CN1358342A - 可变电容耦合天线 - Google Patents
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- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
Abstract
本发明涉及的是一种和无线电收发装置连接的耦合天线,收发装置中有一个或多个集成的电容器。这个耦合天线中至少有一个在由绝缘的电介质材料构成的基底上印制而成的线圈和一个并联的印制而成的电容器,这样就可以减小在收发装置中的集成电容器的电容,而总电容和线圈构成谐振电路。本发明还涉及这种天线的制造方法,以及将这种天线用于无接触芯片卡或接触-无接触交替芯片卡。
Description
技术领域:
本发明涉及的是无接触收发系统,特别涉及的一种带有丝网印制电容器的耦合天线,这种天线特别用于无接触芯片卡或接触-无接触交替的芯片卡。
背景技术:
无接触芯片卡是一种在多个领域中使用越来越多的系统,例如在运输系统中芯片卡已发展成为付款装置,这即是电子钱包(porte-monnaisélectronique)的情况。很多公司也都发展用无接触芯片卡来对其员工进行识别。
无接触芯片卡与相应的阅读装置之间的信息交换是通过置于无接触芯片卡内的一个天线和置于阅读器内的第二个天线之间的远距离电磁耦合来实现的。为了编辑、存储和处理这些信息,所述的卡中具有一个与所述天线相连的芯片或电子模块。通常,芯片是处在一个塑料绝缘基底上(聚氯乙烯(PVC)、聚酯(PET)、聚合碳酸盐(PC)、…)。天线是通过对在基底上的铜或铝进行化学刻蚀或是用金属导线的线圈得到的。芯片中有一个存储区和一个微处理器,其中还有一些电容器,这些电容器决定着与芯片相联系的输入电容。当电容满足下面的谐振条件时,便获得天线-芯片间的最佳耦合,这时应没有寄生振荡。
LCω2=1 (1)式中,L是天线的电感,C是输入电容,ω是角频率,等于2πf,此处f是标准频率(例如为13.56MHz)。
观察这个条件,要求制造商、亦称铸造商,在芯片卡中嵌入足够多的电容器,以能获得足够大的电容值,这样芯片卡的造价便因具有电容器而极大提高。
必须用降低用于芯片卡中的芯片的生产价格才能使无接触芯片卡得以发展。为了降低芯片的成本,铸造商越来越多地减少在芯片卡中集成的电容器的大小,以及输入电路的电容。这样,他们可以生产更小的芯片。
为了满足LCω2=1这一条件,并获得最佳的耦合,便企图通过增加天线的电感L来补偿芯片输入电容的减小。当在于塑料电介质基底上用化学蚀刻铜或铝来制作天线的情况下,是用增加圈数来增加电感的。这种办法往往生成多个重要的缺陷。事实上,所有的电路都存在有电阻,增加圈数在实际上增加了电路的长度,这便导致这种电阻的激增,就显著地影响天线的性能,因而影响到卡的性能。事实上,这种卡与阅读装置的距离就显著减小。
为了限制这种缺陷,同时保持电磁通量通过这个卡的有效截面,必须减小铜线的宽度,这方面的效应是增加了天线的电阻,特别是使卡的安全性变坏,因为增加了在热轧卡体时天线断线的可能性。
蚀刻天线单位成本的显著增加,于是铸造商从使用较小的输入电容所获得的造价的下降就给天线的高价抵消掉了。这样制造和使用这种卡都没有获得效益。
将芯片的电容移到天线那边,将一个或多个电容器和天线直接连接也同样是不可接受的办法。事实上,各种传统的电容器都是高成本,这不能解决卡的造价问题。而且将电容器装在基底上和将电容器和天线连接,这些都不是容易的。
发明内容
本发明的目的在于消除上述的缺陷,提供一种带有低造价的平行板电容器的天线,以得到一种成本比现在市场上低得多的芯片卡,因为芯片卡中的电容器数减少了。
于是,本发明涉及的是和电磁波收发装置相连接的一种耦合天线,这种电磁波收发装置中有一个或多个集成的电容器。在这种耦合天线中至少有一个在由绝缘的电介质材料构成的基底上印制的线圈,还有一个与之并连的在基底上印制的电容器,这就能够减小在前述的装置中集成的一个或多个电容器所提供的电容,而使获得的电容与线圈构成一个谐振回路。
本发明还涉及到这种天线的一种制造方法,其在于:
——用在基底上沉积导电墨,实施第一次印制,其中至少有一圈天线、电容器的下片以及将天线与芯片或模块连结的端头、将天线与电容器下片连接的端头,
——用沉积绝缘墨实施第二次印制,印制电容器的绝缘带,将电容器的下片覆盖起来,
——实施第三次印制,印制电容器的上片以及将天线与电容器的上片相连接。
附图说明
从后面的描述中将进一步看到本发明的目的,目标和特征,在后面描述中参考的附图有:
图1示出一种没有传统接触的带有存储器的芯片卡的电路图。
图2示出的是根据一种特殊的实施方式的在其第一步之后的耦合天线。
图3示出的是在第二步实施之后根据本发明的耦合天线。
图4示出的是在最后一个实施步骤之后根据本发明的耦合天线。
图5示出的是含有根据本发明的耦合天线的芯片卡的电路图。
具体实施方式
根据图1,一个芯片卡10的电路有两部分:天线和芯片。芯片12有一个内部电容Cs14,是用在芯片中的电容器得到的。这个芯片还有一个电子部分16,对应于存储区和处理器。芯片12通过电路10和天线18连接。天线18具有一个电感器Ls22,这个电感器具有电阻Rs20。
图2、3、4示出在本方法的三个主要步骤之后的天线。这个天线是由两个串联的线圈和一个印制电容器构成。在本制造方法的第一步中,如图2所示,两个线圈24和26都印制在由绝缘电介质材料构成的基底28上。同时印制了两个接触片30和32,用来将天线和芯片相连接,以及电容器的下极板34。线圈26的一个端和极板34相连,并通过电桥36和连接片30相连。线圈26的另一端空着。线圈24的一个端头和连接片32连接,而它的另一端是空着的。构成基底的电介质材料是塑料、纸或浸以可以热硬化或经紫外线可以网状化的树脂的玻璃布。所用的塑料例如为聚氯乙烯(PVC)、聚脂(PET、PETG)、聚合碳酸盐(PC)、结合丙烯腈(ABS)。所用的导电墨是由聚合物构成的,并掺有导电成分,导电成分可以是金属。最好墨中掺的是银,有时可以是掺铜或掺碳。墨中可以含有50~70%的小粒状或小片状的银。所用的聚合物是聚脂或丙稀酸树脂。墨中还含有溶剂,起到滑润作用。根据一种特殊的实施方式,所说的溶剂是乙二醇醚。
图3所示的在本制造方法第二步结束时的天线,实现了第二次印制。这第二次印制对应于构成分开电容器的两个极板的绝缘带38的电介质墨的沉积。还在电桥36上面印制了绝缘带40。根据一种理想的实施方式,每层的厚度为25微米。这种墨是由聚合物和在紫外线作用下网状化的材料构成的。这里的聚合物是丙稀酸树脂或是未饱和的聚脂。和导电墨相反,这种墨中没有溶剂。当将这种墨置于紫外线下,这种墨中的聚合物将网状化,这种网状化使墨变硬。这样,电容器的几何形状就非常稳定,特别是这种绝缘带的厚度不变,因此这两个极板间的距离也同样不变。这就使得电容器,因而天线具有最佳的工作质量。为了有足够的绝缘性能,这种墨应该具有尽可能高的相对介电常数。通常其介电常数的值大于3。在一种理想的根据本发明的耦合天线的实施方式中,用于印制绝缘带的墨的介电常数为3.9。为了保证绝缘带具有好的绝缘性能,至少要有两层墨。事实上,在网状化以后,墨层具有非常强的多孔性,妨碍了高的绝缘能力。为解决这个问题,相继重迭印制两层,构成一个具有高的绝缘能力的带。绝缘带38是重迭在极板34上,并将之完全覆盖。绝缘带40同样覆盖了电桥36,这个绝缘带可以将电桥和在本制造方法的最后一步中在线圈24和26的空的端头之间实现的连接绝缘开来。
图4示出在天线制造方法的第三步和最后一步之后的天线。在这一步中,实施第三次印制,印制重迭在绝缘带38之上的电容器上极板42。为了将极板42和连接片32连起来并能将电容器和天线并联,就印制了一个连线44。最后线圈24和26的两个空着的端头也通过印制实现的连线46连接。
这样得到的天线是由两个串联的线圈和一个电容器构成。图5中示出了带有这种天线的一种芯片卡的电路图。
电路图48同样是分成两部分:芯片50和天线52。芯片中有一个电子部分54和一个内部电容Cs156,电子部分对应于存储器区和处理器。这个电容较传统芯片的内部电容要小得多。这个小得多的电容值为天线52的印制电容器所获得的电容Cs2的值所补偿。这个天线还具有一个电阻Rs60和一个自感器Ls62。电容Cs2的值可变,由电容器的大小来决定。根据一种理想的实施方式,天线的电容Cs2要比芯片的Cs1的电容要大。
这种芯片卡是由一个平板形的基底构成的,上面至少有一个和至少一个电容器并联的天线,这天线和一个芯片或模块相连,芯片内的内部电容很小,根据一种特别的实施方式几乎为零。根据无接触芯片卡的一种特殊的实施方式,前述的基底是夹在两个卡体的中间,这两个卡体和基底的每面固结,以使卡硬实。所述的卡体可以是塑料的,在这种情况下,所用的塑料可以是聚氯乙烯(PVC)、聚脂(PET、PETG)、聚合碳酸盐(PC)或是结合丙稀腈(ABS)。当卡体都是塑料时,将卡体和带有一个或多个根据本发明的天线的基底的每个面固结是用将这三个卡的部件热压或冷压来实现的,热压或冷压亦称热轧或冷轧。
于是,由这样得到的耦合天线具有多个重要的优点。事实上,在芯片上实施一个外部电容器便改善芯片卡的性能,特别是当将这种卡和具有相同的内部电容值的芯片的传统的芯片卡相比较的时候。
印制技术的使用使获得的电容器具有相当的弹性,这使得芯片卡在使用时更具有抗机械应力的能力。这样在电容器变形时其电容值并不变。
还有,调节述及的电容器的参量,例如极板的面积或绝缘带的厚度,可以调节电容值,以达到完全谐振。同样可以使电容值极大改变而勿需改变制造方法。于是可以得到一种天线和芯片卡的制造方法,这种方法能方便且迅速地适应具有确定的和固定的内部电容的芯片卡所提出的要求。
最后,具有带着印制电容器的耦合天线的芯片卡的成本与具有传统天线和带有大的内部电容的芯片的芯片卡的成本是不可比拟的,所说的传统天线例如是用铜刻蚀的。这样,芯片卡的制造方法越容易实施,造价就降得越多,因为其中的天线和一个或多个电容器是同时印制的。
Claims (11)
1.一种和带有一个或多个集成的电容器的一个电磁波收发装置相连的耦合天线,述及的耦合天线中至少有一个在绝缘的电介质基底上印制而成的线圈;
述及的天线的特征在于还有一个在述及的基底上印制的与这个天线并联连接的电容器,这样就能够减小在述及的收发装置中集成的(一个或多个)电容器的电容,以能使所获得的电容和上述的线圈构成谐振电路。
2.根据权利要求1的耦合天线,其中的电容器是由至少两个印制的极板构成的,这些极板相互重迭并由电介质墨印制的绝缘带隔开的。
3.根据前述的各条权利要求之一的天线,其中构成基底的介电基片是塑料、纸、或是浸有可经紫外线硬化或网状化的树脂的玻璃布。
4.根据前述的各条权利要求之一的耦合天线,其中用来印制线圈和电容器极板的墨是一种掺有导电材料的聚合物导电墨。
5.根据权利要求2至4中某一条的耦合天线,其中的绝缘带是由至少两层电介质墨构成的,这使得绝缘带具有高的绝缘能力。
6.根据权利要求5的耦合天线,其中的构成两层绝缘带的电介质墨是可用紫外线网状化的聚合物墨。
7.根据前述各条权利要求之一的耦合天线的制造方法,其特征在于这种方法:
——实施第一次印制,通过在基底上沉积导电墨印制天线的至少一圈、述及的电容器的下极板、将这个天线与芯片或模块连接的接触片,以及将这个天线与电容器下极板连接的接触片,
——实施第二次印制,通过沉积电介质墨印制述及的电容器的绝缘带,将电容器的下极板覆盖起来,
——实施第三次印制,在述及的绝缘带的上面重迭印制电容器的上极板,并将天线和电容器的上极板连接。
8.由根据权利要求1至6中某一条的耦合天线和一个芯片或模块连接构成的无接触芯片卡。
9.根据权利要求8的无接触芯片卡,其中的芯片或模块中没有内部电容。
10.根据权利要求8或9的无接触芯片卡,其中的基底是夹在两个卡体之间,述及的卡体与基底的每个面固结,以使芯片卡硬实。
11.根据权利要求10的无接触芯片卡,其中是通过热轧或冷轧将天线的基底和卡体固结的。
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FR0000209A FR2803439B1 (fr) | 2000-01-03 | 2000-01-03 | Antenne de couplage a capacite variable |
FR00/00209 | 2000-01-03 |
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US (1) | US6522308B1 (zh) |
EP (1) | EP1183754A1 (zh) |
JP (1) | JP2003519948A (zh) |
KR (1) | KR100766645B1 (zh) |
CN (1) | CN1175521C (zh) |
AU (1) | AU767701B2 (zh) |
BR (1) | BR0103750A (zh) |
CA (1) | CA2362415C (zh) |
FR (1) | FR2803439B1 (zh) |
HK (1) | HK1048198B (zh) |
ID (1) | ID29786A (zh) |
IL (1) | IL144712A (zh) |
MX (1) | MXPA01008845A (zh) |
NO (1) | NO20014212L (zh) |
NZ (1) | NZ513515A (zh) |
RU (1) | RU2258282C2 (zh) |
TR (1) | TR200102544T1 (zh) |
TW (1) | TW526624B (zh) |
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- 2001-01-02 AU AU31826/01A patent/AU767701B2/en not_active Ceased
- 2001-01-02 CN CNB018000274A patent/CN1175521C/zh not_active Expired - Fee Related
- 2001-01-02 WO PCT/FR2001/000010 patent/WO2001050547A1/fr active Application Filing
- 2001-01-02 RU RU2001126717/09A patent/RU2258282C2/ru not_active IP Right Cessation
- 2001-01-02 TR TR2001/02544T patent/TR200102544T1/xx unknown
- 2001-01-02 CA CA2362415A patent/CA2362415C/fr not_active Expired - Fee Related
- 2001-01-02 JP JP2001550827A patent/JP2003519948A/ja active Pending
- 2001-01-02 EP EP01903855A patent/EP1183754A1/fr not_active Withdrawn
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CN102282723B (zh) * | 2008-12-11 | 2014-09-24 | 埃雷创新公司 | Rfid天线电路 |
CN101976762A (zh) * | 2010-09-19 | 2011-02-16 | 北京握奇数据系统有限公司 | 双通道线圈天线及具有该双通道线圈天线的装置 |
CN103366215A (zh) * | 2012-04-05 | 2013-10-23 | 英飞凌科技股份有限公司 | 用于无接触数据传输的数据载体及其产生方法 |
CN104077620A (zh) * | 2013-12-03 | 2014-10-01 | 北京中电华大电子设计有限责任公司 | 一种具有安全功能的非接触智能卡电磁场耦合的实现电路 |
CN105094231A (zh) * | 2015-07-28 | 2015-11-25 | 京东方科技集团股份有限公司 | 一种显示屏和便携设备 |
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Publication number | Publication date |
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NO20014212D0 (no) | 2001-08-30 |
JP2003519948A (ja) | 2003-06-24 |
AU767701B2 (en) | 2003-11-20 |
KR20020004953A (ko) | 2002-01-16 |
EP1183754A1 (fr) | 2002-03-06 |
NZ513515A (en) | 2004-02-27 |
FR2803439B1 (fr) | 2002-08-30 |
RU2258282C2 (ru) | 2005-08-10 |
WO2001050547A1 (fr) | 2001-07-12 |
NO20014212L (no) | 2001-08-30 |
MXPA01008845A (es) | 2003-02-12 |
ID29786A (id) | 2001-10-11 |
IL144712A (en) | 2005-09-25 |
FR2803439A1 (fr) | 2001-07-06 |
HK1048198B (zh) | 2005-05-27 |
TW526624B (en) | 2003-04-01 |
HK1048198A1 (en) | 2003-03-21 |
IL144712A0 (en) | 2002-06-30 |
CN1175521C (zh) | 2004-11-10 |
BR0103750A (pt) | 2001-12-26 |
CA2362415C (fr) | 2010-03-23 |
TR200102544T1 (tr) | 2002-03-21 |
ZA200106760B (en) | 2001-12-19 |
KR100766645B1 (ko) | 2007-10-15 |
US6522308B1 (en) | 2003-02-18 |
AU3182601A (en) | 2001-07-16 |
CA2362415A1 (fr) | 2001-07-12 |
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