CN1319070C - 多位磁存储元件 - Google Patents

多位磁存储元件 Download PDF

Info

Publication number
CN1319070C
CN1319070C CNB011112263A CN01111226A CN1319070C CN 1319070 C CN1319070 C CN 1319070C CN B011112263 A CNB011112263 A CN B011112263A CN 01111226 A CN01111226 A CN 01111226A CN 1319070 C CN1319070 C CN 1319070C
Authority
CN
China
Prior art keywords
layer
data
separate
layers
data layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB011112263A
Other languages
English (en)
Chinese (zh)
Other versions
CN1316746A (zh
Inventor
M·K·巴塔查里亚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of CN1316746A publication Critical patent/CN1316746A/zh
Application granted granted Critical
Publication of CN1319070C publication Critical patent/CN1319070C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00—Galvanomagnetic devices
    • H10N50/10—Magnetoresistive devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00—Galvanomagnetic devices
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G11C11/161—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect details concerning the memory cell structure, e.g. the layers of the ferromagnetic memory cell
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/56—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
    • G11C11/5607—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency using magnetic storage elements
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C2211/00—Indexing scheme relating to digital stores characterized by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C2211/56—Indexing scheme relating to G11C11/56 and sub-groups for features not covered by these groups
    • G11C2211/561—Multilevel memory cell aspects
    • G11C2211/5615—Multilevel magnetic memory cell using non-magnetic non-conducting interlayer, e.g. MTJ
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C2211/00—Indexing scheme relating to digital stores characterized by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C2211/56—Indexing scheme relating to G11C11/56 and sub-groups for features not covered by these groups
    • G11C2211/561—Multilevel memory cell aspects
    • G11C2211/5616—Multilevel magnetic memory cell using non-magnetic conducting interlayer, e.g. GMR, SV, PSV

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Mram Or Spin Memory Techniques (AREA)
  • Semiconductor Memories (AREA)
  • Hall/Mr Elements (AREA)
  • Thin Magnetic Films (AREA)
CNB011112263A 2000-03-09 2001-03-09 多位磁存储元件 Expired - Lifetime CN1319070C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/522308 2000-03-09
US09/522,308 US6590806B1 (en) 2000-03-09 2000-03-09 Multibit magnetic memory element

Publications (2)

Publication Number Publication Date
CN1316746A CN1316746A (zh) 2001-10-10
CN1319070C true CN1319070C (zh) 2007-05-30

Family

ID=24080344

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB011112263A Expired - Lifetime CN1319070C (zh) 2000-03-09 2001-03-09 多位磁存储元件

Country Status (8)

Country Link
US (1) US6590806B1 (de)
EP (1) EP1132919B1 (de)
JP (1) JP4818523B2 (de)
KR (1) KR20010089201A (de)
CN (1) CN1319070C (de)
DE (1) DE60119199D1 (de)
HK (1) HK1041098A1 (de)
TW (1) TW514914B (de)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6911710B2 (en) * 2000-03-09 2005-06-28 Hewlett-Packard Development Company, L.P. Multi-bit magnetic memory cells
US6576480B2 (en) * 2001-07-26 2003-06-10 Micron Technology, Inc. Structure and method for transverse field enhancement
US6803616B2 (en) 2002-06-17 2004-10-12 Hewlett-Packard Development Company, L.P. Magnetic memory element having controlled nucleation site in data layer
DE10142594A1 (de) * 2001-08-31 2003-03-27 Infineon Technologies Ag Kompensation eines magnetischen Biasfeldes in einer Speicherschicht einer magnetoresistiven Speicherzelle
JP3866567B2 (ja) 2001-12-13 2007-01-10 株式会社東芝 半導体記憶装置及びその製造方法
KR100457158B1 (ko) * 2001-12-26 2004-11-16 주식회사 하이닉스반도체 대칭적인 스위칭 특성을 위한 마그네틱 메모리 셀
US6593608B1 (en) * 2002-03-15 2003-07-15 Hewlett-Packard Development Company, L.P. Magneto resistive storage device having double tunnel junction
TWI222763B (en) * 2002-03-29 2004-10-21 Toshiba Corp Magnetic logic element and magnetic logic element array
US6728132B2 (en) * 2002-04-03 2004-04-27 Micron Technology, Inc. Synthetic-ferrimagnet sense-layer for high density MRAM applications
US6985384B2 (en) * 2002-10-01 2006-01-10 International Business Machines Corporation Spacer integration scheme in MRAM technology
CN101114694A (zh) * 2002-11-26 2008-01-30 株式会社东芝 磁单元和磁存储器
US6667901B1 (en) * 2003-04-29 2003-12-23 Hewlett-Packard Development Company, L.P. Dual-junction magnetic memory device and read method
JP4066361B2 (ja) 2003-07-30 2008-03-26 トヨタ自動車株式会社 燃料電池の冷却システム
US6985385B2 (en) * 2003-08-26 2006-01-10 Grandis, Inc. Magnetic memory element utilizing spin transfer switching and storing multiple bits
JP2005150482A (ja) * 2003-11-18 2005-06-09 Sony Corp 磁気抵抗効果素子及び磁気メモリ装置
US6925000B2 (en) 2003-12-12 2005-08-02 Maglabs, Inc. Method and apparatus for a high density magnetic random access memory (MRAM) with stackable architecture
JP2005310840A (ja) * 2004-04-16 2005-11-04 Toshiba Corp 磁気ランダムアクセスメモリ
US7502248B2 (en) * 2004-05-21 2009-03-10 Samsung Electronics Co., Ltd. Multi-bit magnetic random access memory device
EP1890296B1 (de) 2004-05-21 2010-11-17 Samsung Electronics Co., Ltd. Magnetische Multibit-Speicherzellenvorrichtung mit wahlfreiem Zugriff und Verfahren zum Betrieb und Auslesen derselben
US7436632B2 (en) * 2004-06-30 2008-10-14 Seagate Technology Llc Differential/dual CPP recording head
US7061037B2 (en) * 2004-07-06 2006-06-13 Maglabs, Inc. Magnetic random access memory with multiple memory layers and improved memory cell selectivity
US7075818B2 (en) * 2004-08-23 2006-07-11 Maglabs, Inc. Magnetic random access memory with stacked memory layers having access lines for writing and reading
JP2006093432A (ja) 2004-09-24 2006-04-06 Sony Corp 記憶素子及びメモリ
RU2310928C2 (ru) 2004-10-27 2007-11-20 Самсунг Электроникс Ко., Лтд. Усовершенствованное многоразрядное магнитное запоминающее устройство с произвольной выборкой и способы его функционирования и производства
US20060171197A1 (en) * 2005-01-31 2006-08-03 Ulrich Klostermann Magnetoresistive memory element having a stacked structure
US7173848B2 (en) * 2005-02-01 2007-02-06 Meglabs, Inc. Magnetic random access memory with memory cell stacks having more than two magnetic states
US7379321B2 (en) * 2005-02-04 2008-05-27 Hitachi Global Storage Technologies Netherlands B.V. Memory cell and programmable logic having ferromagnetic structures exhibiting the extraordinary hall effect
KR100647319B1 (ko) 2005-02-05 2006-11-23 삼성전자주식회사 스핀 분극 전류를 이용한 멀티 비트 자기 메모리 소자와그 제조 및 구동 방법
US7285836B2 (en) * 2005-03-09 2007-10-23 Maglabs, Inc. Magnetic random access memory with stacked memory cells having oppositely-directed hard-axis biasing
US7453720B2 (en) * 2005-05-26 2008-11-18 Maglabs, Inc. Magnetic random access memory with stacked toggle memory cells having oppositely-directed easy-axis biasing
US20070253245A1 (en) * 2006-04-27 2007-11-01 Yadav Technology High Capacity Low Cost Multi-Stacked Cross-Line Magnetic Memory
US8183652B2 (en) * 2007-02-12 2012-05-22 Avalanche Technology, Inc. Non-volatile magnetic memory with low switching current and high thermal stability
US8535952B2 (en) * 2006-02-25 2013-09-17 Avalanche Technology, Inc. Method for manufacturing non-volatile magnetic memory
US8058696B2 (en) * 2006-02-25 2011-11-15 Avalanche Technology, Inc. High capacity low cost multi-state magnetic memory
US8084835B2 (en) * 2006-10-20 2011-12-27 Avalanche Technology, Inc. Non-uniform switching based non-volatile magnetic based memory
US8508984B2 (en) * 2006-02-25 2013-08-13 Avalanche Technology, Inc. Low resistance high-TMR magnetic tunnel junction and process for fabrication thereof
US8063459B2 (en) * 2007-02-12 2011-11-22 Avalanche Technologies, Inc. Non-volatile magnetic memory element with graded layer
US8018011B2 (en) * 2007-02-12 2011-09-13 Avalanche Technology, Inc. Low cost multi-state magnetic memory
US20080246104A1 (en) * 2007-02-12 2008-10-09 Yadav Technology High Capacity Low Cost Multi-State Magnetic Memory
US7732881B2 (en) * 2006-11-01 2010-06-08 Avalanche Technology, Inc. Current-confined effect of magnetic nano-current-channel (NCC) for magnetic random access memory (MRAM)
US7388776B1 (en) * 2006-12-22 2008-06-17 Hitachi Global Storage Technologies Netherlands, B.V. Three-dimensional magnetic memory
JP5455313B2 (ja) * 2008-02-21 2014-03-26 株式会社東芝 磁気記憶素子及び磁気記憶装置
US8802451B2 (en) 2008-02-29 2014-08-12 Avalanche Technology Inc. Method for manufacturing high density non-volatile magnetic memory
US9929211B2 (en) * 2008-09-24 2018-03-27 Qualcomm Incorporated Reducing spin pumping induced damping of a free layer of a memory device
US8331141B2 (en) 2009-08-05 2012-12-11 Alexander Mikhailovich Shukh Multibit cell of magnetic random access memory with perpendicular magnetization
US8988934B2 (en) 2010-07-27 2015-03-24 Alexander Mikhailovich Shukh Multibit cell of magnetic random access memory with perpendicular magnetization
US8279662B2 (en) 2010-11-11 2012-10-02 Seagate Technology Llc Multi-bit magnetic memory with independently programmable free layer domains
US8203870B2 (en) 2010-11-23 2012-06-19 Seagate Technology Llc Flux programmed multi-bit magnetic memory
US9047964B2 (en) 2012-08-20 2015-06-02 Qualcomm Incorporated Multi-level memory cell using multiple magnetic tunnel junctions with varying MGO thickness

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5930164A (en) * 1998-02-26 1999-07-27 Motorola, Inc. Magnetic memory unit having four states and operating method thereof
EP0971423A1 (de) * 1998-07-10 2000-01-12 Interuniversitair Micro-Elektronica Centrum Vzw Spin-Valve-Struktur und Herstellungsverfahren

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5936293A (en) * 1998-01-23 1999-08-10 International Business Machines Corporation Hard/soft magnetic tunnel junction device with stable hard ferromagnetic layer
US6278589B1 (en) * 1999-03-30 2001-08-21 International Business Machines Corporation Dual GMR sensor with a single AFM layer

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5930164A (en) * 1998-02-26 1999-07-27 Motorola, Inc. Magnetic memory unit having four states and operating method thereof
EP0971423A1 (de) * 1998-07-10 2000-01-12 Interuniversitair Micro-Elektronica Centrum Vzw Spin-Valve-Struktur und Herstellungsverfahren

Also Published As

Publication number Publication date
EP1132919A2 (de) 2001-09-12
US6590806B1 (en) 2003-07-08
TW514914B (en) 2002-12-21
KR20010089201A (ko) 2001-09-29
EP1132919A3 (de) 2002-08-21
HK1041098A1 (zh) 2002-06-28
CN1316746A (zh) 2001-10-10
JP2001313377A (ja) 2001-11-09
EP1132919B1 (de) 2006-05-03
JP4818523B2 (ja) 2011-11-16
DE60119199D1 (de) 2006-06-08

Similar Documents

Publication Publication Date Title
CN1319070C (zh) 多位磁存储元件
CN1307643C (zh) 具有软基准层的磁阻器件的读取方法
US6593608B1 (en) Magneto resistive storage device having double tunnel junction
US6911710B2 (en) Multi-bit magnetic memory cells
US8178363B2 (en) MRAM with storage layer and super-paramagnetic sensing layer
KR101062160B1 (ko) 복합 자기 프리층을 갖는 자기전자 정보 디바이스
US6728132B2 (en) Synthetic-ferrimagnet sense-layer for high density MRAM applications
US7583529B2 (en) Magnetic tunnel junction devices and magnetic random access memory
US20050167657A1 (en) Multi-bit magnetic memory cells
US7200035B2 (en) Magneto-resistive memory cell structures with improved selectivity
US7425456B2 (en) Antiferromagnetic stabilized storage layers in GMRAM storage devices
CN100356477C (zh) 磁性随机存取存储器、磁性单元、及切换记忆状态的方法
WO2004093103A1 (en) Low switching field magnetic element

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: SAMSUNG ELECTRONICS CO., LTD

Free format text: FORMER OWNER: HEWLETT-PACKARD DEVELOPMENT COMPANY

Effective date: 20071228

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20071228

Address after: Gyeonggi Do, South Korea

Patentee after: Samsung Electronics Co., Ltd.

Address before: California, USA

Patentee before: Hewlett-Packard Co.

REG Reference to a national code

Ref country code: HK

Ref legal event code: WD

Ref document number: 1041098

Country of ref document: HK

CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20070530