CN1286737A - 真空绝缘板 - Google Patents
真空绝缘板 Download PDFInfo
- Publication number
- CN1286737A CN1286737A CN98813181A CN98813181A CN1286737A CN 1286737 A CN1286737 A CN 1286737A CN 98813181 A CN98813181 A CN 98813181A CN 98813181 A CN98813181 A CN 98813181A CN 1286737 A CN1286737 A CN 1286737A
- Authority
- CN
- China
- Prior art keywords
- isocyanate
- reactive
- insulation panel
- plate
- compressed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Abstract
生产真空绝缘板的方法,包括将开孔(半)硬质绝缘泡沫包封在基本不透气的弹性容器中、整体抽真空并密封的步骤,其中在抽真空并密封期间或之后将该板压缩至其压缩前初始厚度的10—90%。
Description
本发明涉及真空绝缘板、其生产方法及其在绝热方面的应用。
真空绝缘板及其生产方法是已知的。
具有降低的内压力的真空绝缘板已知可用于各种应用,包括用于制冷设备中,绝缘板可大大提高设备箱内部的绝热程度。
这种真空绝缘板一般包括低传热系数的填充材料和由包封该填料的气密膜形成的容器,将其整体抽真空至内压约为5mbar或更小并随后进行密封。除了绝缘功能外,填料还具有支撑容器表面以使其在抽真空时不塌陷的功能。
用于这种真空绝缘板的已知填充材料包括细分的无机粉末如锻制氧化硅、石英粉尘、沉淀氧化硅、沉淀氧化硅/飞尘混合物、矾土、细珍珠岩和玻璃纤维。日本公开特开公报133870/82还建议使用开孔的有机泡沫材料作为真空绝缘板中的芯层材料,例如开孔硬质聚氨酯泡沫(见欧洲专利0498628和0188806)。
WO 97/27986描述了一种用开孔硬质绝缘泡沫填充的真空绝缘板的绝热性能的改进方法。该方法包括将开孔硬质泡沫压缩到其压缩前初始厚度的40-90%,将此压缩泡沫放入一个容器中,对此容器抽空至部分真空或几乎完全真空并将此容器密封。通过压缩泡沫提高了泡沫每单位厚度的绝缘性能。
但是根据WO 97/27986所述方法压缩的真空板不完全平整,板表面有许多皱折。当板在冷冻装置的箱中进行原地发泡时这会引起气夹。
因此本发明的一个目的是提供包含具有改进绝热性能的开孔绝缘泡沫材料的真空绝缘板。
本发明的另一个目的是提供包含开孔绝缘泡沫材料的真空绝缘板,该板具有非常平的表面,没有或几乎没有皱折。
根据本发明提供了包含开孔绝缘泡沫材料的真空绝缘板,该板在制成后被压缩至其压缩前初始厚度的10-90%。
本发明的压缩真空绝缘板比未压缩板具有更低的传热系数。此外该板几乎是平的并且板表面没有或几乎没有皱折。这使此板更易于粘贴到被隔离元件的侧面。
加热时该板还显示了改进的尺寸稳定性,这在将板包封在绝缘泡沫材料里的过程中是有利的。在包封过程中板要经历短时高温(一般为约80℃)。
本发明的真空绝缘板是通过将开孔绝缘泡沫材料包封在基本不透气的弹性容器中、整体抽空并密封而制成的,其中在抽空和密封期间或其后板被压缩至其初始厚度的10-90%。
优选压缩在抽空和密封之后进行,但也可与抽空和密封同时进行。板被压缩至其初始厚度的10-90%,优选为其初始厚度的20-80%,更优选为其初始厚度的40-60%,最优选约为其初始厚度的50%。压缩可通过任何本领域已知的方法如置于相对的平行板或相对的辊之间而完成。压缩可作为连续生产过程的一部分在线进行或者可在各个板上脱机进行。
压缩通常在室温进行,但10-150℃之间的任何温度均可使用。优选温度为20-120℃,最优选为70-100℃。压缩板时进行加热甚至还可改进表面的外观和平整度。
用作本发明真空绝缘板填料的适宜绝缘泡沫材料为开孔有机发泡材料。泡沫材料的开孔含量至少为70%,优选至少为90%,且最优选至少为95%。泡沫优选尽可能接近完全开孔或100%开孔。
泡沫(压缩前)密度优选为16-250kg/m3,且最优选为25-100kg/m3。密度将随压缩程度而成比例增加。
用作绝缘泡沫材料的开孔有机发泡材料可衍生自下列材料:聚氨酯、聚苯乙烯、聚乙烯、丙烯酸类树脂、酚醛树脂类树脂(如苯酚甲醛树脂)、卤代聚合物如聚氯乙烯。
在本发明中最优选开孔硬质聚氨酯和氨基甲酸酯改性的聚异氰脲酸酯泡沫塑料。
开孔硬质聚氨酯和氨基甲酸酯改性的聚异氰脲酸酯泡沫塑料一般是通过在泡孔开孔剂存在下使适当的有机多异氰酸酯和多官能团异氰酸酯反应性化合物反应而制备的。制备开孔硬质聚氨酯泡沫的配方实例描述于欧洲专利0498628,0547515,0188806和PCT专利95/02620中。
用于制备开孔硬质聚氨酯泡沫的适宜有机多异氰酸酯包括任何制备硬质聚氨酯或氨基甲酸酯改性的聚异氰脲酸酯泡沫领域已知的任一有机多异氰酸酯,且特别是芳族多异氰酸酯如以其2,4’-,2,2’-和4,4’-异构体及其混合物形式存在的二苯基甲烷二异氰酸酯;二苯基甲烷二异氰酸酯(MDI)及其低聚物的混合物,在本领域中已知为“粗”或“聚合”MDI(聚亚甲基聚亚苯基多异氰酸酯),异氰酸酯官能度大于2;以其2,4-和2,6-异构体及其混合物形式存在的甲苯二异氰酸酯;1,5-萘二异氰酸酯和1,4-二异氰酸根合苯。特别要提到的是所谓的MDI变异体(通过引入氨基甲酸酯、脲基甲酸酯、脲、缩二脲、碳化二亚胺、uretonimine或异氰脲酸酯残基而改性的二苯基甲烷二异氰酸酯)。可提到的其它有机多异氰酸酯包括脂族二异氰酸酯如异佛尔酮二异氰酸酯、1,6-二异氰酸根合己烷和4,4’-二异氰酸根合二环己基甲烷。
用于制备开孔硬质聚氨酯泡沫塑料的多官能团异氰酸酯反应性组合物包括任何制备硬质聚氨酯或氨基甲酸酯改性的聚异氰脲酸酯泡沫领域已知的那些。对于制备硬质泡沫塑料特别重要的是多元醇和多元醇混合物,其平均羟值为300-1000,特别为300-700mg KOH/g,并且羟基官能度为2-8,特别为3-8。适宜的多元醇已在现有技术中有详细描述,它包括烯化氧如环氧乙烷和/或环氧丙烷与每分子中含有2-8个活性氢原子的引发剂的反应产物。适宜的引发剂包括多元醇,例如甘油、三羟甲基丙烷、三乙醇胺、季戊四醇、山梨糖醇和蔗糖;多元胺,例如乙二胺、甲苯二胺、二氨基二苯基甲烷和聚亚甲基聚亚苯基多元胺;氨基醇,例如乙醇胺和二乙醇胺;以及这些引发剂的混合物。其它适宜的聚合多元醇包括通过适当比例的二醇和更高官能度的多元醇与二元羧酸缩合而获得的聚酯。同样适宜的聚合多元醇包括羟基封端的聚硫醚、聚酰胺、聚酯酰胺、聚碳酸酯、聚缩醛、聚烯烃和聚硅氧烷。
进行反应的多异氰酸酯组合物和多官能团异氰酸酯反应性组合物的量将依赖于要生产的硬质聚氨酯或氨基甲酸酯改性的聚异氰脲酸酯泡沫的性质而定并且易于由本领域技术人员确定。
一般使用70-140的异氰酸酯指数制备开孔硬质聚氨酯泡沫,但如果需要,可使用更低的指数。更高的指数,例如150-500甚至高达3000可与三聚作用催化剂联用制备含有异氰脲酸酯键的泡沫塑料。
开孔硬质聚氨酯泡沫塑料的制备可在任何制备硬质聚氨酯或氨基甲酸酯改性的聚异氰脲酸酯泡沫塑料领域已知的发泡剂存在下进行。这种发泡剂包括水或其它放出二氧化碳的化合物或在大气压下沸点高于-70℃的惰性低沸点化合物。
可以已知方式选择用作发泡剂的水的量以提供所要求密度的泡沫塑料,典型用量为每100重量份反应组分为0.05-5重量份,尽管在本发明的特殊实施方案中可引入最多10wt%或甚至高达20wt%的水。
适宜的惰性发泡剂包括例如烃、二烷基醚、烷羧酸烷基酯、脂族和脂环氢氟碳、氢氯氟碳、氯氟烃和含氟醚。适宜的烃发泡剂包括低级脂族或脂环族烃如正戊烷、异戊烷、环戊烷、新戊烷、己烷和环己烷。
为了获得低压时的低传热系数值,可以使用具有降低了孔尺寸(50-150微米)(压缩前)的开孔硬质聚氨酯泡沫塑料。这些小孔开孔硬质聚氨酯泡沫塑料可通过空气成核作用或者通过向形成泡沫塑料的混合物中加入基本不溶的有机化合物而获得。
空气成核作用即是在混合泡沫组分之前在一种或两种泡沫组分中使用分散非常精细的气泡(<10μm)并随后形成泡沫。这些气泡可获得更精细的泡沫。
有机液体在反应混合物中的不溶性通常表现为不溶于一种或多种主要的泡沫配制物成分,特别是不溶于异氰酸酯反应性材料和/或多异氰酸酯。
在这些材料中的溶解度可通过常规技术测定。对于不溶性有机液体此处所用术语“不溶”定义为其在要与之共混的异氰酸酯反应性组合物或者多异氰酸酯组合物中的溶解度,在25℃大气压下小于500ppm。
不溶性有机液体的实例包括氟化的化合物,特别是基本氟化或全氟化的化合物。
此处所用基本氟化的化合物定义为其中至少75%,优选至少90%且最优选至少99%的氢原子已被氟原子取代。
用于制备小孔开孔硬质聚氨酯泡沫的不溶氟化的化合物包括US4981897,US 5034424,US 4972002,EP 0508649,EP 0498628,WO95/18176中所描述的任意一个。
适宜的化合物包括基本氟化或全氟化的烃、基本氟化或全氟化的醚、基本氟化或全氟化的叔胺、基本氟化或全氟化的氨基醚和基本氟化或全氟化的砜。
基本氟化或全氟化烃的适宜实例为含有1-15个碳原子的那些,可以是环状或非环状的、芳族或脂族的以及饱和或不饱和的,如基本氟化或全氟化的甲烷、乙烷、丙烷、丁烷、戊烷、己烷、庚烷、辛烷、壬烷、癸烷、环丁烷、环辛烷、环己烷、环戊烷、环庚烷、降冰片二烯、萘烷、二甲基环丁烷、甲基环己烷、1-甲基萘烷、菲、二甲基环己烷、及其异构体和全氟(环)烯烃如六氟丙烯的二聚体和三聚体。特别要提到的是全氟戊烷和全氟己烷及全氟(4-甲基-2-戊烯)的各种异构体。
基本氟化或全氟化的醚的具体实例包括:全氟丁基四氢呋喃和全氟丙基四氢呋喃。
基本氟化或全氟化的氨基醚的具体实例包括全氟N-(C1-6烷基)吗啉如N-甲基、N-乙基和N-异丙基吗啉。
为了确保没有臭氧损耗的可能性,优选使用不含其它卤原子的氟化的化合物。
适用于制备小孔开孔硬质聚氨酯泡沫塑料的某些不溶性有机液体在发泡反应的条件下本身可作为发泡剂,特别是当其沸点低于反应混合物所产生的放热温度时。毫无疑问,这些材料除了行使不溶性有机液体的功能外还可部分或完全行使发泡剂的功能。
用于制备小孔开孔硬质聚氨酯泡沫塑料的不溶性有机液体的用量占总反应体系的0.05-10wt%,优选0.1-5wt%,最优选0.6-2.3wt%。
基本不溶的有机液体通常是以在一种主要组分(即异氰酸酯反应性组分和/或多异氰酸酯组分)中的乳液或优选微乳液形式加入到发泡反应混合物中的。这种乳液或微乳液可通过使用常规技术和适当的乳化剂来制备。
适于制备在有机多异氰酸酯和/或异氰酸酯反应性化合物中氟化液体化合物稳定的乳液或微乳液的乳化剂包括选自非离子、离子(阴离子或阳离子)和两性表面活性剂的表面活性剂。用于乳化异氰酸酯反应性组合物中氟化液体化合物的优选表面活性剂为氟表面活性剂、有机硅表面活性剂和/或烷氧基化烷烃。
所用乳化剂的量为每100pbw发泡反应体系为0.02-5pbw,以及每100pbw多异氰酸酯或多元醇组合物为0.05-10pbw。
除了多异氰酸酯和多官能团异氰酸酯反应性组合物、发泡剂及任选的不溶性有机液体外,发泡反应混合物通常还包括一种或多种用于生产开孔硬质聚氨酯和氨基甲酸酯改性的多异氰尿酸酯泡沫的配方所常用的其它助剂或添加剂。这些任选的添加剂包括交联剂,例如低分子量多元醇如三乙醇胺;泡沫稳定剂或表面活性剂,例如硅氧烷-氧化烯烃共聚物;氨基甲酸酯催化剂,例如锡化合物如辛酸亚锡或二月桂酸二丁基锡;阻燃剂,例如磷酸卤代烷基酯如三氯丙基磷酸酯或膦酸烷基酯;红外衰减剂如碳黑;及泡孔开孔剂如聚合物颗粒(如聚合物多元醇);不相容液体如溶剂或多元醇;无机填料如膨润土、硅石颗粒(特别是锻制氧化硅)、金属薄片以及硬脂酸酯。
制备开孔硬质聚氨酯和氨基甲酸酯改性的多异氰脲酸酯泡沫塑料的特别优选方法包括使有机多异氰酸酯与异氰酸酯反应性材料在发泡促进剂存在下进行反应的步骤,发泡促进剂为下式的异氰酸酯反应性环状化合物:其中Y为O或NR1,其中每一个R1独立地为C1-C6低级烷基基团或用异氰酸酯反应性基团取代的低级烷基基团;每一个R独立地为氢、C1-C6低级烷基基团或(CH2)m-X,其中X为异氰酸酯反应性基团,其为OH或NH2,以及m为0,1或2;并且
n为1或2;
条件是R1或R中至少一个为或包括异氰酸酯反应性基团。
Y为O的式(Ⅰ)优选化合物为异氰酸酯反应性环状碳酸酯,其为甘油碳酸酯。Y为NR1的式(Ⅰ)优选化合物为下式的异氰酸酯反应性环状脲:
异氰酸酯反应性环状发泡促进剂的用量占总异氰酸酯反应性材料的1-99wt%,优选1-60wt%。
该方法的进一步细节描述于EP 498628,EP 498629,EP 662494,WO95/02620,WO 96/25455,WO 96/36655中(在此全部引入作为参考)。
在进行制备开孔硬质聚氨酯泡沫塑料的过程中,已知的一步法、预聚物或半预聚物技术可与常规的混合方法共同使用并且可以下列形式生产硬质泡沫:块状泡沫塑料、模塑物、模腔充料、喷发泡沫塑料、充气喷沫泡沫或与其它材料如硬纸板、石膏板、纸张、塑料或金属的层压板。
对真空绝缘板构造及其在热设备中应用的一般性描述可见美国专利5,066,437,5,032,439和5,076,984及欧洲专利434266,434225和181778,在此全部引入这些专利及其中提到的文献作为参考。
适宜的包封容器需要是高度不透气性的,因为容器的透气速率直接影响热泄漏的发生和所得真空绝缘板的绝热效率以及该板的运行寿命。而且它们应能防止通过传导或辐射而进行的热传递,应易于通过热封进行密封并且优选是弹性的。
适于作为容器的材料包括诸如聚酯、聚偏氯乙烯、聚丙烯和聚乙烯醇等塑料。优选将塑料薄膜蒸汽沉积上金属薄膜或层压上金属箔以提供更好的耐真空泄漏防护。塑料袋还可包括由较低熔点(低于200℃)的热塑性树脂组成的热塑性热封层。适宜的热塑性塑料的实例包括聚烯烃,如低密度聚乙烯、高密度聚乙烯和聚丙烯、聚丙烯腈、聚偏氯乙烯及其共聚物,和聚胺,如尼龙11和尼龙12,或类似的合成树脂。对于在塑料膜上沉积的金属膜或与塑料膜层压的箔,可以使用金属如铝、钛、铅、铁及其合金或锡及其合金,如锡与锑、铋和铜或其混合物的合金。优选薄铝箔层压板。
在将绝缘填充材料置于气密包封容器之前优选对其进行预处理。
该预处理包括加热,并且任选优选在减压条件下搅动填充材料以从填料表面除去污染物。除去填料污染物尤其改进了预期的板寿命。除去污染物还减少了抽空容器所需要的时间,由此减少了与生产真空绝缘板相关的时间和费用。
为了改进真空绝缘板的性能,在密封板中提供材料以吸收或与气体或蒸汽反应的,气体或蒸汽是由于抽真空不完全而保留的、从外界大气渗透到封装中的、或是从聚氨酯泡沫填料本身放出的。这些材料已知为吸气剂并且可包括例如在除去水蒸汽方面表现优异的颗粒状硫酸钙或微孔状氧化钡、去除有机气体的活性炭、吸收氧和氮的金属及吸收二氧化碳和氮的沸石。其它适宜的吸气剂材料描述于美国专利4,000,246,4,444,821,4,663,551,4,702,986,5,191,980,5,312,606,5,312,607和4,726,974,WO 93/25843及欧洲专利434266和181778中。
冷冻设备只是可利用真空绝缘板的产品的一个例子。它们还可形成绝缘建筑板部件。其它具有一个热面和一个冷面的环境也可从本发明的应用中获益,例如热水器。
真空绝缘板可以很容易地装在冷冻装置的门和壁中。一般用粘结合剂将它们粘结在要绝缘的热装置壁上并随后用液体有机材料如聚氨酯原地发泡。聚氨酯泡沫塑料帮助绝缘板固定在器壁之间并且还提供额外的绝缘功能。
通过下列实施例说明但不限制本发明。
实施例1
通过将开孔硬质聚氨酯泡沫和吸气剂包封在用薄铝箔层压的塑料薄膜中,将其整体抽真空至内压为0.05mbar并整体密封而制成真空绝缘板。该板尺寸为274mm×247mm,初始厚度为30.4mm。该板的初始密度为45.3kg/m3。该板的初始导热系数为5.6mW/mK。
在20℃于压机中将该板压缩至厚度为20.6mm,对应密度为66.8kg/m3。该压缩板的导热系数为4.4mW/mK。
将该板进一步压缩至厚度为15.2mm,对应密度为90.5kg/m3。该压缩板的导热系数为4.1mW/mK。
该压缩板是平的并且几乎没有皱折(见图1)。对比例2
将实施例1中的开孔硬质聚氨酯泡沫塑料压缩至厚度为15.6mm,对应密度为88.2kg/m3,并随后与和上面实施例1相同的吸气剂一起包封在与上面实施例1同样类型的薄膜中,抽真空并密封。该压缩板的导热系数为4.3mW/mK。
但是该压缩板的表面不平并且有许多皱折(见图2)。
实施例3
通过将开孔硬质聚氨酯泡沫塑料和吸气剂包封在用薄铝箔层压的塑料薄膜中,将其整体抽真空至内压为0.05mbar并整体密封而制成真空绝缘板。该板的初始厚度为40mm,初始密度为30kg/m3。该板的初始导热系数为8mW/mK。该板表面的外观处于差至中等之间。
在20℃于平板型压机中将该板压缩至厚度为15mm。该压缩板的导热系数为5.8mW/mK。该板表面平整且良好。
以相同方式压制类似的板,但压缩在80℃进行。该压缩板的导热系数为5.1mW/mK;该板表面平整且非常好,像镜面一样。
以相同方式压制另一块类似的板,但这次温度为120℃。该压缩板的导热系数为4.8mW/mK;该板表面平整且非常好,像镜面一样。
这些结果显示在高温下压缩真空绝缘板可进一步改进板的表面外观。
Claims (11)
1.生产真空绝缘板的方法,该方法包括将开孔(半)硬质绝缘泡沫材料包封在基本不透气的弹性容器中、整体抽真空及密封的步骤,其特征在于在抽真空及密封期间或之后将该板压缩至其压缩前初始厚度的10-90%。
2.根据权利要求1的方法,其中将所述板压缩至其初始厚度的20-80%。
3.根据权利要求2的方法,其中将所述板压缩至其初始厚度的40-60%。
4.根据权利要求3的方法,其中将所述板压缩至其初始厚度的约50%。
5.根据上述权利要求任意一项的方法,其中绝缘泡沫材料包括开孔(半)硬质聚氨酯或氨基甲酸酯改性的聚异氰脲酸酯泡沫。
6.根据上述权利要求任意一项的方法,其中压缩步骤是在70-120℃之间的温度下进行的。
9.由上述权利要求任意一项所定义的方法获得的真空绝缘板。
10.权利要求9所定义的真空绝缘板作为绝热材料的应用。
11.权利要求10的应用,其用在冷冻装置、建筑板、加热管或管道、或锅炉方面。
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EP98100808 | 1998-01-19 | ||
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1998
- 1998-12-21 EP EP98966394A patent/EP1047845A1/en not_active Withdrawn
- 1998-12-21 AU AU22755/99A patent/AU2275599A/en not_active Abandoned
- 1998-12-21 WO PCT/EP1998/008402 patent/WO1999036636A1/en not_active Application Discontinuation
- 1998-12-21 MX MXPA00005788A patent/MXPA00005788A/es unknown
- 1998-12-21 BR BR9814009-4A patent/BR9814009A/pt not_active Application Discontinuation
- 1998-12-21 JP JP2000540329A patent/JP2002509226A/ja not_active Withdrawn
- 1998-12-21 TR TR2000/02088T patent/TR200002088T2/xx unknown
- 1998-12-21 CN CN98813181A patent/CN1286737A/zh active Pending
- 1998-12-21 KR KR1020007007848A patent/KR20010034204A/ko not_active Application Discontinuation
- 1998-12-21 CA CA002313010A patent/CA2313010A1/en not_active Abandoned
-
1999
- 1999-01-18 US US09/233,656 patent/US6322743B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CA2313010A1 (en) | 1999-07-22 |
EP1047845A1 (en) | 2000-11-02 |
BR9814009A (pt) | 2000-10-10 |
TR200002088T2 (tr) | 2000-11-21 |
WO1999036636A1 (en) | 1999-07-22 |
US6322743B1 (en) | 2001-11-27 |
KR20010034204A (ko) | 2001-04-25 |
MXPA00005788A (es) | 2002-09-18 |
AU2275599A (en) | 1999-08-02 |
JP2002509226A (ja) | 2002-03-26 |
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