CN1371505A - 芯片卡模块和包含该模块的芯片卡及芯片卡模块制造方法 - Google Patents
芯片卡模块和包含该模块的芯片卡及芯片卡模块制造方法 Download PDFInfo
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Abstract
倒装片凸起(5)安装在半导体芯片(1)的触点(4)上。倒装片凸起从那里延伸并穿过遮蔽化合物(模)(6),该遮蔽化合物安装作为保护层。倒装片凸起以其背离半导体芯片(1)的端部分别构成约为平面平行的连接面(8)。所述连接面(8)位于属于遮蔽化合物(6)的表面(7)上并且面向背离半导体芯片(1)的方向。在一个优选实施例中,至少在覆盖工序,芯片(1)布置在一个支承件上,特别是在支承条(3)上。
Description
本发明涉及包含半导体芯片的芯片卡模块,其与连接平面导电接触连接,在连接平面上形成有接触区域,而且芯片卡模块至少在一侧备有电绝缘保护层,在保护层背离芯片的表面上形成有连接面,连接面与半导体芯片的接触连接点导电连接,半导体芯片布置为首先使连接面位于连接平面上并通过连接面与接触区域导电接触连接。此外,本发明还涉及制造这种芯片卡模块的方法,以及包含这种芯片卡模块的芯片卡。
芯片卡模块通常包含一个托架,例如层压塑料模或金属连线框,半导体芯片就固定于该托架上。托架的导电层或组成部分做成各种图案以构成各个接触区域,这些区域可通过读卡机分接。接触区域通常布置在连接平面内,其形状和尺寸通常取决于特定的标准规范,例如,ISO标准7816。在传统的芯片卡中,半导体芯片和接触区域借助焊线(Bonddrhten)电接触连接,焊线从半导体芯片的接触连接点通向接触区域的连接点。作为另外一种选择,可利用倒装片技术安装半导体芯片。
为保护芯片和与接触区域的连接,在芯片和连接点之上涂有用环氧树脂,热固性塑料或类似物制成的层。成品芯片卡模块的元件高度通常至少为500-600微米,其最终植入在芯片卡的卡托架中。
DE 197 08 617 A1公开了一种在开头所述形式的芯片卡模块,其中半导体芯片没有结合作为初始“裸露的”的芯片并如上所述地仅仅以后再封装,即封装在芯片卡模块中,相反地,而是结合作为所谓的小片尺寸组件,现在通常称为芯片尺寸组件(CSP)。这些组件已经备有保护层和连接面,并且允许有较小的模块厚度。在这种情况下,对于安装来说,公知的是利用连线框条,仅在将小片尺寸组件-显然假定是成品的一定位、安置并接触连接在各自接触区域上时单个的芯片卡模块才与连线框条分开。
对于制造和构造这种特定封装的芯片或将它们的制品结合到芯片卡模块的安装流程中来说,有许多可选择的方案,必须使这些可选择方案的优点和缺点达到平衡。随着功能的差别越来越大并且芯片从而也变得越来越大,不仅对更小模块厚度的要求在增加,而且对机械坚固性的要求也在增加。随着象CSP一样的封装变得更大,该封装在制造过程中将被结合到连线框条中,对托架条和喷射机器的使用也不可避免地变得越来越差。
本发明的一个目的是提供一种在开头所述形式的芯片卡模块,其制造简单且有效并且具有小的部件尺寸。同时,半导体芯片也应被很好地保护不受机械损伤和化学影响。同时,本发明还具体说明了以最佳制造方式制造这种芯片卡模块的方法。
根据本发明,对于在开头所述形式的芯片卡模块,第一个提及的目的是这样实现的,即倒装片凸起(焊料凸起)置于接触连接点上,该凸起在所有情况下从那里延伸穿过作为保护层涂加的覆盖化合物(模),并且在所有情况下凸起以其远离半导体芯片的端部形成一个连接面,该连接面大致平面平行地位于覆盖化合物的远离半导体芯片的表面内。
在根据本发明制造这种芯片卡模块的方法中,提供了
-半导体芯片通过其下侧-与托架件上的接触连接点相对-固定,并且用可延展材料制造的倒装片凸起,特别是柱式凸起,涂在芯片接触连接点上,
-带有凸起的芯片随后被输送到打开的注模中,注模的上半模包含已经设计好的面向凸起的内壁,
-当注模随后关闭时,该内壁从远离芯片端将凸起压至与要喷射到芯片顶面上的覆盖化合物的厚度对应的高度,
-于是,通过将塑料喷射到关闭的注模内,芯片和凸起,但不是它们的被压成平面的形成连接面的端部,通过覆盖化合物被向下封装至托架件上,
-并且,在以后的过程中,提供了连接平面的接触区域并将其与连接面接触连接。
本发明首先基于这样的事实,即仅仅芯片本身是被覆盖的。从而,保护层或外壳刚刚比芯片本身大一点,并从而极其坚固。另一方面,可以在以后实现解脱和提供接触区域。这种分离使得能够最佳利用托架条(用于待封装的芯片)和多个柱塞(多个注模装置)。模块/机器循环数成倍增大。每次可同时封盖大约300个芯片。
以后可以或者通过溅镀或印刷接触区域来在芯片卡上提供接触区域,或者通过将CSP放置在通过压印或蚀刻制造的金属引线框上来提供接触区域。根据本发明,接触连接不是通过导线实现的,而是通过倒装片凸起实现的。凸起可通过在倒装片技术中通常使用的各种方法来施加。根据本发明,有利的是施加了本身已知的柱式凸起。为此可以使用例如金导线。后者的涂加高度约为70-80微米。在模制过程中,凸起被压至约20微米。该在一方面制造出希望的压成平面的连接面,并且同时制造出一个密封区域以防止在金表面上的所谓的泄漏和溢出(BLEED AND FLUSH)。其余被替换的材料形成用于与接触区域接触的连接连接面。
从从属权利要求中可以看到各种改进和优选措施。
下面参考附图利用示例性实施例更详细地解释本发明,其中
图1以横截面示意性地展示了根据本发明的芯片卡模块,
图2以倾视图示意性地展示了与图1一致但带有不同接触区域的芯片卡模块,
图3和4示意性地展示了包含未完成的芯片卡模块的注模的侧面横截面,它们分别处于打开和关闭状态,
图5展示了仍然固定在托架条上的芯片卡模块的示意性侧面横截面。
图1中所示的芯片卡模块包括半导体芯片1,其通过粘合剂2粘合在托架条3上。所示芯片1和施加在其顶面接触连接点4上的凸起5处于已经完全被封盖的状态。在封盖过程被压平的凸起5的上端平面平行地位于远离芯片1的覆盖化合物6的表面7内,并且分别形成连接面8。
由于托架条3,其在这里作为示例实施为引线框,仅仅用作容纳芯片1的托架材料,所以同样也可以使用塑料制成的托架件,只要后者适合于覆盖工序就行。但是,根据图1实施为金属引线框的托架条3提供了其它的优点,如图1中所示,其在后侧可备有压纹9。其结果是,化合物6不仅粘在托架条3的顶面上,而且还甚至更好地机械锚定在托架条3上。根据图1,芯片卡模块可从顶面以溅镀的接触区域10和11完成,仅仅为了说明,接触区域10和11表示为与表面7有一定的距离,但在实际中它们布置为与各自的连接面8直接接触,即形成紧靠表面7的连接平面。
图2展示了被完全覆盖的芯片,其位于接触区域一侧的模型面7布满排成两行的八个连接面8。该单元12可以这样放置,即首先将连接面8放置在所示连线框13的八个接触区域10和11上,就象单元12借助其托架件结合到托架条3中一样,连线框13可以首先结合到一个接触托架条中。接触区域10,11的数量和布置取决于凸起5或连接面8的数量和位置。
图3展示了位于注模的仍然打开的两个半模14、15内的芯片1,其固定在托架条3上并在其顶面备有凸起5,凸起5的初始高度约为80微米。图4展示了关闭后的状态,即上半模14向下移动后的状态。凸起5被内壁21压至约为20微米的高度并如所希望的在顶面变形成近似平面的连接面8。实际的喷注或封装工序发生在根据图4的注模状态。例如,可以使用易流动的热塑性塑料,将其以高压喷注到注模14、15的内部空间16内。
由于引线框或,更一般地说,托架条3仅仅用于芯片1的覆盖工序,所以可以在以后将其去掉。随后,可以借助弹出器或借助滚子将外壳,即单元12,分离作为散料(bulk material)。比较图5,芯片1可例如通过粘合点17连接到托架条3上。
比较图5,还可以设想将芯片1用的托架3和接触托架条18合在一起。外壳芯片(单元12)被输送到接触托架条18上方的位置并通过弹出器19从后部弹出,然后立即固定在接触托架条18上。为使弹出力最小,如图5中所示,可以在芯片1的下方为芯片1用的托架条3另外提供孔20。对于大的芯片1,弹出器19可穿过这些孔20插入。
对于要求连接面8和接触托架条18之间具有特别好的粘合的应用,可通过简单的附加措施实现。一方面,可以扩大外壳,即覆盖化合物6的表面7。这提供了可借助合适的粘合剂来利用的额外的连接区域。粘合剂取决于选择的托架条18。但是,较大的覆盖物也稍稍影响对托架条3和多柱塞的最佳利用。作为另外一种选择,还可以在附加的工序步骤在连接面8上施加厚度约为20微米的电镀涂层,但需要附着力促进剂。电镀涂层是以无电方式沉积的。还可以有附加的溅镀工序。
根据本发明,保护外壳6刚刚(每侧仅约0.2毫米)比芯片1本身大,从而保证了对托架条和喷注机械的最佳利用。凸起仅仅被部分覆盖,即仅在其侧面,而没有在其形成连接面的被压成平面的顶面。如上所述,凸起通过模制工序成形以形成接触连接面。本发明的芯片卡模块构造带来的另外优点是,凸起不遭受在倒装片技术中常见的剪切应力。这些剪切应力通常导致凸起中心的剥落,本发明通过提供横向支持的覆盖化合物防止了这些剪切应力。
如上所述,对于制造接触区域,一方面例如可以使用如类似CSP模块的带外壳芯片并将其放置在通过压印制造的接触区域上。另一方面,还可以将还外壳芯片插入到芯片卡体的空槽内将通过溅镀或印刷在芯片卡上施加接触区域。
Claims (11)
1、包含半导体芯片(1)的芯片卡模块,其与一个连接平面导电接触,在连接平面上形成有接触区域(10,11),而且芯片卡模块至少在一侧备有一电绝缘保护层(6),在保护层背离芯片(1)的表面(7)上形成有连接面(8),连接面与半导体芯片(1)的接触连接点(4)导电连接,其中半导体芯片(1)布置为首先使连接面(8)位于连接平面上并通过连接面(8)与接触区域(10,11)导电接触连接,
其特征在于,倒装片凸起(5)(焊料凸起)置于接触连接点(4)上,该凸起分别从那里延伸穿过作为保护层涂加的覆盖化合物(模)(6),并且各凸起以其远离半导体芯片(1)的端部形成一个连接面(8),该连接面大致平面平行地位于覆盖化合物(6)的远离半导体芯片(1)的表面(7)内。
2、根据权利要求1中所述的芯片卡模块,其特征在于,倒装片凸起(5)实施为用可延展的特别是含金材料制成的柱式凸起,并且被注模(14,15)压至要喷注的覆盖化合物(6)的厚度。
3、根据权利要求1或2中所述的芯片卡模块,其特征在于,备有倒装片凸起(5)和覆盖化合物(6)的半导体芯片(1)被放置在形成连接平面的连线框(13)上,其特征还在于,连接面(8)被焊接或导电粘接在连线框(13)的接触区域(10,11)上。
4、根据权利要求1或2中所述的芯片卡模块,其特征在于,备有倒装片凸起(5)和覆盖化合物(6)的半导体芯片(1)以位于上面的连接面(8)插入到芯片卡体的对应空槽内,其特征还在于,连接平面是由溅镀或印刷在连接面(8)上的接触区域(10,11)形成的。
5、用于制造根据权利要求1至4中任一项所述的芯片卡模块的方法,其特征在于
-半导体芯片(1)通过其与接触连接点(4)相对的下侧固定在托架件(3)上,其特征还在于,用可延展材料制成的倒装片凸起(5),特别是柱式凸起,施加在芯片(1)的接触连接点(4)上,
-其特征还在于,带有凸起(5)的芯片(1)随后被输送到打开的注模(14,15)中,注模的上半模(14)包含已经设计好的面向凸起(5)的内壁(21),
-当注模(14,15)随后关闭时,该内壁从远离芯片(1)端将凸起(5)压至与要喷射到芯片(1)顶面上的覆盖化合物(6)的厚度对应的高度,
-于是,通过将塑料喷射到关闭的注模(14,15)内,芯片(1)和凸起(5),但不是它们的被压成平面的形成连接面(8)的端部,通过覆盖化合物(6)被向下封装至托架件(3)上,
-其特征还在于,在以后的过程中,提供了连接平面的接触区域(10,11)并将其与连接面(8)接触连接。
6、根据权利要求5中所述的方法,其特征在于,用一托架条(3)作托架件。
7、根据权利要求6中所述的方法,其特征在于,利用接触托架条(18)提供接触区域(10,11),其特征还在于,用覆盖化合物(6)封装的芯片(1)通过其托架条(3)与接触托架条(18)合在一起。
8、根据权利要求5至7中任一项所述的方法,其特征在于,在覆盖工序之后再次去除托架件或托架条(3)。
9、根据权利要求8中所述的方法,其特征在于,托架件或托架条(3)备有位于芯片(1)下方的孔(20),弹出器(19)穿过该孔插入并从而将芯片(1)与托架件或托架条(3)分开。
10、根据权利要求5至9中任一项所述的方法,其特征在于,利用托架引线框作为托架件或利用托架引线框条(13)作为托架条(3)。
11、芯片卡,其特征在于,其包括根据权利要求1至4中任一项所述的芯片卡模块。
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DE19940564A DE19940564C2 (de) | 1999-08-26 | 1999-08-26 | Chipkartenmodul und diesen umfassende Chipkarte, sowie Verfahren zur Herstellung des Chipkartenmoduls |
DE19940564.6 | 1999-08-26 |
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US (1) | US6557769B2 (zh) |
EP (1) | EP1212726B1 (zh) |
JP (1) | JP2003508832A (zh) |
CN (1) | CN1253938C (zh) |
AT (1) | ATE291259T1 (zh) |
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Cited By (2)
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CN102279942A (zh) * | 2011-07-25 | 2011-12-14 | 上海祯显电子科技有限公司 | 一种新型智能卡 |
CN109983478A (zh) * | 2016-11-04 | 2019-07-05 | 智能包装技术公司 | 用于芯片卡的电子模块的制造方法 |
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US6910635B1 (en) * | 2002-10-08 | 2005-06-28 | Amkor Technology, Inc. | Die down multi-media card and method of making same |
DE10310842B4 (de) * | 2003-03-11 | 2007-04-05 | Infineon Technologies Ag | Elektronisches Bauteil mit Halbleiterchip und Kunststoffgehäuse |
WO2006114825A1 (ja) * | 2005-04-06 | 2006-11-02 | Renesas Technology Corp. | 半導体装置の製造方法 |
KR100871707B1 (ko) * | 2007-03-30 | 2008-12-05 | 삼성전자주식회사 | 깨짐을 억제하는 몰딩부를 갖는 웨이퍼 레벨 패키지 및 그제조방법 |
US8723299B2 (en) * | 2010-06-01 | 2014-05-13 | Infineon Technologies Ag | Method and system for forming a thin semiconductor device |
EP2631849A1 (fr) * | 2012-02-27 | 2013-08-28 | Gemalto SA | Procédé de fabrication d'un dispositif comprenant un module doté d'un circuit électrique et/ou électronique |
US9171804B2 (en) | 2012-11-19 | 2015-10-27 | Infineon Technologies Ag | Method for fabricating an electronic component |
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DE4441052A1 (de) * | 1994-11-18 | 1996-05-23 | Orga Kartensysteme Gmbh | Trägerelement für einen IC-Baustein zum Einsatz in Chipkarten |
DE19532755C1 (de) * | 1995-09-05 | 1997-02-20 | Siemens Ag | Chipmodul, insbesondere für den Einbau in Chipkarten, und Verfahren zur Herstellung eines derartigen Chipmoduls |
FR2740935B1 (fr) * | 1995-11-03 | 1997-12-05 | Schlumberger Ind Sa | Procede de fabrication d'un ensemble de modules electroniques pour cartes a memoire electronique |
US6404063B2 (en) * | 1995-12-22 | 2002-06-11 | Micron Technology, Inc. | Die-to-insert permanent connection and method of forming |
DE19600388C2 (de) * | 1996-01-08 | 2000-03-09 | Orga Kartensysteme Gmbh | Chipkarte |
US7166495B2 (en) * | 1996-02-20 | 2007-01-23 | Micron Technology, Inc. | Method of fabricating a multi-die semiconductor package assembly |
DE19639934A1 (de) * | 1996-09-27 | 1998-04-09 | Siemens Ag | Verfahren zur Flipchip-Kontaktierung eines Halbleiterchips mit geringer Anschlußzahl |
DE19708617C2 (de) * | 1997-03-03 | 1999-02-04 | Siemens Ag | Chipkartenmodul und Verfahren zu seiner Herstellung sowie diesen umfassende Chipkarte |
US6074895A (en) * | 1997-09-23 | 2000-06-13 | International Business Machines Corporation | Method of forming a flip chip assembly |
JP3152180B2 (ja) * | 1997-10-03 | 2001-04-03 | 日本電気株式会社 | 半導体装置及びその製造方法 |
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Publication number | Priority date | Publication date | Assignee | Title |
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CN102279942A (zh) * | 2011-07-25 | 2011-12-14 | 上海祯显电子科技有限公司 | 一种新型智能卡 |
CN109983478A (zh) * | 2016-11-04 | 2019-07-05 | 智能包装技术公司 | 用于芯片卡的电子模块的制造方法 |
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WO2001016875A1 (de) | 2001-03-08 |
JP2003508832A (ja) | 2003-03-04 |
DE50009812D1 (de) | 2005-04-21 |
DE19940564C2 (de) | 2002-03-21 |
US6557769B2 (en) | 2003-05-06 |
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US20020113131A1 (en) | 2002-08-22 |
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