CN1454402A - 传输线与模块间的自校准转接 - Google Patents

传输线与模块间的自校准转接 Download PDF

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CN1454402A
CN1454402A CN00819947A CN00819947A CN1454402A CN 1454402 A CN1454402 A CN 1454402A CN 00819947 A CN00819947 A CN 00819947A CN 00819947 A CN00819947 A CN 00819947A CN 1454402 A CN1454402 A CN 1454402A
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transmission line
welding
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卡勒·约吉奥
奥利·萨尔梅拉
玛库·科伊维斯托
密科·萨利科斯基
亚利·纳迪尔·阿斯兰
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced with unbalanced lines or devices
    • H01P5/107—Hollow-waveguide/strip-line transitions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/048—Self-alignment during soldering; Terminals, pads or shape of solder adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components

Abstract

本发明涉及一种用于在传输线(1)和与所述传输线(1)相连的模块(2)之间形成自校准转接的方法。本发明同样涉及这样一种模块(2)，这样一种传输线(1)，可能置于这种模块(2)和这种传输线(1)之间的中间元件(5)，以及包括这种转接的一种系统。为使传输线(1)能与某一其它模块(2)简单且精确地连接，建议在模块(2)和传输线(1)或中间元件(5)上分别使用匹配的焊接粒子(8)和焊接点，并且对连接的元件(1)和(2)或(5)和(2)采用软熔处理，由此构成自校准连接。本发明尤其适用于波导－微波传输带转接。

Description

传输线与模块间的自校准转接
技术领域
本发明涉及一种用于在传输线和与所述传输线相连的模块之间形成自校准转接的方法。本发明同样涉及这样一种模块，这样一种传输线，可能置于这种模块和这种传输线之间的这样一种中间元件，以及包括这种转接的一种系统。
背景技术
传输线与其它模块之间的转接被应用于不同系统中。一种普通的连接是，例如，波导-微波传输带转接。通常，对该连接的精度要求高，因为即使是小的偏差都将降低性能，从而导致相当大的插入损耗。尤其是波导-微波传输带转接对几何误差非常敏感。模拟实验表明，在微波传输带中仅50微米的长度差能致使插入损耗增加0.5dB到1.2dB。
事实上，传输线和其它模块通过机械连接以提供所需的转接。为此可以采用螺栓连接，焊接或类似的方法。然而这类方法导致结果相当不准确并且容差十分大，这样就不能令人满意地满足要求。机械连接传输线和其它模块还需要一个极其困难和耗时的安装步骤。另外，还需要类似定位设备和CAE工具的特殊工具。
发明内容
因此本发明的目的是提供一种允许简单且精确地连接传输线与其它某一模块的方法，提供一种能够简单且精确地与传输线连接的模块，提供一种能够用于简单且精确地连接模块与传输线的中间元件，以及提供一种包括由精确连接形成的传输线到模块的转接的系统。
一方面，这个目的是通过一种用于在传输线和与所述传输线相连的模块之间形成自校准转接的方法，包括权利要求1或2的步骤实现的。
另一方面，这个目的是通过一种用于形成与传输线的自校准转接、呈现权利要求5特征的模块，一种呈现权利要求10特征的中间元件，以及一种用于形成与模块的自校准转接、呈现权利要求11或12特征的传输线实现的。
最后，本发明的目的是通过一种呈现权利要求14或15特征的系统实现的。
本发明出于这样一种观点，即传输线与另一模块之间的精确连接可以通过利用软熔处理下焊接粒子的特性来实现。本领域的技术人员知道，在软熔处理下，由于焊接材料的表面张力现象，焊球和其它焊接粒子是自校准的。因此，在软熔处理下，轻微的未对准会被表面张力所纠正，使得无需使用任何额外的步骤进行校准。按照本发明的建议，当使用焊接粒子的软熔焊接用于传输线与模块间的转接时，就可以实现传输线和模块之间非常精确的连接，由此大大降低了所产生的插入损耗。
所建议的方法和相应的模块，传输线，中间元件和系统，均比现有技术的便宜，因为除了根据现有技术的方法也必须执行的简单的软熔处理外，不再需要额外的工具和操作步骤。
对于根据本发明的方法，模块，传输线和系统建议采用两种基本方案，这两种方案均基于上述原理。根据第一个方案，模块和传输线直接相连或被指定直接相连。根据第二个方案，模块和传输线通过一个中间元件，例如一块印刷电路板，相连或被指定相连。第二个方案具有便于施加焊接点和便于通过软熔焊接连接的优点。
从附属权利要求中可以得到本发明的较佳实施例。
在根据本发明的方法的一个优选实施例中，焊接点是通过利用焊接掩模，特别是通过利用光刻图案形成工艺提供的。采用这种处理，在通过软熔焊接分别连接所述模块和传输线或中间元件时，会达到特别好的精度。如果采用中间元件，这种元件可通过机械方式，例如通过螺丝，被固定到传输线上。
利用所建议的方法和元件，任何模块——系统模块或单个芯片都能以高精度与传输线连接。本发明特别针对连接微波传输带，如带状线，共面波导或类似模块，或T/R发射机/接收机)或类似模块与传输线，因为这些连接都需要特别的定位精度。如果所涉及的传输线是波导，它可具有任何所需的横截面，例如，矩形，脊形或圆形横截面。
在模块上提供的焊接粒子可以是球栅阵列(BGA)型，柱栅阵列(CGA)型，或甚至是倒装晶片型，如果连接的只是单个芯片，而不是整个系统模块的话。
附图说明
下面参考附图更详细地解释本发明，其中
图1示意了本发明的第一个实施例，而
图2示意了本发明的第二个实施例。
具体实施方式
图1示意了本发明的原理。为此，图1示意了根据本发明的系统元件在连接前的截面图。
图中描绘了一部分的矩形波导1构成了本系统的传输线。在其开口端3，波导1有一个增大的边缘4，其上固定了一个中间开口的中间元件5。
在波导1的开口端3之上，描绘了一个简单的微波传输带结构2。这种微波传输带2代表与波导1相连的一个系统模块。微波传输带2在其接地面7上有一个小孔6，通过它微波传输带2与波导1的开口端3耦合以便构成转接。
微波传输带2在其接地面7具有球栅阵列(BGA)或类似形式的连接技术的焊球8，焊球8被紧密地布置在接地面7上的小孔6的周围。
在中间元件5的顶部通过使用焊接掩模形成对应焊球8的排列的焊接点(未示出)。焊接掩膜的清晰度是利用光刻图案形成实现的。
按照图1中描绘的情况，微波传输带2置于波导1上，以便焊球8置于中间元件5的焊接点上。之后执行软熔焊接过程，组合微波传输带2与中间元件5，由此与波导1组合。
通过这样的程序，波导1以非常高的精度连接微波传输带2。即使微波传输带2在中间元件5上的原位置稍微有点不准确，由于焊接材料表面张力的作用，焊接处理还是会将微波传输带2设置在正确的位置。
图2所示的第二个实施例表示根据本发明的一个更为复杂的系统，整个系统模块与波导相连以构成波导—微波传输带转接。对应部件标记与图1相同的附图标记。
在图2的底部，描绘了一个铝制的波导1。波导1镀有一种惰性金属，例如黄金，以维持低损耗特性。
中间开口的FR-4(热固玻璃纤维-环氧薄片)印刷电路板5构成系统的中间元件，并且通过螺丝9与波导1的开口端3的边缘4连接。设计波导1的边缘4，印刷电路板5和二者的螺丝孔，以确保在固定波导1和电路板5时所确定的二者之间的相对位置。在FR-4印刷插线板5的顶部通过BGA型焊球8连接一个带有科伐盖10的陶瓷模块2。模块2的接地面7上的小孔6正好位于波导1的开口端3的开口上方。
系统组装如下：
为陶瓷模块2提供BGA型焊球8，同时为FR-4印刷线路板5提供与之对应的焊接点排列。由此，通过软熔将FR-4印刷线路板5与陶瓷模块2焊接。只有在这之后，由模块2和印刷线路板5组成的整个实体才被置于波导结构1的顶部。最后，FR-4印刷线路板5和陶瓷模块2一起通过机械方式用螺丝9连接波导结构1。

Claims (15)

1、一种用于在传输线(1)和与所述传输线(1)相连的模块(2)之间形成自校准转接的方法，包括步骤：
a)在指定用于连接所述模块(2)与所述传输线(1)的区域，为模块(2)提供焊接粒子(8)的排列；
b)为指定用于连接到模块(2)的传输线(1)的开口端(3)的边缘(4)提供对应模块(2)上的焊接粒子(8)的排列的焊接点排列；
c)将模块(2)的焊接粒子(8)置于焊接点上，并且通过软熔焊接将模块(2)与传输线(1)的开口端(3)的边缘(4)连接。
2、一种用于在传输线(1)和与所述传输线(1)相连的模块(2)之间形成自校准转接的方法，包括步骤：
a)在指定用于连接所述模块(2)与所述传输线(1)的区域，为模块(2)提供焊接粒子(8)的排列；
b)为固定或适合固定到指定用于连接到模块(2)的传输线(1)的开口端(3)的边缘(4)的中间元件(5)提供对应模块(2)上的焊接粒子(8)的排列的焊接点排列；
c)将模块(2)的焊接粒子(8)置于焊接点上，并且通过软熔焊接将模块(2)与中间元件(5)连接；以及
d)如果中间元件(5)没有固定在传输线(1)上，则将中间元件(5)面对面地固定到传输线(1)的焊接点上。
3、根据权利要求2的方法，其特征在于，在步骤d)通过机械方式，尤其是通过螺栓连接，将中间元件(5)固定到传输线(1)上。
4、根据前述权利要求之一的方法，其特征在于，在步骤b)，通过利用焊接掩模，尤其是通过利用光刻图案形成工艺提供焊接点。
5、一种模块(2)，用于与传输线(1)形成自校准转接，并且具有焊接粒子(8)的排列，所述焊接粒子(8)适于匹配并且通过软熔被焊接到指定用于连接模块(2)的传输线(1)的开口端(3)的边缘(4)布置的焊接点上，或者被焊接到固定或适合于固定到传输线(1)的这种边缘(4)的中间元件(5)上。
6、根据权利要求5的模块(2)，其特征在于，为微波传输带，尤其是带状线或共面波导，其在接地面有一个小孔(6)用于形成到传输线(1)的转接，所述焊接粒子(8)布置在所述小孔(6)的周围。
7、根据权利要求5的模块(2)，其特征在于，为发射机/接收机(T/R)模块。
8、根据权利要求5到7之一的模块(2)，其特征在于，为系统模块或单个芯片。
9、根据权利要求5到8之一的模块(2)，其特征在于，焊接粒子(8)是球栅阵列(BGA)型，柱栅阵列(CGA)型，或倒装晶片型。
10、一种中间元件(5)，被固定或适合于被固定到指定用于连接模块(2)的传输线(1)的开口端(3)的边缘(4)上，并且包括焊接点的排列，所述焊接点适于匹配并且通过软熔与所述传输线(1)相连的模块(2)上排列的焊接粒子(8)焊接，以形成自校准转接。
11、根据权利要求10的中间元件(5)通过螺丝(9)被固定或适合于被固定到的一种传输线(1)，所述传输线(1)用于与模块(2)形成自校准转接。
12、一种传输线(1)，用于与模块(2)构成一种自校准转接，并且在指定连接这种模块(2)的开口端(3)的边缘(4)上包括焊接点的排列，这些焊接点适于匹配并且通过软熔与这种模块(2)上排列的焊接粒子(8)焊接。
13、根据权利要求11或12的传输线(1)，其特征在于，是波导。
14、一种系统，包括通过软熔焊接与根据权利要求5至9之一的模块(2)连接的根据权利要求12或13之一的传输线(1)。
15、一种系统，包括通过软熔焊接，经根据权利要求10的中间元件(5)与根据权利要求5至9之一的模块(2)连接的根据权利要求11或13之一的传输线(1)。
CNB008199477A 2000-10-06 2000-10-06 传输线与模块间的自校准转接 Expired - Fee Related CN100355147C (zh)

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EP1325533A1 (en) 2003-07-09
DE60024684T2 (de) 2006-06-22
JP2004511155A (ja) 2004-04-08
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US6940361B1 (en) 2005-09-06
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