DE69840823D1 - Leistungshalbleiteranordnung für Flipchipverbindungen - Google Patents
Leistungshalbleiteranordnung für FlipchipverbindungenInfo
- Publication number
- DE69840823D1 DE69840823D1 DE69840823T DE69840823T DE69840823D1 DE 69840823 D1 DE69840823 D1 DE 69840823D1 DE 69840823 T DE69840823 T DE 69840823T DE 69840823 T DE69840823 T DE 69840823T DE 69840823 D1 DE69840823 D1 DE 69840823D1
- Authority
- DE
- Germany
- Prior art keywords
- flip
- semiconductor device
- power semiconductor
- chip connections
- connections
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP98830132A EP0942635B1 (de) | 1998-03-10 | 1998-03-10 | Leistungshalbleiteranordnung für Flipchipverbindungen |
Publications (1)
Publication Number | Publication Date |
---|---|
DE69840823D1 true DE69840823D1 (de) | 2009-06-25 |
Family
ID=8236568
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69840823T Expired - Lifetime DE69840823D1 (de) | 1998-03-10 | 1998-03-10 | Leistungshalbleiteranordnung für Flipchipverbindungen |
Country Status (3)
Country | Link |
---|---|
US (1) | US6291893B1 (de) |
EP (1) | EP0942635B1 (de) |
DE (1) | DE69840823D1 (de) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19940564C2 (de) * | 1999-08-26 | 2002-03-21 | Infineon Technologies Ag | Chipkartenmodul und diesen umfassende Chipkarte, sowie Verfahren zur Herstellung des Chipkartenmoduls |
US6583513B1 (en) * | 1999-10-12 | 2003-06-24 | Agilent Technologies, Inc. | Integrated circuit package with an IC chip and pads that dissipate heat away from the chip |
US20050286234A1 (en) * | 2004-06-29 | 2005-12-29 | International Business Machines Corporation | Thermally conductive composite interface and methods of fabrication thereof for an electronic assembly |
US9039427B2 (en) * | 2013-02-14 | 2015-05-26 | Texas Instruments Incorporated | Interdigitated chip capacitor assembly |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62144346A (ja) * | 1985-12-19 | 1987-06-27 | Matsushita Electric Ind Co Ltd | 半導体集積回路素子 |
JP2932840B2 (ja) * | 1992-08-06 | 1999-08-09 | 日本電気株式会社 | 半導体素子のボンディング方法 |
GB9225260D0 (en) * | 1992-12-03 | 1993-01-27 | Int Computers Ltd | Cooling electronic circuit assemblies |
EP0637078A1 (de) * | 1993-07-29 | 1995-02-01 | Motorola, Inc. | Eine Halbleiteranordnung mit verbesserter Wärmezerstreuung |
JP2679681B2 (ja) * | 1995-04-28 | 1997-11-19 | 日本電気株式会社 | 半導体装置、半導体装置用パッケージ及びその製造方法 |
US5977626A (en) * | 1998-08-12 | 1999-11-02 | Industrial Technology Research Institute | Thermally and electrically enhanced PBGA package |
-
1998
- 1998-03-10 EP EP98830132A patent/EP0942635B1/de not_active Expired - Lifetime
- 1998-03-10 DE DE69840823T patent/DE69840823D1/de not_active Expired - Lifetime
-
1999
- 1999-01-26 US US09/237,407 patent/US6291893B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US6291893B1 (en) | 2001-09-18 |
EP0942635B1 (de) | 2009-05-13 |
EP0942635A1 (de) | 1999-09-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |