CN1585998A - 用于在压力腔中保持基片的方法和设备 - Google Patents

用于在压力腔中保持基片的方法和设备 Download PDF

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Publication number
CN1585998A
CN1585998A CNA028225236A CN02822523A CN1585998A CN 1585998 A CN1585998 A CN 1585998A CN A028225236 A CNA028225236 A CN A028225236A CN 02822523 A CN02822523 A CN 02822523A CN 1585998 A CN1585998 A CN 1585998A
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CN
China
Prior art keywords
substrate
pressure
fluid
pressure chamber
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA028225236A
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English (en)
Chinese (zh)
Inventor
S·L·沃姆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MiCell Technologies Inc
Original Assignee
MiCell Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MiCell Technologies Inc filed Critical MiCell Technologies Inc
Publication of CN1585998A publication Critical patent/CN1585998A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Physical Vapour Deposition (AREA)
CNA028225236A 2001-09-13 2002-07-30 用于在压力腔中保持基片的方法和设备 Pending CN1585998A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/951,354 US6666928B2 (en) 2001-09-13 2001-09-13 Methods and apparatus for holding a substrate in a pressure chamber
US09/951,354 2001-09-13

Publications (1)

Publication Number Publication Date
CN1585998A true CN1585998A (zh) 2005-02-23

Family

ID=25491592

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA028225236A Pending CN1585998A (zh) 2001-09-13 2002-07-30 用于在压力腔中保持基片的方法和设备

Country Status (7)

Country Link
US (1) US6666928B2 (https=)
EP (1) EP1425779A2 (https=)
JP (1) JP4455880B2 (https=)
KR (1) KR20040036942A (https=)
CN (1) CN1585998A (https=)
TW (1) TW582070B (https=)
WO (1) WO2003023826A2 (https=)

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CN103270192A (zh) * 2010-12-22 2013-08-28 弗劳恩霍弗应用技术研究院 用于基底的固位器和用于涂覆基底的方法
CN105580128A (zh) * 2013-09-26 2016-05-11 应用材料公司 具有射频施加器的可旋转的基板支撑件
CN106252258A (zh) * 2015-06-15 2016-12-21 株式会社思可林集团 基板处理装置

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US8092644B2 (en) * 2003-06-16 2012-01-10 Ionfield Systems, Llc Method and apparatus for cleaning and surface conditioning objects using plasma
US8366871B2 (en) * 2003-06-16 2013-02-05 Ionfield Holdings, Llc Method and apparatus for cleaning and surface conditioning objects using plasma
US20060272675A1 (en) * 2005-06-02 2006-12-07 Cerionx, Inc. Method and apparatus for cleaning and surface conditioning objects using plasma
US20060272674A1 (en) * 2005-06-02 2006-12-07 Cerionx, Inc. Method and apparatus for cleaning and surface conditioning objects using plasma
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US20060065189A1 (en) * 2004-09-30 2006-03-30 Darko Babic Method and system for homogenization of supercritical fluid in a high pressure processing system
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WO2006130779A2 (en) * 2005-06-02 2006-12-07 Cerionx, Inc. Method and apparatus for cleaning and surface conditioning objects using plasma
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KR100753493B1 (ko) * 2006-01-21 2007-08-31 서강대학교산학협력단 세정장치
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TWI500482B (zh) * 2011-03-24 2015-09-21 國立清華大學 利用離心資源之真空裝置
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TWI826650B (zh) * 2012-11-26 2023-12-21 美商應用材料股份有限公司 用於高深寬比半導體元件結構具有污染物去除之無黏附乾燥處理
US9937475B2 (en) 2013-03-27 2018-04-10 University Of Washington Through Its Center For Commercialization Dynamic seal to enable movement of a film or fiber through a pressurized space while maintaining a desired pressure
KR20150064993A (ko) 2013-12-04 2015-06-12 삼성전자주식회사 반도체 제조 장치
JP6015738B2 (ja) * 2014-11-25 2016-10-26 東京エレクトロン株式会社 処理装置、処理方法及び記憶媒体
JP6422827B2 (ja) * 2015-06-15 2018-11-14 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
EP3417477B1 (de) 2016-02-16 2020-01-29 EV Group E. Thallner GmbH Verfahren zum bonden von substraten
JP6875417B2 (ja) * 2016-04-08 2021-05-26 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 真空チャック圧力制御システム
KR102400894B1 (ko) * 2017-06-30 2022-05-24 주식회사 케이씨텍 기판 처리용 챔버 및 기판 처리 방법
TW201946214A (zh) 2018-04-28 2019-12-01 美商應用材料股份有限公司 用於旋轉料架處理腔室的原位晶圓旋轉
KR102510922B1 (ko) * 2021-06-24 2023-03-16 주식회사 테스 실링유닛 및 이를 구비한 기판처리장치
NL2033951B1 (en) * 2023-01-11 2024-07-18 Levitech B V System for treating an individual wafer manufactured from semiconductor material, and methods

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103270192A (zh) * 2010-12-22 2013-08-28 弗劳恩霍弗应用技术研究院 用于基底的固位器和用于涂覆基底的方法
CN105580128A (zh) * 2013-09-26 2016-05-11 应用材料公司 具有射频施加器的可旋转的基板支撑件
CN106252258A (zh) * 2015-06-15 2016-12-21 株式会社思可林集团 基板处理装置
CN106252258B (zh) * 2015-06-15 2018-12-07 株式会社思可林集团 基板处理装置

Also Published As

Publication number Publication date
TW582070B (en) 2004-04-01
JP2005503016A (ja) 2005-01-27
WO2003023826A3 (en) 2004-01-29
KR20040036942A (ko) 2004-05-03
EP1425779A2 (en) 2004-06-09
US6666928B2 (en) 2003-12-23
JP4455880B2 (ja) 2010-04-21
WO2003023826A2 (en) 2003-03-20
US20030047199A1 (en) 2003-03-13

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C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication