ATE312417T1 - Selbstausrichtender uebergang zwischen einer uebertragungsleitung und einem modul - Google Patents
Selbstausrichtender uebergang zwischen einer uebertragungsleitung und einem modulInfo
- Publication number
- ATE312417T1 ATE312417T1 AT00969440T AT00969440T ATE312417T1 AT E312417 T1 ATE312417 T1 AT E312417T1 AT 00969440 T AT00969440 T AT 00969440T AT 00969440 T AT00969440 T AT 00969440T AT E312417 T1 ATE312417 T1 AT E312417T1
- Authority
- AT
- Austria
- Prior art keywords
- transmission line
- module
- transition
- self
- self aligning
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
- H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced with unbalanced lines or devices
- H01P5/107—Hollow-waveguide/strip-line transitions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/048—Self-alignment during soldering; Terminals, pads or shape of solder adapted therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/EP2000/009799 WO2002029923A1 (en) | 2000-10-06 | 2000-10-06 | Self-aligned transition between a transmission line and a module |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE312417T1 true ATE312417T1 (de) | 2005-12-15 |
Family
ID=8164117
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT00969440T ATE312417T1 (de) | 2000-10-06 | 2000-10-06 | Selbstausrichtender uebergang zwischen einer uebertragungsleitung und einem modul |
Country Status (8)
Country | Link |
---|---|
US (1) | US6940361B1 (de) |
EP (1) | EP1325533B1 (de) |
JP (1) | JP3930803B2 (de) |
CN (1) | CN100355147C (de) |
AT (1) | ATE312417T1 (de) |
AU (1) | AU2000279154A1 (de) |
DE (1) | DE60024684T2 (de) |
WO (1) | WO2002029923A1 (de) |
Families Citing this family (57)
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KR100723635B1 (ko) * | 2005-12-08 | 2007-06-04 | 한국전자통신연구원 | 고주파 신호를 전달하기 위한 변환 회로 및 이를 구비한송수신 모듈 |
GB0718706D0 (en) | 2007-09-25 | 2007-11-07 | Creative Physics Ltd | Method and apparatus for reducing laser speckle |
WO2008069714A1 (en) * | 2006-12-05 | 2008-06-12 | Telefonaktiebolaget Lm Ericsson (Publ) | A surface-mountable waveguide arrangement |
US9335604B2 (en) | 2013-12-11 | 2016-05-10 | Milan Momcilo Popovich | Holographic waveguide display |
US11726332B2 (en) | 2009-04-27 | 2023-08-15 | Digilens Inc. | Diffractive projection apparatus |
TWM371979U (en) * | 2009-08-06 | 2010-01-01 | Microelectronics Tech Inc | Wave guide and assembly of wave guide and pcb |
US11300795B1 (en) | 2009-09-30 | 2022-04-12 | Digilens Inc. | Systems for and methods of using fold gratings coordinated with output couplers for dual axis expansion |
US11320571B2 (en) | 2012-11-16 | 2022-05-03 | Rockwell Collins, Inc. | Transparent waveguide display providing upper and lower fields of view with uniform light extraction |
US10795160B1 (en) | 2014-09-25 | 2020-10-06 | Rockwell Collins, Inc. | Systems for and methods of using fold gratings for dual axis expansion |
US8233204B1 (en) | 2009-09-30 | 2012-07-31 | Rockwell Collins, Inc. | Optical displays |
US8659826B1 (en) | 2010-02-04 | 2014-02-25 | Rockwell Collins, Inc. | Worn display system and method without requiring real time tracking for boresight precision |
WO2012136970A1 (en) | 2011-04-07 | 2012-10-11 | Milan Momcilo Popovich | Laser despeckler based on angular diversity |
US20140204455A1 (en) | 2011-08-24 | 2014-07-24 | Milan Momcilo Popovich | Wearable data display |
US10670876B2 (en) | 2011-08-24 | 2020-06-02 | Digilens Inc. | Waveguide laser illuminator incorporating a despeckler |
WO2016020630A2 (en) | 2014-08-08 | 2016-02-11 | Milan Momcilo Popovich | Waveguide laser illuminator incorporating a despeckler |
US8634139B1 (en) | 2011-09-30 | 2014-01-21 | Rockwell Collins, Inc. | System for and method of catadioptric collimation in a compact head up display (HUD) |
US9366864B1 (en) | 2011-09-30 | 2016-06-14 | Rockwell Collins, Inc. | System for and method of displaying information without need for a combiner alignment detector |
US9715067B1 (en) | 2011-09-30 | 2017-07-25 | Rockwell Collins, Inc. | Ultra-compact HUD utilizing waveguide pupil expander with surface relief gratings in high refractive index materials |
US9507150B1 (en) | 2011-09-30 | 2016-11-29 | Rockwell Collins, Inc. | Head up display (HUD) using a bent waveguide assembly |
WO2013102759A2 (en) | 2012-01-06 | 2013-07-11 | Milan Momcilo Popovich | Contact image sensor using switchable bragg gratings |
US9523852B1 (en) | 2012-03-28 | 2016-12-20 | Rockwell Collins, Inc. | Micro collimator system and method for a head up display (HUD) |
EP2842003B1 (de) | 2012-04-25 | 2019-02-27 | Rockwell Collins, Inc. | Holographisches weitwinkeldisplay |
US9933684B2 (en) | 2012-11-16 | 2018-04-03 | Rockwell Collins, Inc. | Transparent waveguide display providing upper and lower fields of view having a specific light output aperture configuration |
US9674413B1 (en) | 2013-04-17 | 2017-06-06 | Rockwell Collins, Inc. | Vision system and method having improved performance and solar mitigation |
US9727772B2 (en) | 2013-07-31 | 2017-08-08 | Digilens, Inc. | Method and apparatus for contact image sensing |
US9244281B1 (en) | 2013-09-26 | 2016-01-26 | Rockwell Collins, Inc. | Display system and method using a detached combiner |
US10732407B1 (en) | 2014-01-10 | 2020-08-04 | Rockwell Collins, Inc. | Near eye head up display system and method with fixed combiner |
US9519089B1 (en) | 2014-01-30 | 2016-12-13 | Rockwell Collins, Inc. | High performance volume phase gratings |
US9244280B1 (en) | 2014-03-25 | 2016-01-26 | Rockwell Collins, Inc. | Near eye display system and method for display enhancement or redundancy |
WO2016020632A1 (en) | 2014-08-08 | 2016-02-11 | Milan Momcilo Popovich | Method for holographic mastering and replication |
US10241330B2 (en) | 2014-09-19 | 2019-03-26 | Digilens, Inc. | Method and apparatus for generating input images for holographic waveguide displays |
US10088675B1 (en) | 2015-05-18 | 2018-10-02 | Rockwell Collins, Inc. | Turning light pipe for a pupil expansion system and method |
US9715110B1 (en) | 2014-09-25 | 2017-07-25 | Rockwell Collins, Inc. | Automotive head up display (HUD) |
CN111323867A (zh) | 2015-01-12 | 2020-06-23 | 迪吉伦斯公司 | 环境隔离的波导显示器 |
US9632226B2 (en) | 2015-02-12 | 2017-04-25 | Digilens Inc. | Waveguide grating device |
US11366316B2 (en) | 2015-05-18 | 2022-06-21 | Rockwell Collins, Inc. | Head up display (HUD) using a light pipe |
US10247943B1 (en) | 2015-05-18 | 2019-04-02 | Rockwell Collins, Inc. | Head up display (HUD) using a light pipe |
US10126552B2 (en) | 2015-05-18 | 2018-11-13 | Rockwell Collins, Inc. | Micro collimator system and method for a head up display (HUD) |
US10108010B2 (en) | 2015-06-29 | 2018-10-23 | Rockwell Collins, Inc. | System for and method of integrating head up displays and head down displays |
JP6598269B2 (ja) | 2015-10-05 | 2019-10-30 | ディジレンズ インコーポレイテッド | 導波管ディスプレイ |
US10598932B1 (en) | 2016-01-06 | 2020-03-24 | Rockwell Collins, Inc. | Head up display for integrating views of conformally mapped symbols and a fixed image source |
JP6895451B2 (ja) | 2016-03-24 | 2021-06-30 | ディジレンズ インコーポレイテッド | 偏光選択ホログラフィー導波管デバイスを提供するための方法および装置 |
EP3433658B1 (de) | 2016-04-11 | 2023-08-09 | DigiLens, Inc. | Holographische wellenleitervorrichtung für die projektion von strukturiertem licht |
US11513350B2 (en) | 2016-12-02 | 2022-11-29 | Digilens Inc. | Waveguide device with uniform output illumination |
US10545346B2 (en) | 2017-01-05 | 2020-01-28 | Digilens Inc. | Wearable heads up displays |
US10295824B2 (en) | 2017-01-26 | 2019-05-21 | Rockwell Collins, Inc. | Head up display with an angled light pipe |
JP6861588B2 (ja) | 2017-07-07 | 2021-04-21 | 株式会社フジクラ | 伝送線路 |
WO2019079350A2 (en) | 2017-10-16 | 2019-04-25 | Digilens, Inc. | SYSTEMS AND METHODS FOR MULTIPLYING THE IMAGE RESOLUTION OF A PIXÉLISÉ DISPLAY |
WO2019136476A1 (en) | 2018-01-08 | 2019-07-11 | Digilens, Inc. | Waveguide architectures and related methods of manufacturing |
KR20200108030A (ko) | 2018-01-08 | 2020-09-16 | 디지렌즈 인코포레이티드. | 도파관 셀 내의 홀로그래픽 격자의 높은 처리능력의 레코딩을 위한 시스템 및 방법 |
US11402801B2 (en) | 2018-07-25 | 2022-08-02 | Digilens Inc. | Systems and methods for fabricating a multilayer optical structure |
WO2020168348A1 (en) | 2019-02-15 | 2020-08-20 | Digilens Inc. | Methods and apparatuses for providing a holographic waveguide display using integrated gratings |
KR20210134763A (ko) | 2019-03-12 | 2021-11-10 | 디지렌즈 인코포레이티드. | 홀로그래픽 도파관 백라이트 및 관련된 제조 방법 |
US20200386947A1 (en) | 2019-06-07 | 2020-12-10 | Digilens Inc. | Waveguides Incorporating Transmissive and Reflective Gratings and Related Methods of Manufacturing |
KR20220038452A (ko) | 2019-07-29 | 2022-03-28 | 디지렌즈 인코포레이티드. | 픽셀화된 디스플레이의 이미지 해상도와 시야를 증배하는 방법 및 장치 |
JP2022546413A (ja) | 2019-08-29 | 2022-11-04 | ディジレンズ インコーポレイテッド | 真空回折格子および製造方法 |
DE102020121855A1 (de) | 2020-08-20 | 2022-02-24 | Infineon Technologies Ag | Hochfrequenz-Vorrichtungen und zugehörige Herstellungsverfahren |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0485986A (ja) * | 1990-07-30 | 1992-03-18 | Rohm Co Ltd | 印刷回路基板 |
US5793263A (en) | 1996-05-17 | 1998-08-11 | University Of Massachusetts | Waveguide-microstrip transmission line transition structure having an integral slot and antenna coupling arrangement |
JP2003068928A (ja) * | 2001-08-28 | 2003-03-07 | Kyocera Corp | 高周波用配線基板の実装構造 |
-
2000
- 2000-10-06 JP JP2002533428A patent/JP3930803B2/ja not_active Expired - Fee Related
- 2000-10-06 DE DE60024684T patent/DE60024684T2/de not_active Expired - Lifetime
- 2000-10-06 CN CNB008199477A patent/CN100355147C/zh not_active Expired - Fee Related
- 2000-10-06 US US10/398,440 patent/US6940361B1/en not_active Expired - Fee Related
- 2000-10-06 WO PCT/EP2000/009799 patent/WO2002029923A1/en active IP Right Grant
- 2000-10-06 EP EP00969440A patent/EP1325533B1/de not_active Expired - Lifetime
- 2000-10-06 AU AU2000279154A patent/AU2000279154A1/en not_active Abandoned
- 2000-10-06 AT AT00969440T patent/ATE312417T1/de not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP1325533B1 (de) | 2005-12-07 |
CN1454402A (zh) | 2003-11-05 |
CN100355147C (zh) | 2007-12-12 |
US6940361B1 (en) | 2005-09-06 |
WO2002029923A1 (en) | 2002-04-11 |
AU2000279154A1 (en) | 2002-04-15 |
JP3930803B2 (ja) | 2007-06-13 |
DE60024684T2 (de) | 2006-06-22 |
DE60024684D1 (de) | 2006-01-12 |
EP1325533A1 (de) | 2003-07-09 |
JP2004511155A (ja) | 2004-04-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |