CN1323506A - 挠性线路板的制造方法 - Google Patents
挠性线路板的制造方法 Download PDFInfo
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Abstract
本发明提供一种挠性印刷线路板的制造方法,在该挠性印刷线路板的每个主表面上带有至少一个蚀刻或电镀的细部,所述方法包括下列步骤:提供包括介电基片(10)和至少一层导电基层(11)具有两个主表面的原料(1);将带有覆盖片(14)的光刻胶(16)层压在原料(1)的至少一个主表面上;和将图象(18)印刷在覆盖片(14)上,或者除去覆盖片(14)将图象(18)直接印刷在光刻胶(16)上。
Description
发明的背景
发明的领域
本发明涉及一种电气互连的电路(例如介电基片的两面均蚀刻或电镀细部(features)的挠性电路,尤其是IC集成电路和带球格子排列型(tape ballgrid array type,TBGA)电路)的制造方法。
相关领域的描述
用于制造小间距挠性电路板的常规成象和曝光技术需要使用不连续的光掩模,这种掩模具有在线路基片上曝光成图象的不透明区。使用不连续掩模进行定位和曝光是一种缓慢的方法,因为负责转变卷材位置的技师需要在固定掩模的机械打开和闭合时转换卷材的位置。需要双面图象的线路图形要求在基片相反的两面的细部之间准确地对准位置。一种使用不连续的光掩模的成象法要求两个光掩模相互之间绞接,使之能从卷材上移开以便改变卷材的位置。这种开启和闭合操作会使基片两面上的图象错位,因为通常不采用有效的定位系统来校验定位。
美国专利5,637,426公开了一种在基片(如印刷线路板、半导体基片和透明的塑料和玻璃基片)上形成光刻胶图案的方法。该带图案的光刻胶层可用于限定细部(如线路层或焊料光刻胶图案)。该方法必须在物体上形成光刻胶层、在覆盖在物体上的光刻胶层上放置透明的掩模基片、用喷墨打印机直接在该透明的掩模基片上形成掩模图案、将带有掩模的光刻胶层置于光辐照下、移去该透明的掩模基片,随后对光刻胶层显影。在Uchikawa方法中使用喷墨打印机并不对线路进行双面处理是其与本发明的关键不同之处。该专利未提到在物体相反的表面上形成细部或对其进行加工的方法或效用。尤其是Uchikawa未提到在线路基片相反面上形成的掩模图案的定位方法。同样,该专利未提到使相反两侧的相关细部之间满足定位要求以确保获得合格的电性能的方法。Uchikawa的权利要求的一个关键限定是基片被加工成具有许多通孔。在线路板的情况下,这意味着未采用Uchikawa的方法来制造该通孔。
美国专利4,853,317公开了一种采用喷墨打印机使打印的或挠性的印刷线路板系列化的方法。据说该方法的实用性在于它能使单独的印刷板带有系列化的独特标记,而每组所需的系列无需单独的光掩模或打印板。该方法需要提供挠性或打印的线路板、直接在光刻胶层上打印系列信息、将带线路图案图象的光掩模置于光刻胶上,对光刻胶进行辐照和最后显影。Hayes的方法中使用喷墨打印机和未进行双面线路加工是其与本发明的一个关键差异。对于Uchikawa,在本发明实用要求的图象分辨率下,已知喷墨机的成象速率不能与本发明掩模图象制造法相比拟。另外,该文献既未报道双面加工的方法,又未提出或公开该效用(系列化)本身需要双面加工。
鉴于上述情况,并且由于常规的成象速度约为0.30-1m/min,需要一种能高速制造和双面加工的方法。
本发明方法采用依次的图象成象和曝光步骤,它速度比常规图象成象和曝光技术目前可能的速度高。这种高速成象和曝光可降低制造成本并能经济地制得更小批量的产品。本方法能用于添加和扣除(additive and subtrative)制造法。
在本发明中使用高速印刷法(如凹版印刷、曲面印刷或胶版印刷)在包覆介电基片的光刻胶覆盖片上直接产生所需的图象,或者直接印刷在光刻胶本身上。这种类型的成象形式与采用不连续的光掩模产生图象的常规成象方法完全不同。图象是用油墨印刷在光刻胶或者带光刻胶的聚合物基片上的而非形成在透明基片(如玻璃)上的。
当以与印刷连续的方法进行图象曝光和显影时,本发明印刷和成象的总速度约为1.8-3m/min。但是,曝光速度受光刻胶的灵敏度以及光源强度的限制。根据光源类型和光刻胶的灵敏度,曝光速度约为0.05-0.16m/sec。因此,成象是一个受该速度限制的步骤,即如果该方法不是综合的,单独的高速印刷速度非常快。所述各种高速印刷方法的印刷速度可高达46m/min。
发明的概述
本发明提供一种在各个主表面上至少具有一个蚀刻或电镀的细部的挠性印刷线路板的制造方法,它包括下列步骤:
(a)提供包括介电基片和至少一层导电基层的原料,该原料具有两个主表面;
(b)将上面固定地附着有覆盖片的光刻胶层压在原料的至少一个主表面上;
(c)除去该覆盖片;
(d)将图象直接印刷在光刻胶上。
本发明还提供一种挠性印刷线路板的制造方法,在该挠性印刷线路板的各个主表面上带有至少一个蚀刻或电镀的细部,所述方法包括下列步骤:
(a)提供包括介电基片和至少一层导电基层的原料,该原料具有两个主表面;
(b)将光刻胶层压在原料的至少一个主表面上,所述光刻胶具有固定地附着在它上面的覆盖片;
(c)将图象印刷在所述覆盖片上。
在本文中,术语具有下列含义:
1.如果存在的话,“光掩模”是指光刻胶及其覆盖片;
2.术语“光刻胶”是指能防止随后步骤的影响和使用的化学品作用的光敏材料;
3.术语“固定地附着”是指以一种制品附着在另一制品上,其附着的方式使得在无人工剥离下不易滑动或分离。
除非另有说明,否则所有百分数、份和比例均是以重量计算的。
附图简述
图1是本发明方法原料的透视图;
图2是各表面层压有光刻胶层和覆盖片的原料的透视图;
图3是图2材料的覆盖片上放置有光掩模的透视图;
图4是光刻胶层辐照和显影后材料的透视图;
图5是形成线路层后挠性线路板的透视图;
图6是带有形成的通孔的介电基片层的透视图;
图7是导电基层蚀刻后的最终挠性线路板的透视图;
图8是用于另一种扣除方法的原料透视图;
图9是用于第二种方法层压有光掩模片的原料的透视图;
图10是图9材料的覆盖片上置有光掩模并经印刷的透视图;
图11是光刻胶层经辐照和显影后的材料的透视图;
图12是形成线路层并且导电基片层蚀刻后的挠性线路板的透视图;
图13是带有形成的通孔的介电基片层的透视图;
图14是剥去光刻胶层后挠性线路板的透视图;
图15是带粘合剂层结构的原料的透视图;
图16是衬垫与通孔对准的挠性线路板的正视图。
发明的详细描述
图1-7说明当使用添加印刷线路板制造方法时本发明较好的实例。在添加方法中,线路轨迹以所需的图案形成于原料1上。图8-11是使用扣除方法时本发明较好的实例。在扣除方法中,通过从原料1上除去导电材料连续层的区域而形成线路轨迹。导电层22的除去区域构成所需的电路轨迹图案。
图1所示的原料1包括介电基片10、在该介电基片的至少一个表面上的金属氧化物层12和在金属氧化物层12上的导电基层11。本领域已知金属氧化物层12用于增加介电基片10和导电基层11之间的粘合性。介电基片10较好是完全固化的聚合物材料,包括例如聚酯(如聚对苯二甲酸乙二醇酯、聚碳酸酯)和聚酰亚胺膜。聚酰亚胺是较好的聚合物膜,它包括未改性的聚酰亚胺和改性的聚酰亚胺,如聚酯酰亚胺、聚酰亚胺-酰亚胺-酯、聚酰胺-酰亚胺、聚硅氧烷酰亚胺和其他混合的酰亚胺。更好的是由1,2,4,5-苯四酸酐和4,4-二氨基-二苯醚制成的以Kapton从E.I.DuPont de Nemours,Inc(DuPont)的聚酰亚胺聚合物。这种材料的各种衍生材料可以KaptonTM E、KaptonTMV和KaptonTM H购得。类似的材料可以PyralinTM的商标购自DuPont,以ApicalTM购自Kaneka Chemical Industries。通常,原料的厚度为35-125微米。
形成金属氧化物层12的方法包括,但不限于阴极溅镀和化学气相沉积;适用的方法还包括热蒸发。用于形成金属氧化物层12的较好的材料是铬。其它适用的材料包括铁、镍、锰、钼、锆及其混合物。
图2是层压在原料1两侧的光掩模片13。光掩模片13一般用标准的层压技术在热和压力下层压的。光掩模片13是由对特定波长的辐照光敏感的光刻胶层16和对该特定波长的辐照光透明的聚合物覆盖片14组成的。适用的光刻胶包括负光刻胶,例如可负加工的水性可聚合的、可光致固化的组合物,如美国专利3,469,982、3,448,098、3,867,152和3,526,504所述的组合物。这种光刻胶包括至少一种聚合物材料、附加的可交联单体以及光引发剂。聚合物的例子包括丙烯酸类和甲基丙烯酸类共聚物以及(甲基)丙烯酸酯与苯乙烯和马来酸酐的共聚物。其例子包括,但不限于以RistonTM购自杜邦、以AquamerTMSF系列313、120和125以及CF系列购自Hercules、以及以PhototecTM购自Hotachi的聚甲基丙烯酸甲酯聚合物。覆盖片固定地附着在光刻胶上,它具有良好的定位性,从而可在相对快的加工速度下进行印刷和曝光,并且无需缓慢地进行印刷。
层压光掩模片13后,如图3所示将掩模图案18直接印刷在两层覆盖片14上。采用的印刷方法包括连续法如凹版印刷、曲面印刷和胶版印刷技术。印刷技术的具体选择至少部分取决于具体线路板设计的分辨率、定位和成本要求。
各种印刷技术各具有优缺点,可推荐其用于不同用途。曲面印刷和凸版印刷的成本低、印刷准备时间短,但是与某些印刷方法相比质量较差。另外,凸版印刷和低度曲面印刷法会在印刷夹辊之间使光刻胶基片承受不均匀的力。这会产生压力导致的缺陷。由于这些类型的印刷通常不是“尖端”的,因此这些技术用于本发明时通常需要对目前市售的一代印刷机的定位进行升级。
胶印平版印刷法提供均匀的压力、较高的图象质量以及可能较高的最高速度,需要较长的印刷准备时间。轮转凹版印刷提供高的线速度和最长的行程(runs)、非常高的图象质量,尤其是线路制作(在对电子学是重要的),但是需要制造昂贵的印刷筒以及长的装配时间。
无水平版印刷具有胶版印刷的优点,图象质量有进一步的改进,但是目前选用的油墨稍有所限制。
喷墨和静电印刷的图象质量通常较低,不很适合要求高的线路制作,并且未配置成双面定位。除非需要相当短行程的很低质量制作或者制造单个试样,并且丝网印刷最终不能得到一般要求的线路领域的图象质量,否则它们不予考虑。
掩模图案18是由油墨不透明区形成的,它阻挡光辐照防止其作用于光刻胶层16上。敞开区允许辐照光透过覆盖片并作用在光刻胶层16上。掩模图案16的形状限定最终线路的设计。由于随后除去覆盖片14,因此油墨污染显影液的可能性很小。
本发明使用的油墨取决于选用的精确印刷技术、选用的干燥技术以及基片。但是,重要的是将油墨中的颗粒和碎片减至最少以便将缺陷减至最少。如果需要在光刻胶上直接打印,选用的油墨必须不影响光刻胶的显影。与水基光刻胶显影技术一起使用的具体添加剂包括含单体或低聚物的酸。
光刻胶层16的曝光通常是一种“步骤重复”型过程,此时将适当数量的制品移入辐照室,光刻胶层在其中接受合适的照射,并对介电基片10两侧的光刻胶层16照射特定的波长的光,以便在光刻胶层16中引发化学反应。这种化学反应导致在光刻胶层16上形成与掩模图案相同的图案。除去覆盖片14后,可在显影液中对光刻胶层16进行显影。如图4所示,经特定波长辐照并置于所需的显影液中以后,被掩模图案18的不透明区覆盖的光刻胶层16的区域(负作用区)被显影液选择性地除去,形成露出区20和21。随后可对露出区20和21进行蚀刻和/或电镀步骤,制得所需的细部。这些细部一般包括导电线路轨迹和导电或不导电的通孔。
所有的附图均显示负作用的光刻胶层16,它对波长能透过覆盖片14的辐照敏感。或者,可使用正作用的光刻胶材料,它颠倒掩模图案18的不透明区和敞开区。在对正作用光刻胶材料进行辐照和显影后,光刻胶材料16未处于掩模图案18的不透明区下的区域将被显影液除去。
线路层22可形成在介电基片10表面上光刻胶层16已经显影的露出区20中。较好的是,线路层22通过电镀形成。如图5所示,电镀会使线路层仅形成在介电基片露出导电基层11的表面上。当导电基层11和电镀浴溶液之间形成电流后,导电基层11起促进吸引金属材料的作用。本领域已知有多种电镀设备和方法;可使用任何常规的方法。
图6显示在介电基片10的露出区21形成通孔24。尽管本发明线路板通常至少具有一个通孔,但是也可使用盲道(即未蚀穿基片的通道)。根据形成通孔24所采用的方法类型,孔壁可如图所示是倾斜的或者相互之间是基本平行的。如图7所示,在形成通孔后,剥去剩余的光刻胶层16并蚀刻导电基层以防止线路层22的单根线路轨迹之间发生短路。通常还除去通孔24底部的金属氧化物层12。可使用各种不危害聚合物膜的蚀刻剂,如购自Electrochemicals,Inc.的Perma-etchTM。化学蚀刻通常形成倾斜的孔壁,需要光掩模来限定所需的形状。在化学蚀刻液中稳定的光掩模阻止了整个介电基片发生溶解。
其它形成孔道、通孔等的方法(如激光烧蚀)通常形成基本平行的孔壁,但是仍需要使用掩模来确定通孔24的位置。如有必要还可采用形成孔道等的其它方法,如机械蚀刻和不使用掩模用钇-铝-石榴石即YAG激光形成通孔24。
根据线路板的要求,可使用另一种制造线路板的添加方法。这种方法在形成线路层以前要求覆盖片14保留在线路板通孔表面的位置上。在该方法的这步骤完成前将覆盖片保留在适当位置能保护下层光刻胶层16免遭由于物理或化学相互作用产生的损害。这种方法次序需要第二显影步骤对光刻胶层16进行显影,以便形成通孔24。如图8所示,原料100包括介电基片10、在介电基片的至少一个表面上的金属氧化物层12、在金属氧化物层12上的导电基层11以及未形成图案的线路层22。在图8所示的实例中,线路层22较好是由电镀形成的。
图9显示光掩模片13层压在原料100的各个表面上。该方法的这一步骤与添加法的步骤相同。在扣除法中,在线路层22中形成线路轨迹图案的掩模图案18与用于添加法的图案相反。图10在介电基片10的线路层22上的掩模图案18与图3所示的掩模图案的不同之处在于掩模图案18的不透明区位于要求没有线路层22的区域。无论使用正作用光刻胶还是使用负作用光刻胶,在扣除方法中用于形成线路轨迹的光掩模18的不透明区与添加法中使用的不透明区相反。颠倒轨迹侧掩模图案18的不透明区会使显影的轨迹侧光刻胶的图案也发生颠倒。
对于扣除法,蚀刻前如图11所示的掩模图案导致线路层22的不需要区域被蚀刻除去,形成如图12所示的所需的线路轨迹图案。注意图11所示的导电基层11的露出区也被蚀刻除去(图12)。如图13所示,在扣除法中以与添加法相同的方法形成通孔22。形成通孔22后,除去光刻胶层16。通常还除去在通孔24底部的金属氧化物12。如图14所示形成的线路板与图7所示的线路板基本相同。
图15所示的原料200也可用于扣除法中。线路层22是使用粘合剂层26粘结在介电基片10上的。通常,采用铜箔薄片作为线路层22的材料。使用如图15所示的原料200需要改变选用的工艺步骤。根据使用的粘合剂,关键的差异在于需要另一种工艺步骤或蚀刻液从通孔24的底部除去粘合剂。
对于适当的线路性能和制造性能,将衬垫区28对准相邻的通孔24是关键的。如图16所示,衬垫区28必须完全叠合在通孔24上。通过改变通孔24和衬垫区28的大小来满足相互对准的要求,从而保持叠合,以便用选用的图案印刷技术达到定位性能。在某些情况下,印刷设备通过齿轮驱动辊保持对准。在需要更高精度的其它情况下,使用能在线检测和调节定位的闭环定位系统。
在另一种方法(扣除法或添加法)中,层压光掩模后,剥去覆盖片,将图象直接印刷在光刻胶上。随后对光刻胶进行曝光,该步骤以后,除去未曝光的部分和油墨,并继续上述工艺步骤。
对于任何一种方法,可使用附加的步骤如预蚀刻或后蚀刻酸浴、水浸泡以及中和,可电镀附加的金属(如金、镍或锡)层,并可使用附加的焊接步骤以形成最终产品。
本发明方法制得的线路板可用于制造所有电子设备。
实施例
得到一类Toray WF 80Ⅱ曲面印刷和凸版印刷的印板。按制造商的介绍将其置于一个带负膜的接触真空结构中,所述负膜含有线路试验元件,其线路线/间距对的尺寸为4-32mil。将这些印板固定在“Little Joe”油墨试验机(Little Joe Industries,Belle Mead,NJ)第一段的铝块上,并按制造商介绍施加油墨。
用粘合带将基片(包括聚合物光刻胶和任选的覆盖涂层)粘结在滚动的圆鼓上,使之滚动经过带油墨的印板表面以施加图案。随后固化带油墨的试样。将其置于Fusion UV半敞开处理器中使用Fusion F300W6英寸的D灯以45英尺/分钟的速度对其进行照射。辐照光聚焦在试样平面上。用紫外光辐照试样后,从试样上除去覆盖片,用0.75%NaCO3溶液对光刻胶图象显影约1分钟。在含有185g/l硫酸的100g/l硫酸铜铜电镀浴中以20A/英尺2的电流密度对试样镀铜,总滞留时间为1小时。在45%KOH浴中在约93℃的温度下将聚酰亚胺载体膜蚀刻3分钟,随后约在62℃将光刻胶除在3%KOH中,漂清最终部件并干燥。
使用的油墨包括购自Louis O.Werneke Company(Plymouth,MN)的黑色UV固化的凸版印刷油墨,其配制成具有最小的粒径,以及两种如下配制的常规UV固化的油墨:油墨1油墨2成分来源- 74份 SarboxTMSB500 E50 Sartomer,Total75份 - SarboxTMSB510 E35 Sartomer,Total12份 18份 CDI 15858 CDI Dispersions7份 8份 DarocureTM1173 Ciba Specialty Chemicals5份 - SartomerTM SR506A Sartomer,Total
Claims (7)
1.一种在各个主表面上至少具有一个蚀刻或电镀的细部的挠性印刷线路板的制造方法,它包括下列步骤:
(a)提供包括介电基片和至少一层导电基层的原料,该原料具有两个主表面;
(b)将上面固定地附着有覆盖片的光刻胶层压在所述原料的至少一个主表面上;
(c)将图象印刷在所述覆盖片上。
2.一种挠性印刷线路板的制造方法,在该挠性印刷线路板的每个主表面上带有至少一个蚀刻或电镀的细部,所述方法包括下列步骤:
(a)提供包括介电基片和至少一层导电基层的原料,该原料具有两个主表面;
(b)将光刻胶层压在所述原料的至少一个主表面上,所述光刻胶上带有覆盖片;
(c)除去所述覆盖片;和
(d)将图象直接印刷在所述光刻胶上。
2.如权利要求1或2所述的方法,其特征在于所述印刷是用选自曲面印刷和凸版印刷的连续法完成的。
3.如权利要求1或2所述的方法,其特征在于所述印刷是通过选自胶印平版印刷、轮转凹版印刷和无水平版印刷的方法完成的。
4.如权利要求1或2所述的方法,其特征在于所述印刷是通过选自喷墨打印和静电印刷的方法完成的。
5.如权利要求1或2所述的方法,其特征在于所述原料还包括在介电基片的至少一个表面上的金属氧化物层。
6.如权利要求1或2所述的方法,其特征在于上面带有覆盖片的光刻胶是层压在所述原料的两个主表面上的。
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---|---|---|---|---|
JP3296356B2 (ja) * | 1999-02-08 | 2002-06-24 | 松下電器産業株式会社 | 弾性表面波デバイスとその製造方法 |
US6885564B2 (en) | 2003-02-11 | 2005-04-26 | Honeywell International Inc. | Electronics box having internal circuit cards interconnected to external connectors sans motherboard |
US20050186404A1 (en) * | 2004-02-23 | 2005-08-25 | Guoping Mao | Etched polycarbonate films |
US20090113702A1 (en) * | 2007-11-01 | 2009-05-07 | Western Digital Technologies, Inc. | Disk drive comprising a double sided flex circuit wherein a first side lead provides an etching mask for a second side lead |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3415699A (en) * | 1965-03-29 | 1968-12-10 | Buckbee Mears Co | Production of etched patterns in a continuously moving metal strip |
US3526504A (en) * | 1966-07-07 | 1970-09-01 | Du Pont | Photocrosslinkable elements and processes |
US3448098A (en) * | 1966-09-27 | 1969-06-03 | Merck & Co Inc | Production of guanylic acid |
GB1233401A (zh) * | 1967-06-29 | 1971-05-26 | ||
US3469982A (en) * | 1968-09-11 | 1969-09-30 | Jack Richard Celeste | Process for making photoresists |
GB1429649A (en) * | 1972-06-22 | 1976-03-24 | Agfagevaert | Unsaturated carboxylic esters of hydroxyalkyl carbamates addition polymers derived thereform and photographic silver halide materials containing said polymers |
GB2117670B (en) * | 1982-04-06 | 1985-06-26 | Dainippon Ink & Chemicals | Method for forming a cured resin coating having a desired pattern on the surface of a substrate |
US4853317A (en) * | 1988-04-04 | 1989-08-01 | Microfab Technologies, Inc. | Method and apparatus for serializing printed circuit boards and flex circuits |
US5137791A (en) * | 1990-09-13 | 1992-08-11 | Sheldahl Inc. | Metal-film laminate resistant to delamination |
EP0568841A1 (en) * | 1992-05-07 | 1993-11-10 | E.I. Du Pont De Nemours And Company | Process of photoimaging using ink jet printing |
US5334487A (en) * | 1992-07-23 | 1994-08-02 | International Business Machines Corporation | Method for forming a patterned layer on a substrate |
US5719749A (en) * | 1994-09-26 | 1998-02-17 | Sheldahl, Inc. | Printed circuit assembly with fine pitch flexible printed circuit overlay mounted to printed circuit board |
JP2865578B2 (ja) * | 1994-10-25 | 1999-03-08 | 富士通株式会社 | レジストパターンの作成方法、その方法により得られるプリント配線板及びその作成装置 |
-
1998
- 1998-10-15 US US09/173,325 patent/US6150071A/en not_active Expired - Fee Related
-
1999
- 1999-02-11 AU AU26755/99A patent/AU2675599A/en not_active Abandoned
- 1999-02-11 CN CN99812182A patent/CN1323506A/zh active Pending
- 1999-02-11 EP EP99906972A patent/EP1125479A1/en not_active Withdrawn
- 1999-02-11 CA CA002344826A patent/CA2344826A1/en not_active Abandoned
- 1999-02-11 KR KR1020017004717A patent/KR20010075633A/ko not_active Application Discontinuation
- 1999-02-11 WO PCT/US1999/003062 patent/WO2000022896A1/en not_active Application Discontinuation
- 1999-02-11 JP JP2000576688A patent/JP2002527914A/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100356535C (zh) * | 2002-07-03 | 2007-12-19 | 三井金属矿业株式会社 | 挠性配线基板及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
AU2675599A (en) | 2000-05-01 |
KR20010075633A (ko) | 2001-08-09 |
US6150071A (en) | 2000-11-21 |
EP1125479A1 (en) | 2001-08-22 |
WO2000022896A1 (en) | 2000-04-20 |
CA2344826A1 (en) | 2000-04-20 |
JP2002527914A (ja) | 2002-08-27 |
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