CN1328783C - 垂直式快闪存储器的结构及其制造方法 - Google Patents
垂直式快闪存储器的结构及其制造方法 Download PDFInfo
- Publication number
- CN1328783C CN1328783C CNB031512844A CN03151284A CN1328783C CN 1328783 C CN1328783 C CN 1328783C CN B031512844 A CNB031512844 A CN B031512844A CN 03151284 A CN03151284 A CN 03151284A CN 1328783 C CN1328783 C CN 1328783C
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- Prior art keywords
- flash memory
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000000034 method Methods 0.000 title claims description 28
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000010703 silicon Substances 0.000 claims abstract description 23
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 22
- 238000007667 floating Methods 0.000 claims abstract description 17
- 238000005530 etching Methods 0.000 claims abstract description 15
- 238000004519 manufacturing process Methods 0.000 claims abstract description 9
- 230000004888 barrier function Effects 0.000 claims description 26
- 239000011810 insulating material Substances 0.000 claims description 24
- 230000015572 biosynthetic process Effects 0.000 claims description 19
- 239000006185 dispersion Substances 0.000 claims description 19
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 238000003701 mechanical milling Methods 0.000 claims description 8
- 239000000126 substance Substances 0.000 claims description 8
- 230000009286 beneficial effect Effects 0.000 claims description 6
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 5
- 239000000377 silicon dioxide Substances 0.000 claims description 5
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 4
- 229910052721 tungsten Inorganic materials 0.000 claims description 4
- 239000010937 tungsten Substances 0.000 claims description 4
- 229940090044 injection Drugs 0.000 claims 1
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 7
- 239000012774 insulation material Substances 0.000 abstract description 5
- 239000000758 substrate Substances 0.000 abstract description 4
- 238000009413 insulation Methods 0.000 abstract 6
- 239000008187 granular material Substances 0.000 abstract 3
- 150000002500 ions Chemical class 0.000 abstract 1
- 239000011521 glass Substances 0.000 description 3
- 238000005468 ion implantation Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000011856 silicon-based particle Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 230000005689 Fowler Nordheim tunneling Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 230000005641 tunneling Effects 0.000 description 1
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- Non-Volatile Memory (AREA)
Abstract
Description
Claims (17)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB031512844A CN1328783C (zh) | 2003-09-28 | 2003-09-28 | 垂直式快闪存储器的结构及其制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB031512844A CN1328783C (zh) | 2003-09-28 | 2003-09-28 | 垂直式快闪存储器的结构及其制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1601726A CN1601726A (zh) | 2005-03-30 |
CN1328783C true CN1328783C (zh) | 2007-07-25 |
Family
ID=34659918
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB031512844A Expired - Lifetime CN1328783C (zh) | 2003-09-28 | 2003-09-28 | 垂直式快闪存储器的结构及其制造方法 |
Country Status (1)
Country | Link |
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CN (1) | CN1328783C (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102054781B (zh) * | 2009-11-10 | 2012-12-05 | 中芯国际集成电路制造(上海)有限公司 | 垂直式闪存结构及其制造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1195886A (zh) * | 1997-04-10 | 1998-10-14 | 联华电子股份有限公司 | 半导体元件的制造方法 |
US20020096703A1 (en) * | 1996-05-29 | 2002-07-25 | Madhukar B. Vora | Vertically integrated flash eeprom for greater density and lower cost |
US6548856B1 (en) * | 1998-03-05 | 2003-04-15 | Taiwan Semiconductor Manufacturing Company | Vertical stacked gate flash memory device |
-
2003
- 2003-09-28 CN CNB031512844A patent/CN1328783C/zh not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020096703A1 (en) * | 1996-05-29 | 2002-07-25 | Madhukar B. Vora | Vertically integrated flash eeprom for greater density and lower cost |
CN1195886A (zh) * | 1997-04-10 | 1998-10-14 | 联华电子股份有限公司 | 半导体元件的制造方法 |
US6548856B1 (en) * | 1998-03-05 | 2003-04-15 | Taiwan Semiconductor Manufacturing Company | Vertical stacked gate flash memory device |
Also Published As
Publication number | Publication date |
---|---|
CN1601726A (zh) | 2005-03-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Effective date: 20111205 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20111205 Address after: 201203 Shanghai Zhangjiang Road, Zhangjiang High Tech Park of Pudong New Area No. 18 Co-patentee after: Semiconductor Manufacturing International (Beijing) Corp. Patentee after: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) Corp. Address before: 201203 Shanghai Zhangjiang Road, Zhangjiang High Tech Park of Pudong New Area No. 18 Patentee before: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) Corp. |
|
CX01 | Expiry of patent term |
Granted publication date: 20070725 |
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CX01 | Expiry of patent term |