CN1560165A - Aldehyde-free adhesives for artificial board - Google Patents
Aldehyde-free adhesives for artificial board Download PDFInfo
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- CN1560165A CN1560165A CNA2004100140751A CN200410014075A CN1560165A CN 1560165 A CN1560165 A CN 1560165A CN A2004100140751 A CNA2004100140751 A CN A2004100140751A CN 200410014075 A CN200410014075 A CN 200410014075A CN 1560165 A CN1560165 A CN 1560165A
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Abstract
The invention relates to an artificial board aldehyde-free adhesive, providing a method of preparing the adhesive. And its characteristic: in substance, it uses cross-linking and curing high-molecular compound, cross-linking agent, mildewproof agent, fillings and deionized water to prepare the adhesive to replace the urea formaldehyde for producing artificial boards, and it can radically eliminate dissociative formaldehyde pollution and harm in the industry.
Description
Technical field
The present invention relates to a kind of aldehyde-free cement for wood-based panel, belong to adhesive area.
Background technology
Urea-formaldehyde glue is higher because of Joint strength, and cold-resistant water-based is better, and the chemically-resistant medicament corrodes, and makes easyly, and cost is low and used in a large number, and in wood-based panel industry, the usage quantity of urea-formaldehyde glue accounts for about 70% of the total consumption of the various glue of whole wood-based panel industry.But it is crisp easily aging that the shortcoming of urea-formaldehyde glue is a property, even more serious is to have a large amount of formaldehyde in the production process to discharge, contaminate environment, harm direct labor's health, and the finished product sheet material of producing with urea-formaldehyde glue in use, can constantly discharge free formaldehyde for a long time, harm user's physical and mental health.Along with the continuous reinforcement of health of people consciousness and environmental consciousness, the harm of urea-formaldehyde glue is subjected to people's attention day by day.
Carried out much about of the research of low toxicity glued board for addressing this problem both at home and abroad with urea-formaldehyde glue.But all be to improve aspect the production technique of urea-formaldehyde glue, as changing feed ratio, means such as employing batch charging reduce formaldehyde total consumption in glue or the like, and the urea-formaldehyde glue of Sheng Chaning can make free formaldehyde release decrease really like this.Also there are at present many investigators to adopt the method for adding formaldehyde-trapping agent to reduce the burst size of free formaldehyde.But aforesaid method does not all fundamentally solve formaldehyde pollution and harm problem.
China is on Wood-based Panel Production scale and wood-based plate ultimate production, it is Wood-based Panel Production big country, because the urea-formaldehyde glue of domestic production is of poor quality, the finished product sheet material free formaldehyde release of the production of using has had a strong impact on the foreign exchange earning of China's wood-based plate than the external product height.Therefore, how China's wood-based panel industry that always has been described as evergreen industry since the reform and opening-up breaks away from the puzzlement of glue, allows product really go abroad, and seeks bigger more permanent development, is the important topic of pendulum in face of the Study on Adhesive worker.
Summary of the invention
For fundamentally solving formaldehyde pollution and harm problem in the wood-based panel industry, we utilize macromolecular compound, linking agent, mould inhibitor, filler and deionized water to be mixed with aldehyde-free cement for wood-based panel, and available replacement urea-formaldehyde glue is used for the production of wood-based plate.This makes wood-based plate really become Green Product and has crucial meaning promoting the no hydroformylation of adhesion agent for artificial board.Produce market has a extensive future, and economic benefit and social benefit are all very good, and will produce good ecological benefits, have important and practical meanings.
The artificial plate aldehyde-free cement of the present invention is characterized in that it being that the no aldehyde macromolecular compound (0.1%～60%), linking agent (0.1%～60%), mould inhibitor (0.1%～20%), filler (0.1%～60%) and the deionized water (1%～90%) that utilize cross-linkable solidifying is formulated in essence.
The artificial plate aldehyde-free cement of the present invention, the no aldehyde macromolecular compound of used 0.1%～60% cross-linkable solidifying are to utilize unsaturated monomer (1%～95%), initiator (0.001%～15%), emulsifying agent (0.001%～15%) and solvent (1%～95%) or dispersion medium (1%～95%) to be polymerized with certain method at a certain temperature.
The artificial plate aldehyde-free cement of the present invention, used 0.1%～60% linking agent are one or more in multi-functional epoxy compound or Resins, epoxy, polycarboxylic acid, polyamine, polyvalent alcohol, the polyisocyanates.
The artificial plate aldehyde-free cement of the present invention, used 0.1%～20% mould inhibitor are one or more in phenol organic compound mould inhibitor, organosulfur compounds mould inhibitor, organic tin compound mould inhibitor, quaternary ammonium salt organic compound mould inhibitor, other mould inhibitor.
The artificial plate aldehyde-free cement of the present invention, used 0.1%～60% filler are mineral-type filler and organic class filler.
The artificial plate aldehyde-free cement of the present invention, used 0.1%～60% linking agent is one or more in the following linking agent:
(1) multi-functional epoxy compound is terephthalic acid diglycidyl ester, faces phthalic acid 2-glycidyl ester, m-phthalic acid 2-glycidyl ester, hexanodioic acid 2-glycidyl ester, P-hydroxybenzoic acid 2-glycidyl ether-ether, resorcinol diglycidyl ether, ethylene glycol diglycidylether, trihydroxymethylpropanyltri diglycidyl ether, 1,4-butanediol diglycidyl ether, glycerol triglycidyl ether, or Resins, epoxy is bisphenol A type epoxy resin (bisphenol A diglycidyl ether, oxirane value=0.1～0.8).
(2) polycarboxylic acid is terephthalic acid, faces phthalic acid, m-phthalic acid, maleic acid, FUMARIC ACID TECH GRADE, citric acid, tartrate, propanedioic acid, Succinic Acid, hexanodioic acid, benzene-1, trimellitic acid, trimesic acid.
(3) polyamine is quadrol, propylene diamine, butanediamine, hexanediamine, diethylenetriamine, triethylene tetramine, tetraethylene pentamine, hydroxyethylethylene diamine, Ursol D, faces phenylenediamine, mphenylenediamine.
(4) polyvalent alcohol is ethylene glycol, propylene glycol, butyleneglycol, hexylene glycol, neopentyl glycol, glycerol, TriMethylolPropane(TMP), tetramethylolmethane, glucose, fructose, Diethylene Glycol, triethylene glycol, Resorcinol, faces dihydroxy-benzene, Resorcinol.
(5) polyisocyanates is a 2,4 toluene diisocyanate, 2,6-tolylene diisocyanate, 4,4 '-diphenylmethanediisocyanate, 2,4 '-diphenylmethanediisocyanate, 2,2 '-diphenylmethanediisocyanate, xylylene diisocyanate, naphthalene-1, the 5-vulcabond.
The artificial plate aldehyde-free cement of the present invention, used 0.1%～20% mould inhibitor is one or more in the following mould inhibitor:
(1) phenol organic compound mould inhibitor be pentachlorophenol, sodium pentachlorophenol, pentachlorophenol copper, face phenylphenol, lauric acid pentachlorophenol, to chloro resorcinol
(2) organosulfur compounds mould inhibitor is tetramethyl-thiuram disulfide, ferric dimethyl dithiocarbamate, ziram, 2-mercaptobenzothiazole zinc.
(3) organic tin compound mould inhibitor is two tributyltin oxides, dibutyl tin laurate, FUMARIC ACID TECH GRADE tributyl tin.
(4) the quaternary ammonium salt organic compound mould inhibitor is Dodecyl trimethyl ammonium chloride, palmityl trimethyl ammonium chloride, octadecyl trimethyl ammonium chloride, dodecyl benzyl dimethyl ammonium chloride, cetalkonium chloride, stearyl dimethyl benzyl ammonium chloride.
(5) other mould inhibitor is 2,3,5,6-tetrachloro-4-(methyl sulfanilamide (SN)) pyridine, copper naphthenate, tetrachloro isophthalonitrile.
The artificial plate aldehyde-free cement of the present invention, used 0.1%～60% filler is one or more in the following filler:
(1) the mineral-type filler is Paris white (100～1200 order), kaolin (100～1200 order), Feldspar Powder (100～1200 order), nepheline powder (100～1200 order), silicon dioxide powder (100～1200 order), talcum powder (100～1200 order), aluminum oxide (100～1200 order), magnesium oxide (100～1200 order), titanium dioxide (100～1200 order), zinc oxide (100～1200 order), diatomite (100～1200 order), mica powder (100～1200 order), wollastonite powder (100～1200 order).
(2) organic class filler is W-Gum (100～1200 order) and potato starch (100～1200 order).
The no aldehyde macromolecular compound of cross-linkable solidifying among the present invention, 1%～95% used unsaturated monomer of polymerization are one or more in acrylate, methacrylate, vinylformic acid and ester class thereof, methacrylic acid and ester class thereof, third rare nitrile, third rare acid amides and derivative, vinylbenzene, MALEIC ANHYDRIDE and derivative thereof, the vinyl acetate.
The no aldehyde macromolecular compound of cross-linkable solidifying among the present invention, 0.001%～15% used initiator of polymerization are one or more in azo-initiator, organic peroxide initiator, inorganic peroxide class initiator and the oxidation-reduction class initiator.
The no aldehyde macromolecular compound of cross-linkable solidifying among the present invention, 1%～95% used solvent of polymerization are one or more in mineral-type solvent and the organic kind solvent, or 1%～95% used dispersion medium of polymerization is a water.
The no aldehyde macromolecular compound of cross-linkable solidifying among the present invention, 0.001%～15% used emulsifying agent of polymerization are one or more in anionic emulsifier, amphoteric ion type emulsifying agent and the nonionic emulsifier.
The no aldehyde macromolecular compound of cross-linkable solidifying among the present invention, 1%～95% used unsaturated monomer of polymerization are one or more in the following unsaturated monomer:
(1) acrylate is sodium acrylate, potassium acrylate, ammonium acrylate.
(2) methacrylate is sodium methacrylate, methacrylic acid potassium, ammonium methacrylate.
(3) vinylformic acid and ester class thereof are vinylformic acid, methyl acrylate, ethyl propenoate, butyl acrylate, Isooctyl acrylate monomer, acrylic acid epoxy propyl ester, Hydroxyethyl acrylate, Propylene glycol monoacrylate, vinylformic acid aminoethyl ester.
(4) methacrylic acid and ester class thereof are methacrylic acid, methyl methacrylate, Jia Jibingxisuanyizhi, butyl methacrylate, Isooctyl methacrylate, glytidyl methacrylate, hydroxyethyl methylacrylate, Rocryl 410, methacrylic acid aminoethyl ester.
(5) MALEIC ANHYDRIDE and derivative thereof are MALEIC ANHYDRIDE, dimethyl maleate, diethyl maleate, dibutyl maleate, maleimide.
(6) third rare acid amides and derivative thereof are third rare acid amides, the rare acid amides of N-methyl-prop, N-methylol third rare acid amides.
(7) other unsaturated monomer is: third rare nitrile, vinylbenzene, vinyl acetate.
The no aldehyde macromolecular compound of cross-linkable solidifying among the present invention, 0.001%～15% used initiator of polymerization are one or more in the following initiator:
(1) azo-initiator is Diisopropyl azodicarboxylate, 2,2'-Azobis(2,4-dimethylvaleronitrile).
(2) organic peroxide initiator is dicumyl peroxide, di-tert-butyl peroxide, dibenzoyl peroxide.
(3) inorganic peroxide class initiator is Sodium Persulfate, Potassium Persulphate, ammonium persulphate.
(4) oxidation-reduction class initiator is made up of Oxidizing and Reducing Agents, wherein oxygenant is Sodium Persulfate, Potassium Persulphate, ammonium persulphate, hydrogen peroxide, tertbutyl peroxide, diisopropylbenzenehydroperoxide, isopropyl benzene hydroperoxide, dicumyl peroxide, di-tert-butyl peroxide, dibenzoyl peroxide, reductive agent is ferrous sulfate, S-WAT, oxalic acid, cobalt naphthenate, N, accelerine.
The no aldehyde macromolecular compound of cross-linkable solidifying among the present invention, 0.001%～15% used emulsifying agent of polymerization are one or more in the following emulsifying agent:
(1) anionic emulsifier is sodium soap RCOONa (R=C
11-17), sodium lauryl sulphate, Sodium dodecylbenzene sulfonate, sodium dibutyl naphthalene sulfonate.
(2) the amphoteric ion type emulsifying agent is Varion CDG-K, octadecyl dimethyl betaine, sodium dodecyl aminopropionitrile.
(3) nonionic emulsifier is a fatty alcohol-polyoxyethylene ether
(R=C
11-17, n=8-15), alkylphenol polyoxyethylene
(R=C
6-12, n=5-15), lauric monoglyceride, sorbyl alcohol lauric acid monoesters, anhydrous sorbitol lauric acid monoesters.
The no aldehyde macromolecular compound of cross-linkable solidifying among the present invention, 1%～95% used dispersion medium of polymerization is a water, or 1%～95% used solvent of polymerization is in the following solvent one or more:
(1) the mineral-type solvent is a water.
(2) organic kind solvent is benzene,toluene,xylene, ethanol, acetone, methylethylketone, hexanaphthene, pimelinketone, dimethyl formamide, dimethyl sulfoxide (DMSO).
The no aldehyde macromolecular compound of cross-linkable solidifying among the present invention, used polymerization process can be any in mass polymerization, suspension polymerization, solution polymerization process and the emulsion polymerization.
The no aldehyde macromolecular compound of cross-linkable solidifying among the present invention, polymeric reaction temperature is 0 ℃～180 ℃ during polymerization.
Embodiment
Below by embodiment the artificial plate of the present invention is described in further detail with aldehyde-free cement, but these embodiment limit scope of the present invention.
Embodiment 1 vinylbenzene (20%)-acrylic acid epoxy propyl ester (8%)-vinyl cyanide (8%)-butyl acrylate (4%) copolymer emulsion
Vinylbenzene 200g
Acrylic acid epoxy propyl ester 80g
Vinyl cyanide 80g
Butyl acrylate 40g
Emulsifying agent (OP-10) 15g
Sodium lauryl sulphate 5g
Polyvinyl alcohol (PVA) 40g
Deionized water 536g
Potassium Persulphate 4g
Thermometer is being housed, stirring rod, reflux condensing tube, in the 2L four-hole boiling flask of constant pressure funnel and well heater, add 40g polyvinyl alcohol (PVA) and 536g water, heating also is controlled under 75 ℃ the temperature, after being stirred to polyvinyl alcohol and dissolving fully, add the 4g Potassium Persulphate again, 5g sodium lauryl sulphate and 15g emulsifying agent (OP-10), stirring and dissolving is even, add 200g vinylbenzene again, 80g acrylic acid epoxy propyl ester, / 3rd of 80g vinyl cyanide and a 40g Butyl Acrylate Monomer mixture, temperature control is added dropwise to other 2/3rds monomer mixtures continuously in the above-mentioned 2L four-hole boiling flask by constant pressure funnel in 1.5h and carries out polyreaction under 75 ℃.Behind reinforced the finishing, continue polymerization 9h under 75 ℃ temperature, promptly obtain vinylbenzene (20%)-acrylic acid epoxy propyl ester (8%)-vinyl cyanide (8%)-butyl acrylate (4%) copolymer emulsion.
Embodiment 2 vinyl acetates (29%)-acrylic acid epoxy propyl ester (8%)-butyl acrylate (3%) copolymer emulsion
Vinyl acetate 290g
Acrylic acid epoxy propyl ester 80g
Butyl acrylate 30g
Emulsifying agent (OP-10) 15g
Sodium lauryl sulphate 5g
Polyvinyl alcohol (PVA) 40g
Deionized water 536g
Potassium Persulphate 4g
Thermometer is being housed, stirring rod, reflux condensing tube, in the 2L four-hole boiling flask of constant pressure funnel and well heater, add 40g polyvinyl alcohol (PVA) and 536g water, heating also is controlled under 75 ℃ the temperature, after being stirred to polyvinyl alcohol and dissolving fully, add the 4g Potassium Persulphate again, 5g sodium lauryl sulphate and 15g emulsifying agent (OP-10), stirring and dissolving is even, add the 290g vinyl acetate again, / 3rd of 80g acrylic acid epoxy propyl ester and a 30g Butyl Acrylate Monomer mixture, temperature control is added dropwise to other 2/3rds monomer mixtures continuously in the above-mentioned 2L four-hole boiling flask by constant pressure funnel in 1.5h and carries out polyreaction under 75 ℃.Behind reinforced the finishing, continue polymerization 9h under 75 ℃ temperature, promptly obtain vinyl acetate (29%)-acrylic acid epoxy propyl ester (8%)-butyl acrylate (3%) copolymer emulsion.
Embodiment 3
A.40% vinylbenzene (20%)-acrylic acid epoxy propyl ester (8%)-vinyl cyanide (8%)-butyl acrylate (4%) copolymer emulsion
800g
B. W-Gum 80g
C. sodium pentachlorophenol 10g
D. deionized water 80g
E. diethylenetriamine 30g
After a, b, c and d mixing and stirring, face with preceding adding solidifying agent e and stir and to use.The artificial plate of the present invention is 50 ℃～180 ℃ with the solidification value of aldehyde-free cement.
Embodiment 4
A.40% vinylbenzene (20%)-acrylic acid epoxy propyl ester (8%)-vinyl cyanide (8%)-butyl acrylate (4%) copolymer emulsion
800g
B. W-Gum 80g
C. sodium pentachlorophenol 10g
D. deionized water 85g
E. triethylene tetramine 25g
After a, b, c and d mixing and stirring, face with preceding adding solidifying agent e and stir and to use.The artificial plate of the present invention is 50 ℃～180 ℃ with the solidification value of aldehyde-free cement.
Embodiment 5
A.40% vinylbenzene (20%)-acrylic acid epoxy propyl ester (8%)-vinyl cyanide (8%)-butyl acrylate (4%) copolymer emulsion
800g
B. W-Gum 80g
C. sodium pentachlorophenol 10g
D. deionized water 90g
E. tetraethylene pentamine 20g
After a, b, c and d mixing and stirring, face with preceding adding solidifying agent e and stir and to use.The artificial plate of the present invention is 50 ℃～180 ℃ with the solidification value of aldehyde-free cement.
Embodiment 6
A.40% vinyl acetate (29%)-acrylic acid epoxy propyl ester (8%)-butyl acrylate (3%) copolymer emulsion
80％
B. W-Gum 80g
C. sodium pentachlorophenol 10g
D. deionized water 80g
E. diethylenetriamine 30g
After a, b, c and d mixing and stirring, face with preceding adding solidifying agent e and stir and to use.The artificial plate of the present invention is 50 ℃～180 ℃ with the solidification value of aldehyde-free cement.
Embodiment 7
A.40% vinyl acetate (29%)-acrylic acid epoxy propyl ester (8%)-butyl acrylate (3%) copolymer emulsion
B. W-Gum 80g
C. sodium pentachlorophenol 10g
D. deionized water 85g
E. triethylene tetramine 25g
After a, b, c and d mixing and stirring, face with preceding adding solidifying agent e and stir and to use.The artificial plate of the present invention is 50 ℃～180 ℃ with the solidification value of aldehyde-free cement.
Embodiment 8
A.40% vinyl acetate (29%)-acrylic acid epoxy propyl ester (8%)-butyl acrylate (3%) copolymer emulsion
B. W-Gum 80g
C. sodium pentachlorophenol 10g
D. deionized water 90g
E. tetraethylene pentamine 20g
After a, b, c and d mixing and stirring, face with preceding adding solidifying agent e and stir and to use.The artificial plate of the present invention is 50 ℃～180 ℃ with the solidification value of aldehyde-free cement.
Claims (10)
1, the artificial plate aldehyde-free cement of the present invention is characterized in that it being that the no aldehyde macromolecular compound (0.1%～60%), linking agent (0.1%～60%), mould inhibitor (0.1%～20%), filler (0.1%～60%) and the deionized water (1%～90%) that utilize cross-linkable solidifying is formulated in essence.
2, aldehyde-free cement for wood-based panel according to claim 1 is characterized in that the no aldehyde macromolecular compound of 0.1%～60% cross-linkable solidifying is to utilize unsaturated monomer (1%～95%), initiator (0.001%～15%), emulsifying agent (0.001%～15%) and solvent (1%～95%) or dispersion medium (1%～95%) to be polymerized with certain method at a certain temperature.
3, aldehyde-free cement for wood-based panel according to claim 1 is characterized in that 0.1%～60% linking agent is one or more in the following linking agent:
(1) multi-functional epoxy compound is terephthalic acid diglycidyl ester, faces phthalic acid 2-glycidyl ester, m-phthalic acid 2-glycidyl ester, hexanodioic acid 2-glycidyl ester, P-hydroxybenzoic acid 2-glycidyl ether-ether, resorcinol diglycidyl ether, ethylene glycol diglycidylether, trihydroxymethylpropanyltri diglycidyl ether, 1,4-butanediol diglycidyl ether, glycerol triglycidyl ether, or Resins, epoxy is bisphenol A type epoxy resin (bisphenol A diglycidyl ether, oxirane value=0.1～0.8).
(2) polycarboxylic acid is terephthalic acid, faces phthalic acid, m-phthalic acid, maleic acid, FUMARIC ACID TECH GRADE, citric acid, tartrate, propanedioic acid, Succinic Acid, hexanodioic acid, benzene-1, trimellitic acid, trimesic acid.
(3) polyamine is quadrol, propylene diamine, butanediamine, hexanediamine, diethylenetriamine, triethylene tetramine, tetraethylene pentamine, hydroxyethylethylene diamine, Ursol D, faces phenylenediamine, mphenylenediamine.
(4) polyvalent alcohol is ethylene glycol, propylene glycol, butyleneglycol, hexylene glycol, neopentyl glycol, glycerol, TriMethylolPropane(TMP), tetramethylolmethane, glucose, fructose, Diethylene Glycol, triethylene glycol, Resorcinol, faces dihydroxy-benzene, Resorcinol.
(5) polyisocyanates is a 2,4 toluene diisocyanate, 2,6-tolylene diisocyanate, 4,4 '-diphenylmethanediisocyanate, 2,4 '-diphenylmethanediisocyanate, 2,2-diphenylmethanediisocyanate, xylylene diisocyanate, naphthalene-1,5-vulcabond.
4, aldehyde-free cement for wood-based panel according to claim 1 is characterized in that 0.1%～20% mould inhibitor is one or more in the following mould inhibitor:
(1) phenol organic compound mould inhibitor be pentachlorophenol, sodium pentachlorophenol, pentachlorophenol copper, face phenylphenol, lauric acid pentachlorophenol, to chloro resorcinol
(2) organosulfur compounds mould inhibitor is tetramethyl-thiuram disulfide, ferric dimethyl dithiocarbamate, ziram, 2-mercaptobenzothiazole zinc.
(3) organic tin compound mould inhibitor is two tributyltin oxides, dibutyl tin laurate, FUMARIC ACID TECH GRADE tributyl tin.
(4) the quaternary ammonium salt organic compound mould inhibitor is Dodecyl trimethyl ammonium chloride, palmityl trimethyl ammonium chloride, octadecyl trimethyl ammonium chloride, dodecyl benzyl dimethyl ammonium chloride, cetalkonium chloride, stearyl dimethyl benzyl ammonium chloride.
(5) other mould inhibitor is 2,3,5,6-tetrachloro-4-(methyl sulfanilamide (SN)) pyridine, copper naphthenate, tetrachloro isophthalonitrile.
5, aldehyde-free cement for wood-based panel according to claim 1 is characterized in that 0.1%～60% filler is one or more in the following filler:
(1) the mineral-type filler is Paris white (100～1200 order), kaolin (100～1200 order), Feldspar Powder (100～1200 order), nepheline powder (100～1200 order), silicon dioxide powder (100～1200 order), talcum powder (100～1200 order), aluminum oxide (100～1200 order), magnesium oxide (100～1200 order), titanium dioxide (100～1200 order), zinc oxide (100～1200 order), diatomite (100～1200 order), mica powder (100～1200 order), wollastonite powder (100～1200 order).
(2) organic class filler is W-Gum (100～1200 order) and potato starch (100～1200 order).
6, the no aldehyde macromolecular compound of cross-linkable solidifying according to claim 2 is characterized in that 1%～95% used unsaturated monomer of polymerization is one or more in the following unsaturated monomer:
(1) acrylate is sodium acrylate, potassium acrylate, ammonium acrylate.
(2) methacrylate is sodium methacrylate, methacrylic acid potassium, ammonium methacrylate.
(3) vinylformic acid and ester class thereof are vinylformic acid, methyl acrylate, ethyl propenoate, butyl acrylate, Isooctyl acrylate monomer, acrylic acid epoxy propyl ester, Hydroxyethyl acrylate, Propylene glycol monoacrylate, vinylformic acid aminoethyl ester.
(4) methacrylic acid and ester class thereof are methacrylic acid, methyl methacrylate, Jia Jibingxisuanyizhi, butyl methacrylate, Isooctyl methacrylate, glytidyl methacrylate, hydroxyethyl methylacrylate, Rocryl 410, methacrylic acid aminoethyl ester.
(5) MALEIC ANHYDRIDE and derivative thereof are MALEIC ANHYDRIDE, dimethyl maleate, diethyl maleate, dibutyl maleate, maleimide.
(6) third rare acid amides and derivative thereof are third rare acid amides, the rare acid amides of N-methyl-prop, N-methylol third rare acid amides.
(7) other unsaturated monomer is: vinyl cyanide, vinylbenzene, vinyl acetate.
7, the no aldehyde macromolecular compound of cross-linkable solidifying according to claim 2 is characterized in that 0.001%～15% used initiator of polymerization is one or more in the following initiator:
(1) azo-initiator is Diisopropyl azodicarboxylate, 2,2'-Azobis(2,4-dimethylvaleronitrile).
(2) organic peroxide initiator is dicumyl peroxide, di-tert-butyl peroxide, dibenzoyl peroxide.
(3) inorganic peroxide class initiator is Sodium Persulfate, Potassium Persulphate, ammonium persulphate.
(4) oxidation-reduction class initiator is made up of Oxidizing and Reducing Agents, wherein oxygenant is Sodium Persulfate, Potassium Persulphate, ammonium persulphate, hydrogen peroxide, tertbutyl peroxide, diisopropylbenzenehydroperoxide, isopropyl benzene hydroperoxide, dicumyl peroxide, di-tert-butyl peroxide, dibenzoyl peroxide, reductive agent is ferrous sulfate, S-WAT, oxalic acid, cobalt naphthenate, N, accelerine.
8, the no aldehyde macromolecular compound of cross-linkable solidifying according to claim 2 is characterized in that 0.001%～15% used emulsifying agent of polymerization is one or more in the following emulsifying agent:
(1) anionic emulsifier is sodium soap RCOONa (R=C
11-17), sodium lauryl sulphate, Sodium dodecylbenzene sulfonate, sodium dibutyl naphthalene sulfonate.
(2) the amphoteric ion type emulsifying agent is Varion CDG-K, octadecyl dimethyl betaine, sodium dodecyl aminopropionitrile.
(3) nonionic emulsifier is a fatty alcohol-polyoxyethylene ether
(R=C
11-17, n=8-15), alkylphenol polyoxyethylene
(R=C
6-12, n=5-15), lauric monoglyceride, sorbyl alcohol lauric acid monoesters, anhydrous sorbitol lauric acid monoesters.
9, the no aldehyde macromolecular compound of cross-linkable solidifying according to claim 2 is characterized in that 1%～95% used dispersion medium of polymerization is a water, or 1%～95% used solvent of polymerization is in the following solvent one or more:
(1) the mineral-type solvent is a water.
(2) organic kind solvent is benzene,toluene,xylene, ethanol, acetone, methylethylketone, hexanaphthene, pimelinketone, dimethyl formamide, dimethyl sulfoxide (DMSO).
10, the no aldehyde macromolecular compound of cross-linkable solidifying according to claim 2, it is characterized in that used polymerization process can be any in mass polymerization, suspension polymerization, solution polymerization process and the emulsion polymerization, polymeric reaction temperature is 0 ℃～180 ℃ during polymerization.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100140751A CN1313555C (en) | 2004-02-17 | 2004-02-17 | Aldehyde-free adhesives for artificial board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100140751A CN1313555C (en) | 2004-02-17 | 2004-02-17 | Aldehyde-free adhesives for artificial board |
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| CN1560165A true CN1560165A (en) | 2005-01-05 |
| CN1313555C CN1313555C (en) | 2007-05-02 |
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ID=34440175
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| CNB2004100140751A Expired - Fee Related CN1313555C (en) | 2004-02-17 | 2004-02-17 | Aldehyde-free adhesives for artificial board |
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| CN100389942C (en) * | 2005-12-06 | 2008-05-28 | 戴武兵 | Method for making aldehyde-free composite floor-board |
| CN102516857A (en) * | 2011-11-25 | 2012-06-27 | 东营市盛基环保工程有限公司 | Formaldehyde-free cementing compound for profiled artificial board and preparation method thereof |
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| CN102876240A (en) * | 2012-09-20 | 2013-01-16 | 吴江市天源塑胶有限公司 | High-performance building adhesive |
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| JPS5998177A (en) * | 1982-11-26 | 1984-06-06 | Nitto Electric Ind Co Ltd | Emulsion-type pressure-sensitive adhesive |
| CN86210169U (en) * | 1986-12-15 | 1987-12-12 | 上海市房屋设备工程公司电梯电器工程处 | Plastic protective groove for electric wire |
| CN1120060A (en) * | 1994-10-07 | 1996-04-10 | 福州市建筑科学研究所 | Adhesive for building and its production method |
| CN1135512A (en) * | 1995-05-12 | 1996-11-13 | 四川联合大学 | Aqueous emulsion paper-plastic composite adhesive |
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