CN1271899C - 接合区图形结构和电气部件安装用基板 - Google Patents

接合区图形结构和电气部件安装用基板 Download PDF

Info

Publication number
CN1271899C
CN1271899C CN 200310123243 CN200310123243A CN1271899C CN 1271899 C CN1271899 C CN 1271899C CN 200310123243 CN200310123243 CN 200310123243 CN 200310123243 A CN200310123243 A CN 200310123243A CN 1271899 C CN1271899 C CN 1271899C
Authority
CN
China
Prior art keywords
mentioned
electric component
bonding land
peristome
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 200310123243
Other languages
English (en)
Chinese (zh)
Other versions
CN1518402A (zh
Inventor
佐藤实
桥田淳二
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Publication of CN1518402A publication Critical patent/CN1518402A/zh
Application granted granted Critical
Publication of CN1271899C publication Critical patent/CN1271899C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
CN 200310123243 2003-01-08 2003-12-18 接合区图形结构和电气部件安装用基板 Expired - Fee Related CN1271899C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003002074A JP2004214533A (ja) 2003-01-08 2003-01-08 ランドパターン構造および電気部品搭載用基板
JP2003002074 2003-01-08

Publications (2)

Publication Number Publication Date
CN1518402A CN1518402A (zh) 2004-08-04
CN1271899C true CN1271899C (zh) 2006-08-23

Family

ID=32819922

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 200310123243 Expired - Fee Related CN1271899C (zh) 2003-01-08 2003-12-18 接合区图形结构和电气部件安装用基板

Country Status (2)

Country Link
JP (1) JP2004214533A (ja)
CN (1) CN1271899C (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100527917C (zh) * 2005-11-23 2009-08-12 比亚迪股份有限公司 一种线路板基体上焊盘的制造方法及焊盘

Also Published As

Publication number Publication date
JP2004214533A (ja) 2004-07-29
CN1518402A (zh) 2004-08-04

Similar Documents

Publication Publication Date Title
EP1827067B1 (en) Method of forming a circuit substrate
US20130119012A1 (en) Interconnection element for electric circuits
KR20180010890A (ko) 연성 회로기판, cof 모듈 및 이를 포함하는 전자 디바이스
US8779292B2 (en) Substrate and substrate bonding device using the same
CN103338590B (zh) 软性电路板及其制造方法
CN1271899C (zh) 接合区图形结构和电气部件安装用基板
KR101713640B1 (ko) 부품 내장 기판
JP2005311106A (ja) 配線回路基板
JP4113969B2 (ja) プリント配線板
JP2008166496A (ja) フレキシブル配線基板
CN210807797U (zh) 一种连接可靠的pcb板
CN1301047C (zh) 焊盘图形结构以及电气部件搭载用基板
CN1264393C (zh) 选择性电镀法
KR20070111886A (ko) 표면 실장용 인쇄 회로 기판 및 그 형성방법
CN1216418C (zh) 可设置无源组件的基板
JP2004327605A (ja) プリント基板の接続構造
CN101621889A (zh) 印刷电路板和电子装置
JP3077392U (ja) プリント基板
JP2003188486A (ja) 配線基板及び半導体装置並びにそれらの製造方法
WO2022168478A1 (ja) モジュール
JP2007019150A (ja) プリント配線板およびプリント回路板
US7122909B2 (en) Wiring board, stacked wiring board and method of manufacturing the same, semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
KR20180000996A (ko) 연성 회로 기판 및 그 제조 방법
JP3914478B2 (ja) Lsiチップ実装可撓配線板
JP2005050975A (ja) 配線基板のランド構造

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20060823

Termination date: 20171218