CN1262516A - Resistance for high-voltage and its method for regulating resistance - Google Patents
Resistance for high-voltage and its method for regulating resistance Download PDFInfo
- Publication number
- CN1262516A CN1262516A CN99126058A CN99126058A CN1262516A CN 1262516 A CN1262516 A CN 1262516A CN 99126058 A CN99126058 A CN 99126058A CN 99126058 A CN99126058 A CN 99126058A CN 1262516 A CN1262516 A CN 1262516A
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- China
- Prior art keywords
- adjustment
- resistance
- resistive film
- resistance value
- groove
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
- H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
- H01C17/242—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by laser
Abstract
From the non-forming portion of resistor film 3 on the substrate 1 to the resistor film 3 of the resistance value adjustment portion 3a, laser trimming is used to remove the resistor film 3 in straight line shape so as to form 4 removed slots 7, in which each removed slot 7 has the same length. The invention provides high precision adjustment of resistance value that can be performed in short time and, high voltage used resistor and its adjustment method of resistance value, in which high insulation characteristic can be obtained at the resistance value adjustment portion.
Description
The present invention relates to be used for the high pressure resistance of high-tension circuits such as high voltage source, TV imagescope, CRT monitor.
This in the past high pressure forms as follows with resistance, form a plurality of terminal electrodes on insulating properties substrates such as aluminium oxide, forms resistive film by printing, sintering between these terminal electrodes.Then,, remove the part that (adjustment) forms the resistance adjustment part of resistive film, adjust resistance value by sanding machine method and laser adjustment method for the resistance value that obtains wishing.
The sanding machine method is the method for removing the part of resistive film with the high-pressure injection alumina powder.Can form wide cut and adjust groove.Laser adjustment method in the past is that resistance value is measured on the limit, and the limit is to the method for resistive film irradiating laser with a part of removing resistive film.When reaching target resistance values, finish to adjust.Form very narrow adjustment groove by this laser adjustment method, width is 0.05～0.3mm, when forming a plurality of adjustment groove, forms different adjustment slot lengths.
In order to make such high pressure be applied to the high voltage of number KV～tens of KV with resistance, the potential difference that applies to resistance adjustment part is also up to hundreds of V～number KV, and the adjustment to resistance adjustment part enforcement importantly has high voltage withstanding high-insulativity.Therefore, this high pressure can form wide cut with resistance and adjust groove, is used for the adjustment by the sanding machine method that can obtain high-insulativity more.But, because the adjustment time is long, need adjusted cleaning etc. with the sanding machine method, there is the manufacturing cost height, further high accuracy is adjusted the problem of resistance value.
In addition, use laser adjustment method in the past can shorten adjustment time and high accuracy adjustment resistance value, but the high pressure in the past of having adjusted resistance value with laser adjustment method exist owing to the width of adjustment groove is narrow, can not obtain the such problem of high-insulativity with resistance.That is to say that when the laser adjustment method by has in the past formed the adjustment groove of a linearity, under the high-voltage state when having applied actual the use, exist when leakage current flows to the adjustment groove, resistance value reduces significantly, the problem of characteristic difference.And when having formed a plurality of adjustment groove, as shown in Figure 3, owing to adjust the length difference of groove 13, because high voltage concentrates on the terminal point part (A part among Fig. 3) of long adjustment groove of length, leakage current flows to this part, the characteristic variation.In Fig. 3, the 11st, substrate, the 12nd, the resistance adjustment part of resistive film, the 13rd, adjust groove.
The purpose of this invention is to provide and a kind ofly adjust method by laser and can adjust resistance value in the short time high accuracy, the high pressure that can obtain high-insulativity with resistance adjustment part is with resistance and resistance value method of adjustment thereof.
For achieving the above object, the present invention 1 high pressure comprises substrate and the resistive film that forms with resistance on described substrate, it is characterized in that beginning to cover resistive film by the non-portion of formation of described on-chip resistive film, adjusting formed a plurality of linearity by laser, to adjust groove be parallel, and an end that is positioned at resistive film is formed on the same straight line that is positioned at adjustment groove orthogonal directions.
The present invention 2 high pressure with the resistance value method of adjustment of resistance be comprise substrate and the high pressure of the resistive film that on described substrate, forms with the resistance value method of adjustment of resistance, it is characterized in that beginning to cover resistive film by the non-portion of formation of described on-chip resistive film, by the laser adjustment, form a plurality of adjustment grooves with same length according to the adjustment length of calculating by initial resistivity value.
As according to above-mentioned formation, the adjustment groove that forms by the laser adjustment is to form a plurality of linearities like that on the adjustment groove same line in vertical direction in an end and the resistive film separately, specific adjustment groove high voltage is not concentrated to be increased, and make and respectively adjust the voltage minimizing that groove increases, can obtain high-insulativity with resistance adjustment part.Adjusting the groove number is to set according to the voltage that resistance adjustment part increases.That is,, form a plurality of adjustment grooves according to increasing of the voltage that resistance adjustment part is increased.That is to say,, also can be used on the laser adjustment method that the short time high accuracy is adjusted resistance value, carry out high voltage bearing resistance value adjustment even be applied in high-tension high pressure resistance.
Below, the brief description accompanying drawing.
Fig. 1 is the vertical view of the high pressure of the embodiment of the invention 1 with resistance.
Fig. 2 is the vertical view of the high pressure of the embodiment of the invention 1 with the resistance adjustment part of resistance.
Fig. 3 is the vertical view of the resistance adjustment part of high pressure usefulness resistance before.
Among the figure, the 1-substrate; The 2-terminal electrode; The 3-resistive film; The 3a-resistance adjustment part; 4-glass coating; The 5-lead terminal; 7-adjusts groove.
Embodiment
Below, the high pressure resistance of the embodiment of the invention 1 is described according to Fig. 1 and Fig. 2.Fig. 1 is a high pressure with the vertical view of resistance, the part amplification plan view that Fig. 2 is resistance adjustment part.
The high pressure of present embodiment has the rectangular-shaped insulating properties substrate 1 that the pottery by aluminium oxide etc. constitutes with resistance.Form the terminal electrode 2,2 that Ag series conductor paste printing sintering is formed at the both ends of substrate 1, between terminal electrode 2,2, form the resistive film 3 that will form based on the resistance slurry printing sintering of ruthenium-oxide, in the formation zone of resistive film 3 as covering resistive film 3, lining glass coating 4, by the welding etc. to terminal electrode 2,2 anchor leg terminals 5,5.Also have, glass coating 4 is to form as required, so the occasion that does not form is also arranged.Also have, normally with substrate 1 all linings outer dress resin (omitting diagram).Then, this high pressure by adjusting the laser adjustment method of resistance value in the short time high accuracy, is adjusted its resistance value with resistance.
Be positioned at the non-formation portion of resistive film 3 at and an end parallel with the minor face of substrate 1, the other end is located in the resistive film 3 formation and respectively adjusts groove 7, and their two ends begin to form same length by the long limit of substrate 1 from same position.That is to say that each adjusts a end that groove 7 is positioned at resistive film 3 all on same the straight line vertical with adjusting groove 7.
This structure is that separately an end and the such linearity of same position in the resistive film forms a plurality of adjustment grooves that form by the laser adjustment, because not concentrating, specific adjustment groove high voltage do not increase, and make and respectively adjust the voltage minimizing that groove increases, can access the high-insulativity of resistance adjustment part.
The resistance value method of adjustment of adjusting with the laser of resistance by the high pressure of present embodiment is as follows.At first, the gauge head that terminal electrode 2,2 contact resistance pH-value determination pHs are used is measured whole resistance values.Adjust number and adjust length if then set, need calculate the resistance value that obtains by the resistance value of measuring.At this moment, adjusting number is to increase and the voltage of imagination and the adjusting range of laser adjusting device according to resistance adjustment part, preestablishes the number (more than 2) of its minimum.Then, adjust resistive film 3, resistive film 3 is formed a plurality of adjustment grooves 7 of same length with adjustment number of calculating and adjustment length linearity laser.The starting point of setting laser adjustment is positioned at the position that long limit by a side of each substrate 1 begins not form resistive film 3 parts of same position, sets its terminal point and is positioned at resistive film 3.Also have, the spacing between adjustment is to adjust with the kind of resistance according to predefined each high pressure.
Like this, present embodiment was not to use such in the past limit to measure the resistance value limit and adjusts, when resistance value reaches setting, finish the method for adjustment, but before the adjustment beginning, measure its initial resistivity value, carry out the laser adjustment according to this initial resistivity value decision adjustment number and adjustment length.
Also have, high pressure is not limited only to the foregoing description with the formation of resistance, for example also can be constructed as follows, formed 3 above terminal electrodes or increased the resistance adjustment part of the foregoing description, the part of resistive film has been formed the short-term of ladder shape, cut off this short-term with rough adjustment resistance value.
As described above, as according to high pressure resistance of the present invention, the adjustment groove that forms by the laser adjustment is to form a plurality of linearities like that on the adjustment groove same line in vertical direction in an end and the resistive film separately, do not concentrate increase at specific adjustment groove high voltage, and make and respectively adjust the voltage minimizing that groove increases, can access the high-insulativity of resistance adjustment part.
And, as according to the resistance value method of adjustment of high pressure of the present invention, can use the laser adjustment method of adjusting resistance value in the short time high accuracy with resistance, carry out high voltage bearing resistance value adjustment.
Claims (2)
1. high pressure resistance comprises:
Substrate and the resistive film that on described substrate, forms, it is characterized in that, the non-portion of formation by described on-chip resistive film begins to cover resistive film, adjusting formed a plurality of linearity by laser, to adjust groove be parallel, and form an end that is positioned at resistive film make be positioned at the mutually perpendicular straight line of adjustment groove on.
2. the resistance value method of adjustment of a high pressure usefulness resistance comprises substrate and the resistive film that forms on described substrate, it is characterized in that:
The non-portion of formation by described on-chip resistive film begins to cover resistive film, by the laser adjustment, forms a plurality of adjustment grooves according to the adjustment length of being calculated by initial resistivity value with same length.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11017429A JP2000216013A (en) | 1999-01-26 | 1999-01-26 | Resistor for high pressure and resistance value adjusting method thereof |
| JP17429/1999 | 1999-01-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1262516A true CN1262516A (en) | 2000-08-09 |
| CN1169163C CN1169163C (en) | 2004-09-29 |
Family
ID=11943786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB991260589A Expired - Lifetime CN1169163C (en) | 1999-01-26 | 1999-12-14 | Resistance for high-voltage and its method for regulating resistance |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2000216013A (en) |
| KR (1) | KR100396182B1 (en) |
| CN (1) | CN1169163C (en) |
| TW (1) | TW432400B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102074326A (en) * | 2009-11-24 | 2011-05-25 | 兴亚株式会社 | Resistance value regulating method of resistor |
| CN102176356A (en) * | 2011-03-01 | 2011-09-07 | 西安天衡计量仪表有限公司 | Platinum resistor chip and manufacture method thereof |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5179155B2 (en) * | 2007-12-07 | 2013-04-10 | 太陽社電気株式会社 | Chip resistor |
| JP6618248B2 (en) * | 2014-10-24 | 2019-12-11 | Koa株式会社 | Resistor and manufacturing method thereof |
| CN113808802B (en) * | 2021-07-13 | 2022-04-12 | 国网浙江省电力有限公司营销服务中心 | Cage type extra-high voltage load frame and direct-current high-voltage equipment |
| JP2023021533A (en) * | 2021-08-02 | 2023-02-14 | Koa株式会社 | Resistor and method of manufacturing the same |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2827608B2 (en) * | 1991-08-26 | 1998-11-25 | 日本電気株式会社 | Laser trimming method for thick film resistor |
-
1999
- 1999-01-26 JP JP11017429A patent/JP2000216013A/en active Pending
- 1999-11-30 TW TW088120897A patent/TW432400B/en not_active IP Right Cessation
- 1999-12-07 KR KR10-1999-0055395A patent/KR100396182B1/en active IP Right Grant
- 1999-12-14 CN CNB991260589A patent/CN1169163C/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102074326A (en) * | 2009-11-24 | 2011-05-25 | 兴亚株式会社 | Resistance value regulating method of resistor |
| CN102074326B (en) * | 2009-11-24 | 2015-04-01 | 兴亚株式会社 | Resistance value regulating method of resistor |
| CN102176356A (en) * | 2011-03-01 | 2011-09-07 | 西安天衡计量仪表有限公司 | Platinum resistor chip and manufacture method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TW432400B (en) | 2001-05-01 |
| KR100396182B1 (en) | 2003-08-27 |
| JP2000216013A (en) | 2000-08-04 |
| KR20000052424A (en) | 2000-08-25 |
| CN1169163C (en) | 2004-09-29 |
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| Date | Code | Title | Description |
|---|---|---|---|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20040929 |
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| CX01 | Expiry of patent term |