CN1411061A - 动态随机存取存储器模块封装 - Google Patents
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Abstract
一种动态随机存取存储器模块封装,该封装以“芯片上基板”的方式,在模块印刷电路板上形成多个窗口,再将芯片直接粘接于模块印刷电路板的背面,并使得芯片的焊点位于窗口的中央。接着以导线穿过窗口,而跨接于模块印刷电路板正面的内接点与芯片的焊点。最后进行封胶,以保护导线、模块印刷电路板的内接点、芯片及其焊点。
Description
技术领域
本发明涉及一种动态随机存取存储器模块封装(DRAM ModulePackage),且特别涉及一种以芯片直接粘接(DCA,Direct Chip Attach)的方式,将芯片直接组装于模块印刷电路板(module print circuit board)的“芯片上基板”(BOC,Board On Chip)型动态随机存取存储器模块封装。
背景技术
在插脚数要求不高的集成电路产品中,常利用引线键合(wire bonding)的方式,将芯片(die)上的键合焊点(bonding pad)与导线框上的导线(lead)作电连接。此类产品常见的有小外形封装(SOP,Small Outline Package)及四边引线扁平封装(QFP,Quad Flat Package)。而芯片上焊点的分布则有周围分布型(peripheral pad)及中央分布型(central pad)等。
就动态随机存取存储器(Dynamic Random Access Memory,以下简称DRAM)芯片而言,因其所需的接插脚数少,且内部线路简单,故可将其焊点设计成中央分布型,以共用部份接线。由于现有的动态随机存取存储器模块(DRAM module),常采用导线接脚位于芯片上(LOC,Lead on Chip)的封装工艺,但其仍是将芯片独立进行封装之后,再利用表面安装技术(SMT,Surface Mount Technology),将封装后的芯片固定在模块印刷电路板(module print circuit board)上。
为了简化工艺,现有的方法还有在封胶的前,以芯片直接粘接(DCA,Direct Chip Attach)的方式,将芯片的背面粘接于模块印刷电路板的表面,并利用引线键合(wire bonding)的方式,分别以导线跨接于芯片的有源表面上的焊点及模块印刷电路板表面的接点,最后进行封胶,而完成一“板上芯片”(COB,Chip On Board)型的动态随机存取存储器模块封装。
请同时参考图1及图2,其中图1为现有的动态随机存取存储器模块的示意图,而图2为图1的局部区域100的放大示意图。如图1所示,模块印刷电路板104上排列有多个动态随机存取存储器元件102。为了便于说明,图2并未绘示原动态随机存取存储器元件102的外部封装胶体(moldingcompound),图示为芯片108,其键合焊点(bonding pad)106分布于芯片108的中央,并藉由导线110将键合焊点106与位于芯片108两侧的模块印刷电路板104上的内接点(mounting pad)112相电连接。
请参考图3,它是图1的局部剖面示意图,芯片108具有有源表面(activesurface)108a和对应的背面108b,并具有多个键合焊点106,其位于有源表面108a的中央。利用贴带(tape)122,将芯片108的背面108b粘接于模块印刷电路板104的上表面104a,并以引线键合的方式,分别将导线110跨接于芯片108的键合焊点106和模块印刷电路板104的内接点112。最后,利用封装胶体(molding compound)114包覆芯片108、导线110、内接点112及部分模块印刷电路板104,如此即以“板上芯片”(COB,Chip OnBoard)的方式,将芯片108直接组装在模块印刷电路板104上。
承上所述,由于芯片108的键合焊点106属于中央分布型,故其引线键合的距离会大于一般周围分布型的焊点的引线键合距离,因而发生导线110过长的问题(long wire)。此外,在引线键合工艺时,同样会因为导线110过长,使得导线容易发生坍塌而接触到芯片108的边缘,因而发生短路的问题(short to die edge)。
发明内容
本发明的目的在于缩短动态随机存取存储器模块的导线长度,以有效降低导线所产生的电阻,进而提高动态随机存取存储器模块的工作效能,同时可改善现有的动态随机存取存储器模块封装的导线过长,容易使导线坍塌而接触芯片的边缘,因而发生短路的问题。
基于本发明的上述目的,本发明提出一种动态随机存取存储器模块封装,包括一模块印刷电路板,其具有一上表面及对应的一下表面,并具有多个窗口,其分别贯穿模块印刷电路板,且模块印刷电路板的内部具有一模块电路,其具有多个内接点及多个外接点,其中内接点位于模块印刷电路板的上表面,而外接点位于模块印刷电路板的一侧端,并且这些内接点之间彼此电连接,而这些内接点亦与这些外接点相电连接。此外,多个芯片分别具有一有源表面及多个焊点,其中这些焊点约略位于对应的有源表面的中央,并且一芯片对应一窗口,而以其有源表面贴合于模块印刷电路板的下表面,并使焊点约略位于窗口中央。另外,多条导线分别穿过窗口,而跨接于焊点及内接点,而多个封装胶体则分别包覆对应的芯片、内接点、焊点、导线及部分模块印刷电路板。
本发明使得模块印刷电路板的内接点更接近芯片的有源表面中央的焊点,故可大幅缩短导线长度,因而有效降低导线所产生的电阻,进而提高动态随机存取存储器模块的工作效能。
本发明可缩短跨接于芯片的焊点和模块印刷电路板的内接点之间的导线长度,以避免现有在引线键合时,因导线过长而容易坍塌接触芯片的边缘,因而发生短路的问题。
附图说明
为让本发明的上述目的、特征和优点能够明显易懂,下文特举一优选实施例,并配合附图,作详细说明如下:
图1为现有的动态随机存取存储器模块的示意图;
图2为图1的局部区域100的放大示意图;
图3为图1的局部剖面示意图;
图4为根据本发明的优选实施例的动态随机存取存储器模块的示意图;
图5为图4的局部区域200的放大示意图;
图6为图4的局部剖面示意图;以及
图7A~7D为图6的动态随机存取存储器模块封装的局部剖面流程图。
附图中的附图标记说明如下:
100、200:局部区域 102、202:动态随机存取存储器元件
104、204:模块印刷电路板 104a、204a:上表面
104b、204b:下表面 106、206:键合焊点
108、208:芯片 108a、208a:有源表面
108b、208b:背面 110、210:导线
112、212:内接点 114、214a、214b:封装胶体
122、222:贴带 211:模块电路
213:外接点 216:窗口
具体实施方式
请参考图4及图5,其中图4为根据本发明的优选实施例的动态随机存取存储器模块的示意图,而图5为图4的局部区域200的放大示意图。如图4所示,模块印刷电路板(module print circuit board)204上排列有多个动态随机存取存储器元件202。为了便于说明,图5并未图示动态随机存取存储器元件202的外部封装胶体(molding compound)。模块印刷电路板204具有多个窗口(window)216,其贯穿模块印刷电路板204。芯片208,例如为动态随机存取存储器芯片,其键合焊点(bonding pad)206分布于芯片208的有源表面(active surface)208a的中央,同时位于窗口216的中央,并利用导线210跨接于芯片208的焊点206与模块印刷电路板204的内接点(mounting pad)212之间,用以电连接焊点206与对应的内接点212。
请参考图6,其为图4的局部剖面示意图。模块印刷电路板204具有上表面204a及对应的下表面204b,而芯片208具有有源表面208a和对应的背面208b。此外,芯片208具有多个焊点206,其分布于有源表面208a的中央,而模块印刷电路板204的内部具有一模块电路211,用以电连接各个芯片208,其中模块电路211具有多个内接点212及多个外接点213(如图4所示),其中内接点212位于模块印刷电路板204的上表面204a,而分别对应焊点206,且内接点212之间彼此电连接,而外接点213则位于模块印刷电路板204的一侧端,如图4所示,用以作为信号的输出入接点,并且外接点213与内接点212相电连接。利用贴带(tape)222将芯片208的有源表面208a粘接于模块印刷电路板204的下表面204b,并使得焊点206位于模块印刷电路板204的窗口216的中央。另外,利用导线210穿过窗口216而跨接于芯片208的焊点206和对应的模块印刷电路板204的内接点212。而上封装胶体214a及下封装胶体214b则分别包覆芯片208、导线210、内接点212及部份模块印刷电路板204。如此可将芯片208直接组装于模块印刷电路板204,而完成一“芯片上基板”(BOC,Board On Chip)型的动态随机存取存储器模块封装。
为了详细说明本发明的优选实施例的动态随机存取存储器模块封装的工艺,请依序参考图7A~7D,其为图6的动态随机存取存储器模块封装的剖面流程图。首先如图7A所示,设计制造出一模块印刷电路板204,其材料例如是以玻璃环氧树脂为材料的FR-4、FR-5基板,或是以双顺丁烯二酸酰亚胺(Bismaleimide-Triazine,BT)树脂为材料的BT基板,而模块印刷电路板204具有上表面204a及对应的下表面204b,并在模块印刷电路板204上形成窗口216,其贯穿模块印刷电路板204。
同样如图7A所示,模块印刷电路板204的内部设计有一模块电路211,其具有多个内接点212及多个外接点213(如图4所示),其中内接点212位于模块印刷电路板204的上表面204a,而彼此电连接,而外接点213则位于模块印刷电路板204的一侧端,如图4所示,用以作为信号输出入的接点,并与内接点212相电连接。接着,将贴带222粘接于模块印刷电路板204的下表面204b,并对应位于窗口216的两侧,用以后续贴合图7B的芯片208的有源表面208a,其中贴带222可用热熔胶来取代。
接着,如图7B所示,芯片208具有有源表面(active surface)208a及对应的背面208b,并且具有多个焊点206,其分布于有源表面208a的中央,而模块印刷电路板204的上表面204a则具有多个内接点212,其分别对应焊点206。利用贴带222将芯片208的有源表面208a对应粘接于模块印刷电路板204的下表面204b,并使得焊点206位于窗口216的中央。然后,在工作温度范围150℃~200℃之间,进行贴带222的固化(curing),其中优选的工作温度约为170℃。
之后,如图7C所示,再利用高频引线键合机(high freq.bonder),以引线键合(wire boning)的方式形成导线210,例如为金线(gold wire),其中导线210穿过窗口216而跨接于芯片208的焊点206和模块印刷电路板204的内接点212,而工作温度范围约略在100℃~150℃之间,其中优选的工作温度约为120℃。
最后,如图7D所示,以压膜(molding)或涂布(coating)的方式,形成上封装胶体(molding compound)214a及下封装胶体214b于芯片208的上下两面之后,再进行上封装胶体214a及下封装胶体214b的固化,其中上封装胶体214a包覆导线210、内接点212、芯片208的部分有源表面208a及部分模块印刷电路板204,而下封装胶体214b则包覆芯片208及部分的模块印刷电路板204,其中上封装胶体214a及下封装胶体214b的材料例如为环氧树脂(epoxy)。如此即可将芯片208直接组装于模块印刷电路板204,而完成一“芯片上基板”(BOC,Board On Chip)型的动态随机存取存储器模块封装。
依照本发明的特征,使得模块印刷电路板的内接点更接近芯片的焊点,故可大幅缩短跨接于内接点及焊点的导线长度,因而有效降低导线所产生的电阻,进而提高动态随机存取存储器模块的工作效能。
依照本发明的特征,藉由缩短跨接于芯片的焊点及模块印刷电路板的内接点的间的导线长度,可避免现有由于导线过长,在引线键合工艺时,导线容易坍塌接触芯片的边缘,因而发生短路的问题。
依照上述本发明的实施例可知,本发明至少具有下列优点:
(1)本发明的动态随机存取存储器模块封装藉由模块印刷电路板的窗口设计,使得模块印刷电路板的内接点更接近芯片的焊点,故可大幅缩短跨接于内接点及焊点的导线长度,因而有效降低导线所产生的电阻,进而提高动态随机存取存储器模块的工作效能。
(2)本发明的动态随机存取存储器模块封装可将中央分布型焊点的动态随机存取存储器芯片直接组装于印刷电路板上,并藉由缩短跨接于芯片的焊点及模块印刷电路板的内接点之间的导线长度,以避免现有由于导线过长,在引线键合工艺时,导线容易坍塌而接触芯片的边缘,因而发生短路的问题。
虽然本发明已以一优选实施例公开如上,但是其并非用以限定本发明,在不脱离本发明的精神和范围的情况下,本领域的技术人员可作些许的更改与润饰,因此本发明的保护范围应当以权利要求所界定的为准。
Claims (15)
1.一种动态随机存取存储器模块封装,至少包括:
一模块印刷电路板,具有一上表面及对应的一下表面,并具有多个窗口,其分别贯穿该模块印刷电路板,且该模块印刷电路板的内部具有一模块电路,其具有多个内接点及多个外接点,其中该些内接点位于该模块印刷电路板的该上表面,而该些外接点位于该模块印刷电路板的一侧端,并且该些内接点之间彼此电连接,且该些内接点与该些外接点相电连接;
多个芯片,分别具有一有源表面及多个焊点,其中该些焊点约略位于对应的该有源表面的中央,并且每一该些芯片对应该些窗口之一,而以该有源表面贴合于该模块印刷电路板的该下表面,并使该些焊点分别约略位于对应的该窗口的中央;
多个导线,分别穿过对应的该些窗口,而跨接于对应的该些焊点之一及对应的该些内接点之一;以及
多个封装胶体,分别包覆对应的该些芯片、该些内接点、该些焊点、该些导线及部分该模块印刷电路板。
2.如权利要求1所述的动态随机存取存储器模块封装,其中该模块印刷电路板的材料包括玻璃环氧基树脂。
3.如权利要求1所述的动态随机存取存储器模块封装,其中该模块印刷电路板的材料包括双顺丁烯二酸酰亚胺树脂。
4.如权利要求1所述的动态随机存取存储器模块封装,其中该些芯片包括动态随机存取存储器芯片。
5.如权利要求1所述的动态随机存取存储器模块封装,其中该些芯片以贴带贴合于该模块印刷电路板的该下表面。
6.如权利要求1所述的动态随机存取存储器模块封装,其中该些芯片以热熔胶贴合于该模块印刷电路板的该下表面。
7.如权利要求1所述的动态随机存取存储器模块封装,其中该些导线包括金线。
8.如权利要求1所述的动态随机存取存储器模块封装,其中该些封装胶体的材料包括环氧树脂。
9.一种存储器模块封装,至少包括:
一印刷电路板,具有多个窗口,其分别贯穿该印刷电路板,且该印刷电路板的内部具有一模块电路,其具有多个内接点及多个外接点,并且该些内接点之间彼此电连接,且该些内接点与该些外接点相电连接;
多个芯片,分别对应该些窗口之一,而贴合于该印刷电路板,而与对应的该些内接点相电连接;以及
多个封装胶体,分别包覆对应的该些芯片、该些内接点及部分该印刷电路板。
10.如权利要求9所述的存储器模块封装,其中该印刷电路板的材料包括玻璃环氧基树脂。
11.如权利要求9所述的存储器模块封装,其中该印刷电路板的材料包括双顺丁烯二酸酰亚胺树脂。
12.如权利要求9所述的存储器模块封装,其中该些芯片包括动态随机存取存储器芯片。
13.如权利要求9所述的存储器模块封装,其中该些芯片以贴带贴合于该印刷电路板。
14.如权利要求9所述的存储器模块封装,其中该些芯片以热熔胶贴合于该印刷电路板。
15.如权利要求9所述的存储器模块封装,其中该些封装胶体的材料包括环氧树脂。
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CN101897175A (zh) * | 2007-12-18 | 2010-11-24 | 豪威科技有限公司 | 焊接连接可靠性改进的可回焊相机模块 |
CN105070702A (zh) * | 2015-09-07 | 2015-11-18 | 珠海全志科技股份有限公司 | 提升封装兼容性的芯片dram焊盘排布结构 |
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CN101897175A (zh) * | 2007-12-18 | 2010-11-24 | 豪威科技有限公司 | 焊接连接可靠性改进的可回焊相机模块 |
CN101897175B (zh) * | 2007-12-18 | 2013-07-24 | 豪威科技有限公司 | 焊接连接可靠性改进的可回焊相机模块 |
CN105070702A (zh) * | 2015-09-07 | 2015-11-18 | 珠海全志科技股份有限公司 | 提升封装兼容性的芯片dram焊盘排布结构 |
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