CN1401994A - 灰调掩模的缺陷检查方法及缺陷检查装置 - Google Patents
灰调掩模的缺陷检查方法及缺陷检查装置 Download PDFInfo
- Publication number
- CN1401994A CN1401994A CN02108249A CN02108249A CN1401994A CN 1401994 A CN1401994 A CN 1401994A CN 02108249 A CN02108249 A CN 02108249A CN 02108249 A CN02108249 A CN 02108249A CN 1401994 A CN1401994 A CN 1401994A
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- CN
- China
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- defective
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000007547 defect Effects 0.000 title claims abstract description 49
- 238000000034 method Methods 0.000 title claims abstract description 35
- 238000007689 inspection Methods 0.000 claims abstract description 19
- 230000002950 deficient Effects 0.000 claims description 102
- 230000005540 biological transmission Effects 0.000 claims description 63
- 239000000284 extract Substances 0.000 claims description 25
- 238000001514 detection method Methods 0.000 claims description 20
- 238000000605 extraction Methods 0.000 claims description 9
- 238000012550 audit Methods 0.000 claims description 8
- 230000003287 optical effect Effects 0.000 claims description 8
- 229920002120 photoresistant polymer Polymers 0.000 claims description 7
- 230000000007 visual effect Effects 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000002834 transmittance Methods 0.000 claims description 4
- 239000010408 film Substances 0.000 description 8
- 239000000758 substrate Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 150000001845 chromium compounds Chemical group 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
- G03F1/84—Inspecting
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/50—Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Quality & Reliability (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Theoretical Computer Science (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Abstract
Description
Claims (8)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001248650A JP3879904B2 (ja) | 2000-09-29 | 2001-08-20 | グレートーンマスクの欠陥検査方法及び欠陥検査装置 |
JP248650/2001 | 2001-08-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1401994A true CN1401994A (zh) | 2003-03-12 |
CN1218171C CN1218171C (zh) | 2005-09-07 |
Family
ID=19077780
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN021082499A Expired - Lifetime CN1218171C (zh) | 2001-08-20 | 2002-03-28 | 灰调掩模的缺陷检查方法及缺陷检查装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7035448B2 (zh) |
CN (1) | CN1218171C (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1312533C (zh) * | 2003-09-02 | 2007-04-25 | 三洋电机株式会社 | 蚀刻方法及使用蚀刻方法的电路装置的制造方法 |
CN100432809C (zh) * | 2004-07-12 | 2008-11-12 | Hoya株式会社 | 灰色调掩模和灰色调掩模的制造方法 |
CN101451963B (zh) * | 2006-08-01 | 2013-02-20 | 以色列商·应用材料以色列公司 | 用于缺陷检测的方法和系统 |
CN105652589A (zh) * | 2003-07-03 | 2016-06-08 | 恪纳腾技术公司 | 使用设计者意图数据检查晶片和掩模版的方法和系统 |
CN115641329A (zh) * | 2022-11-15 | 2023-01-24 | 武汉惠强新能源材料科技有限公司 | 一种锂电池隔膜缺陷检测方法及系统 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101403965B1 (ko) | 2012-07-23 | 2014-06-10 | 케이맥(주) | 주기격자 대상물의 분석 방법 |
JP2017516548A (ja) | 2014-06-06 | 2017-06-22 | デックスコム・インコーポレーテッド | データ及び文脈に基づいた故障判別及び応答処理 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6714670B1 (en) * | 1998-05-20 | 2004-03-30 | Cognex Corporation | Methods and apparatuses to determine the state of elements |
US6436802B1 (en) * | 1998-11-30 | 2002-08-20 | Adoamtest Corp. | Method of producing contact structure |
US6529621B1 (en) * | 1998-12-17 | 2003-03-04 | Kla-Tencor | Mechanisms for making and inspecting reticles |
-
2002
- 2002-03-28 US US10/107,820 patent/US7035448B2/en not_active Expired - Fee Related
- 2002-03-28 CN CN021082499A patent/CN1218171C/zh not_active Expired - Lifetime
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105652589A (zh) * | 2003-07-03 | 2016-06-08 | 恪纳腾技术公司 | 使用设计者意图数据检查晶片和掩模版的方法和系统 |
US10713771B2 (en) | 2003-07-03 | 2020-07-14 | Kla-Tencor Technologies Corp. | Methods and systems for inspection of wafers and reticles using designer intent data |
CN105652589B (zh) * | 2003-07-03 | 2020-10-27 | 恪纳腾技术公司 | 使用设计者意图数据检查晶片和掩模版的方法和系统 |
CN1312533C (zh) * | 2003-09-02 | 2007-04-25 | 三洋电机株式会社 | 蚀刻方法及使用蚀刻方法的电路装置的制造方法 |
CN100432809C (zh) * | 2004-07-12 | 2008-11-12 | Hoya株式会社 | 灰色调掩模和灰色调掩模的制造方法 |
CN101451963B (zh) * | 2006-08-01 | 2013-02-20 | 以色列商·应用材料以色列公司 | 用于缺陷检测的方法和系统 |
CN115641329A (zh) * | 2022-11-15 | 2023-01-24 | 武汉惠强新能源材料科技有限公司 | 一种锂电池隔膜缺陷检测方法及系统 |
Also Published As
Publication number | Publication date |
---|---|
US7035448B2 (en) | 2006-04-25 |
US20030035575A1 (en) | 2003-02-20 |
CN1218171C (zh) | 2005-09-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C06 | Publication | ||
PB01 | Publication | ||
ASS | Succession or assignment of patent right |
Owner name: HOYA CO., LTD. Free format text: FORMER OWNER: HOYA CORP. Effective date: 20040430 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20040430 Address after: Tokyo, Japan Applicant after: HOYA Corporation Address before: Tokyo, Japan Applicant before: Hoya Corp. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP02 | Change in the address of a patent holder |
Address after: Japan Tokyo 160-8347 Shinjuku Shinjuku six chome 10 No. 1 Patentee after: HOYA Corporation Address before: Tokyo, Japan Patentee before: HOYA Corporation |
|
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20050907 |