JPH09306703A - Resistor and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resistor which has excellent load characteristic, pulse resistance and surge resistance, and enables adjustment of resistance value with high precision. SOLUTION: Electrodes 12 are provided on a board 11, and the main resistance path 13 is provided between the electrodes 12. A first ladder-shaped resistance path for rough adjustment, including first ladder steps 14 parallel to the main resistance path 13 and first connection resistance paths 15 connecting the first ladder steps 14 and connected with the main resistance path 13, is provided in a part of the main resistance path 13. A second ladder-shaped resistance path, including second ladder steps 16 extending vertically from the main resistance path 13 and a second connection resistance path 17 connecting the second ladder steps 16, is provided at a portion of the main resistance path 13. Since a resistor has these ladder-shaped resistance paths for rough adjustment and for fine adjustment, adjustment of resistance value with high precision is enabled and excellent load characteristic, pulse resistance and surge resistance may be obtained.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resistor used in electronic equipment and a method for manufacturing the same.

[0002]

2. Description of the Related Art Generally, in a rectangular chip resistor or the like, an electrode and a resistor are formed by a thick film construction method by printing and firing a thick film paste or a vapor deposition / sputtering construction method, and this resistor is cut by a laser or the like to obtain a desired resistance. It matches the value. When the resistor is cut by a laser, the resistor around the cutting groove is damaged by the heat of the laser, so that the load characteristics and the pulse characteristics are deteriorated. Therefore, a method of adjusting the resistance value to a desired value by providing a ladder-shaped resistance path in a part of the resistor and cutting this ladder step is also considered.

A conventional resistor having a ladder type resistance path will be described below. Conventionally, a resistor having a ladder type resistance path is known from Japanese Patent Laid-Open No. 60-163402. FIG. 19 is a plan view of a conventional resistor. In FIG. 19, 1 is a substrate made of alumina. Reference numeral 2 denotes an electrode made of nichrome-gold, which is provided from the side of the upper surface of the substrate 1 to the side surface and the front and back surfaces. 3, 4 and 5 are resistors made of a tantalum thin film, which are formed between the electrodes 2 on the surface of the substrate 1. 3 is a main resistance path, and 4 and 5 are so that the ladder steps are parallel to the main resistance path 3. In the provided ladder resistance path, the resistance width of the ladder resistance path 5 is set thicker than the resistance width of the ladder resistance path 4. Reference numeral 6 denotes a cutting groove formed when the ladder step of the ladder resistance path is cut by a laser.

The manufacturing method of the conventional resistor configured as described above will be described below.

First, a tantalum thin film resistor and a nichrome-gold electrode pattern are formed on both ends of a substrate 1 whose main component is alumina having a purity of 96% by a usual magnetron sputtering apparatus.

Next, after a resistor and an electrode pattern are formed by a photo-etching technique, heat treatment is performed at 350 ° C. for 1 hour.

Next, the ladder stage of the ladder type resistance path 4 is cut by a laser, and the resistance value of the ladder type resistance path 5 is roughly adjusted until the resistance value can be finely adjusted.

Finally, the resistance value is finely adjusted by cutting the ladder step of the ladder-type resistance path 5 with a laser, which has a larger resistance width than the ladder-type resistance path 4 and has a small increase in the resistance value when the ladder step is cut. , A resistor having a desired resistance value.

In the resistor pattern having such a ladder-shaped resistance path, the resistance value can be adjusted discontinuously by cutting the ladder steps of the ladder-shaped resistance path with a laser, and the heat of the laser can be adjusted. Since current does not flow around the cutting groove that is damaged by, the load characteristics, surge resistance, and pulse resistance are improved.

[0010]

However, in the above conventional configuration, in order to adjust the resistance value with high accuracy, the resistance width of the ladder resistance path is made thicker than the resistance width of the main resistance path.
It is necessary to reduce the change in resistance value when the ladder stage of the resistor is cut. However, in order to correspond to high accuracy of ± 5% or less, the resistance width of the ladder resistance path must be made considerably thicker than the resistance width of the main resistance path. The distance between the ladder steps of the resistance path must be made small enough to make it difficult to manufacture, or the number of ladder steps must be reduced, and it was practically difficult to precisely adjust the resistance value by laser trimming of the ladder resistance path. . There is a demand for a resistor that has a resistance width that is approximately the same as that of a conventional ladder-type resistance path, that enables highly accurate resistance value adjustment, and that has excellent load characteristics, surge resistance, and pulse resistance. There is.

An object of the present invention is to provide a resistor capable of highly accurately adjusting a resistance value and having excellent load characteristics, surge resistance and pulse resistance.

[0012]

In order to solve this problem, the present invention provides a first ladder type resistance path in which a ladder stage for coarse adjustment of resistance value is provided in parallel with a main resistance path, or A first resistance value adjusting resistance path that is cut perpendicularly to the main resistance path to adjust the resistance value, and a ladder step that is capable of highly accurate resistance value adjustment and that extends vertically to the main resistance path. The resistor is configured to have a resistor pattern including two ladder-shaped resistance paths or a second resistance value adjusting resistance path that is cut in parallel with the main resistance path to adjust the resistance value.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is a substrate, a pair of electrodes provided on a side portion of the upper surface of the substrate, and a main resistance path electrically connected between the electrodes. And a first ladder-shaped resistance path in which a ladder step is provided in a part of the main resistance path so as to be parallel to the main resistance path, and a second ladder step having a ladder step extending in a direction perpendicular to the main resistance path. When the resistance value adjustment is adjusted, the first ladder-shaped resistance path is used for coarse adjustment of the resistance value, and the second ladder-shaped resistance path is used for the fine adjustment of the resistance value. Acts as an adjustment tool, enables highly accurate resistance value adjustment, and because current does not flow to the damaged part due to laser trimming for resistance value adjustment, load characteristics, surge resistance, and pulse resistance are improved. Is to have.

According to a second aspect of the present invention, the resistance width of the resistance path connecting the ladder stages of the second ladder type resistance path is
The resistor according to claim 1, wherein the resistance width is narrower than that of the main resistance path, and the resistance change when the second ladder resistance path is cut for fine adjustment of the resistance value is different from that of the resistor according to claim 1. Since it becomes smaller, it has the effect that the resistance value can be adjusted with higher accuracy, in addition to the operation described in claim 1.

According to a third aspect of the invention, the specific resistance of the resistance path connecting the ladder stages of the second ladder type resistance path is
The resistor according to claim 1, which is higher than the specific resistance of the main resistance path, and a resistance value change when the second ladder resistance path is cut for fine adjustment of the resistance value is different from that of the resistor according to claim 1. Since it becomes smaller, it has the effect that the resistance value can be adjusted with higher accuracy, in addition to the operation described in claim 1.

The invention according to claim 4 is the resistor according to claim 1, wherein the main resistance path meanders so that the ladder stages of the first and second ladder-shaped resistance paths are in the same direction. In addition to the operation of claim 1, the resistor pattern can be downsized, and the resistor can generate heat over a wide area of the substrate. Therefore, the pattern effectively uses the substrate for heat dissipation. It also has an effect of further improving surge resistance and pulse resistance.

The invention according to claim 5 is the resistor according to claim 1, wherein the ladder stage of the second ladder-shaped resistance path is made of a conductor, and the resistance value of the second ladder-shaped resistance path is adjusted. Therefore, since the number of cut conductors and the change in resistance value are proportional to each other, the resistance value can be easily adjusted in addition to the operation according to the first aspect.

The invention according to claim 6 is a substrate,
A pair of electrodes provided on the sides of the upper surface of the substrate, a main resistance path electrically connected between the electrodes, and a cutting groove formed in a part of the main resistance path perpendicular to the main resistance path. A resistor including a first resistance value adjusting resistance path provided and a second resistance value adjusting resistance path provided so that a cutting groove is parallel to the main resistance path. When adjusting the first
The resistance path for adjusting the resistance value is used for coarse adjustment of the resistance value.
The resistance path for adjusting the resistance of works as a fine adjustment of the resistance.
Since the accuracy of resistance adjustment depends on the accuracy of laser cutting distance adjustment, it is possible to adjust resistance with extremely high accuracy, and because the pattern of the resistance path length is long, the laser adjustment for resistance adjustment Since the power consumption is not concentrated at the damaged portion of the resistor due to heat, it has an effect of excellent load characteristics, surge resistance, and pulse resistance.

The invention according to claim 7 is a substrate,
A pair of electrodes provided on the sides of the upper surface of the substrate, a main resistance path electrically connected between the electrodes, and a ladder step provided in a part of the main resistance path in parallel with the main resistance path. And a second ladder-shaped resistance path and a second resistance-value adjusting resistance path provided so that the cutting groove is parallel to the main resistance path. The resistance value is adjusted. At this time, the first ladder-shaped resistance path serves for coarse adjustment of the resistance value, the second resistance value adjustment resistance path serves for fine adjustment of the resistance value, and the resistance value adjustment resistance path provides the accuracy of resistance value adjustment. Is dependent on the accuracy of laser cutting distance adjustment, it is possible to adjust the resistance value with extremely high precision, and the first ladder resistance is used in the damaged portion of the resistor due to the heat of the laser for resistance value adjustment. Current does not flow in the path, and power consumption is not concentrated in the second resistance value adjusting resistance path. Therefore, the load characteristic, surge resistance, and has the effect that pulse resistance is excellent.

The invention according to claim 8 is a substrate,
A pair of electrodes provided on the side of the upper surface of the substrate, a meandering main resistance path electrically connected between the electrodes, and two cutting grooves as a main resistance path in a part of the main resistance path. A resistor comprising a first resistance value adjusting resistance path provided so as to be vertical, and has the function of reducing the size of the resistor pattern together with the function of claim 6. .

Further, in the invention described in claim 9, the main resistance path is meandering so that the cutting grooves of the first and second resistance value adjusting resistance paths are in the same direction. It is a resistor, and has the function of reducing the size of the resistor pattern in addition to the function of the sixth aspect.

According to a tenth aspect of the present invention, the main resistance path meanders so that the ladder steps of the first ladder-type resistance path and the cutting grooves of the second resistance value adjusting resistance path are perpendicular to each other. The resistor according to claim 7, which has the effect of being able to reduce the size of the resistor pattern in addition to the effect of claim 7.

The invention described in claim 11 is the first,
The resistance width of the second resistance value adjusting resistance path is wider than the resistance width of the main resistance path, wherein the resistance width is larger than the resistance width of the main resistance path. Since the concentration of power consumption in the damaged part of the body can be further reduced, it has an effect of further improving load characteristics, surge resistance, and pulse resistance.

The invention according to claim 12 is characterized in that the meandering main resistance path has rounded corners.
The resistor according to claim 0, the concentration of power consumption at the corners is alleviated together with the action according to claims 4, 8, 9 and 10, so that the load characteristics, surge resistance and pulse resistance are further improved. Has the effect of.

According to a thirteenth aspect of the present invention, a pair of electrodes is provided on a side portion of the upper surface of the substrate, a main resistance path electrically connected between the electrodes, and a ladder step in a part of the main resistance path. And a second ladder-shaped resistance path having a ladder step extending in a direction perpendicular to the main resistance path and a first ladder-shaped resistance path provided in parallel with the main resistance path. A ladder stage is provided in order from the one closer to the main resistance line of the first ladder type resistance line to perform a rough adjustment of the resistance value, and the ladder stage is cut from one of the second ladder type resistance lines in order for resistance. A method of manufacturing a resistor, wherein the value is finely adjusted.
It has an effect that the described resistor can be adjusted to a desired resistance value and actually manufactured.

According to a fourteenth aspect of the present invention, a pair of electrodes is provided on a side portion of the upper surface of the substrate, a main resistance path electrically connected between the electrodes, and a ladder step in a part of the main resistance path. Is provided in parallel with the main resistance path, and a resistance body including a first ladder resistance path and a ladder step extending in the vertical direction is provided in the main resistance path, and the specific resistance is higher than that of the resistance body. And a resistance path forming a second ladder-type resistance path by connecting ladder stages extending vertically from the main resistance path with a high resistance element,
The resistance value is roughly adjusted by cutting the ladder stages in order from the one closer to the main resistance path of the first ladder type resistance path, and the ladder value is cut by cutting the ladder steps sequentially from either one of the second ladder type resistance path. This is a method of manufacturing a resistor that is finely adjusted, and has an effect that the resistor according to claim 3 can be adjusted to a desired resistance value and actually manufactured.

According to a fifteenth aspect of the present invention, a pair of electrodes is provided on a side portion of the upper surface of the substrate, a main resistance path electrically connected between the electrodes, and a ladder step in a part of the main resistance path. Is provided so as to be parallel to the main resistance path and a first ladder-shaped resistance path is provided, and a second resistance element that is parallel to and independent of the main resistance path is provided. A resistor is connected to the main resistance path, and a ladder step that constitutes a second ladder-type resistance path is provided by a conductor, and the one closer to the main resistance path of the first ladder-type resistance path is cut in order to reduce the resistance value. 7. A method of manufacturing a resistor, comprising performing a rough adjustment and cutting a ladder step in order from either one of the second ladder-shaped resistance paths to finely adjust a resistance value.
It has an effect that the described resistor can be adjusted to a desired resistance value and actually manufactured.

According to a sixteenth aspect of the present invention, a pair of electrodes is provided on a side portion of the upper surface of the substrate, and a main resistance path electrically connected between the electrodes and a main resistance path partially connected to the main resistance path. From a first resistance value adjusting resistance path that cuts perpendicularly to the resistance path and adjusts the resistance value, and a second resistance value adjusting resistance path that cuts parallel to the main resistance path and adjusts the resistance value. A resistor
Roughly adjust the resistance value by cutting the first resistance value adjusting resistance path in the direction perpendicular to the main resistance path from the side closer to the main resistance path, and from the second resistance value adjusting resistance path from either one. A method of manufacturing a resistor in which the resistance value is finely adjusted by cutting in parallel to the main resistance path, and the resistor according to claim 6, 9 or 11 can be adjusted to a desired resistance value and actually manufactured. Have.

According to a seventeenth aspect of the present invention, a pair of electrodes is provided on the side of the upper surface of the substrate, a main resistance path electrically connected between the electrodes, and a ladder step in a part of the main resistance path. A resistance including a first ladder-shaped resistance path provided so as to be parallel to the main resistance path, and a second resistance value adjusting resistance path for adjusting the resistance value by cutting in parallel with the main resistance path. A body is provided, and the ladder steps are cut in order from the one closer to the main resistance path of the first ladder-shaped resistance path to roughly adjust the resistance value, and the second resistance value adjustment resistance path is used from either one of the main resistance paths. 8. A method for manufacturing a resistor, wherein the resistance value is finely adjusted by cutting in parallel with
It has an effect that the resistor described in 10 can be adjusted to a desired resistance value and actually manufactured.

According to the eighteenth aspect of the present invention, a pair of electrodes are provided on the side of the upper surface of the substrate, and the meandering main resistance path electrically connecting between the electrodes and a part of the main resistance path. Is provided with a resistance body including a first resistance value adjusting resistance path for adjusting a resistance value by cutting the main resistance path in a direction perpendicular to the main resistance path. The resistance value adjusting resistance path is cut to roughly adjust the resistance value, and the first resistance value adjusting resistance path is cut from the side closer to the main resistance path in the direction perpendicular to the main resistance path to finely adjust the resistance value. This is a method of manufacturing a resistor that performs adjustment, and has the effect of being able to actually manufacture the resistor according to the eighth aspect by adjusting it to a desired resistance value.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. (Embodiment 1) FIG. 1 is a plan view of a resistor including a ladder type resistance path in a resistor according to an embodiment of the present invention. Reference numeral 11 is a substrate of alumina, steatite, forsterite, beryllia, titania, glass, glass ceramic or the like. Reference numeral 12 denotes an electrode made of silver, silver-palladium, copper, gold, or the like, which is provided from a pair of opposing side surfaces of the substrate 11 to the front and back surfaces. 13 is a main resistance path and electrode 1
It is formed between two. 14 is the first ladder stage,
It is provided so as to be parallel to the main resistance path 13. Fifteen
Is a first connection resistance path that connects the first ladder stage 14 and connects to the main resistance path 13. The first ladder step 14 and the first connection resistance path 15 form a first ladder resistance path in which the ladder step is parallel to the main resistance path 13. 16 is the main resistance path 13
Is a second ladder step extending vertically from the. 17
Is a second connection resistance path connecting the second ladder stage 16. The second ladder stage 16 and the second connection resistance path 17 form a second ladder resistance path in which the ladder step extends vertically from the main resistance path 13. 13, 14, 15, 16, 17
Is a resistor such as ruthenium oxide. Reference numeral 18 is a first cutting groove formed when the first ladder step is cut by a laser for coarse adjustment of the resistance value. Reference numeral 19 is a second cutting groove formed when the second ladder step is cut by a laser for fine adjustment of the resistance value.

A method of manufacturing the resistor having the resistor having the ladder-shaped resistance path according to the embodiment of the present invention configured as described above will be described below.

FIG. 2 is a process diagram of a resistor including a ladder type resistance path in a resistor according to an embodiment of the present invention.

First, as shown in FIG. 2A, an electrode 12 is printed using a silver-based glaze electrode paste on a substrate 11 containing alumina having a purity of 96% as a main component, and then it is heated to 850 ° C. in a belt firing furnace. 5 minutes to 10 minutes, 30 minutes in total
The electrode 12 is formed by firing for 60 minutes.

Next, as shown in FIG. 2B, a main resistance path 13 connected between the electrodes 12, a first ladder stage 14 provided in parallel with the main resistance path 13, and a first ladder stage 14 are provided. A first connection resistance path 15 that connects the first ladder step 14 and connects it to the main resistance path 13, a second ladder step 16 that extends vertically from the main resistance path 13, and a second ladder step 16 are connected. After printing the resistor formed of the second connection resistance path 17 using the ruthenium oxide-based glaze resistance paste, the belt firing furnace is used at 850 ° C. for 5 minutes to 10 minutes, for a total of 30 minutes to 60 minutes.
Bake for minutes to form a resistor.

Next, as shown in FIG. 2C, the first ladder stage 14 is cut by a laser in order from the side closer to the main resistance path 13, and the second ladder stage 16 for fine adjustment is cut to obtain a desired one. The resistance value is roughly adjusted to the range in which the resistance value can be adjusted.

Next, as shown in FIG. 2 (d), the second ladder stage 16 is sequentially cut with a laser from either one, and the resistance value is finely adjusted to obtain a desired resistance value to manufacture a resistor. It is a thing.

The number of stages of ladder steps of the ladder resistance path is different depending on the resistor. The operation of the resistor including the ladder-shaped resistor path in the resistor constructed and manufactured as described above according to the embodiment of the present invention will be described below.

When the first ladder stage 14 which is the ladder stage of the first ladder type resistance path is cut from the side closer to the main resistance path 13,
Since the resistance path length greatly increases and the resistance value increases largely, it is suitable for coarse adjustment of the resistance value. When the second ladder stage 16 which is the ladder stage of the second ladder type resistance path is cut, the resistance path length does not increase and the resistance width only slightly decreases, so that the resistance value does not increase so much and the number of ladder steps cut is small. Since the increase in the resistance value and the increase in the resistance value are almost proportional to each other, the resistance value after cutting the ladder stage can be easily predicted, which is suitable for fine adjustment of the resistance value. For example, the rough adjustment of the resistance value to around -10% to -5% of the desired resistance value is performed by cutting the first ladder stage 14 and then by cutting the second ladder stage 16 ± 1 of the desired resistance value. % To ± 2%
You can adjust the resistance value up to. Thus, the width that is easy to manufacture,
A ladder-shaped resistance pattern with intervals allows more precise resistance adjustment.

By completely cutting the ladder stage of the ladder resistance path by the laser, no current flows in the portion damaged by the heat of the laser, so that excellent load characteristics, pulse resistance and surge resistance can be obtained. A resistor having is obtained.

If the resistance width of the second connection resistance path 17 is made narrower than the resistance width of the main resistance path, the increase of the resistance value at the time of disconnection can be made smaller and the resistance value can be adjusted with higher accuracy. is there.

(Second Embodiment) FIG. 3 is a plan view of a resistor according to a second embodiment of the present invention. 11 is alumina,
Substrates such as steatite, forsterite, beryllia, titania, glass, glass ceramics. 12 is an electrode made of silver, silver-palladium, copper, gold or the like
Are provided from the pair of side surfaces facing each other to the front and back surfaces. A main resistance path 13 is formed between the electrodes 12. Reference numeral 14 denotes a first ladder step, which is provided so as to be parallel to the main resistance path 13. Reference numeral 15 is a first connection resistance path which connects the first ladder stage 14 and is connected to the main resistance path 13. The first ladder step 14 and the first connection resistance path 15 form a first ladder resistance path in which the ladder step is parallel to the main resistance path 13. Reference numeral 16 is a second ladder step extending vertically from the main resistance path 13. Reference numeral 17 is a second connection resistance path for connecting the second ladder stage 16. The second ladder stage 16 and the second connection resistance path 17 form a second ladder resistance path in which the ladder step extends vertically from the main resistance path 13.
Reference numerals 13, 14, 15, 16 are made of resistors such as ruthenium oxide. Reference numeral 17 is made of a resistor such as ruthenium oxide having a higher specific resistance than the main resistance path 13. Reference numeral 18 is a first cutting groove formed when the first ladder step is cut by a laser for coarse adjustment of the resistance value. Reference numeral 19 is a second cutting groove formed when the second ladder step 16 is cut by a laser for fine adjustment of the resistance value.

Regarding the resistor configured as described above,
The manufacturing method will be described below. FIG. 4 is a process diagram of a resistor according to the second embodiment of the present invention.

First, as shown in FIG. 4 (a), an electrode 12 is printed using a silver-based grace electrode paste on a substrate 11 whose main component is alumina having a purity of 96%, and then it is heated to 850 ° C. in a belt baking furnace. 5 minutes to 10 minutes, 30 minutes in total
The electrode 12 is formed by firing for 60 minutes.

Next, as shown in FIG. 4B, a main resistance path 13 connected between the electrodes 12 and a first ladder stage 14 provided in parallel with the main resistance path 13, A resistor made up of a first connection resistance path 15 connecting the first ladder step 14 and the main resistance path 13 and a second ladder step 16 extending vertically from the main resistance path 13 is made of ruthenium oxide. Print using a system glaze resistance paste.

Next, as shown in FIG. 4C, the second connection resistance path 17 for connecting the second ladder stage 16 and the main resistance path 13 are connected.
After printing with a ruthenium oxide-based glaze resistance paste with a higher specific resistance than 850 ° C in a belt baking furnace
5 minutes to 10 minutes, a total of 30 minutes to 60 minutes,
Form a resistor.

Next, as shown in FIG. 4D, the first ladder stage 14 is sequentially cut by a laser from the side closer to the main resistance path 13, and the resistance value is cut by cutting the second ladder stage 16 for fine adjustment. Roughly adjust the resistance value to within the adjustable range.

Next, as shown in FIG. 4 (e), the second ladder stage 16 is sequentially cut by a laser from either one, and the resistance value is finely adjusted to a desired resistance value to manufacture a resistor. It is a thing.

The number of stages of ladder steps of the ladder type resistance path is different depending on the resistor. The operation of the resistor constructed and manufactured as described above will be described below.

Similar to the resistor shown in the first embodiment, the resistance value can be adjusted with high accuracy by combining the ladder type resistance paths for the rough adjustment and the fine adjustment, and the excellent load characteristics and surge resistance can be obtained. When a resistor having pulse resistance and pulse resistance is obtained and the second ladder stage 16 which is the ladder stage of the second ladder type resistance path is cut by a laser, the resistance value rises as shown in the first embodiment. Since it is smaller than the resistor, finer adjustment of the resistance value can be performed with higher accuracy.

(Third Embodiment) FIG. 5 is a plan view of a resistor according to a third embodiment of the present invention. 11 is alumina,
Substrates such as steatite, forsterite, beryllia, titania, glass, glass ceramics. 12 is an electrode made of silver, silver-palladium, copper, gold or the like
Are provided from the pair of side surfaces facing each other to the front and back surfaces. Reference numeral 13 is a main resistance path, which includes the first ladder-type resistance path and the second resistance path.
The ladder-shaped resistance path of (1) meanders in the same direction and is formed between the electrodes 12. Reference numeral 14 denotes a first ladder step, which is provided so as to be parallel to the main resistance path 13. 15 connects the first ladder stage 14 and connects the main resistance path 13
Is a first connection resistance path connected to. First ladder stage 14
And the first connection resistance path 15 forms a first ladder resistance path whose ladder stage is parallel to the main resistance path 13. Reference numeral 16 is a second ladder step extending vertically from the main resistance path 13. Reference numeral 17 is a second connection resistance path for connecting the second ladder stage 16. Second ladder stage 16 and second connection resistance path 17
Forms a second ladder resistance path in which the ladder steps extend vertically from the main resistance path 13. 13, 14, 15, 1
Reference numerals 6 and 17 are resistors such as ruthenium oxide. Reference numeral 18 is a first cutting groove formed when the first ladder step is cut by a laser for coarse adjustment of the resistance value. Reference numeral 19 is a second cutting groove formed when the second ladder step is cut by a laser for fine adjustment of the resistance value.

Regarding the resistor configured as described above,
The manufacturing method will be described below. FIG. 6 is a process diagram of a resistor according to the third embodiment of the present invention.

First, as shown in FIG. 6A, an electrode 12 is printed using a silver-based glaze electrode paste on a substrate 11 whose main component is alumina having a purity of 96%, and then it is heated at 850 ° C. in a belt firing furnace. 5 minutes to 10 minutes, 30 minutes in total
The electrode 12 is formed by firing for 60 minutes.

Next, as shown in FIG. 6B, the first ladder type resistance path and the second ladder type resistance path of the main resistance path 13 of the resistor shown in the first embodiment between the electrodes 12. After printing a resistor formed by deforming the ladder steps in the same direction using a ruthenium oxide-based glaze resistance paste, the belt firing furnace is used at 850 ° C. for 5 minutes to 10 minutes, for a total of 30 minutes to 6
Bake for 0 minutes to form a resistor.

Next, as shown in FIG. 6C, the first ladder stage 14 is sequentially cut by a laser from the side closer to the main resistance path 13, and the second ladder stage 16 for fine adjustment is cut to obtain a desired one. The resistance value is roughly adjusted to the range in which the resistance value can be adjusted.

Next, as shown in FIG. 6D, the second ladder stage 16 is sequentially cut by a laser from either one, and the resistance value is finely adjusted to a desired resistance value to manufacture a resistor. It is a thing.

Further, the number of stages of the ladder stages of the ladder type resistance path is different depending on the resistor. The operation of the resistor constructed and manufactured as described above will be described below.

Similar to the resistor shown in the first embodiment, it is possible to adjust the resistance value with high precision by combining the ladder type resistance paths for the coarse adjustment and the fine adjustment. Resistance and pulse resistance are obtained, and the circuit is electrically equivalent to the resistor shown in the first embodiment, but a ladder-shaped resistance path that requires an area is very large in area on the substrate. Embodiment 1 can be arranged efficiently.
Can be designed with a smaller area than that shown in
Smaller resistors are possible.

(Fourth Embodiment) FIG. 7 is a plan view of a resistor according to a fourth embodiment of the present invention. 11 is alumina,
Substrates such as steatite, forsterite, beryllia, titania, glass, glass ceramics. Reference numeral 12 is an electrode made of silver, silver-palladium, copper, gold or the like, which is provided from a pair of opposing side surfaces of the substrate 11 to the front and back surfaces. 1
A main resistance path 3 is formed between the electrodes 12. 1
Reference numeral 4 denotes a first ladder stage, which is provided so as to be parallel to the main resistance path 13. Reference numeral 15 is a first connection resistance path which connects the first ladder stage 14 and is connected to the main resistance path 13.
The first ladder step 14 and the first connection resistance path 15 form a first ladder resistance path in which the ladder step is parallel to the main resistance path 13. Reference numeral 16 is a second ladder step extending vertically from the main resistance path 13. Reference numeral 17 is a second connection resistance path for connecting the second ladder stage 16. Second ladder stage 16 and second
The connection resistance path 17 forms a second ladder resistance path in which the ladder step extends vertically from the main resistance path 13. 1
3, 14, 15, and 17 are made of resistors such as ruthenium oxide. 16 is made of a conductor such as silver, silver-palladium, copper or gold. Reference numeral 18 denotes a first cutting groove formed when the first ladder step 14 is cut by a laser for coarse adjustment of the resistance value. Reference numeral 19 is a second cutting groove formed when the second ladder step 16 is cut by a laser for fine adjustment of the resistance value.

Regarding the resistor configured as described above,
The manufacturing method will be described below. FIG. 8 is a process diagram of a resistor according to the fourth embodiment of the present invention.

First, as shown in FIG. 8A, a second ladder step 16 composed of an electrode 12 and a conductor is printed on a substrate 11 whose main component is alumina having a purity of 96% by using a silver-based glaze electrode paste. Then, it is heated at 850 ° C for 5 hours in a belt baking furnace.
The second ladder step 16 including the electrode 12 and the conductor is formed by baking for 30 minutes to 60 minutes in total for 10 minutes to 10 minutes.

Next, as shown in FIG. 8B, the main resistance path 13 connected between the electrodes 12, the first ladder stage 14 provided in parallel with the main resistance path 13, and the first ladder step 14 are provided. A resistor composed of a first connection resistance path 15 for connecting the first ladder step 14 and the main resistance path 13 and a second connection resistance path 17 for connecting the second ladder step 16 made of a conductor is made of ruthenium oxide. After printing with the glaze resistance paste, baking is performed in a belt baking furnace at 850 ° C. for 5 minutes to 10 minutes, for a total of 30 minutes to 60 minutes to form a resistor.

Next, as shown in FIG. 8C, the first ladder stage 14 is cut by a laser in order from the one closer to the main resistance path 13, and the resistance value is cut by cutting the second ladder stage 16 for fine adjustment. Roughly adjust the resistance value to within the adjustable range.

Next, as shown in FIG. 8D, the second ladder stage 16 is sequentially cut by a laser from either one, and the resistance value is finely adjusted to a desired resistance value to manufacture a resistor. It is a thing.

Further, the number of stages of ladder steps of the ladder type resistance path is different depending on the resistor. The operation of the resistor constructed and manufactured as described above will be described below.

Similar to the resistor shown in the first embodiment, by combining the ladder type resistor paths for coarse adjustment and fine adjustment, it is possible to adjust the resistance value with high accuracy and to obtain excellent load characteristics and surge resistance. Resistance and pulse resistance are obtained, and when the second ladder stage 16 is cut by a laser, the reduction of the resistance width of the second ladder type resistance path is constant, so that the resistance of the second ladder stage 16 is reduced. The number of cuts and resistance change are proportional. This makes it possible to accurately predict a change in resistance value after cutting, which facilitates resistance value adjustment.

(Fifth Embodiment) FIG. 9 is a plan view of a resistor according to a fifth embodiment of the present invention. 11 is alumina,
Substrates such as steatite, forsterite, beryllia, titania, glass, glass ceramics. 12 is an electrode made of silver, silver-palladium, copper, gold or the like
Are provided from the pair of side surfaces facing each other to the front and back surfaces. A main resistance path 13 is formed between the electrodes 12. Reference numeral 20 is a first resistance value adjusting resistance path for forming the first cutting groove 18 perpendicularly to the main resistance path 13. Reference numeral 21 is a second resistance value adjusting resistance path that forms the second cutting groove 19 in parallel with the main resistance path 13. Reference numeral 18 denotes a first cutting groove formed when the first resistance value adjusting resistance path is cut by a laser perpendicularly to the main resistance path 13 for rough adjustment of the resistance value.
Reference numeral 19 denotes a second cutting groove formed when the second resistance value adjusting resistance path is cut by a laser in parallel with the main resistance path 13 for fine adjustment of the resistance value. Reference numerals 13, 20, 21 are made of resistors such as ruthenium oxide.

Regarding the resistor configured as described above,
The manufacturing method will be described below. FIG. 10 is a process diagram of a resistor according to the fifth embodiment of the present invention.

First, as shown in FIG. 10A, the purity is 96%.
After printing the electrode 12 using the silver-based glaze electrode paste on the substrate 11 containing alumina as the main component, the electrode is fired in a belt firing furnace at 850 ° C. for 5 minutes to 10 minutes, for a total of 30 minutes to 60 minutes. 12 is formed.

Next, as shown in FIG. 10B, the main resistance path 13 connected between the electrodes 12 and the first cutting groove 18 for coarse adjustment of the resistance value are formed perpendicularly to the main resistance path 13. From the first resistance value adjusting resistance path 20 and the second resistance value adjusting resistance path 21 forming the second cutting groove 19 for fine adjustment of the resistance value in parallel with the main resistance path 13. After printing the resulting resistor with a ruthenium oxide-based glaze resistance paste, a belt baking furnace is used at 850 ° C. for 5 minutes to 10 minutes, for a total of 3
Bake for 0 to 60 minutes to form a resistor.

Next, as shown in FIG. 10C, the first resistance value adjusting resistance path 20 is cut from the side closer to the main resistance path 13 with a laser, and the second resistance value adjusting for fine adjustment is performed. The resistance value is roughly adjusted to a range in which the resistance value can be adjusted to a desired value by cutting the use resistance path 21.

Next, as shown in FIG. 10D, the second resistance value adjusting resistance path 21 is cut from one of them by a laser, and the resistance value is finely adjusted to a desired resistance value. It is to manufacture a container.

The length of the resistance value adjusting resistance path to be cut depends on the resistor.

The operation of the resistor constructed and manufactured as described above will be described below.

When the first resistance value adjusting resistance path 20 is cut from the direction close to the main resistance path 13, the resistance path length greatly increases and the resistance value increases largely, so that it is suitable for the rough adjustment of the resistance value. There is. When the second resistance value adjusting resistance path 21 is cut from either one, the resistance path length does not increase and the resistance width only decreases, so the resistance value does not increase so much and the cutting distance and the resistance value increase. Since it is almost proportional, it is suitable for fine adjustment of the resistance value.

For example, -10% to -2% of the desired resistance value
Rough adjustment of the resistance value up to the vicinity is performed by cutting the first resistance value adjusting resistance path 20, and then the second resistance value adjusting resistance path 21.
The resistance value can be adjusted to ± 0.1% to ± 1% of the desired resistance value by cutting. As described above, with the resistor pattern which is easy to manufacture, the resistance value can be adjusted with higher accuracy.

Further, since the resistor pattern has a long resistance path length, the power consumption is dispersed without being concentrated in the damaged portion due to the heat of the laser, so that the resistor having excellent load characteristics, pulse resistance and surge resistance. Is obtained.

If the position of the cutting groove of the second resistance value adjusting resistance path 21 is far from the main resistance path, the increase in resistance value during cutting can be made smaller, and more accurate resistance value adjustment can be performed. Easily possible. Further, by making the resistance widths of the first and second resistance value adjusting resistance paths 20 and 21 wider than the resistance width of the main resistance path, it is possible to further reduce the concentration of power consumption on the damaged portion due to the heat of the laser. Because of its excellent load characteristics,
A resistor having pulse resistance and surge resistance can be obtained.

(Sixth Embodiment) FIG. 11 is a plan view of a resistor according to a sixth embodiment of the present invention. Reference numeral 11 is a substrate of alumina, steatite, forsterite, beryllia, titania, glass, glass ceramic or the like. 12
Is an electrode made of silver, silver-palladium, copper, gold or the like, and the substrate 1
It is provided from a pair of side surfaces facing each other to the front and back surfaces. A main resistance path 13 is formed between the electrodes 12. Reference numeral 14 denotes a first ladder step, which is provided so as to be parallel to the main resistance path 13. 15 is the first ladder stage 14
Is a first connection resistance path connected to the main resistance path 13. The first ladder step 14 and the first connection resistance path 15 form a first ladder resistance path in which the ladder step is parallel to the main resistance path 13. Reference numeral 18 is a first cutting groove formed when the first ladder step is cut by a laser for coarse adjustment of the resistance value. Reference numeral 21 is a second resistance value adjusting resistance path that forms the second cutting groove 19 in parallel with the main resistance path 13. Reference numeral 19 denotes a second cutting groove formed when the second resistance value adjusting resistance path 21 is cut in parallel with the main resistance path 13 by a laser for fine adjustment of the resistance value. Reference numerals 13, 14, 15, 21 are made of resistors such as ruthenium oxide.

Regarding the resistor configured as described above,
The manufacturing method will be described below. FIG. 12 is a process diagram of a resistor according to the sixth embodiment of the present invention.

First, as shown in FIG. 12A, the purity is 96%.
After printing the electrode 12 using the silver-based glaze electrode paste on the substrate 11 containing alumina as a main component, the electrode is fired at 850 ° C. for 5 minutes to 10 minutes by a belt firing path, for a total of 30 minutes to 60 minutes. 12 is formed.

Next, as shown in FIG. 12B, the main resistance path 13 connected between the electrodes 12, the first ladder stage 14 provided in parallel with the main resistance path 13, and the first ladder stage 14 are provided. A first connection resistance path 15 that connects the first ladder stage 14 to the main resistance path 13 and a second cutting groove 19 for fine adjustment of the resistance value.
After printing a resistor composed of the second resistance value adjusting resistance path 21 which is formed in parallel with the main resistance path 13 using a ruthenium oxide-based glaze resistance paste, the
A resistor is formed by firing at 0 ° C. for 5 minutes to 10 minutes, for a total of 30 minutes to 60 minutes.

Next, as shown in FIG. 12C, the first ladder stage 14 is sequentially cut from the side closer to the main resistance path 13 by a laser, and the second resistance value adjusting resistance path 21 for fine adjustment is cut. The resistance value is roughly adjusted to the range in which the desired resistance value can be adjusted by cutting.

Next, as shown in FIG. 12 (d), the second resistance value adjusting resistance path 21 is cut from one of them by a laser, and the resistance value is finely adjusted to a desired resistance value. It is to manufacture a container.

Further, it depends on the resistor whether the ladder stage of the ladder type resistance path is cut or how long the resistance value adjusting resistance path is cut.

The operation of the resistor constructed and manufactured as described above will be described below.

When the first ladder stage 14 which is the ladder stage of the first ladder type resistance path is cut, the resistance path length increases greatly,
Since the increase in the resistance value becomes large, it is suitable for coarse adjustment of the resistance value. When the second resistance value adjusting resistance path 21 is cut in parallel with the main resistance path, the resistance path length does not increase and the resistance width only decreases, so that the resistance value does not increase so much and the cutting distance and the resistance value Since the rise is almost proportional, it is suitable for fine adjustment of the resistance value.

For example, -10% to -2% of the predetermined resistance value
The rough adjustment of the resistance value up to the vicinity is performed by cutting the first ladder stage 14, and then the second resistance value adjusting resistance path 21 is cut to reduce the resistance value to ± 0.1% to ± 1% of the desired resistance value. You can adjust the value. As described above, with the resistor pattern which is easy to manufacture, the resistance value can be adjusted with higher accuracy.

Further, in the ladder type resistance path, since the ladder is completely cut by the laser, no current flows in the portion damaged by the heat of the laser, so that the resistance value adjusting resistance path is damaged by the laser heat. Since the power consumption is not concentrated and dispersed in the part, a resistor having better load characteristics, pulse resistance, and surge resistance can be obtained.

If the position of the cutting groove of the second resistance value adjusting resistance path 21 is far from the main resistance path, the increase of the resistance value at the time of cutting can be made smaller, and the resistance value can be adjusted with higher accuracy. Easily possible.

(Seventh Embodiment) FIG. 13 is a plan view of a resistor according to a seventh embodiment of the present invention. Reference numeral 11 is a substrate of alumina, steatite, forsterite, beryllia, titania, glass, glass ceramic or the like. 12
Is an electrode made of silver, silver-palladium, copper, gold or the like, and the substrate 1
It is provided from a pair of side surfaces facing each other to the front and back surfaces. A main resistance path 13 is formed between the electrodes 12 so that the cutting grooves of the first and second resistance value adjusting resistance paths 20 and 21 meander in the same direction. Reference numeral 20 is a first resistance value adjusting resistance path for forming the first cutting groove 18 perpendicularly to the main resistance path 13. Reference numeral 21 is a second resistance value adjusting resistance path that forms the second cutting groove 19 in parallel with the main resistance path 13. Reference numeral 18 denotes a first cutting groove formed when the first resistance value adjusting resistance path is cut by a laser perpendicularly to the main resistance path 13 for rough adjustment of the resistance value. Reference numeral 19 denotes a second resistance value adjusting resistance path 21 for main resistance path 1 for fine adjustment of the resistance value.
Second formed when laser cutting in parallel with 3
It is a cutting groove. Reference numerals 13, 20, 21 are made of resistors such as ruthenium oxide.

Regarding the resistor configured as described above,
The manufacturing method will be described below. FIG. 14 is a process diagram of a resistor according to the seventh embodiment of the present invention.

First, as shown in FIG. 14A, the purity is 96%.
After printing the electrode 12 using the silver-based glaze electrode paste on the substrate 11 containing alumina as the main component, the electrode is fired in a belt firing furnace at 850 ° C. for 5 minutes to 10 minutes, for a total of 30 minutes to 60 minutes. 12 is formed.

Next, as shown in FIG. 14B, the main resistance path 13 connected between the electrodes 12 and the first cutting groove 18 for coarse adjustment of the resistance value are formed perpendicularly to the main resistance path 13. From the first resistance value adjusting resistance path 20 and the second resistance value adjusting resistance path 21 forming the second cutting groove 19 for fine adjustment of the resistance value in parallel with the main resistance path 13. After printing the resulting resistor with a ruthenium oxide-based glaze resistance paste, a belt baking furnace is used at 850 ° C. for 5 minutes to 10 minutes, for a total of 3
Bake for 0 to 60 minutes to form a resistor.

Next, as shown in FIG. 14C, the first resistance value adjusting resistance path 20 is cut from the side closer to the main resistance path 13 with a laser, and the second resistance value adjusting for fine adjustment is performed. The resistance value is roughly adjusted to a range in which the resistance value can be adjusted to a desired value by cutting the use resistance path 21.

Next, as shown in FIG. 14D, the second resistance value adjusting resistance path 21 is cut with a laser from one of them, and the resistance value is finely adjusted to a desired resistance value. It is to manufacture a container.

The length of the resistance value adjusting resistance path to be cut depends on the resistor.

The operation of the resistor constructed and manufactured as described above will be described below.

Similar to the resistor shown in the fifth embodiment, it is possible to adjust the resistance value with high precision by combining the resistance paths for adjusting the resistance value for the coarse adjustment and the resistance value for the fine adjustment. A resistor having surge resistance and pulse resistance can be obtained, and a resistor pattern, which is an electrically equivalent circuit to the resistor shown in the fifth embodiment, requires a large area on the substrate. Since it can be arranged very efficiently, it can be designed in a smaller area than that shown in the fifth embodiment, and a smaller resistor can be realized.

(Embodiment 8) FIG. 15 is a plan view of a resistor according to Embodiment 8 of the present invention. Reference numeral 11 is a substrate of alumina, steatite, forsterite, beryllia, titania, glass, glass ceramic or the like. 12
Is an electrode made of silver, silver-palladium, copper, gold or the like, and the substrate 1
It is provided from a pair of side surfaces facing each other to the front and back surfaces. Reference numeral 13 is a main resistance path, and the cutting groove of the ladder step of the first ladder type resistance path and the cutting groove of the second resistance value adjusting resistance path meander so as to be vertical and are formed between the electrodes 12. 14
Is a first ladder stage and is provided so as to be parallel to the main resistance path 13. 15 connects the first ladder step 14,
It is a first connection resistance path connected to the main resistance path 13. First
The ladder stage 14 and the first connection resistance path 15 form a first ladder resistance path in which the ladder step is parallel to the main resistance path 13. Reference numeral 18 is a first cutting groove formed when the first ladder step is cut by a laser for coarse adjustment of the resistance value.
Reference numeral 21 is a second resistance value adjusting resistance path that forms the second cutting groove 19 in parallel with the main resistance path 13. Reference numeral 19 denotes a second resistance value adjusting resistance path 21 for main resistance path 1 for fine adjustment of the resistance value.
Second formed when cutting with a laser parallel to 3
It is a cutting groove. Reference numerals 13, 14, 15, 21 are made of resistors such as ruthenium oxide.

Regarding the resistor configured as described above,
The manufacturing method will be described below. FIG. 16 is a process diagram of a resistor according to the eighth embodiment of the present invention.

First, as shown in FIG. 16A, the purity is 96%.
After printing the electrode 12 using the silver-based glaze electrode paste on the substrate 11 containing alumina as the main component, the electrode is fired in a belt firing furnace at 850 ° C. for 5 minutes to 10 minutes, for a total of 30 minutes to 60 minutes. 12 is formed.

Next, as shown in FIG. 16B, a main resistance path 13 connected between the electrodes 12, a first ladder stage 14 provided in parallel with the main resistance path 13, and A first connection resistance path 15 that connects the first ladder stage 14 to the main resistance path 13 and a second cutting groove 19 for fine adjustment of the resistance value.
After the resistor formed of the second resistance value adjusting resistance path 21 which is formed in parallel with the main resistance path 13 is printed by using the ruthenium oxide-based grace resistance paste,
A resistor is formed by firing at 50 ° C. for 5 minutes to 10 minutes, for a total of 30 minutes to 60 minutes.

Next, as shown in FIG. 16 (c), the first ladder stage 14 is sequentially cut from the side closer to the main resistance path 13 with a laser, and the second resistance value adjusting resistance path 21 for fine adjustment is cut. The resistance value is roughly adjusted to the range in which the desired resistance value can be adjusted by cutting.

Next, as shown in FIG. 16D, the second resistance value adjusting resistance path 21 is cut with a laser from one of them, and the resistance value is finely adjusted to a desired resistance value. It is to manufacture a container.

Further, it depends on the resistor whether the ladder stage of the ladder type resistance path is cut or how long the resistance value adjusting resistance path is cut.

The operation of the resistor constructed and manufactured as described above will be described below.

Similar to the resistor shown in the sixth embodiment, the resistance value adjustment can be performed with high accuracy by combining the rough adjustment ladder resistance path and the fine adjustment resistance value adjustment resistance path. A resistor having load characteristics, surge resistance, and pulse resistance can be obtained, and a resistor pattern which is an electrically equivalent circuit to the resistor shown in the sixth embodiment but requires an area is formed on the substrate. Since it can be arranged very efficiently in terms of area, it can be designed with a smaller area than that shown in the sixth embodiment, and a smaller resistor can be realized.

(Ninth Embodiment) FIG. 17 is a plan view of a resistor according to a ninth embodiment. Reference numeral 11 is a substrate of alumina, steatite, forsterite, beryllia, titania, glass, glass ceramic or the like. 12 is silver, silver-
Electrodes made of palladium, copper, gold or the like are provided from the pair of opposed side surfaces of the substrate 11 to the front and back surfaces. Thirteen
Is a main resistance path, which meanders and is formed between the electrodes 12. Reference numeral 22 is a resistance value adjusting resistance path for forming the first cutting groove 18 perpendicularly to the main resistance path 13. Reference numeral 18 denotes a first cutting groove formed when the resistance value adjusting resistance path 22 is cut perpendicularly to the main resistance path 13 by a laser for coarse adjustment of the resistance value. Reference numeral 19 is the first cutting groove 1 for fine adjustment of the resistance value.
8 is a second cutting groove which is formed when the resistance value adjusting resistance path 22 is adjacent to 8 and is cut perpendicularly to the main resistance path 13 by a laser. The main resistance path 13 and the resistance value adjusting resistance path 22 are made of a resistor such as ruthenium oxide.

Regarding the resistor configured as described above,
The manufacturing method will be described below. FIG. 18 is a process diagram of a resistor according to the ninth embodiment of the present invention.

First, as shown in FIG. 18A, the purity is 96%.
After printing the electrode 12 using the silver-based glaze electrode paste on the substrate 11 containing alumina as the main component, the electrode is fired in a belt firing furnace at 850 ° C. for 5 minutes to 10 minutes, for a total of 30 minutes to 60 minutes. 12 is formed.

Next, as shown in FIG. 18B, the meandering main resistance path 13 connected between the electrodes 12, the first cutting groove 18 for adjusting the resistance value, and the second cutting groove 18 for adjusting the resistance value. After printing a resistor consisting of a resistance value adjusting resistance path 22 in which 19 is formed perpendicularly to the main resistance path 13 using a ruthenium oxide glaze resistance paste, a belt firing furnace is used at 850 ° C. for 5 minutes to 10 minutes in total. Bake for 30 to 60 minutes to form a resistor.

Next, as shown in FIG. 18C, the resistance value adjusting resistance path 22 is cut from the side closer to the main resistance path 13 with a laser and adjusted to a desired resistance value by the first cutting groove 18. Roughly adjust the resistance value to the range that allows.

Next, as shown in FIG. 18D, the resistance value adjusting resistance path 22 is provided adjacent to the first cutting groove 18 and the main resistance path 1 is formed.
Laser is cut from the side closer to 3 and the resistance value is finely adjusted by the second cutting groove 19 to obtain a desired resistance value, and a resistor is manufactured.

The length of the resistance value adjusting resistance path 22 cut depends on the resistor.

The operation of the resistor constructed and manufactured as described above will be described below.

When the resistance value adjusting resistance path 22 is cut from the direction close to the main resistance path 13, the resistance path length greatly increases,
Since the increase in the resistance value becomes large, it is suitable for coarse adjustment of the resistance value. When cutting is made just beside the cutting groove from a direction close to the main resistance path 13, the resistance path length does not increase and the resistance width only decreases, so that the resistance value does not increase so much and the cutting distance and the resistance value increase. Since it is almost proportional, it is suitable for fine adjustment of the resistance value.

For example, -10% to -2% of the desired resistance value
The resistance value can be roughly adjusted to the vicinity by the first cutting, and then the second cutting can adjust the resistance value to ± 0.1% to ± 1% of the desired resistance value. As described above, with the resistor pattern which is easy to manufacture, the resistance value can be adjusted with higher accuracy.

Further, since the resistor pattern has a long resistance path length, the power consumption is dispersed without being concentrated in the portion damaged by the heat of the laser, so that the resistor having excellent load characteristics, pulse resistance and surge resistance. Is obtained.

In the above description, the electrodes and the resistors are formed by printing and firing a silver-based glaze electrode paste and a ruthenium oxide-based glaze resistance paste, respectively, but the same applies to other electrode pastes and resistance pastes. The same applies when the electrodes and resistors are formed by plating, vapor deposition, or sputtering.

Further, by rounding the meandering portion angle of the main resistance path 13, current concentration at the meandering portion can be alleviated, so that load characteristics, surge resistance, and pulse resistance can be improved.

[0122]

As described above, according to the present invention, the first ladder type resistance path for coarse adjustment or the first resistance value adjustment resistance path and the second ladder type resistance path for fine adjustment or the first ladder type resistance path for fine adjustment. Since the resistor pattern includes the resistance path for resistance adjustment of No. 2, the resistance value can be adjusted with high accuracy, and even after the resistance value adjustment,
In the damaged part of the resistor caused by laser trimming, the power consumption is not concentrated but dispersed, so the load characteristics,
The advantageous effect that a resistor having excellent surge resistance and pulse resistance can be provided is obtained.

[Brief description of drawings]

FIG. 1 is a plan view of a resistor according to an embodiment of the present invention.

[Fig. 2]

FIG. 3 is a plan view of a resistor according to the second embodiment of the present invention.

[Fig. 4] Same process drawing

FIG. 5 is a plan view of a resistor according to a third embodiment of the present invention.

FIG. 6

FIG. 7 is a plan view of a resistor according to a fourth embodiment of the present invention.

FIG. 8

FIG. 9 is a plan view of a resistor according to a fifth embodiment of the present invention.

FIG. 10

FIG. 11 is a plan view of a resistor according to a sixth embodiment of the present invention.

FIG. 12

FIG. 13 is a plan view of a resistor according to a seventh embodiment of the present invention.

FIG. 14 is the same process diagram

FIG. 15 is a plan view of a resistor according to the eighth embodiment of the present invention.

FIG. 16

FIG. 17 is a plan view of a resistor according to a ninth embodiment of the present invention.

FIG. 18

FIG. 19 is a plan view of a conventional resistor.

[Explanation of symbols]

 Reference Signs List 11 substrate 12 electrode 13 main resistance path 14 first ladder stage 15 first connection resistance path 16 second ladder stage 17 second connection resistance path 18 first cutting groove 19 second cutting groove 20 first resistance value Adjustment resistance path 21 Second resistance value adjustment resistance path

Claims (18)

[Claims] 1. A substrate, a pair of electrodes provided on a side portion of an upper surface of the substrate, a main resistance path electrically connected between the electrodes, and a ladder step in the main resistance path in a part of the main resistance path. A resistor comprising a first ladder resistance path provided parallel to the path and a second ladder resistance path having a ladder step extending in a direction perpendicular to the main resistance path. 2. The resistor according to claim 1, wherein the resistance width of the resistance path connecting the ladder stages of the second ladder-shaped resistance path is narrower than the resistance width of the main resistance path. 3. The resistor according to claim 1, wherein the resistance of the resistance path connecting the ladder stages of the second ladder-shaped resistance path is higher than that of the main resistance path. 4. The ladder stage of the first and second ladder-shaped resistance paths comprises:
The main resistance path meanders in the same direction.
The resistor as described. 5. The resistor according to claim 1, wherein the ladder stage of the second ladder resistance path is made of a conductor. 6. A substrate, a pair of electrodes provided on a side portion of an upper surface of the substrate, a main resistance path electrically connected between the electrodes, and a cutting groove as a main part of the main resistance path. A first resistance value adjusting resistance path provided so as to be perpendicular to the resistance path;
A resistor comprising a second resistance value adjusting resistance path provided such that a cutting groove is parallel to the main resistance path. 7. A substrate, a pair of electrodes provided on a side portion of an upper surface of the substrate, a main resistance path electrically connected between the electrodes, and a ladder step in the main resistance path in a part of the main resistance path. A resistor comprising a first ladder-shaped resistance path provided so as to be parallel to the path, and a second resistance value adjusting resistance path provided so that the cutting groove is parallel to the main resistance path. 8. A substrate, a pair of electrodes provided on a side portion of an upper surface of the substrate, a meandering main resistance path electrically connected between the electrodes, and two main resistance paths provided in a part of the main resistance path. A resistor comprising a resistance path for adjusting a resistance value provided so that the cutting groove of is perpendicular to the main resistance path. 9. The resistor according to claim 6, wherein the main resistance path meanders such that the cutting grooves of the first and second resistance value adjusting resistance paths are in the same direction. 10. The resistor according to claim 7, wherein the main resistance path meanders such that the ladder step of the first ladder resistance path and the cutting groove of the second resistance value adjusting resistance path are vertical. 11. The resistor according to claim 6, wherein the resistance width of the first and second resistance value adjusting resistance paths is wider than the resistance width of the main resistance path. 12. The resistor according to claim 4, wherein the meandering portion of the main resistance path has a rounded corner. 13. A pair of electrodes is provided on a side portion of an upper surface of a substrate, a main resistance path electrically connected between the electrodes, and a ladder step in a part of the main resistance path is parallel to the main resistance path. A first ladder-shaped resistance path and a second ladder-shaped resistance path having a ladder step extending vertically to the main resistance path, and a first ladder-shaped resistance path is provided. Of the resistor which performs the coarse adjustment of the resistance value by cutting the ladder stages in order from the one closer to the main resistance path, and finely adjusts the resistance value by cutting the ladder stage sequentially from either one of the second ladder type resistance path. Production method. 14. A pair of electrodes is provided on a side portion of an upper surface of a substrate, and a main resistance path electrically connected between the electrodes, and a ladder step in a part of the main resistance path is parallel to the main resistance path. A resistor having a first ladder-shaped resistance path and a ladder step extending in the vertical direction to the main resistance path, and the main resistance path is a resistance body having a higher specific resistance than the resistance body. From the first ladder resistance path, the ladder steps extending vertically from the first ladder resistance path are connected to each other to form a resistance path that constitutes a second ladder resistance path. The method of manufacturing a resistor in which the resistance value is finely adjusted by coarsely adjusting the resistance value and cutting the ladder stage in order from either one of the second ladder resistance paths. 15. A pair of electrodes is provided on a side portion of an upper surface of a substrate, a main resistance path electrically connected between the electrodes, and a ladder step is arranged in parallel with the main resistance path in a part of the main resistance path. A resistor comprising a first ladder-shaped resistor path provided in
A second resistor is provided parallel to and independent of the main resistance path, and a ladder step is connected by a conductor to connect the second resistance body and the main resistance path to form a second ladder-shaped resistance path. Roughly adjust the resistance value by cutting the ladder stages in order from the one closer to the main resistance route of the ladder type resistance line, and finely adjust the resistance value by cutting the ladder stage in order from either one of the second ladder type resistance route. Method of manufacturing resistor. 16. A pair of electrodes is provided on a side portion of an upper surface of a substrate, a main resistance path electrically connected between the electrodes, and a resistance is formed by cutting a part of the main resistance path perpendicularly to the main resistance path. A resistance body including a first resistance value adjusting resistance path for adjusting a value and a second resistance value adjusting resistance path for adjusting a resistance value by cutting in parallel with the main resistance path is provided. The resistance line for resistance adjustment is roughly adjusted by cutting the first resistance line for resistance value adjustment in a direction perpendicular to the main resistance line from the side closer to A method of manufacturing a resistor in which the resistance value is finely adjusted by cutting in parallel with. 17. A main resistance path electrically provided between a pair of electrodes provided on a side portion of an upper surface of a substrate, and a ladder step is parallel to the main resistance path in a part of the main resistance path. A first ladder-shaped resistance path and a second resistance-value adjusting resistance path for adjusting a resistance value by cutting in parallel with the main resistance path, and a first ladder-shaped resistance path is provided. The resistance value is roughly adjusted by cutting the ladder stages in order from the one closer to the main resistance path of the resistance path, and the second resistance value adjusting resistance path is cut parallel to the main resistance path from either one of the resistance values. A method of manufacturing a resistor for fine adjustment. 18. A pair of electrodes is provided on a side portion of an upper surface of a substrate, and a meandering main resistance path electrically connected between the electrodes and a part of the main resistance path is cut perpendicularly to the main resistance path. A resistance body consisting of a resistance value adjusting resistance path for adjusting the resistance value is provided, and the resistance value adjusting resistance path is cut in a direction perpendicular to the main resistance path from the side closer to the main resistance path to roughly adjust the resistance value. The resistance that finely adjusts the resistance value by cutting the resistance value adjusting resistance path in the direction perpendicular to the main resistance path from the side close to the main resistance path adjacent to the cutting groove formed during rough adjustment. Manufacturing method.