CN1313555C - Aldehyde-free adhesives for artificial board - Google Patents
Aldehyde-free adhesives for artificial board Download PDFInfo
- Publication number
- CN1313555C CN1313555C CNB2004100140751A CN200410014075A CN1313555C CN 1313555 C CN1313555 C CN 1313555C CN B2004100140751 A CNB2004100140751 A CN B2004100140751A CN 200410014075 A CN200410014075 A CN 200410014075A CN 1313555 C CN1313555 C CN 1313555C
- Authority
- CN
- China
- Prior art keywords
- aldehyde
- deionized water
- wood
- cross
- acrylic acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Curing Cements, Concrete, And Artificial Stone (AREA)
Abstract
The present invention relates to aldehyde-free adhesive for artificial plates, which belongs to the field of adhesive. The present invention also provides a preparation method of the aldehyde-free adhesive for artificial plates. The present invention is characterized in that the aldehyde-free adhesive for artificial plates is essentially prepared from aldehyde-free macromolecular compounds capable of being cross-linked and solidified, cross-linking agents, mildew inhibitors, filling materials and deionized water. When used for replacing urea-formaldehyde glue for the production of the artificial plates, the aldehyde-free adhesive can essentially eliminate the pollution and the harm of free formaldehyde in artificial plate industry.
Description
Technical field
The present invention relates to a kind of aldehyde-free cement for wood-based panel, belong to adhesive area.
Background technology
Urea-formaldehyde glue is higher because of Joint strength, and cold-resistant water-based is better, and the chemically-resistant medicament corrodes, and makes easyly, and cost is low and used in a large number, and in wood-based panel industry, the usage quantity of urea-formaldehyde glue accounts for about 70% of the total consumption of the various glue of whole wood-based panel industry.But it is crisp easily aging that the shortcoming of urea-formaldehyde glue is a property, even more serious is to have a large amount of formaldehyde in the production process to discharge, contaminate environment, harm direct labor's health, and the finished product sheet material of producing with urea-formaldehyde glue in use, can constantly discharge free formaldehyde for a long time, harm user's physical and mental health.Along with the continuous reinforcement of health of people consciousness and environmental consciousness, the harm of urea-formaldehyde glue is subjected to people's attention day by day.
Carried out much about of the research of low toxicity glued board for addressing this problem both at home and abroad with urea-formaldehyde glue.But all be to improve aspect the production technique of urea-formaldehyde glue, as changing feed ratio, means such as employing batch charging reduce formaldehyde total consumption in glue or the like, and the urea-formaldehyde glue of Sheng Chaning can make free formaldehyde release decrease really like this.Also there are at present many investigators to adopt the method for adding formaldehyde-trapping agent to reduce the burst size of free formaldehyde.But aforesaid method does not all fundamentally solve formaldehyde pollution and harm problem.
China is on Wood-based Panel Production scale and wood-based plate ultimate production, it is Wood-based Panel Production big country, because the urea-formaldehyde glue of domestic production is of poor quality, the finished product sheet material free formaldehyde release of the production of using has had a strong impact on the foreign exchange earning of China's wood-based plate than the external product height.Therefore, how China's wood-based panel industry that always has been described as evergreen industry since the reform and opening-up breaks away from the puzzlement of glue, allows product really go abroad, and seeks bigger more permanent development, is the important topic of pendulum in face of the Study on Adhesive worker.
Summary of the invention
For fundamentally solving formaldehyde pollution and harm problem in the wood-based panel industry, we utilize macromolecular compound, linking agent, mould inhibitor, filler and deionized water to be mixed with aldehyde-free cement for wood-based panel, and available replacement urea-formaldehyde glue is used for the production of wood-based plate.This makes wood-based plate really become Green Product and has crucial meaning promoting the no hydroformylation of adhesion agent for artificial board.Produce market has a extensive future, and economic benefit and social benefit are all very good, and will produce good ecological benefits, have important and practical meanings.
The artificial plate aldehyde-free cement of the present invention is characterized in that it being that the no aldehyde macromolecular compound (0.1%～60%), linking agent (0.1%～60%), mould inhibitor (0.1%～20%), filler (0.1%～60%) and the deionized water (1%～90%) that utilize cross-linkable solidifying is formulated in essence.
The artificial plate aldehyde-free cement of the present invention, the no aldehyde macromolecular compound of used 0.1%～60% cross-linkable solidifying are to utilize unsaturated monomer (1%～95%), initiator (0.001%～15%), emulsifying agent (0.001%～15%) and solvent (1%～95%) or dispersion medium (1%～95%) to be polymerized with certain method at a certain temperature.
The artificial plate aldehyde-free cement of the present invention, used 0.1%～60% linking agent are one or more in multi-functional epoxy compound or Resins, epoxy, polycarboxylic acid, polyamine, polyvalent alcohol, the polyisocyanates.
The artificial plate aldehyde-free cement of the present invention, used 0.1%～20% mould inhibitor are one or more in phenol organic compound mould inhibitor, organosulfur compounds mould inhibitor, organic tin compound mould inhibitor, quaternary ammonium salt organic compound mould inhibitor, other mould inhibitor.
The artificial plate aldehyde-free cement of the present invention, used 0.1%～60% filler are mineral-type filler and organic class filler.
The artificial plate aldehyde-free cement of the present invention, used 0.1%～60% linking agent is one or more in the following linking agent:
(1) multi-functional epoxy compound is terephthalic acid diglycidyl ester, o-phthalic acid diglycidyl ester, m-phthalic acid 2-glycidyl ester, hexanodioic acid 2-glycidyl ester, P-hydroxybenzoic acid 2-glycidyl ether-ether, resorcinol diglycidyl ether, ethylene glycol diglycidylether, trihydroxymethylpropanyltri diglycidyl ether, 1,4-butanediol diglycidyl ether, glycerol triglycidyl ether, or Resins, epoxy is bisphenol A type epoxy resin (bisphenol A diglycidyl ether, oxirane value=0.1～0.8).
(2) polycarboxylic acid is terephthalic acid, phthalic acid, m-phthalic acid, maleic acid, FUMARIC ACID TECH GRADE, citric acid, tartrate, propanedioic acid, Succinic Acid, hexanodioic acid, benzene-1, trimellitic acid, trimesic acid.
(3) polyamine is quadrol, propylene diamine, butanediamine, hexanediamine, diethylenetriamine, triethylene tetramine, tetraethylene pentamine, hydroxyethylethylene diamine, Ursol D, O-Phenylene Diamine, mphenylenediamine.
(4) polyvalent alcohol is ethylene glycol, propylene glycol, butyleneglycol, hexylene glycol, neopentyl glycol, glycerol, TriMethylolPropane(TMP), tetramethylolmethane, glucose, fructose, Diethylene Glycol, triethylene glycol, Resorcinol, pyrocatechol, Resorcinol.
(5) polyisocyanates is a 2,4 toluene diisocyanate, 2,6-tolylene diisocyanate, 4,4 '-diphenylmethanediisocyanate, 2,4 '-diphenylmethanediisocyanate, 2,2 '-diphenylmethanediisocyanate, xylylene diisocyanate, naphthalene-1, the 5-vulcabond.
The artificial plate aldehyde-free cement of the present invention, used 0.1%～20% mould inhibitor is one or more in the following mould inhibitor:
(1) phenol organic compound mould inhibitor be pentachlorophenol, sodium pentachlorophenol, pentachlorophenol copper, orthoxenol, lauric acid pentachlorophenol, to chloro resorcinol
(2) organosulfur compounds mould inhibitor is tetramethyl-thiuram disulfide, ferric dimethyl dithiocarbamate, ziram, 2-mercaptobenzothiazole zinc.
(3) organic tin compound mould inhibitor is two tributyltin oxides, dibutyl tin laurate, FUMARIC ACID TECH GRADE tributyl tin.
(4) the quaternary ammonium salt organic compound mould inhibitor is Dodecyl trimethyl ammonium chloride, palmityl trimethyl ammonium chloride, octadecyl trimethyl ammonium chloride, dodecyl benzyl dimethyl ammonium chloride, cetalkonium chloride, stearyl dimethyl benzyl ammonium chloride.
(5) other mould inhibitor is 2,3,5,6-tetrachloro-4-(methyl sulfanilamide (SN)) pyridine, copper naphthenate, tetrachloro isophthalonitrile.
The artificial plate aldehyde-free cement of the present invention, used 0.1%～60% filler is one or more in the following filler:
(1) the mineral-type filler is Paris white (100～1200 order), kaolin (100～1200 order), Feldspar Powder (100～1200 order), nepheline powder (100～1200 order), silicon dioxide powder (100～1200 order), talcum powder (100～1200 order), aluminum oxide (100～1200 order), magnesium oxide (100～1200 order), titanium dioxide (100～1200 order), zinc oxide (100～1200 order), diatomite (100～1200 order), mica powder (100～1200 order), wollastonite powder (100～1200 order).
(2) organic class filler is W-Gum (100～1200 order) and potato starch (100～1200 order).
The no aldehyde macromolecular compound of cross-linkable solidifying among the present invention, 1%～95% used unsaturated monomer of polymerization are one or more in acrylate, methacrylate, vinylformic acid and ester class thereof, methacrylic acid and ester class, vinyl cyanide, acrylamide and derivative thereof, vinylbenzene, MALEIC ANHYDRIDE and derivative thereof, the vinyl acetate.
The no aldehyde macromolecular compound of cross-linkable solidifying among the present invention, 0.001%～15% used initiator of polymerization are one or more in azo-initiator, organic peroxide initiator, inorganic peroxide class initiator and the oxidation-reduction class initiator.
The no aldehyde macromolecular compound of cross-linkable solidifying among the present invention, 1%～95% used solvent of polymerization are one or more in mineral-type solvent and the organic kind solvent, or 1%～95% used dispersion medium of polymerization is a water.
The no aldehyde macromolecular compound of cross-linkable solidifying among the present invention, 0.001%～15% used emulsifying agent of polymerization are one or more in anionic emulsifier, amphoteric ion type emulsifying agent and the nonionic emulsifier.
The no aldehyde macromolecular compound of cross-linkable solidifying among the present invention, 1%～95% used unsaturated monomer of polymerization are one or more in the following unsaturated monomer:
(1) acrylate is sodium acrylate, potassium acrylate, ammonium acrylate.
(2) methacrylate is sodium methacrylate, methacrylic acid potassium, ammonium methacrylate.
(3) vinylformic acid and ester class thereof are vinylformic acid, methyl acrylate, ethyl propenoate, butyl acrylate, Isooctyl acrylate monomer, acrylic acid epoxy propyl ester, Hydroxyethyl acrylate, Propylene glycol monoacrylate, vinylformic acid aminoethyl ester.
(4) methacrylic acid and ester class thereof are methacrylic acid, methyl methacrylate, Jia Jibingxisuanyizhi, butyl methacrylate, Isooctyl methacrylate, glytidyl methacrylate, hydroxyethyl methylacrylate, Rocryl 410, methacrylic acid aminoethyl ester.
(5) MALEIC ANHYDRIDE and derivative thereof are MALEIC ANHYDRIDE, dimethyl maleate, diethyl maleate, dibutyl maleate, maleimide.
(6) acrylamide and derivative thereof are acrylamide, N methacrylamide, N hydroxymethyl acrylamide.
(7) other unsaturated monomer is: vinyl cyanide, vinylbenzene, vinyl acetate.
The no aldehyde macromolecular compound of cross-linkable solidifying among the present invention, 0.001%～15% used initiator of polymerization are one or more in the following initiator:
(1) azo-initiator is Diisopropyl azodicarboxylate, 2,2'-Azobis(2,4-dimethylvaleronitrile).
(2) organic peroxide initiator is dicumyl peroxide, di-tert-butyl peroxide, dibenzoyl peroxide.
(3) inorganic peroxide class initiator is Sodium Persulfate, Potassium Persulphate, ammonium persulphate.
(4) oxidation-reduction class initiator is made up of Oxidizing and Reducing Agents, wherein oxygenant is Sodium Persulfate, Potassium Persulphate, ammonium persulphate, hydrogen peroxide, tertbutyl peroxide, diisopropylbenzenehydroperoxide, isopropyl benzene hydroperoxide, dicumyl peroxide, di-tert-butyl peroxide, dibenzoyl peroxide, reductive agent is ferrous sulfate, S-WAT, oxalic acid, cobalt naphthenate, N, accelerine.
The no aldehyde macromolecular compound of cross-linkable solidifying among the present invention, 0.001%～15% used emulsifying agent of polymerization are one or more in the following emulsifying agent:
(1) anionic emulsifier is sodium soap R
1COONa (R
1=C
11-17), sodium lauryl sulphate, Sodium dodecylbenzene sulfonate, sodium dibutyl naphthalene sulfonate.
(2) the amphoteric ion type emulsifying agent is Varion CDG-K, octadecyl dimethyl betaine, sodium dodecyl aminopropionitrile.
(3) nonionic emulsifier is a fatty alcohol-polyoxyethylene ether
(R
2=C
11-17, n
1=8-15), alkylphenol polyoxyethylene
(R
3=C
6-12, n
2=5-15), lauric monoglyceride, sorbyl alcohol lauric acid monoesters, anhydrous sorbitol lauric acid monoesters.
The no aldehyde macromolecular compound of cross-linkable solidifying among the present invention, 1%～95% used dispersion medium of polymerization is a water, or 1%～95% used solvent of polymerization is in the following solvent one or more:
(1) the mineral-type solvent is a water.
(2) organic kind solvent is benzene,toluene,xylene, ethanol, acetone, methylethylketone, hexanaphthene, pimelinketone, dimethyl formamide, dimethyl sulfoxide (DMSO).
The no aldehyde macromolecular compound of cross-linkable solidifying among the present invention, used polymerization process can be any in mass polymerization, suspension polymerization, solution polymerization process and the emulsion polymerization.
The no aldehyde macromolecular compound of cross-linkable solidifying among the present invention, polymeric reaction temperature is 0 ℃～180 ℃ during polymerization.
Embodiment
Below by embodiment the artificial plate of the present invention is described in further detail with aldehyde-free cement, but these embodiment limit scope of the present invention.
Embodiment 1 vinylbenzene (20%)-acrylic acid epoxy propyl ester (8%)-vinyl cyanide (8%)-butyl acrylate (4%) copolymer emulsion
Vinylbenzene 200g
Acrylic acid epoxy propyl ester 80g
Vinyl cyanide 80g
Butyl acrylate 40g
Emulsifying agent (OP-10) 15g
Sodium lauryl sulphate 5g
Polyvinyl alcohol (PVA) 40g
Deionized water 536g
Potassium Persulphate 4g
Thermometer is being housed, stirring rod, the cocurrent flow prolong, in the 2L four-hole boiling flask of constant pressure funnel and well heater, add 40g polyvinyl alcohol (PVA) and 536g water, heating also is controlled under 75 ℃ the temperature, after being stirred to polyvinyl alcohol and dissolving fully, add the 4g Potassium Persulphate again, 5g sodium lauryl sulphate and 15g emulsifying agent (OP-10), stirring and dissolving is even, add 200g vinylbenzene again, 80g acrylic acid epoxy propyl ester, / 3rd of 80g vinyl cyanide and a 40g Butyl Acrylate Monomer mixture, temperature control is added dropwise to other 2/3rds monomer mixtures continuously in the above-mentioned 2L four-hole boiling flask by constant pressure funnel in 1.5h and carries out polyreaction under 75 ℃.Behind reinforced the finishing, continue polymerization 9h under 75 ℃ temperature, promptly obtain vinylbenzene (20%)-acrylic acid epoxy propyl ester (8%)-vinyl cyanide (8%)-butyl acrylate (4%) copolymer emulsion.
Embodiment 2 vinyl acetates (29%)-acrylic acid epoxy propyl ester (8%)-butyl acrylate (3%) copolymer emulsion
Vinyl acetate 290g
Acrylic acid epoxy propyl ester 80g
Butyl acrylate 30g
Emulsifying agent (OP-10) 15g
Sodium lauryl sulphate 5g
Polyvinyl alcohol (PVA) 40g
Deionized water 536g
Potassium Persulphate 4g
Thermometer is being housed, stirring rod, reflux condensing tube, in the 2L four-hole boiling flask of constant pressure funnel and well heater, add 40g polyvinyl alcohol (PVA) and 536g water, heating also is controlled under 75 ℃ the temperature, after being stirred to polyvinyl alcohol and dissolving fully, add the 4g Potassium Persulphate again, 5g sodium lauryl sulphate and 15g emulsifying agent (OP-10), stirring and dissolving is even, add the 290g vinyl acetate again, / 3rd of 80g acrylic acid epoxy propyl ester and a 30g Butyl Acrylate Monomer mixture, temperature control is added dropwise to other 2/3rds monomer mixtures continuously in the above-mentioned 2L four-hole boiling flask by constant pressure funnel in 1.5h and carries out polyreaction under 75 ℃.Behind reinforced the finishing, continue polymerization 9h under 75 ℃ temperature, promptly obtain vinyl acetate (29%)-acrylic acid epoxy propyl ester (8%)-butyl acrylate (3%) copolymer emulsion.
Embodiment 3
A.40% vinylbenzene (20%)-acrylic acid epoxy propyl ester (8%)-vinyl cyanide (8%)-butyl acrylate (4%) copolymer emulsion
800g
B. W-Gum 80g
C. sodium pentachlorophenol 10g
D. deionized water 80g
E. diethylenetriamine 30g
After a, b, c and d mixing and stirring, face with preceding adding solidifying agent e and stir and to use.The artificial plate of the present invention is 50 ℃～180 ℃ with the solidification value of aldehyde-free cement.
Embodiment 4
A.40% vinylbenzene (20%)-acrylic acid epoxy propyl ester (8%)-vinyl cyanide (8%)-butyl acrylate (4%) copolymer emulsion
800g
B. W-Gum 80g
C. sodium pentachlorophenol 10g
D. deionized water 85g
E. triethylene tetramine 25g
After a, b, c and d mixing and stirring, face with preceding adding solidifying agent e and stir and to use.The artificial plate of the present invention is 50 ℃～180 ℃ with the solidification value of aldehyde-free cement.
Embodiment 5
A.40% vinylbenzene (20%)-acrylic acid epoxy propyl ester (8%)-vinyl cyanide (8%)-butyl acrylate (4%) copolymer emulsion
800g
B. W-Gum 80g
C. sodium pentachlorophenol 10g
D. deionized water 90g
E. tetraethylene pentamine 20g
After a, b, c and d mixing and stirring, face with preceding adding solidifying agent e and stir and to use.The artificial plate of the present invention is 50 ℃～180 ℃ with the solidification value of aldehyde-free cement.
Embodiment 6
A.40% vinyl acetate (29%)-acrylic acid epoxy propyl ester (8%)-butyl acrylate (3%) copolymer emulsion
80％
B. W-Gum 80g
C. sodium pentachlorophenol 10g
D. deionized water 80g
E. diethylenetriamine 30g
After a, b, c and d mixing and stirring, face with preceding adding solidifying agent e and stir and to use.The artificial plate of the present invention is 50 ℃～180 ℃ with the solidification value of aldehyde-free cement.
Embodiment 7
A.40% vinyl acetate (29%)-acrylic acid epoxy propyl ester (8%)-butyl acrylate (3%) copolymer emulsion
B. W-Gum 80g
C. sodium pentachlorophenol 10g
D. deionized water 85g
E. triethylene tetramine 25g
After a, b, c and d mixing and stirring, face with preceding adding solidifying agent e and stir and to use.The artificial plate of the present invention is 50 ℃～180 ℃ with the solidification value of aldehyde-free cement.
Embodiment 8
A.40% vinyl acetate (29%)-acrylic acid epoxy propyl ester (8%)-butyl acrylate (3%) copolymer emulsion
B. W-Gum 80g
C. sodium pentachlorophenol 10g
D. deionized water 90g
E. tetraethylene pentamine 20g
After a, b, c and d mixing and stirring, face with preceding adding solidifying agent e and stir and to use.The artificial plate of the present invention is 50 ℃～180 ℃ with the solidification value of aldehyde-free cement.
Claims (2)
1. an aldehyde-free cement for wood-based panel is characterized in that utilizing no aldehyde macromolecular compound, linking agent, mould inhibitor, filler and the deionized water of cross-linkable solidifying formulated; Wherein the no aldehyde macromolecular compound of cross-linkable solidifying is to utilize unsaturated monomer, initiator, emulsifying agent and dispersion medium are polymerized, wherein unsaturated monomer is by butyl acrylate, the acrylic acid epoxy propyl ester, vinylbenzene and vinyl cyanide are formed, initiator is a Potassium Persulphate, emulsifying agent is by OP-10, sodium lauryl sulphate and polyvinyl alcohol are formed, dispersion medium is a deionized water, wherein butyl acrylate, the acrylic acid epoxy propyl ester, vinylbenzene, vinyl cyanide, OP-10, sodium lauryl sulphate, polyvinyl alcohol, Potassium Persulphate, the quality proportioning of deionized water is: 40: 80: 200: 80: 15: 5: 40: 4: 536; Filler is a W-Gum; Mould inhibitor is a sodium pentachlorophenol; Linking agent is a diethylenetriamine; The quality proportioning of the no aldehyde macromolecular compound of cross-linkable solidifying, W-Gum, sodium pentachlorophenol, deionized water, diethylenetriamine is: 800: 80: 10: 80: 30, after no aldehyde macromolecular compound, W-Gum, sodium pentachlorophenol and the deionized water mixing and stirring with cross-linkable solidifying, the adding diethylenetriamine stirs and promptly obtains aldehyde-free cement for wood-based panel.
2. the preparation method of aldehyde-free cement for wood-based panel according to claim 1, it is characterized in that thermometer is being housed, stirring rod, reflux condensing tube, in the 2L four-hole boiling flask of constant pressure funnel and well heater, add 40g polyvinyl alcohol and 536g deionized water, heating also is controlled under 75 ℃, after being stirred to polyvinyl alcohol and dissolving fully, add the 4g Potassium Persulphate again, 5g sodium lauryl sulphate and 15g emulsifier op-10, stirring and dissolving is even, add 200g vinylbenzene again, the 80g vinyl cyanide, / 3rd of 80g acrylic acid epoxy propyl ester and a 40g Butyl Acrylate Monomer mixture, temperature control is under 75 ℃, in 1.5h, other 2/3rds monomer mixtures are added drop-wise in the above-mentioned 2L four-hole boiling flask continuously by constant pressure funnel and carry out polyreaction, behind reinforced the finishing, continuation is polymerization 9h under 75 ℃ temperature, promptly get styrene-acrylonitrile-acrylic acid epoxy propyl ester-butyl acrylate copolymer emulsion, with copolymer emulsion, W-Gum, sodium pentachlorophenol, after the deionized water mixing and stirring, adding linking agent diethylenetriamine stirs and promptly obtains aldehyde-free cement for wood-based panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100140751A CN1313555C (en) | 2004-02-17 | 2004-02-17 | Aldehyde-free adhesives for artificial board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100140751A CN1313555C (en) | 2004-02-17 | 2004-02-17 | Aldehyde-free adhesives for artificial board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1560165A CN1560165A (en) | 2005-01-05 |
| CN1313555C true CN1313555C (en) | 2007-05-02 |
Family
ID=34440175
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100140751A Expired - Fee Related CN1313555C (en) | 2004-02-17 | 2004-02-17 | Aldehyde-free adhesives for artificial board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1313555C (en) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100389942C (en) * | 2005-12-06 | 2008-05-28 | 戴武兵 | Method for making aldehyde-free composite floor-board |
| CN102516857B (en) * | 2011-11-25 | 2015-04-29 | 东营市盛基环保工程有限公司 | Formaldehyde-free cementing compound for profiled artificial board and preparation method thereof |
| CN102838939B (en) * | 2012-09-12 | 2013-09-04 | 广东金万得胶粘剂有限公司 | Modified water-base nano binder |
| CN102876240B (en) * | 2012-09-20 | 2013-09-25 | 吴江市天源塑胶有限公司 | High-performance building adhesive |
| CN103013404B (en) * | 2012-12-31 | 2015-02-25 | 佛山海特化工科技有限公司 | Dry powder adhesive for paper products and preparation method thereof |
| CN103541236A (en) * | 2013-10-23 | 2014-01-29 | 合肥聚合辐化技术有限公司 | Soft corrosion-resistant printing adhesive and preparation method |
| CN103834309A (en) * | 2014-02-26 | 2014-06-04 | 南通优尼科化工有限公司 | Methyl methacrylate adhesive |
| CN103862540B (en) * | 2014-02-27 | 2017-05-24 | 李海滨 | Method for reinforcing and modifying bamboo willow wood |
| CN103820040A (en) * | 2014-03-20 | 2014-05-28 | 浙江红高梁木业有限公司 | Adhesive for solid wood floors and preparation method of adhesive |
| CN104673148A (en) * | 2015-01-28 | 2015-06-03 | 南通市鸿瑞化工有限公司 | Environmental-friendly adhesive and preparation method thereof |
| CN104673147A (en) * | 2015-01-28 | 2015-06-03 | 海安县紫石涂料有限公司 | Strong water-resistant white emulsion and preparation method thereof |
| CN104882197A (en) * | 2015-06-02 | 2015-09-02 | 江苏亨通线缆科技有限公司 | Aluminum alloy flexible cable for power supply to communications facilities |
| CN105082310A (en) * | 2015-07-29 | 2015-11-25 | 安徽鑫润新型材料有限公司 | Antimicrobial, deodorant and environment-friendly fiberboard and preparation method thereof |
| CN105082311A (en) * | 2015-07-29 | 2015-11-25 | 安徽鑫润新型材料有限公司 | Anti-aging environment-friendly fiberboard and preparing method thereof |
| CN105082312A (en) * | 2015-07-29 | 2015-11-25 | 安徽鑫润新型材料有限公司 | Insect-repellent, mildewproof and environment-friendly fiberboard and preparation method thereof |
| CN105150349A (en) * | 2015-07-29 | 2015-12-16 | 安徽鑫润新型材料有限公司 | Environmentally friendly fiberboard capable of calming nerves and aiding sleeping and preparation method of environmentally friendly fiberboard |
| CN105153860A (en) * | 2015-09-14 | 2015-12-16 | 安徽华润涂料有限公司 | Adhesive of wear-resistant paint on outer layers of household security windows and preparation method thereof |
| CN105925217B (en) * | 2016-05-11 | 2018-02-02 | 南京京锦元科技实业有限公司 | A kind of polyvinyl acetate emulsion binding agent |
| CN106345710A (en) * | 2016-08-24 | 2017-01-25 | 安徽正田能源科技有限公司 | Glue pre-decomposition agent for silicon wafer processing and preparation method thereof |
| CN106336835B (en) * | 2016-09-20 | 2018-05-04 | 中国科学院理化技术研究所 | Single-component aldehyde-free adhesive for multilayer board and application thereof |
| CN107056134B (en) * | 2017-04-27 | 2019-05-17 | 福州皇家地坪有限公司 | Prefabricated aqueous environment protection grinding stone system |
| CN107459950A (en) * | 2017-09-02 | 2017-12-12 | 佛山市北朝源科技服务有限公司 | A kind of epoxy resin composition for semiconductor encapsulation |
| CN107471387A (en) * | 2017-09-27 | 2017-12-15 | 柳州隆泰竹业有限公司 | A kind of production method for recombinating bamboo flooring |
| CN108130025A (en) * | 2017-12-19 | 2018-06-08 | 江苏斯瑞达新材料科技有限公司 | Environment-friendlyhigh-viscosity high-viscosity acrylate adhesive and its preparation process |
| CN110157342A (en) * | 2018-03-27 | 2019-08-23 | 利辛县缘艺纱网有限公司 | A kind of screen door and window exempts to punch installation adhesive and preparation method thereof |
| CN108485539A (en) * | 2018-04-20 | 2018-09-04 | 张剑 | A kind of preparation method of paper tube adhesive |
| CN108485540A (en) * | 2018-04-23 | 2018-09-04 | 合肥市晨雷思建筑材料科技有限公司 | A kind of wallpaper organo-mineral complexing adhesive |
| CN109321013A (en) * | 2018-10-18 | 2019-02-12 | 扬州中涂科技集团有限公司 | A kind of aqueous interfacial agents of revetment |
| CN109676734A (en) * | 2018-12-29 | 2019-04-26 | 南宁市邦得力木业有限责任公司 | Method for preparing hexagonal plate blank base material by using eucalyptus core |
| CN110510908A (en) * | 2019-08-08 | 2019-11-29 | 泰源工程集团股份有限公司 | A kind of paving cement mortar modified additive |
| CN114213999A (en) * | 2021-12-13 | 2022-03-22 | 云南正邦科技有限公司 | Water-based formaldehyde-free adhesive |
| CN115404011B (en) * | 2022-10-31 | 2023-03-03 | 四川省众望科希盟科技有限公司 | Method for bonding aircraft box section and expanded polytetrafluoroethylene in medium environment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5998177A (en) * | 1982-11-26 | 1984-06-06 | Nitto Electric Ind Co Ltd | Emulsion-type pressure-sensitive adhesive |
| CN86210169U (en) * | 1986-12-15 | 1987-12-12 | 上海市房屋设备工程公司电梯电器工程处 | Plastic protective groove for electric wire |
| CN1120060A (en) * | 1994-10-07 | 1996-04-10 | 福州市建筑科学研究所 | Adhesive for building and its production method |
| CN1135512A (en) * | 1995-05-12 | 1996-11-13 | 四川联合大学 | Aqueous emulsion paper-plastic composite adhesive |
-
2004
- 2004-02-17 CN CNB2004100140751A patent/CN1313555C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5998177A (en) * | 1982-11-26 | 1984-06-06 | Nitto Electric Ind Co Ltd | Emulsion-type pressure-sensitive adhesive |
| CN86210169U (en) * | 1986-12-15 | 1987-12-12 | 上海市房屋设备工程公司电梯电器工程处 | Plastic protective groove for electric wire |
| CN1120060A (en) * | 1994-10-07 | 1996-04-10 | 福州市建筑科学研究所 | Adhesive for building and its production method |
| CN1135512A (en) * | 1995-05-12 | 1996-11-13 | 四川联合大学 | Aqueous emulsion paper-plastic composite adhesive |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1560165A (en) | 2005-01-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1313555C (en) | Aldehyde-free adhesives for artificial board | |
| CN1102917C (en) | Cement additive and cement composition using same | |
| CN100343293C (en) | Fluorosilicone modified acrylic emulsion for weather resistant antifouling paint | |
| CN1104391C (en) | Cement dispersing agent, prepn, method and composition using said cement dispersing agent | |
| CN105531340B (en) | Acrylate emulsion adhesive and preparation method thereof | |
| CN1125000C (en) | Application of polymer in plaster wall slab | |
| CN1100107C (en) | Emulsion adhesives | |
| CN1052471A (en) | Has the cement that improves chemical resistance by polymer modification | |
| CN1311041C (en) | High molecule compound of aldehyde-free adhesives for producing artificial board | |
| CN1959530A (en) | Ultraviolet light solidified coating in use for post processing of imaging material | |
| CN1743371A (en) | Nucleocapsid structure polyvinyl chloride impact modifier, and its preparing method and use | |
| CN1244658C (en) | Water based copolymer adhesive for artificial board and its preparation method | |
| CN101062850A (en) | Flexible acrylic ester emulsion for sand pulp | |
| CN1138054A (en) | Preparation of emulsifier-free aqueous polymer emulsions | |
| CN1436824A (en) | Ultraviolet light cured burnished paint for wooden articles | |
| CN1667009A (en) | Carboxylic acids graft copolymer concrete strengthening agent | |
| CN1950412A (en) | Impact resistance modifier and resin composition | |
| CN1872771A (en) | Method for synthesizing water reducing agent of polycarboxylate | |
| CN1823150A (en) | Water-whitening resistant latex emulsion pressure sensitive adhesive and its production | |
| CN1249187C (en) | Composite adhesive specially for heat insulating polystyrene outer-wall board | |
| CN101045772A (en) | Elastic phenylethylene-ester acrylate water-proof emulsion and preparation method thereof | |
| CN1903930A (en) | Flexible acrylic acid waste polyurethane water composite joint filling material and its preparation method | |
| CN107488426A (en) | A kind of water-based tile adhesives and preparation method thereof | |
| EP3642285B1 (en) | Aqueous dispersion of polymeric particles having core-shell structure, the preparation thereof and the coating formed therefrom | |
| CN1587178A (en) | Polymer emulsion for cement base material water reducing and its preparing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |