CN1257307C - 双扫描薄膜处理系统 - Google Patents
双扫描薄膜处理系统 Download PDFInfo
- Publication number
- CN1257307C CN1257307C CN 01814155 CN01814155A CN1257307C CN 1257307 C CN1257307 C CN 1257307C CN 01814155 CN01814155 CN 01814155 CN 01814155 A CN01814155 A CN 01814155A CN 1257307 C CN1257307 C CN 1257307C
- Authority
- CN
- China
- Prior art keywords
- scanning
- deposition
- motion
- ion beam
- target
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/228—Gas flow assisted PVD deposition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
- C23C14/044—Coating on selected surface areas, e.g. using masks using masks using masks to redistribute rather than totally prevent coating, e.g. producing thickness gradient
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/46—Sputtering by ion beam produced by an external ion source
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US21704900P | 2000-07-10 | 2000-07-10 | |
US60/217,049 | 2000-07-10 | ||
US09/840,394 US6669824B2 (en) | 2000-07-10 | 2001-04-23 | Dual-scan thin film processing system |
US09/840,394 | 2001-04-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1447865A CN1447865A (zh) | 2003-10-08 |
CN1257307C true CN1257307C (zh) | 2006-05-24 |
Family
ID=26911563
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 01814155 Expired - Fee Related CN1257307C (zh) | 2000-07-10 | 2001-07-09 | 双扫描薄膜处理系统 |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1301651A2 (fr) |
JP (1) | JP2004533538A (fr) |
CN (1) | CN1257307C (fr) |
AU (1) | AU2001273260A1 (fr) |
WO (1) | WO2002004695A2 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107636196A (zh) * | 2015-05-14 | 2018-01-26 | 瓦里安半导体设备公司 | 多层沉积装置及方法 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104378904B (zh) * | 2014-11-20 | 2017-01-18 | 大连理工大学 | 一种体产生负氢离子机制的等离子体腔室 |
CN106987817B (zh) * | 2017-04-17 | 2019-03-29 | 同济大学 | 一种提高线型磁控溅射靶枪在凹形柱面基底镀膜质量的方法 |
JP2020023739A (ja) * | 2018-08-08 | 2020-02-13 | 株式会社アルバック | イオンビームスパッタリング装置及びイオンビームスパッタリング方法 |
JP2020026539A (ja) * | 2018-08-09 | 2020-02-20 | 株式会社アルバック | イオンビームスパッタリング装置及びイオンビームスパッタリング方法 |
CN114703455B (zh) * | 2022-02-21 | 2023-11-28 | 松山湖材料实验室 | 组合薄膜制备方法及装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2959023B2 (ja) * | 1990-02-23 | 1999-10-06 | 日本電気株式会社 | イオンビームスパッタ装置 |
JP3074712B2 (ja) * | 1990-08-31 | 2000-08-07 | 日本電気株式会社 | 銀の単結晶薄膜および金属人工格子の製造方法 |
US5356673A (en) * | 1991-03-18 | 1994-10-18 | Jet Process Corporation | Evaporation system and method for gas jet deposition of thin film materials |
JPH05170448A (ja) * | 1991-12-26 | 1993-07-09 | Matsushita Electric Ind Co Ltd | セラミックス薄膜の製造方法 |
JP3452617B2 (ja) * | 1993-12-10 | 2003-09-29 | 真空冶金株式会社 | ガスデポジション装置 |
US5571332A (en) * | 1995-02-10 | 1996-11-05 | Jet Process Corporation | Electron jet vapor deposition system |
DE19513918C1 (de) * | 1995-04-12 | 1996-11-07 | Fraunhofer Ges Forschung | Verfahren zur Beschichtung von sub-Mikrometerstrukturen und seine Anwendung |
JPH1026698A (ja) * | 1996-07-12 | 1998-01-27 | Nikon Corp | 真空薄膜形成装置及び反射鏡の製造方法 |
JP3861329B2 (ja) * | 1996-07-17 | 2006-12-20 | 株式会社ニコン | 真空薄膜形成装置及び反射鏡の製造方法 |
US6086727A (en) * | 1998-06-05 | 2000-07-11 | International Business Machines Corporation | Method and apparatus to improve the properties of ion beam deposited films in an ion beam sputtering system |
JP3081844B2 (ja) * | 1998-08-26 | 2000-08-28 | 日本電信電話株式会社 | 光フィルタの製造方法 |
-
2001
- 2001-07-09 AU AU2001273260A patent/AU2001273260A1/en not_active Abandoned
- 2001-07-09 WO PCT/US2001/021517 patent/WO2002004695A2/fr active Application Filing
- 2001-07-09 JP JP2002509548A patent/JP2004533538A/ja active Pending
- 2001-07-09 EP EP01952519A patent/EP1301651A2/fr not_active Withdrawn
- 2001-07-09 CN CN 01814155 patent/CN1257307C/zh not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107636196A (zh) * | 2015-05-14 | 2018-01-26 | 瓦里安半导体设备公司 | 多层沉积装置及方法 |
CN107636196B (zh) * | 2015-05-14 | 2020-03-06 | 瓦里安半导体设备公司 | 多层沉积处理装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2002004695A3 (fr) | 2002-06-20 |
JP2004533538A (ja) | 2004-11-04 |
WO2002004695A2 (fr) | 2002-01-17 |
EP1301651A2 (fr) | 2003-04-16 |
CN1447865A (zh) | 2003-10-08 |
AU2001273260A1 (en) | 2002-01-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20060524 Termination date: 20100709 |