CN1477686A - 超声波接合用接合工具 - Google Patents

超声波接合用接合工具 Download PDF

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Publication number
CN1477686A
CN1477686A CNA031491944A CN03149194A CN1477686A CN 1477686 A CN1477686 A CN 1477686A CN A031491944 A CNA031491944 A CN A031491944A CN 03149194 A CN03149194 A CN 03149194A CN 1477686 A CN1477686 A CN 1477686A
Authority
CN
China
Prior art keywords
joining tool
ultrasonic wave
face
engages
instrument
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA031491944A
Other languages
English (en)
Chinese (zh)
Inventor
山本佳津子
文
藤冈昭文
男
中井哲男
二
石桥惠二
郎
关裕一郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Publication of CN1477686A publication Critical patent/CN1477686A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H01L21/607—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving the application of mechanical vibrations, e.g. ultrasonic vibrations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75312—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H01L2224/75353—Ultrasonic horns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
CNA031491944A 2002-08-23 2003-06-20 超声波接合用接合工具 Pending CN1477686A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002242797 2002-08-23
JP2002242797A JP2004087539A (ja) 2002-08-23 2002-08-23 超音波ボンディング用ボンディングツール

Publications (1)

Publication Number Publication Date
CN1477686A true CN1477686A (zh) 2004-02-25

Family

ID=31884591

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA031491944A Pending CN1477686A (zh) 2002-08-23 2003-06-20 超声波接合用接合工具

Country Status (4)

Country Link
JP (1) JP2004087539A (ja)
KR (1) KR20040018198A (ja)
CN (1) CN1477686A (ja)
TW (1) TW200403123A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100446206C (zh) * 2004-11-09 2008-12-24 富士通株式会社 超声波安装方法及采用该方法的超声波安装设备
CN102490132A (zh) * 2011-11-25 2012-06-13 苏州科技学院 一种压电超声振动吸附拾取器
CN105101658A (zh) * 2015-09-09 2015-11-25 中南大学 一种纳米银导电墨水的热超声低温烧结方法及装置
CN111384425A (zh) * 2018-12-27 2020-07-07 三洋电机株式会社 二次电池

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4525210B2 (ja) * 2004-06-29 2010-08-18 株式会社村田製作所 超音波接合装置
JP2006210534A (ja) * 2005-01-26 2006-08-10 Sumitomo Electric Hardmetal Corp 実装工具
JP4507941B2 (ja) * 2005-03-28 2010-07-21 パナソニック電工株式会社 超音波接合装置の製造方法
KR100837734B1 (ko) * 2006-08-01 2008-06-13 (주)창조엔지니어링 초음파를 이용한 솔더볼 본딩방법
JP5967545B2 (ja) * 2013-02-21 2016-08-10 パナソニックＩｐマネジメント株式会社 電子部品ボンディングツール
WO2020158621A1 (ja) * 2019-01-28 2020-08-06 京セラ株式会社 ボンディングツールおよびその製造方法、並びにボンディング装置およびボンディング方法
KR102464697B1 (ko) 2020-05-12 2022-11-08 한국야금 주식회사 다이아몬드 피복 본딩 공구
CN113305362B (zh) * 2021-06-15 2024-04-02 青岛科技大学 一种通过超声波修复精密加工用烧结金刚石工具的方法
CN114309920A (zh) * 2021-12-23 2022-04-12 潮州三环（集团）股份有限公司 一种陶瓷劈刀及制备方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100446206C (zh) * 2004-11-09 2008-12-24 富士通株式会社 超声波安装方法及采用该方法的超声波安装设备
CN102490132A (zh) * 2011-11-25 2012-06-13 苏州科技学院 一种压电超声振动吸附拾取器
CN102490132B (zh) * 2011-11-25 2013-06-19 苏州科技学院 一种压电超声振动吸附拾取器
CN105101658A (zh) * 2015-09-09 2015-11-25 中南大学 一种纳米银导电墨水的热超声低温烧结方法及装置
CN105101658B (zh) * 2015-09-09 2017-10-20 中南大学 一种纳米银导电墨水的热超声低温烧结方法及装置
CN111384425A (zh) * 2018-12-27 2020-07-07 三洋电机株式会社 二次电池
CN111384425B (zh) * 2018-12-27 2024-02-02 三洋电机株式会社 二次电池

Also Published As

Publication number Publication date
TW200403123A (en) 2004-03-01
KR20040018198A (ko) 2004-03-02
JP2004087539A (ja) 2004-03-18

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C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication