CN1574259A - 安装半导体的装置 - Google Patents
安装半导体的装置 Download PDFInfo
- Publication number
- CN1574259A CN1574259A CNA2004100485047A CN200410048504A CN1574259A CN 1574259 A CN1574259 A CN 1574259A CN A2004100485047 A CNA2004100485047 A CN A2004100485047A CN 200410048504 A CN200410048504 A CN 200410048504A CN 1574259 A CN1574259 A CN 1574259A
- Authority
- CN
- China
- Prior art keywords
- chip
- guide
- forth
- along
- electric machine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53183—Multilead component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53191—Means to apply vacuum directly to position or hold work part
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T74/00—Machine element or mechanism
- Y10T74/20—Control lever and linkage systems
- Y10T74/20207—Multiple controlling elements for single controlled element
- Y10T74/20341—Power elements as controlling elements
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T74/00—Machine element or mechanism
- Y10T74/20—Control lever and linkage systems
- Y10T74/20207—Multiple controlling elements for single controlled element
- Y10T74/20341—Power elements as controlling elements
- Y10T74/20354—Planar surface with orthogonal movement only
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
Description
Claims (3)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH20031006/03 | 2003-06-06 | ||
CH01006/03A CH696103A5 (de) | 2003-06-06 | 2003-06-06 | Halbleiter-Montageeinrichtung. |
CH1006/2003 | 2003-06-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1574259A true CN1574259A (zh) | 2005-02-02 |
CN100380618C CN100380618C (zh) | 2008-04-09 |
Family
ID=33480363
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100485047A Expired - Fee Related CN100380618C (zh) | 2003-06-06 | 2004-06-07 | 安装半导体的装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7120995B2 (zh) |
KR (1) | KR20040108574A (zh) |
CN (1) | CN100380618C (zh) |
CH (1) | CH696103A5 (zh) |
DE (1) | DE102004026534B4 (zh) |
TW (1) | TWI237297B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106426161A (zh) * | 2015-08-06 | 2017-02-22 | 康耐视公司 | 在引导装配环境中将机器视觉坐标空间关联在一起的系统和方法 |
CN111430251A (zh) * | 2020-04-01 | 2020-07-17 | 深圳新益昌科技股份有限公司 | 绑头固晶装置 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1612843A1 (de) * | 2004-07-02 | 2006-01-04 | Unaxis International Trading Ltd | Verfahren und Einrichtung fuer die Montage von Halbleiterchips |
WO2007118511A1 (de) * | 2006-04-12 | 2007-10-25 | Alphasem Gmbh | Verfahren und vorrichtung zum ablegen von elektronischen bauteilen, insbesondere halbleiterchips auf einem substrat |
WO2009037108A2 (de) * | 2007-09-18 | 2009-03-26 | Oerlikon Assembly Equipment Ag, Steinhausen | Pick und place system für eine halbleiter-montageeinrichtung |
WO2009047214A2 (en) * | 2007-10-09 | 2009-04-16 | Oerlikon Assembly Equipment Ag, Steinhausen | Method for picking up semiconductor chips from a wafer table and mounting the removed semiconductor chips on a substrate |
CH698334B1 (de) | 2007-10-09 | 2011-07-29 | Esec Ag | Verfahren für die Entnahme und Montage von auf einem Wafertisch bereitgestellten Halbleiterchips auf einem Substrat. |
JP2011035342A (ja) * | 2009-08-06 | 2011-02-17 | Renesas Electronics Corp | リード成形用金型およびリード成形用金型を用いた半導体装置の製造方法 |
FR2977756B1 (fr) * | 2011-07-06 | 2014-03-28 | Jfp Microtechnic | Dispositif de prelevement et de pose de petits objets |
US9776270B2 (en) * | 2013-10-01 | 2017-10-03 | Globalfoundries Inc. | Chip joining by induction heating |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR900005760B1 (ko) * | 1986-02-19 | 1990-08-09 | 가부시기가이샤 히다찌 세이사꾸쇼 | 가동코일형 리니어 모터 |
DE3938088A1 (de) * | 1989-11-16 | 1991-05-23 | Bosch Gmbh Robert | Bestueckkopf fuer elektronische bauelemente |
JP2635889B2 (ja) * | 1992-06-24 | 1997-07-30 | 株式会社東芝 | ダイボンディング装置 |
WO1997032460A1 (de) * | 1996-02-29 | 1997-09-04 | Alphasem Ag | Verfahren und vorrichtung zum aufnehmen, orientieren und montieren von bauelementen |
JP3149782B2 (ja) * | 1996-05-07 | 2001-03-26 | 松下電器産業株式会社 | ダイボンディング装置およびダイボンディング方法 |
CH693229A5 (de) * | 1997-04-30 | 2003-04-30 | Esec Tradingsa | Einrichtung und Verfahren zur Montage vonHalbleiterchips auf einem Substrat. |
EP0923111B1 (de) * | 1997-12-07 | 2007-05-02 | Oerlikon Assembly Equipment AG, Steinhausen | Halbleiter-Montageeinrichtung mit einem hin und her geführten Chipgreifer |
ATE306118T1 (de) * | 1998-10-01 | 2005-10-15 | Unaxis Int Trading Ltd | Halbleiter-montageeinrichtung mit einem chipgreifer |
JP2000133995A (ja) * | 1998-10-27 | 2000-05-12 | Matsushita Electric Ind Co Ltd | 部品装着方法とその装置 |
JP3806894B2 (ja) * | 1998-11-26 | 2006-08-09 | 日立ビアメカニクス株式会社 | プリント基板加工機 |
JP3792996B2 (ja) * | 2000-06-08 | 2006-07-05 | 株式会社新川 | ダイ及び小物部品の移送装置 |
KR100412272B1 (ko) * | 2001-11-21 | 2003-12-31 | 미래산업 주식회사 | 부품의 편평도 검사 장치 및 그 방법 |
EP1321967B1 (de) * | 2001-12-05 | 2004-11-03 | Esec Trading S.A. | Einrichtung für die Montage von Halbleiterchips |
TW567574B (en) * | 2001-12-05 | 2003-12-21 | Esec Trading Sa | Apparatus for mounting semiconductor chips |
JP3772808B2 (ja) * | 2002-08-29 | 2006-05-10 | 株式会社村田製作所 | 部品装着装置 |
US6798088B2 (en) * | 2002-11-07 | 2004-09-28 | Industrial Technology Research Institute | Structure for symmetrically disposed linear motor operated tool machine |
US6930412B2 (en) * | 2003-01-16 | 2005-08-16 | En-Sheng Chang | Closed box structure of the horizontal linear motor machine tool |
-
2003
- 2003-06-06 CH CH01006/03A patent/CH696103A5/de not_active IP Right Cessation
-
2004
- 2004-05-29 DE DE102004026534A patent/DE102004026534B4/de not_active Expired - Fee Related
- 2004-05-31 TW TW093115458A patent/TWI237297B/zh not_active IP Right Cessation
- 2004-06-01 KR KR1020040039686A patent/KR20040108574A/ko active IP Right Grant
- 2004-06-03 US US10/861,720 patent/US7120995B2/en not_active Expired - Fee Related
- 2004-06-07 CN CNB2004100485047A patent/CN100380618C/zh not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106426161A (zh) * | 2015-08-06 | 2017-02-22 | 康耐视公司 | 在引导装配环境中将机器视觉坐标空间关联在一起的系统和方法 |
CN106426161B (zh) * | 2015-08-06 | 2020-04-07 | 康耐视公司 | 在引导装配环境中将机器视觉坐标空间关联的系统和方法 |
CN111430251A (zh) * | 2020-04-01 | 2020-07-17 | 深圳新益昌科技股份有限公司 | 绑头固晶装置 |
CN111430251B (zh) * | 2020-04-01 | 2020-10-13 | 深圳新益昌科技股份有限公司 | 绑头固晶装置 |
Also Published As
Publication number | Publication date |
---|---|
TWI237297B (en) | 2005-08-01 |
DE102004026534B4 (de) | 2007-09-27 |
US7120995B2 (en) | 2006-10-17 |
DE102004026534A1 (de) | 2005-02-17 |
KR20040108574A (ko) | 2004-12-24 |
US20040246794A1 (en) | 2004-12-09 |
CN100380618C (zh) | 2008-04-09 |
CH696103A5 (de) | 2006-12-15 |
TW200504803A (en) | 2005-02-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: UNISYS XUN SCHWEITZER CO., LTD. Free format text: FORMER OWNER: YOU LI XUN INTERNATIONAL TRADE CO., LTD. Effective date: 20081010 Owner name: OERLIKON SEAL EQUIPMENT CO., LTD., STEINHAUSEN Free format text: FORMER OWNER: UNISYS XUN SCHWEITZER CO., LTD. Effective date: 20081010 |
|
C41 | Transfer of patent application or patent right or utility model | ||
C56 | Change in the name or address of the patentee |
Owner name: YOU LI XUN INTERNATIONAL TRADE CO., LTD. Free format text: FORMER NAME OR ADDRESS: ESEC TRADE CORPORATION |
|
CP01 | Change in the name or title of a patent holder |
Address after: Swiss Camden Patentee after: Unisys Xun International trade LLC Address before: Swiss Camden Patentee before: ESEC TRADING S.A. |
|
TR01 | Transfer of patent right |
Effective date of registration: 20081010 Address after: Swiss Camden Patentee after: ESEC Trading S.A. Address before: Swiss Camden Patentee before: Xun Shi Weiss Co.,Ltd. Unisys Effective date of registration: 20081010 Address after: Swiss Camden Patentee after: Xun Shi Weiss Co.,Ltd. Unisys Address before: Swiss Camden Patentee before: Unisys Xun International trade LLC |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080409 Termination date: 20100607 |