CN1573477B - LCD device having a smaller level difference - Google Patents
LCD device having a smaller level difference Download PDFInfo
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- CN1573477B CN1573477B CN2004100474201A CN200410047420A CN1573477B CN 1573477 B CN1573477 B CN 1573477B CN 2004100474201 A CN2004100474201 A CN 2004100474201A CN 200410047420 A CN200410047420 A CN 200410047420A CN 1573477 B CN1573477 B CN 1573477B
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- 239000000758 substrate Substances 0.000 claims abstract description 69
- 239000002184 metal Substances 0.000 claims description 57
- 239000004973 liquid crystal related substance Substances 0.000 claims description 21
- 239000011159 matrix material Substances 0.000 claims description 17
- 239000000428 dust Substances 0.000 abstract 1
- 239000010408 film Substances 0.000 description 137
- 239000004744 fabric Substances 0.000 description 9
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- 230000015572 biosynthetic process Effects 0.000 description 4
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13458—Terminal pads
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1337—Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers
- G02F1/13378—Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers by treatment of the surface, e.g. embossing, rubbing or light irradiation
- G02F1/133784—Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers by treatment of the surface, e.g. embossing, rubbing or light irradiation by rubbing
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- Physics & Mathematics (AREA)
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- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Liquid Crystal (AREA)
Abstract
The TFT substrate of an LCD device has an array of pixel electrodes defined by a plurality of signal lines and a plurality of scanning lines. Each terminal of the scanning lines includes a first metallic pattern, a second metallic pattern in contact with the first metallic pattern through a first via hole, and an ITO pattern in contact with the second metallic pattern through a second via hole. The ITO pattern has a width smaller than the width of the first via hole and larger than the second via hole, thereby providing the TFT substrate with a smaller level difference. The smaller level difference prevents the dust generated during a rubbing treatment from attaching onto the TFT substrate.
Description
Technical field
The present invention relates to a kind of liquid crystal display (LCD) equipment, and be specifically related on the surface of active matrix (active-matrix) substrate, have more the low height difference and can prevent that chip from touching the LCD equipment on the surface of active matrix substrate.
Background technology
LCD equipment is more and more as the flat pannel display such as computer system and televisor.In the middle of other LCD equipment, active matrix mode LCD (AM-LCD) equipment has the response of more speed, and is suitable for the introducing of greater amount pixel, the improvement of picture quality, the increase of panel size and the improvement of color.
Fig. 3 has described the illustrative configurations of common (traditional) AM-LCD equipment in the vertical view, and wherein liquid crystal (LC) layer is clipped between TFT substrate (active matrix substrate) 11 and the counter substrate (countersubstrate) 12.TFT substrate 11 is installed many signal wires that extend parallel to each other 13 on it, and many sweep traces 14 that extend perpendicular to signal wire 13.Each connection TFT (thin film transistor (TFT)) a plurality of pixel electrode 17 of 18 is placed on point of crossing between signal wire 13 and the sweep trace 14 with matrix form.
At the end of signal wire 13, corresponding signal terminal 16 is provided, and, provides scanning terminal 15 at the end of corresponding sweep trace 14.Signal terminal 16 and scanning terminal 15 projectioies as the terminal and the driving circuit that are electrically connected to flexible connection board, and the signal pin of electrical contact probe plate, during production test, this signal pin is as the transmission of test drive signal.The public electrode that on counter substrate 12, does not illustrate especially in the installation diagram, chromatic color filter and oriented film.Perhaps, on the TFT substrate, provide public electrode.
Fig. 4 A shows the step of the manufacture process that is used to make the TFT substrate among the LCD of Fig. 3 continuously to Fig. 4 F, wherein as shown in the figure, described the zone that is used to scan terminal, signal terminal, sweep trace, signal wire and pixel electrode respectively.On such as the transparent substrates of making by glass, formed first metal film, and composition first metal film is to form sweep trace 22 and first metal film pattern 23 (Fig. 4 A) that scans terminal, deposit first dielectric film 24 (Fig. 4 B) on whole zone subsequently.
Then, composition first dielectric film 24 exposes first metal film pattern 23 of scanning terminal 23 to form first through hole 41 from first through hole 41.Then, deposit and composition second metal film spread all over Zone Full deposit second dielectric film 27 (Fig. 4 D) subsequently to form signal wire 25, signal terminal 26 and second metal film pattern 42 (Fig. 4 C) that scans terminal on second metal film pattern 42 of signal wire 25, signal terminal 26 and scanning terminal.After this, in second dielectric film 27, form second through hole 28 and 29, to expose signal terminal 26 and second metal film pattern 42 (Fig. 4 E) that scans terminal by second through hole 28 and 29.
Then, on second metal film pattern 42 of signal terminal 26 and scanning terminal, spread all over the transparent conducting film of Zone Full deposit, the conducting film that composition is transparent to be forming transparent pixel electrode 30 subsequently, and forms transparent terminal 31 and 32 (Fig. 4 F) on second metal film pattern 42 of scanning terminal and signal terminal 26.After this, on the viewing area, form oriented film, and this oriented film is subjected to friction treatment to aim at a direction formation indentation (scratch) on oriented film.On oriented film, indentation has the function of aiming at the axle of LC molecule in the LC layer with specific inceptive direction.It should be noted that: consider that TFT is not critical elements and can uses conventional art to form TFT in the feature of the present invention, omitted the description that forms the process of TFT at this.
Fig. 5 schematically shows the friction treatment that is used for oriented film.Carry out friction treatment, so that the traversing condenser reller (rubbing roller) 51 that contacts brush (or friction fabric) 55 is guided, on the oriented film 43 that forms on the substrate 52, to slide, wherein rotate traversing condenser reller 51, thereby form the indentation that extends with a direction on the surface of oriented film 43.Traversing condenser reller 51 rotates in a counter-clockwise direction, and move in the left side of substrate 52 in figure, and like this, with the direction of arrow RD, promptly friction treatment is carried out in the left side of substrate 52 to the right side from figure.
Friction treatment produces from the filings (or smear metal) of oriented film 43 and the cloth bits (or coarse wool) of the bristle that comes self-friction fabric 55.The friction treatment of implementing on a plurality of substrates with independent continuous step causes filings and cloth to be considered to be worth doing from the substrate transfer that wherein produces chip to subsequently substrate.So the chip that transmits is attached on the substrate, especially attached to the surf zone of substrate 52 with difference in height, and the zone that forms such as periphery or through hole at recess.
Fig. 6 shows the example that is attached to the chip of difference in height on substrate 52 surfaces.The direction of motion of the sense of rotation of traversing condenser reller 51 and substrate 52 causes chip 54 to be attached to the ladder of recess 53 usually, shown on the RD of friction treatment direction, and the front end ladder " A " of recess 53 as shown in Figure 6 and tail end ladder " B ".It should be noted that: because compare with the chip 54 that is attached on the front end ladder " A ", be attached to the more bristle removal of possibility quilt friction fabric 55 of chip 54 on the tail end ladder " B ", go up the quantity of chip 54 less than being attached to the upward quantity of chip 54 of front end ladder " A " so be attached to the tail end ladder " B " of recess 53.This expression: front end ladder " A " is located to locate more preferably to form littler difference in height than tail end ladder " B ", to reduce the quantity of debris of catching effectively on difference in height.
Fig. 7 A shows near the plan view from above of the traditional structure the scanning terminal that forms on the substrate, and Fig. 7 B shows among Fig. 7 A along the cut-open view of the scanning terminal of line A-A ' intercepting.Scanning terminal and near layer structure thereof comprise: at first metal film pattern 1 (23 among Fig. 4 F), first dielectric film 6 (24 among Fig. 4 F), second metal film pattern 2 (42 among Fig. 4 F), second dielectric film 7 (27 among Fig. 4 F) and the ITO film figure 3 (31 among Fig. 4 F) of the last consecutive deposition of substrate 10 (21 among Fig. 4 F).First dielectric film 6 and second dielectric film 7 wherein have first through hole 4 and second through hole 5 respectively, to allow being electrically connected between first metal film pattern 1 and second metal film pattern 2 and second metal film pattern 2 and the ITO film figure 3 respectively.In Fig. 7 A, shown in the outside of terminal, the order of arrangement is as follows, and arrange continuously with the peripheral of second through hole 5 periphery (inwall) of the edge of the edge of ITO film figure 3, first metal film pattern 1, the edge of second metal film pattern 2, first through hole 4.
Fig. 8 A and 8B show respectively and are similar to Fig. 7 A and 7B, near the structure of another traditional terminal.Terminal and near layer structure thereof comprise: first metal film pattern 1, first dielectric film 6, second dielectric film 7 and the ITO film figure 3 of consecutive deposition on substrate 10, wherein first dielectric film 6 and second dielectric film 7 have the first public through hole 4.In Fig. 8 A, shown in the outside of terminal, the order of arrangement is as follows, and the peripheral of the edge of the edge of ITO film figure 3, first metal film pattern 1 and first through hole 4 arranged continuously.With texture ratio among Fig. 7, this designs simplification of terminal manufacture process.
In the said structure of the scanning terminal shown in Fig. 7 A and Fig. 7 B and Fig. 8 A and the 8B, because the periphery of the through hole of first dielectric film 6 probably or accurately meets the periphery of the through hole of second dielectric film 7, therefore the differences in height that form on ITO film figure 3 surfaces be equivalent to first dielectric film, 6 thickness and second dielectric film, 7 thickness with, and this thickness with relatively large.This causes that forming the quantity of debris that is attached on the ladder at scanning terminal place becomes big.Between the erecting stage of LCD equipment or after, the chip that is attached on the substrate can enter the viewing area, thereby has reduced the picture quality of LCD equipment.
In order to reduce the debris quantities on the surface that is attached to the TFT substrate, patent disclosure JP-A-2001-311963 has described a kind of technology, wherein switching device is connected to corresponding pixel electrode by through hole, by balance (equalization) film is provided, reduced the difference in height (Fig. 1 in open) on the surface of TFT substrate in described through hole.
In order to reduce the debris quantities on the surface that is attached to oriented film, patent disclosure JP-A-1997-43629 has described another kind of technology, wherein place dummy electrodes in the outside of viewing area, consider to be worth doing in the viewing area, to be captured in the cloth that transmits during the friction treatment, and prevent that the cloth bits from entering the viewing area of substrate subsequently (Fig. 1 in open).
The structure of describing in JP-A-2001-311963 can not be applied to the terminal of LCD equipment, the bottom metal film pattern that is electrically connected to of the ITO film figure of top wherein, reason is: the structure of description uses the organic insulating film between ITO film figure and the bottom metal film pattern to be used to reduce difference in height.
The structure of describing in JP-A-1997-43629 has prevented that chip is attached to the viewing area in the LCD equipment, can not prevent that chip is attached on the terminal, although this structure can reduce the total amount of the chip that adheres to.In addition, the space that is used for dummy electrodes has increased the edge area of the substrate except the viewing area.
Summary of the invention
In view of the problems referred to above in the conventional art, an object of the present invention is to provide a kind of LCD equipment, it can reduce the difference in height on the surface of active matrix substrate, with the quantity of debris on the ladder that is attached to difference in height on the minimizing active matrix substrate, and do not cause the increase of size and the reduction of LCD equipment performance.
The invention provides a kind of liquid crystal display (LCD) equipment, comprise active matrix substrate and counter substrate, and be clipped in liquid crystal (LC) layer between active matrix substrate and the counter substrate, this active matrix substrate comprises: transparent dielectric substrate; The many signal line that on transparent substrates, extend parallel to each other; Extend parallel to each other and perpendicular to the multi-strip scanning line of signal wire; Near the point of crossing of signal wire and sweep trace, arrange a plurality of pixel electrodes; Be connected to a plurality of terminals of signal wire and sweep trace; And cover oriented film above the pixel electrode, terminal one of at least have a layer structure, described layer structure comprises: first metal film pattern that forms on transparent dielectric substrate; And transparent conductive film pattern, first and second through hole by first and second dielectric film, this transparent conductive film pattern is electrically connected to first metal film pattern, this transparent conductive film pattern has an edge, observe from the angle perpendicular to the active matrix substrate, at least a portion at this edge is positioned at the inside of first through hole and the outside of second through hole.
According to LCD equipment of the present invention, because second through hole is less than first through hole, and transparent conducting film has the marginal portion between first through hole and second through hole, therefore with traditional texture ratio, the difference in height that forms on transparent conducting film is littler, thereby during the friction treatment of oriented film, reduced the chip of catching by the difference in height of terminal.
With reference to accompanying drawing, by following description, above-mentioned and other purpose of the present invention, characteristic and advantage will be more obvious.
Description of drawings
Figure 1A and Figure 1B are respectively according to vertical view and cut-open view near the terminal in the LCD equipment of first embodiment of the invention.
Fig. 2 A and Fig. 2 B are respectively according to vertical view and cut-open view near the terminal in the LCD equipment of second embodiment of the invention.
Fig. 3 is the schematic plan of common LCD equipment.
Fig. 4 A is the cut-open view of common LCD equipment to Fig. 4 F, is used for illustrating continuously the step that the manufacturing that is used for making LCD equipment is handled.
Fig. 5 shows the schematic cross sectional views of the friction treatment of the TFT substrate that is implemented into shown in Fig. 3.
Fig. 6 shows the schematic cross sectional views that is attached to the chip on the TFT substrate during the friction treatment.
Fig. 7 A and Fig. 7 B show the structure of terminal in traditional LCD equipment.
Fig. 8 A and Fig. 8 B show the structure of terminal in another traditional LCD equipment.
Embodiment
More specifically describe the present invention referring now to accompanying drawing, reference number same among the wherein whole figure is indicated same element.
With reference to Figure 1A and Figure 1B, the structure according to scanning terminal in the LCD equipment of first embodiment of the invention has been shown.LCD equipment shown in these figure is AM-LCD equipment, and whole configurations of AM-LCD equipment are similar to the configuration shown in Fig. 3.As shown in Figure 3, the LCD equipment of the present embodiment LC layer that also comprises TFT substrate 11 and counter substrate 12 especially and be clipped in TFT substrate 11 and counter substrate 12.
TFT substrate 11 is installed many signal wires that extend parallel to each other 13 on it, and many sweep traces 14 that extend perpendicular to signal wire 13.A plurality of pixel electrodes 17 of each connection TFT18 are placed on point of crossing between signal wire 13 and the sweep trace 14 with matrix form.
At the end of signal wire 13, corresponding signal terminal 16 is provided, and, provides scanning terminal 15 at the end of corresponding sweep trace 14.Signal terminal 16 and scanning terminal 15 projectioies as the terminal and the driving circuit that are electrically connected to flexible connection board, and the signal pin of electrical contact probe plate, during production test, this signal pin is as the transmission of drive signal.The public electrode that on counter substrate 12, does not illustrate especially in the installation diagram, chromatic color filter and oriented film.
LCD apparatus characteristic according to present embodiment is: the structure of the terminal such as the scanning terminal will be described below.It should be noted that: as long as the terminal in the present embodiment comprises first and second metal film pattern and transparent conductive film pattern, the structure of terminal just can be applicable to scan terminal or signal terminal in the present embodiment.
Shown in Figure 1B, terminal and near layer structure thereof comprise: first metal film pattern 1; First dielectric film 6 wherein has first through hole 4, is used to expose the part of first metal film pattern 1; Second metal film pattern 2 forms in first through hole 4 to contact first metal film pattern 1 by first through hole 4; Second dielectric film 7 wherein has the part that second through hole 5 is used to expose second metal film pattern 2; And, contact the ITO film figure 3 of second metal film pattern 2 by second through hole 5.ITO film figure 3 has the outer peripheral areas that forms on second dielectric film 7, and the central area that contacts second metal film 2 by second through hole 5.
Second through hole 5 has periphery, and it is fully away from the periphery of first through hole 4, and with traditional texture ratio, the zone of the periphery that second through hole 5 has is littler.Pattern and spacing that ITO film figure 3 forms with the terminal that meets driving circuit.ITO film figure 3 is from the peripheral projection of second contact hole 5, and like this, with the width comparison of second contact hole 5, ITO film figure 3 has bigger width " a ".Yet, the width of ITO film figure 3 " and a is " less than the width of first metal film pattern 1, first through hole 4 and second metal film pattern 2.ITO film figure 3 has an edge, its with specific range away from the edge of first metal film pattern 1 and second metal film pattern and the periphery of first through hole 4.Make in the horizontal direction as distance expression specific in this context, can be by the ladder that first through hole 4 forms away from the distance of the ladder that forms by second through hole 5.Attention: four limits of ITO film figure 3 be enough with the four corresponding limits of second metal film pattern or the periphery of first through hole 4 one of at least away from first metal film pattern 1.
Now, will manufacture process that make the LCD equipment with the terminal shown in Figure 1A and Figure 1B be described.Near the scanning terminal the structure, process described in the present embodiment itself is similar to the process to Fig. 4 F with reference to Fig. 4 A usually.Depositing metal film on the transparent substrates of making such as glass, and this metal film of composition is to form the sweep trace (14 among Fig. 3) and first metal film pattern 1, the terminal part of each composition scanning terminal of a plurality of first metal film patterns 1.Then, first dielectric film 6 forms on whole zone, and etched with formation first through hole 4 in first dielectric film 6, thereby exposes the part of first metal film pattern 1.
Then, another kind of metal film deposition is on first dielectric film 6, and is and patterned to form the signal wire (13 among Fig. 3) and second metal film pattern 2, and each of a plurality of second metal film patterns 2 formed the terminal part of scanning terminal.After this, second dielectric film 7 forms on whole zone, and etchedly has second through hole 5 littler than first through hole, 4 sizes with formation, exposes the part of second metal film pattern 2 from second through hole 5.
Then, the ITO film forms on whole zone, and patterned to form pixel electrode (17 among Fig. 3) and ITO film figure 3, and each of a plurality of ITO film figures 3 formed the terminal part of scanning terminal.The width of ITO film figure 3 is greater than the width of second through hole 5, but less than the width of first through hole 4.Then, except the terminal area that comprises signal terminal and scanning terminal, in the viewing area, form oriented film.Then, oriented film is subjected to friction treatment and is used for forming indentation on oriented film, and this indentation is finally aimed at the axle of LC molecule in the LC layer with specific direction.
It should be noted that: because TFT is not a critical elements in the feature of the present invention, so omitted the description of the process of formation TFT (switching device).Be similar to conventional art, the counter substrate 12 shown in Fig. 3 obtains by form public electrode, chromatic color filter and oriented film on transparent substrates.The LC layer is clipped between so independent TFT substrate 11 for preparing and the counter substrate 12 and places to finish the LCD panel.Public electrode can be placed on the TFT substrate.Public electrode can be placed on the TFT substrate rather than be placed on the counter substrate.
Should also be noted that: if signal wire rather than sweep trace form on glass substrate 10, then signal terminal can have the structure shown in Figure 1A and Figure 1B.
As mentioned above, the terminal that is used for being electrically connected at present embodiment LCD equipment, the thickness of in fact only corresponding second dielectric film 7 of difference in height of the ITO film figure 3 of composition terminal part, and like this, littler difference in height is provided on TFT substrate 11, thereby during the friction treatment of oriented film, reduce the quantity of debris that is attached on the terminal.
With reference to Fig. 2 A and Fig. 2 B, second embodiment according to this aspect has been shown, near the structure in the LCD equipment terminal.Shown in Fig. 2 A, the frictional direction of oriented film is illustrated by arrow RD, and it points to upper right from the lower-left.Terminal shown in Fig. 2 A and Fig. 2 B is similar to the terminal shown in Figure 1A and Figure 1B, difference is: the center of first through hole 4 is departed from the center of second through hole 5 on the direction RD of friction treatment, and ITO film figure 3 forms in second through hole 5, and has four limits above four limits that cover second dielectric film 7 of forming second through hole 5.
The pattern and the spacing of the terminal of corresponding driving circuit are placed ITO film figure 3.Second through hole 5 is positioned at the regional extent of ITO film figure 3.In addition, observe from the friction treatment of carrying out with direction RD, the peripheral leading edge with second metal film pattern 2 of the front end of the leading edge of first metal film pattern 1, first through hole 4 is placed away from the leading edge of ITO film figure 3 with specific range.
ITO film figure 3 departs from frictional direction more especially, and wherein the leading edge of ITO film figure 3 is placed on further from the position of the leading edge of first through hole 4 at terminal place.This is because with reference to Fig. 6, as mentioned above, in the friction treatment, compare with the tail end ladder of recess, more may rest on the front end ladder of recess from the chip of oriented film, and bigger distance prevents that effectively chip is attached to the front end ladder between the front end periphery of the leading edge of ITO film figure 3 and first through hole 4.The structure of terminal can be similar to the terminal manufacturing of first embodiment in the present embodiment.
According to the LCD equipment of present embodiment, the zone that comprises the terminal of first metal film pattern, first through hole and second metal pattern can be made less than the zone of terminal among first embodiment.This is particularly suitable for the situation of the thin space of driving circuit terminal, and according to the production of chip, obtains being similar to the advantage among first embodiment.
As mentioned above, embodiments of the invention obtain one of at least following advantage:
(1) form the chip of the smaller amounts be attached to ladder at the terminal place, this chip comprises filings that is produced by oriented film and the cloth bits that produce from the friction fabric;
(2) the littler zone of ITO film figure, or width " a ", this zone is fit to the situation of the thin space of driving circuit terminal; And
(3) be used for the bigger zone of first through hole and second through hole, to reduce the contact resistance in the terminal.
Because the foregoing description is only described as an example, therefore the invention is not restricted to the foregoing description, and those of ordinary skill in the art can easily carry out various modifications or change and not depart from the scope of the present invention from the foregoing description.For example, the invention is not restricted to AM-LCD equipment, and be applied to the LCD equipment of any kind.Limit by second dielectric film 7 is provided one of at least away from the corresponding sides of first dielectric film 6, the structure of the foregoing description can be applicable to the structure of Fig. 8 A and Fig. 8 B.
Claims (8)
1. a liquid crystal display comprises active matrix substrate and counter substrate, and is clipped in the liquid crystal layer between active matrix substrate and the counter substrate, and described active matrix substrate comprises:
Transparent dielectric substrate;
The many signal line that on described transparent substrates, extend parallel to each other; Extend parallel to each other and perpendicular to the multi-strip scanning line of described signal wire;
Near the point of crossing of described signal wire and described sweep trace, arrange a plurality of pixel electrodes; Be connected to a plurality of terminals of described signal wire and described sweep trace; And
Cover the oriented film above the described pixel electrode,
Described terminal have one of at least a layer structure, described layer structure comprises: first metal film pattern that forms on described transparent dielectric substrate; And transparent conductive film pattern, first and second through hole by described first and second dielectric film, described transparent conductive film pattern is electrically connected to first metal film pattern, described transparent conductive film pattern has an edge, observe from angle perpendicular to described active matrix substrate, the at least a portion at described edge is positioned at the inside of described first through hole and the outside of described second through hole
Wherein, the periphery of second through hole is positioned at the periphery of first through hole.
2. liquid crystal display as claimed in claim 1, wherein said terminal described comprises one of at least second metal film pattern that is placed between described first metal film pattern and the described transparent conductive film pattern, described second metal film pattern contacts described first metal film pattern by described first through hole, and, contact described transparent conducting film by described second through hole.
3. liquid crystal display as claimed in claim 1, wherein said transparent conductive film pattern has a center, and the center of described first through hole is aimed at described center in fact.
4. liquid crystal display as claimed in claim 1, wherein said transparent conductive film pattern has a center, the center of described first through hole of described misalignment.
5. liquid crystal display as claimed in claim 4, wherein said transparent conductive film pattern have the another part that protrudes or aim at the periphery of described first through hole from the periphery of described first through hole.
6. liquid crystal display as claimed in claim 5, wherein said terminal has a surface, observe from the angle of the friction treatment of described oriented film, described surface has littler difference in height near the leading edge of described transparent conducting film than the trailing edge near described transparent conducting film.
7. liquid crystal display as claimed in claim 4, the described center of described first through hole is departed from the described center of wherein said transparent conductive film pattern on the frictional direction of described oriented film.
8. liquid crystal display as claimed in claim 7, wherein said second through hole departs from described first through hole on described frictional direction.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP149482/2003 | 2003-05-27 | ||
| JP2003149482A JP4517063B2 (en) | 2003-05-27 | 2003-05-27 | Liquid crystal display |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1573477A CN1573477A (en) | 2005-02-02 |
| CN1573477B true CN1573477B (en) | 2010-05-26 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2004100474201A Expired - Lifetime CN1573477B (en) | 2003-05-27 | 2004-05-27 | LCD device having a smaller level difference |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7142276B2 (en) |
| JP (1) | JP4517063B2 (en) |
| KR (1) | KR100649915B1 (en) |
| CN (1) | CN1573477B (en) |
| TW (1) | TWI248545B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007108470A (en) * | 2005-10-14 | 2007-04-26 | Nec Lcd Technologies Ltd | Active matrix substrate and liquid crystal display device |
| JP5019834B2 (en) * | 2006-09-26 | 2012-09-05 | インフォビジョン オプトエレクトロニクス ホールデングズ リミティッド | Display device substrate and display device |
| US8218116B2 (en) * | 2007-08-01 | 2012-07-10 | Sony Corporation | Liquid crystal display panel and manufacturing method thereof |
| JP5154298B2 (en) * | 2007-08-01 | 2013-02-27 | 株式会社ジャパンディスプレイウェスト | Liquid crystal display panel and manufacturing method thereof |
| JP5723023B2 (en) * | 2011-11-18 | 2015-05-27 | シャープ株式会社 | Active matrix substrate, liquid crystal display device, and method of manufacturing active matrix substrate |
| CN105824162B (en) * | 2016-06-01 | 2020-09-01 | 北京京东方光电科技有限公司 | Array substrate, manufacturing method thereof and display device |
| CN109581718A (en) * | 2019-01-30 | 2019-04-05 | 京东方科技集团股份有限公司 | Array substrate mother matrix, array substrate, display panel and display device |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0943629A (en) | 1995-07-31 | 1997-02-14 | Sony Corp | Liquid crystal display device |
| DE69635239T2 (en) * | 1995-11-21 | 2006-07-06 | Samsung Electronics Co., Ltd., Suwon | Process for producing a liquid crystal display |
| JP3647542B2 (en) * | 1996-02-20 | 2005-05-11 | 株式会社半導体エネルギー研究所 | Liquid crystal display |
| JP3226836B2 (en) * | 1997-06-26 | 2001-11-05 | 日本電気株式会社 | Liquid crystal display device and manufacturing method thereof |
| JP3361278B2 (en) * | 1997-12-26 | 2003-01-07 | シャープ株式会社 | Reflection type liquid crystal display device, method for manufacturing the same, and method for manufacturing circuit board |
| KR100660809B1 (en) | 1999-12-31 | 2006-12-26 | 엘지.필립스 엘시디 주식회사 | Liquid crystal display device and method for fabricating the same |
| JP3989662B2 (en) * | 2000-01-13 | 2007-10-10 | セイコーエプソン株式会社 | Liquid crystal device and manufacturing method thereof |
| JP2001311963A (en) | 2000-04-27 | 2001-11-09 | Toshiba Corp | Liquid crystal display device and manufacturing method therefor |
| JP4815659B2 (en) * | 2000-06-09 | 2011-11-16 | ソニー株式会社 | Liquid crystal display |
| JP4051190B2 (en) * | 2000-10-31 | 2008-02-20 | シャープ株式会社 | Display device manufacturing method, display device substrate, and measurement system |
| KR100685945B1 (en) * | 2000-12-29 | 2007-02-23 | 엘지.필립스 엘시디 주식회사 | Liquid crystal display and manufacturing method of the same |
| KR100858297B1 (en) * | 2001-11-02 | 2008-09-11 | 삼성전자주식회사 | Reflective-transmissive type liquid crystal display device and method of manufacturing the same |
| JP2004094020A (en) * | 2002-09-02 | 2004-03-25 | Toshiba Matsushita Display Technology Co Ltd | Liquid crystal display |
-
2003
- 2003-05-27 JP JP2003149482A patent/JP4517063B2/en not_active Expired - Lifetime
-
2004
- 2004-05-19 US US10/848,716 patent/US7142276B2/en not_active Expired - Lifetime
- 2004-05-26 TW TW093114913A patent/TWI248545B/en not_active IP Right Cessation
- 2004-05-27 KR KR1020040037819A patent/KR100649915B1/en active IP Right Grant
- 2004-05-27 CN CN2004100474201A patent/CN1573477B/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2004354496A (en) | 2004-12-16 |
| TW200510882A (en) | 2005-03-16 |
| US7142276B2 (en) | 2006-11-28 |
| JP4517063B2 (en) | 2010-08-04 |
| KR20040102344A (en) | 2004-12-04 |
| CN1573477A (en) | 2005-02-02 |
| TWI248545B (en) | 2006-02-01 |
| KR100649915B1 (en) | 2006-11-24 |
| US20040239857A1 (en) | 2004-12-02 |
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