垫6卷绕和引导从粘合带卷轴21解开的粘合带4围绕和进入包括导向滚筒组的释放机构7。粘合带供应单元5可旋转地被装置主体(未示)的垂直壁部所支承,而其旋转用制动机构之类所限制。
衬垫卷绕单元8包括联合地连接于诸如马达之类驱动机构的收集卷轴22,和可旋转地被装置主体(未示)垂直壁部所支承的导向滚筒组。
如图4所示,连接机构9由装置主体的导轨24所掌握,使连接机构9的框架23能够朝粘合带移动方向滑动。连接机构9联合地通过诸如马达(未示)的驱动单元连接。连接滚筒25可旋转地被框架23所支承,并且通过气缸(未示)之类垂直地摇动。就是说,在连接滚筒25压紧在粘合带4表面并且旋转时,粘合带4连接在晶片2的表面上。
如图2所示,粘合带切割装置10包括以可垂直移动方式附着在球轴35上的切割器单元26;垂直地移动切割器单元26的垂直驱动单元27;和用于控制垂直驱动单元的控制单元(未示)。
切割器单元26包括以悬臂方式被垂直驱动单元27支承的臂部28;装在臂部28末端上部的马达29;和刀20。刀20的一端连接于向下穿透臂部28的马达29的旋转轴,而刀20的切割器向下固定使刀20能够转动。
垂直驱动单元27沿球轴35垂直运动。球轴35在其底部设置限制块(虽然没有显示)以限制垂直驱动单元27最下面部分的位置(高度)。
马达29把旋转力通过旋转轴传递到刀20以便转动刀20。
如图4所示,不需要粘合带分离机构30具有装置主体导轨24所控制的框架31,使框架31可以朝粘合带运动方向滑动,并且联合地通过诸如马达(未示)的驱动机构连接。分离滚筒32可旋转地由框架31所支承。分离滚筒32从晶片2分离已经沿晶片2外周边缘切割的不需要粘合带。
不需要粘合带卷绕单元15的收集卷轴33枢转地由粘合带连接装置1的垂直壁部支承,并且联合地连接到诸如马达的驱动机构。就是说,如果从粘合带供应单元5解开预定数量的粘合带4并提供给晶片2,驱动单元运转而已经切割的不需要粘合带4围绕在收集卷轴33上。
中间厚的圆柱形卷绕滚筒16设置在收集卷轴33和不需要粘合带分离机构30之间。按照这样的配置,已经沿晶片2形状切割的不需要粘合带4的切割部分进入中间厚的圆柱形形状的厚轴部分。不需要粘合带4围绕在收集卷轴33上,使粘合带4以这样的方式伸展,以至未切割部分不在宽度方向收缩。因此,围绕在卷轴33上的不需要粘合带不弯曲并且当卷绕时不集中在中心部分,而且所有从粘合带供应单元5供应的粘合带4能够被卷绕和收集。因此,有可能连续地连接粘合带4在晶片2的表面上。
如图5所示,中间厚的圆柱形卷绕滚筒16具有一种形状,其周边侧面增大,使其从旋转轴X的两端弯曲趋向旋转轴X的中心部分。在此,卷绕滚筒16周边侧面的曲率半径R可以按照粘合带4的刚度、厚度等而适当地变化。曲率半径R较佳地在1,000到100,000mm范围内,更佳约为1,500mm。此外,中间厚的圆柱形卷绕滚筒16可以用,例如,诸如不锈钢、树脂等制成。虽然在本实施例中设置一个卷绕滚筒16,也可以设置多个中间厚的圆柱形滚筒,而且卷绕滚筒的数量可以按照粘合带4的刚度及厚度而适当地变化。
其次,将参照附图给出一系列连接坚硬和厚实的粘合带4到晶片2表面上的操作。在晶片容器11a、11b的多个台上容纳多个晶片2。通过机械手12从晶片容器11a、11b之一中取出一个晶片2。在此,机械手12的晶片夹持器17插入晶片容器11a、11b中的晶片2之间。机械手12通过晶片夹持器17从晶片背面吸住和夹持晶片2,并且晶片2被运输到对准台14。
装在对准台14上的晶片2根据方位平面或缺口定位。在晶片2定位后,晶片2的背面被机械手12吸住和夹持并且晶片2被运输到卡盘台3。
装在卡盘台3上的晶片2被定位,并且被吸住和夹持。在此,粘合带4的连接装置9和粘合带分离机构30位于其初始位置,而切割器单元26位于上面的待命位置。
当晶片2的定位动作完成以后,粘合带4连接机构9的连接滚筒25向下摇动,连接滚筒25压紧粘合带4,并且在这样状态下连接滚筒25在晶片2上以相反于粘合带运动方向旋转,使粘合带4均匀地连接在晶片2的整个表面。当粘合带4的连接机构9到达终点时,连接滚筒向上运动。
其次,切割器单元26降下到粘合带的切割位置,而刀20刺入并穿透粘合带4。在此,穿入粘合带4的刀20在预定位置(高度)上停止。在预定位置上停止的刀20沿设置在卡盘台3上的凹槽移动。就是说,刀20沿晶片2的外部周边切割粘合带4。在此,通过连接机构9和不需要粘合带分离机构30对于粘合带4施加张力。
在粘合带4切割以后,切割器单元26向上移动并回到待命位置。
接着,不需要粘合带分离机构30卷绕起已经在晶片2上切割的不需要粘合带4并且从晶片2上分离不需要粘合带4,同时在晶片2上以相反于粘合带运动方向移动。
当不需要粘合带4到达分离操作位置时,不需要粘合带分离机构30和连接机构9在粘合带运动方向移动,并回到其初始位置。在此,有中间厚的圆柱形卷绕滚筒16在宽度方向对不需要粘合带4施加张力,而不需要粘合带4围绕在收集卷轴33周围使其不致在宽度方向收缩。按照这样的操作,粘合带4从粘合带供应单元5连同预定数量的释放衬垫6一起解开,并且当粘合带4通过释放机构7时,释放衬垫6和粘合带4互相分离。按照上述程序,用于连接粘合带4到晶片2表面的一系列操作就已完成。
如上所描述,按照本发明,当粘合带连接在晶片表面时,粘合带在其切割后并不在宽度方向收缩或变形,以至粘合带连接于晶片的性质可以稳定。此外,已经切割的不需要粘合带可以整齐地卷绕。
在上述实施例中,只有卷绕滚筒16形成为中间厚的圆柱形状;不过,收集卷轴33也可以形成中间厚的圆柱形状。
本发明可以用其它特定形式实施而不至于偏离其精神和本质属性,并且相应地应该参照所附权利要求而不是上述说明书作为本发明范围的说明。
Claims (9)
1.一种粘合带连接方法,以便将粘合带连接到物体表面,沿物体的外周边缘切割粘合带,并且然后收集已经切割的不需要粘合带,该方法包括下列步骤:
卷绕并收集不需要的粘合带,使不需要粘合带在其切割部分上在宽度方向上不致收缩。
2.按照权利要求1所述的粘合带连接方法,其特征在于,不需要粘合带当在其宽度方向上施加张力时被卷绕和收集。
3.按照权利要求1所述的粘合带连接方法,其特征在于,不需要粘合带被卷绕在至少一个中间厚的圆柱形卷绕滚筒上,并被卷绕和收集,这样,粘合带在其切割部分上在宽度方向不收缩。
4.一种粘合带连接装置,以便将粘合带连接到物体表面,沿物体的外周边缘切割粘合带,并且然后收集已经切割的不需要粘合带,该装置包括:
容器,用于在其中包含物体;
运输装置,用于从容器中运输该物体;
定位装置,用于在其上安装由运输装置运输的物体,并且使物体定位;
物体夹持器,用于夹持定位的物体;
粘合带供应单元,用于供应粘合带到安装在物体夹持器上的物体;
释放机构,用于从一释放衬垫释放粘合带;
衬垫卷绕单元,用于卷起由释放机构释放的释放衬垫;
连接机构,用于将从粘合带供应单元供应的粘合带连接到物体的表面;
粘合带切割装置,用于沿物体外部周边切割连接在物体上的粘合带;和
不需要粘合带卷绕单元,用于卷起已经切割的不需要的粘合带,其中
不需要粘合带卷绕单元上设置有至少一个中间厚的圆柱形卷绕滚筒,不需要粘合带卷绕在该滚筒上,从而不在宽度方向收缩。
5.按照权利要求4的粘合带连接装置,其特征在于,中间厚的圆柱形卷绕滚筒是运输和引导不需要粘合带的引导滚筒。
6.按照权利要求4的粘合带连接装置,其特征在于,中间厚的圆柱形卷绕滚筒是卷起和收集不需要粘合带的收集卷轴。
7.按照权利要求4的粘合带连接装置,其特征在于,中间厚的圆柱形卷绕滚筒在其从旋转轴两端向旋转轴中心部分弯曲的周边侧面上具有曲率半径,其范围在1,000到100,000mm内。
8.按照权利要求4的粘合带连接装置,其特征在于,中间厚的圆柱形卷绕滚筒包括用金属制成的轴。
9.按照权利要求4的粘合带连接装置,其特征在于,中间厚的圆柱形卷绕滚筒包括用树脂制成的轴。
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CN102097294A (zh) * | 2009-11-20 | 2011-06-15 | 日东电工株式会社 | 粘合带粘贴装置及粘合带粘贴方法 |
CN101150046B (zh) * | 2006-09-20 | 2012-02-22 | 日东电工株式会社 | 粘贴带切断方法及采用该方法的粘贴带粘贴装置 |
CN101252080B (zh) * | 2007-02-22 | 2012-08-08 | 日东电工株式会社 | 粘合带粘贴装置 |
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JP4746003B2 (ja) * | 2007-05-07 | 2011-08-10 | リンテック株式会社 | 移載装置及び移載方法 |
DE102008018173A1 (de) * | 2008-04-03 | 2009-10-08 | Bizerba Gmbh & Co. Kg | Ablagevorrichtung für Lebensmittelscheiben, Lebensmittel-Schneidemaschine, Verfahren zur Ablage von Lebensmittelscheiben und Trennblatt-Endlosband |
CN110253875B (zh) * | 2019-08-09 | 2021-05-28 | 湖南明意湖智能科技股份有限公司 | 一种基于安全防护的玻璃自动贴膜机 |
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US6405957B1 (en) * | 2000-02-15 | 2002-06-18 | Imation Corp. | Data storage tape cartridge and tape path with an idler wrap guide for reduced lateral tape movement |
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CN101150046B (zh) * | 2006-09-20 | 2012-02-22 | 日东电工株式会社 | 粘贴带切断方法及采用该方法的粘贴带粘贴装置 |
CN101252080B (zh) * | 2007-02-22 | 2012-08-08 | 日东电工株式会社 | 粘合带粘贴装置 |
CN102097294A (zh) * | 2009-11-20 | 2011-06-15 | 日东电工株式会社 | 粘合带粘贴装置及粘合带粘贴方法 |
CN102097294B (zh) * | 2009-11-20 | 2015-06-03 | 日东电工株式会社 | 粘合带粘贴装置及粘合带粘贴方法 |
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MY138357A (en) | 2009-05-29 |
US7207367B2 (en) | 2007-04-24 |
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TWI257666B (en) | 2006-07-01 |
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