CN1315743A - 光学图像传感集成电路的单片规模封装 - Google Patents
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Abstract
公开了光学图像传感器集成电路的一种单片规模封装。微透镜放在一个上面制作了图像传感器的晶片上。一种粘合料放在晶片的顶上。粘合料有与晶片上有微透镜的传感器阵列对齐的开口。然后将一个护罩玻璃放在粘合剂上面,粘合剂被激活后将护罩玻璃与晶片粘着起来。因为粘合剂有开口在有微透镜的部分上面,所以不会有粘合剂引起的畸变或透镜作用的减弱。
Description
本发明涉及到图像传感集成电路,尤其涉及到一个利用一种粘合料(adhesive matrix)进行单片规模封装的方法。
目前,在以前的技术中光学图像传感器器件的单片规模封装要求晶片完全镀上一种光学透明的粘合剂,然后覆盖上一种透明的护罩材料。通常,光学透明的粘合剂可以是一种环氧树脂,而透明材料是玻璃。
但是,几乎所有图像传感器为了满足性能目标都要求应用微透镜来增加光占空系数(optical fill factor)。如图1所示,显示了一种典型的光学传感器单片规模封装。此封装技术包括一个上面制作了图像传感器芯片的晶片101。在晶片101的顶上制作了微透镜103,各自覆盖每个像素(图像单元)。当填料扩展进刻划线后,就加上一个粘合层105,通常采用某种均匀旋转镀膜技术。最后,在粘合剂上加一个护罩玻璃107。粘合层105的作用是将护罩玻璃107紧固在晶片101上。通常,粘合剂是一种环氧树脂。
其次,将晶片101的背面磨光,使晶片更薄。然后用一种晶片锯开操作将伸出的图像传感器电导线暴露在减薄的晶片背面外。接着用传统的沉积和刻蚀过程将暴露的导线伸长形成电接触。最后,用一个模切机器将晶片101切成单个的传感器。
然而,这种以前的单片规模封装方法对图象传感器来说是有问题的,因为微透镜材料的折射率与粘合层105的折射率很相似。这样,粘合层105可能会抵消微透镜103的光学作用。
本发明是光学图象传感器集成电路的一种单片规模封装方法。微透镜放在一个上面有图像传感器的晶片上。一种诸如环氧树脂之类的粘合料放在晶片顶上。粘合料有开口,这些开口与晶片上面的集成电路图像传感阵列对齐。然后将一个护罩玻璃放在粘合料上,激活粘合料将护罩玻璃和晶片紧固在一起。因为粘合剂在微透镜上方有开口,所以粘合剂不会引起畸变。
图1是一种以前的图像传感器集成电路单片规模封装技术。
图2是依照本发明制作的一个粘合料顶视图。
图3是依照本发明制作的一种图像传感器单片规模封装的截面图。
图4是图3所示的单片规模封装的一个顶视图。
按照本发明,用一种粘合料将一个护罩玻璃与一个上面制作了图像传感器的晶片粘着在一起。特别是,参考图2,提供一种粘合料201。粘合料201也可以当作一个预制品。粘合料201包含开口203。开口203制成跟包含微透镜的晶片上的位置相符。
这样,由图4可见,开口203与晶片301顶上制作的微透镜303对齐,并放置在微透镜上。当粘合料201放在晶片301的顶上时,开口203与微透镜303是对齐的。其次,将一个护罩玻璃307加在粘合料201的顶上。注意粘合料201尺寸基本上跟晶片301一样。护罩玻璃307放到粘合料201的顶上之后,用光照、加压和/或加热激活粘合料201。这就导致粘合料201将护罩玻璃307和晶片301紧固在一起。结果在护罩玻璃307和微透镜阵列303之间形成了腔309。图4显示了单片封装的一个顶视图。
此外,从图4可见,用标记数字401显示了图像传感器的外边界。注意透镜阵列303只覆盖了实际的集成电路401的一部分。集成电路401的剩余电路用于信号处理,因此,它没有被微透镜303覆盖。集成电路401的外围区域会被粘合料201的粘合剂毫无不利作用地覆盖。将护罩玻璃307和晶片301粘着起来后,按照以前的技术,晶片301将进一步处理,切片产生单个的集成电路器件。
使粘合料具有不覆盖微透镜传感阵列的开口,以前的技术中遇到的环氧树脂抵消微透镜的光学作用的问题就可以避免了。换句话说,在微透镜上形成了不包含粘合剂的一个腔室。这允许微透镜工作时不会受到粘合剂的干扰。
确实,利用粘合料201形成的腔室309还可以实现其他好处。例如,腔室309可以填充气态或液态材料,进一步增强光学特性、温度特性或成像传感器的其他性能。在腔室中填充气体或液体材料可以在加护罩玻璃307之前进行。例如,一种折射率小于1的气态或液态材料可以进一步增强微透镜的光学特性。此外,具有良好散热特性的气态或液态材料可以用来散发掉图像传感器产生的热量,从而增加图像器件的性能。最后,粘合剂材料可以做成不透明的,以增强器件的性能。
本发明的上述实施例的描述并不是想穷尽无遗,或将本发明限制为公开的这些精确形式。虽然这里描述的本发明的实施例和实例是为了举例说明,但各种等价修改在本发明的范围内是有可能的,那些熟识相关行业的人士将会认可这一点。例如,粘合料201的尺寸可以变,以适应晶片301的尺寸。此外,开口203的尺寸可以变,以便与晶片301上制成的图像传感器中包含的微透镜阵列的尺寸相符。按照上面的详细描述可以对本发明进行这些修改。下面的权利要求中采用的术语不应当解释成将本发明限制为在说明书和权利要求中公开的特定实施例。更确切地说,本发明的范围完全由下列权利要求确定,这些权利要求将按照已制定的权利要求解释准则进行解释。
例如,不是用一个粘合剂预制品构成腔室,而是用液体配料设备或与丝印相似的技术将粘合剂加到所要求的图案里。
Claims (4)
1、一种方法,包括:
将微透镜加到一个晶片上,上述晶片包括多个图像传感器集成电路,上述微透镜加到上述图像传感器集成电路的一个传感阵列部分上;
将一种粘合料加到上述晶片的顶上,上述粘合料包括多个开口,当上述粘合料加到上述晶片上时这些开口的位置与上述传感阵列部分对应;并且
将一个护罩玻璃加到上述粘合料的顶上。
2、权利要求1所述的方法,进一步包括将上述粘合料激活从而将上述护罩玻璃与上述晶片束缚在一起的步骤。
3、一种单片规模封装,包括:
一个包含多个图像传感器集成电路的晶片,上述晶片有微透镜加在上面,每个图像传感器集成电路有一组微透镜;
加到上述晶片上的一种粘合料,上述粘合料具有与上述微透镜的位置对应的开口;并且
加到上述粘合料上的一个护罩玻璃,上述粘合料将上述护罩玻璃与上述晶片紧固在一起。
4、一种单片规模封装,包括:
一个包含多个图像传感器的晶片,每个图像传感器有一个传感区,上述晶片有加在上面的微透镜,每个图象传感器有一组微透镜;
加到上述晶片上的一种粘合料,上述粘合料有与上述传感区的位置对应的开口;并且
加到上述粘合料上的一个护罩玻璃,上述粘合料将上述护罩玻璃与上述晶片紧固在一起。
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US09/536890 | 2000-03-28 | ||
US09/536,890 US6285064B1 (en) | 2000-03-28 | 2000-03-28 | Chip scale packaging technique for optical image sensing integrated circuits |
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CN1182588C CN1182588C (zh) | 2004-12-29 |
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- 2000-12-13 EP EP00311102A patent/EP1139435B1/en not_active Expired - Lifetime
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2001
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CN1294634C (zh) * | 2003-03-25 | 2007-01-10 | 富士胶片株式会社 | 固态成像装置及其制造方法 |
CN100454563C (zh) * | 2003-05-30 | 2009-01-21 | 佳能株式会社 | 固态图像传感装置及其制造方法 |
CN100495689C (zh) * | 2004-01-06 | 2009-06-03 | 飞思卡尔半导体公司 | 包装光学传感器的方法和图像传感器装置 |
CN101359643B (zh) * | 2007-07-30 | 2010-06-02 | 日月光半导体(上海)股份有限公司 | 封装基板及其制造方法 |
Also Published As
Publication number | Publication date |
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US6285064B1 (en) | 2001-09-04 |
EP1139435A2 (en) | 2001-10-04 |
EP1139435A3 (en) | 2004-08-11 |
CN1182588C (zh) | 2004-12-29 |
TW465054B (en) | 2001-11-21 |
EP1139435B1 (en) | 2011-06-15 |
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