CN1542839B - 直接在电路板上安装的存储系统以及相关的方法 - Google Patents

直接在电路板上安装的存储系统以及相关的方法 Download PDF

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Publication number
CN1542839B
CN1542839B CN2004100477286A CN200410047728A CN1542839B CN 1542839 B CN1542839 B CN 1542839B CN 2004100477286 A CN2004100477286 A CN 2004100477286A CN 200410047728 A CN200410047728 A CN 200410047728A CN 1542839 B CN1542839 B CN 1542839B
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CN
China
Prior art keywords
memory
motherboard
signal
clock
storage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2004100477286A
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English (en)
Chinese (zh)
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CN1542839A (zh
Inventor
李祯培
郑会柱
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Samsung Electronics Co Ltd
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Samsung Electronics Co Ltd
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Filing date
Publication date
Priority claimed from KR10-2003-0028175A external-priority patent/KR100532432B1/ko
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of CN1542839A publication Critical patent/CN1542839A/zh
Application granted granted Critical
Publication of CN1542839B publication Critical patent/CN1542839B/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/14—Handling requests for interconnection or transfer
    • G06F13/16—Handling requests for interconnection or transfer for access to memory bus
    • G06F13/1668—Details of memory controller
    • G06F13/1673—Details of memory controller using buffers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/14—Handling requests for interconnection or transfer
    • G06F13/16—Handling requests for interconnection or transfer for access to memory bus
    • G06F13/1668—Details of memory controller
    • G06F13/1684—Details of memory controller using multiple buses

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Dram (AREA)
  • Memory System (AREA)
CN2004100477286A 2003-05-02 2004-05-02 直接在电路板上安装的存储系统以及相关的方法 Expired - Fee Related CN1542839B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR28175/2003 2003-05-02
KR28175/03 2003-05-02
KR10-2003-0028175A KR100532432B1 (ko) 2003-05-02 2003-05-02 커맨드 신호와 어드레스 신호의 고속 전송이 가능한메모리 시스템
US10/750,093 2003-12-31
US10/750093 2003-12-31
US10/750,093 US7227796B2 (en) 2003-05-02 2003-12-31 Memory system mounted directly on board and associated method

Publications (2)

Publication Number Publication Date
CN1542839A CN1542839A (zh) 2004-11-03
CN1542839B true CN1542839B (zh) 2010-08-25

Family

ID=33455675

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2004100477286A Expired - Fee Related CN1542839B (zh) 2003-05-02 2004-05-02 直接在电路板上安装的存储系统以及相关的方法

Country Status (5)

Country Link
US (1) US7692983B2 (enExample)
JP (1) JP4837899B2 (enExample)
CN (1) CN1542839B (enExample)
DE (1) DE102004022347B4 (enExample)
TW (1) TWI261269B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100532432B1 (ko) * 2003-05-02 2005-11-30 삼성전자주식회사 커맨드 신호와 어드레스 신호의 고속 전송이 가능한메모리 시스템
DE102004022347B4 (de) 2003-05-02 2008-04-03 Samsung Electronics Co., Ltd., Suwon Speichersystem mit Motherboard und zugehöriges Montageverfahren
US8143720B2 (en) * 2007-02-06 2012-03-27 Rambus Inc. Semiconductor module with micro-buffers
TW200921595A (en) * 2007-11-14 2009-05-16 Darfon Electronics Corp Multi-lamp backlight apparatus
US7915912B2 (en) * 2008-09-24 2011-03-29 Rambus Inc. Signal lines with internal and external termination
KR20140037443A (ko) * 2012-09-18 2014-03-27 삼성전자주식회사 메모리 장치 및 그 튜닝 방법
US8860479B2 (en) * 2013-03-15 2014-10-14 Intel Corporation Integrated clock differential buffering
JP6424847B2 (ja) * 2016-02-16 2018-11-21 京セラドキュメントソリューションズ株式会社 伝送装置及びこれを備えた画像形成装置
EP3837611A4 (en) 2018-08-14 2022-05-11 Rambus Inc. PACKAGED INTEGRATED DEVICE
US11757436B2 (en) * 2021-08-30 2023-09-12 Taiwan Semiconductor Manufacturing Company Ltd. System for signal propagation and method of operating the same

Citations (4)

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Publication number Priority date Publication date Assignee Title
US5321664A (en) * 1989-01-16 1994-06-14 Hitachi, Ltd. Semiconductor integrated circuit device having various blocks specifically arranged on a single semiconductor substrate for high speed operation
CN1198548A (zh) * 1997-01-06 1998-11-11 三星电子株式会社 一种带有插入式模块的计算机系统
US6414869B1 (en) * 1997-12-02 2002-07-02 Micron Technology, Inc. Quad in-line memory module
US6418034B1 (en) * 1999-01-14 2002-07-09 Micron Technology, Inc. Stacked printed circuit board memory module and method of augmenting memory therein

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Publication number Priority date Publication date Assignee Title
JPH08305629A (ja) * 1995-04-25 1996-11-22 Internatl Business Mach Corp <Ibm> メモリ・アクセス制御装置及びメモリ・アクセス制御方法、コンピュータ・システム
US5650757A (en) * 1996-03-27 1997-07-22 Hewlett-Packard Company Impedance stepping for increasing the operating speed of computer backplane busses
JP3455040B2 (ja) * 1996-12-16 2003-10-06 株式会社日立製作所 ソースクロック同期式メモリシステムおよびメモリユニット
JPH10283256A (ja) * 1997-04-07 1998-10-23 Nec Corp メモリバス接続方式
US5896346A (en) * 1997-08-21 1999-04-20 International Business Machines Corporation High speed and low cost SDRAM memory subsystem
US6229727B1 (en) * 1998-09-28 2001-05-08 Cisco Technology, Inc. Method and apparatus for support of multiple memory devices in a single memory socket architecture
US6414868B1 (en) * 1999-06-07 2002-07-02 Sun Microsystems, Inc. Memory expansion module including multiple memory banks and a bank control circuit
JP2001022684A (ja) * 1999-07-13 2001-01-26 Toshiba Corp システム基板及びコンピュータシステム
WO2001042893A1 (en) * 1999-12-10 2001-06-14 Hitachi, Ltd Semiconductor module
JP4569912B2 (ja) * 2000-03-10 2010-10-27 エルピーダメモリ株式会社 メモリシステム
KR100399594B1 (ko) * 2000-05-04 2003-09-26 삼성전자주식회사 시스템 보드 및 이 보드의 임피이던스 조절 방법
US7313715B2 (en) 2001-02-09 2007-12-25 Samsung Electronics Co., Ltd. Memory system having stub bus configuration
JP3799251B2 (ja) * 2001-08-24 2006-07-19 エルピーダメモリ株式会社 メモリデバイス及びメモリシステム
DE10152916B4 (de) * 2001-10-26 2006-11-30 Infineon Technologies Ag Informationsenthaltungseinrichtung für Speichermodule und Speicherchips
DE102004022347B4 (de) 2003-05-02 2008-04-03 Samsung Electronics Co., Ltd., Suwon Speichersystem mit Motherboard und zugehöriges Montageverfahren
KR100532432B1 (ko) * 2003-05-02 2005-11-30 삼성전자주식회사 커맨드 신호와 어드레스 신호의 고속 전송이 가능한메모리 시스템

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5321664A (en) * 1989-01-16 1994-06-14 Hitachi, Ltd. Semiconductor integrated circuit device having various blocks specifically arranged on a single semiconductor substrate for high speed operation
CN1198548A (zh) * 1997-01-06 1998-11-11 三星电子株式会社 一种带有插入式模块的计算机系统
US6414869B1 (en) * 1997-12-02 2002-07-02 Micron Technology, Inc. Quad in-line memory module
US6418034B1 (en) * 1999-01-14 2002-07-09 Micron Technology, Inc. Stacked printed circuit board memory module and method of augmenting memory therein

Also Published As

Publication number Publication date
DE102004022347B4 (de) 2008-04-03
DE102004022347A1 (de) 2004-12-09
TW200519964A (en) 2005-06-16
US20070250658A1 (en) 2007-10-25
CN1542839A (zh) 2004-11-03
JP2004334879A (ja) 2004-11-25
US7692983B2 (en) 2010-04-06
TWI261269B (en) 2006-09-01
JP4837899B2 (ja) 2011-12-14

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Granted publication date: 20100825

Termination date: 20140502