CN108351966A - 光学指纹传感器封装 - Google Patents
光学指纹传感器封装 Download PDFInfo
- Publication number
- CN108351966A CN108351966A CN201680067295.1A CN201680067295A CN108351966A CN 108351966 A CN108351966 A CN 108351966A CN 201680067295 A CN201680067295 A CN 201680067295A CN 108351966 A CN108351966 A CN 108351966A
- Authority
- CN
- China
- Prior art keywords
- optical
- substrate
- image sensor
- light
- sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1329—Protecting the fingerprint sensor against damage caused by the finger
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Human Computer Interaction (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
Description
Claims (24)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201562220712P | 2015-09-18 | 2015-09-18 | |
US62/220712 | 2015-09-18 | ||
PCT/US2016/052553 WO2017049318A1 (en) | 2015-09-18 | 2016-09-19 | Optical fingerprint sensor package |
Publications (1)
Publication Number | Publication Date |
---|---|
CN108351966A true CN108351966A (zh) | 2018-07-31 |
Family
ID=58283040
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201680067295.1A Pending CN108351966A (zh) | 2015-09-18 | 2016-09-19 | 光学指纹传感器封装 |
Country Status (4)
Country | Link |
---|---|
US (1) | US10185866B2 (zh) |
KR (1) | KR102459731B1 (zh) |
CN (1) | CN108351966A (zh) |
WO (1) | WO2017049318A1 (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020030130A1 (zh) * | 2018-08-10 | 2020-02-13 | 京东方科技集团股份有限公司 | 指纹识别面板及识别指纹的方法和指纹识别装置 |
CN110909720A (zh) * | 2019-12-18 | 2020-03-24 | 京东方科技集团股份有限公司 | 一种彩膜基板、显示面板及显示装置 |
CN111128897A (zh) * | 2019-12-30 | 2020-05-08 | 济南海马机械设计有限公司 | 一种光电探测器 |
CN111277739A (zh) * | 2020-02-14 | 2020-06-12 | Oppo广东移动通信有限公司 | 感光组件、镜头模组及电子设备 |
WO2022047761A1 (zh) * | 2020-09-06 | 2022-03-10 | 深圳市汇顶科技股份有限公司 | 芯片加工方法、系统、芯片和设备 |
Families Citing this family (36)
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EP2908341B1 (en) * | 2014-02-18 | 2018-07-11 | ams AG | Semiconductor device with surface integrated focusing element |
US10043847B2 (en) * | 2014-08-26 | 2018-08-07 | Gingy Technology Inc. | Image capturing module and electrical apparatus |
US10713521B2 (en) | 2016-08-05 | 2020-07-14 | Gingy Technology Inc. | Image capturing apparatus and manufacturing method thereof |
US10732771B2 (en) | 2014-11-12 | 2020-08-04 | Shenzhen GOODIX Technology Co., Ltd. | Fingerprint sensors having in-pixel optical sensors |
US10437974B2 (en) | 2015-06-18 | 2019-10-08 | Shenzhen GOODIX Technology Co., Ltd. | Optical sensing performance of under-screen optical sensor module for on-screen fingerprint sensing |
KR101928319B1 (ko) | 2015-06-18 | 2018-12-12 | 선전 구딕스 테크놀로지 컴퍼니, 리미티드 | 광 감지 능력을 가지는 다기능 지문 센서 |
US10410037B2 (en) | 2015-06-18 | 2019-09-10 | Shenzhen GOODIX Technology Co., Ltd. | Under-screen optical sensor module for on-screen fingerprint sensing implementing imaging lens, extra illumination or optical collimator array |
CN107004130B (zh) | 2015-06-18 | 2020-08-28 | 深圳市汇顶科技股份有限公司 | 用于屏幕上指纹感应的屏幕下光学传感器模块 |
US10410033B2 (en) | 2015-06-18 | 2019-09-10 | Shenzhen GOODIX Technology Co., Ltd. | Under-LCD screen optical sensor module for on-screen fingerprint sensing |
US10002281B2 (en) * | 2015-07-09 | 2018-06-19 | Gingy Technology Inc. | Fingerprint identification module |
US10489631B2 (en) | 2015-07-09 | 2019-11-26 | Gingy Technology Inc. | Biometric identification module |
TWI547884B (zh) * | 2015-07-09 | 2016-09-01 | 金佶科技股份有限公司 | 指紋辨識模組 |
TW201721492A (zh) * | 2015-12-10 | 2017-06-16 | 台瀚科技股份有限公司 | 三明治式指紋辨識裝置 |
CN105893992A (zh) * | 2016-05-31 | 2016-08-24 | 京东方科技集团股份有限公司 | 指纹识别结构和方法、显示装置 |
US20180039811A1 (en) * | 2016-08-05 | 2018-02-08 | Gingy Technology Inc. | Biometric apparatus |
US10073288B2 (en) * | 2016-10-07 | 2018-09-11 | Keycore Technology Corp. | Liquid crystal module with fingerprint identification function |
US10073305B2 (en) * | 2016-10-07 | 2018-09-11 | Keycore Technology Corp. | Liquid crystal device with fingerprint identification function |
US20180144180A1 (en) * | 2016-11-18 | 2018-05-24 | Keycore Technology Corp. | Fingerprint identification module |
CN206602107U (zh) * | 2016-11-23 | 2017-10-31 | 创智能科技股份有限公司 | 指纹感测辨识封装结构 |
US10614283B2 (en) | 2017-03-07 | 2020-04-07 | Shenzhen GOODIX Technology Co., Ltd. | Devices with peripheral task bar display zone and under-LCD screen optical sensor module for on-screen fingerprint sensing |
KR101910518B1 (ko) | 2017-04-11 | 2018-10-22 | 삼성전자주식회사 | 생체 센서 및 생체 센서를 포함하는 장치 |
TWI659367B (zh) * | 2017-05-24 | 2019-05-11 | 義隆電子股份有限公司 | 電子裝置及其影像擷取模組 |
US10331939B2 (en) * | 2017-07-06 | 2019-06-25 | Shenzhen GOODIX Technology Co., Ltd. | Multi-layer optical designs of under-screen optical sensor module having spaced optical collimator array and optical sensor array for on-screen fingerprint sensing |
KR102448682B1 (ko) | 2017-09-25 | 2022-09-29 | 삼성전자주식회사 | 지문인식 패키지 및 그 제조방법 |
CN108124467A (zh) * | 2017-12-27 | 2018-06-05 | 深圳信炜科技有限公司 | 抗混叠成像元件以及光学式传感器的制备方法 |
US10216975B1 (en) * | 2018-02-23 | 2019-02-26 | Shenzhen GOODIX Technology Co., Ltd. | Optical imaging via imaging lens and imaging pinhole in under-screen optical sensor module for on-screen fingerprint sensing in devices having organic light emitting diode (OLED) screens or other screens |
WO2020017858A1 (ko) * | 2018-07-17 | 2020-01-23 | 주식회사 엘지화학 | 광학식 지문인식 시스템 및 이를 포함하는 모바일 기기 |
KR102593949B1 (ko) | 2018-07-25 | 2023-10-27 | 삼성전자주식회사 | 이미지 센서 |
CN111436209A (zh) * | 2018-11-12 | 2020-07-21 | 深圳市汇顶科技股份有限公司 | 一种光学传感装置和终端 |
CN210605745U (zh) * | 2018-12-13 | 2020-05-22 | 深圳市汇顶科技股份有限公司 | 指纹识别装置和电子设备 |
KR20200076937A (ko) | 2018-12-20 | 2020-06-30 | 삼성전자주식회사 | 후면조사형 이미지 센서 및 이를 포함하는 전자 기기 |
KR102386104B1 (ko) | 2018-12-21 | 2022-04-13 | 삼성전자주식회사 | 후면조사형 이미지 센서 및 이를 포함하는 전자 기기 |
CN111860452B (zh) * | 2019-02-02 | 2022-03-04 | 深圳市汇顶科技股份有限公司 | 指纹识别装置和电子设备 |
KR102393910B1 (ko) * | 2019-03-22 | 2022-05-03 | 아크소프트 코포레이션 리미티드 | 타일형 이미지 센서 |
US11637211B2 (en) * | 2021-02-02 | 2023-04-25 | Rockwell Collins, Inc. | Optically clear thermal spreader for status indication within an electronics package |
EP4334904A1 (en) * | 2021-05-04 | 2024-03-13 | Fingerprint Cards Anacatum IP AB | Optical fingerprint sensor comprising a diffractive element |
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US20030103686A1 (en) * | 2001-12-04 | 2003-06-05 | Canon Kabushiki Kaisha | Image input device |
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US20110298715A1 (en) * | 2010-06-04 | 2011-12-08 | Sae Magnetics (H.K.) Ltd. | Optical navigation apparatus |
US20120321149A1 (en) * | 2011-05-17 | 2012-12-20 | Carver John F | Fingerprint sensors |
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-
2016
- 2016-09-19 WO PCT/US2016/052553 patent/WO2017049318A1/en active Application Filing
- 2016-09-19 KR KR1020187007711A patent/KR102459731B1/ko active IP Right Grant
- 2016-09-19 CN CN201680067295.1A patent/CN108351966A/zh active Pending
- 2016-09-19 US US15/269,901 patent/US10185866B2/en active Active
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US20030103686A1 (en) * | 2001-12-04 | 2003-06-05 | Canon Kabushiki Kaisha | Image input device |
US20090166784A1 (en) * | 2006-09-15 | 2009-07-02 | Fujitsu Microelectronics Limited | Semiconductor device and method for fabricating semiconductor device |
CN101930323A (zh) * | 2009-06-18 | 2010-12-29 | 安华高科技Ecbuip(新加坡)私人有限公司 | 具有光导膜的光学指纹导航装置 |
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Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020030130A1 (zh) * | 2018-08-10 | 2020-02-13 | 京东方科技集团股份有限公司 | 指纹识别面板及识别指纹的方法和指纹识别装置 |
CN110826373A (zh) * | 2018-08-10 | 2020-02-21 | 京东方科技集团股份有限公司 | 指纹识别面板及识别指纹的方法和指纹识别装置 |
CN110826373B (zh) * | 2018-08-10 | 2022-10-11 | 京东方科技集团股份有限公司 | 指纹识别面板及识别指纹的方法和指纹识别装置 |
US11651615B2 (en) | 2018-08-10 | 2023-05-16 | Boe Technology Group Co., Ltd. | Fingerprint identification panel, fingerprint identification method and fingerprint identification device |
CN110909720A (zh) * | 2019-12-18 | 2020-03-24 | 京东方科技集团股份有限公司 | 一种彩膜基板、显示面板及显示装置 |
CN110909720B (zh) * | 2019-12-18 | 2023-08-25 | 京东方科技集团股份有限公司 | 一种彩膜基板、显示面板及显示装置 |
CN111128897A (zh) * | 2019-12-30 | 2020-05-08 | 济南海马机械设计有限公司 | 一种光电探测器 |
CN111128897B (zh) * | 2019-12-30 | 2021-11-05 | 江苏大摩半导体科技有限公司 | 一种光电探测器 |
CN111277739A (zh) * | 2020-02-14 | 2020-06-12 | Oppo广东移动通信有限公司 | 感光组件、镜头模组及电子设备 |
WO2022047761A1 (zh) * | 2020-09-06 | 2022-03-10 | 深圳市汇顶科技股份有限公司 | 芯片加工方法、系统、芯片和设备 |
Also Published As
Publication number | Publication date |
---|---|
US10185866B2 (en) | 2019-01-22 |
WO2017049318A1 (en) | 2017-03-23 |
KR20180043307A (ko) | 2018-04-27 |
US20170083745A1 (en) | 2017-03-23 |
KR102459731B1 (ko) | 2022-10-28 |
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