CN1254789C - 具有空气支承表面的自旋阀传感器、磁头、磁盘驱动器及制造方法 - Google Patents

具有空气支承表面的自旋阀传感器、磁头、磁盘驱动器及制造方法 Download PDF

Info

Publication number
CN1254789C
CN1254789C CNB998141038A CN99814103A CN1254789C CN 1254789 C CN1254789 C CN 1254789C CN B998141038 A CNB998141038 A CN B998141038A CN 99814103 A CN99814103 A CN 99814103A CN 1254789 C CN1254789 C CN 1254789C
Authority
CN
China
Prior art keywords
layer
nailed
valve sensor
spin
ferromagnetic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB998141038A
Other languages
English (en)
Other versions
CN1329742A (zh
Inventor
M·皮纳巴斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Maxell Digital Products China Co Ltd
Original Assignee
Hitachi Global Storage Technologies Netherlands BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Global Storage Technologies Netherlands BV filed Critical Hitachi Global Storage Technologies Netherlands BV
Publication of CN1329742A publication Critical patent/CN1329742A/zh
Application granted granted Critical
Publication of CN1254789C publication Critical patent/CN1254789C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y25/00Nanomagnetism, e.g. magnetoimpedance, anisotropic magnetoresistance, giant magnetoresistance or tunneling magnetoresistance
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127Structure or manufacture of heads, e.g. inductive
    • G11B5/33Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only
    • G11B5/39Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00Arrangements or instruments for measuring magnetic variables
    • G01R33/02Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/06Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
    • G01R33/09Magnetoresistive devices
    • G01R33/093Magnetoresistive devices using multilayer structures, e.g. giant magnetoresistance sensors
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127Structure or manufacture of heads, e.g. inductive
    • G11B5/33Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only
    • G11B5/39Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects
    • G11B5/3903Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects using magnetic thin film layers or their effects, the films being part of integrated structures
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127Structure or manufacture of heads, e.g. inductive
    • G11B5/33Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only
    • G11B5/39Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects
    • G11B5/3903Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects using magnetic thin film layers or their effects, the films being part of integrated structures
    • G11B5/3906Details related to the use of magnetic thin film layers or to their effects
    • G11B5/3929Disposition of magnetic thin films not used for directly coupling magnetic flux from the track to the MR film or for shielding
    • G11B5/3932Magnetic biasing films
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127Structure or manufacture of heads, e.g. inductive
    • G11B5/33Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only
    • G11B5/39Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects
    • G11B5/3903Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects using magnetic thin film layers or their effects, the films being part of integrated structures
    • G11B5/3967Composite structural arrangements of transducers, e.g. inductive write and magnetoresistive read
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00Thin magnetic films, e.g. of one-domain structure
    • H01F10/32Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
    • H01F10/324Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
    • H01F10/3268Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the exchange coupling being asymmetric, e.g. by use of additional pinning, by using antiferromagnetic or ferromagnetic coupling interface, i.e. so-called spin-valve [SV] structure, e.g. NiFe/Cu/NiFe/FeMn
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127Structure or manufacture of heads, e.g. inductive
    • G11B5/33Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only
    • G11B5/39Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects
    • G11B2005/3996Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects large or giant magnetoresistive effects [GMR], e.g. as generated in spin-valve [SV] devices
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127Structure or manufacture of heads, e.g. inductive
    • G11B5/33Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only
    • G11B5/39Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects
    • G11B5/3903Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects using magnetic thin film layers or their effects, the films being part of integrated structures
    • G11B5/3906Details related to the use of magnetic thin film layers or to their effects
    • G11B5/3945Heads comprising more than one sensitive element
    • G11B5/3948Heads comprising more than one sensitive element the sensitive elements being active read-out elements
    • G11B5/3951Heads comprising more than one sensitive element the sensitive elements being active read-out elements the active elements being arranged on several parallel planes
    • G11B5/3954Heads comprising more than one sensitive element the sensitive elements being active read-out elements the active elements being arranged on several parallel planes the active elements transducing on a single track
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/4902Electromagnet, transformer or inductor
    • Y10T29/49021Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/4902Electromagnet, transformer or inductor
    • Y10T29/49021Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
    • Y10T29/49027Mounting preformed head/core onto other structure
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/4902Electromagnet, transformer or inductor
    • Y10T29/49021Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
    • Y10T29/49032Fabricating head structure or component thereof
    • Y10T29/49036Fabricating head structure or component thereof including measuring or testing
    • Y10T29/49041Fabricating head structure or component thereof including measuring or testing with significant slider/housing shaping or treating
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/4902Electromagnet, transformer or inductor
    • Y10T29/49021Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
    • Y10T29/49032Fabricating head structure or component thereof
    • Y10T29/49036Fabricating head structure or component thereof including measuring or testing
    • Y10T29/49043Depositing magnetic layer or coating
    • Y10T29/49044Plural magnetic deposition layers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/4902Electromagnet, transformer or inductor
    • Y10T29/49021Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
    • Y10T29/49032Fabricating head structure or component thereof
    • Y10T29/49036Fabricating head structure or component thereof including measuring or testing
    • Y10T29/49043Depositing magnetic layer or coating
    • Y10T29/49046Depositing magnetic layer or coating with etching or machining of magnetic material
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/4902Electromagnet, transformer or inductor
    • Y10T29/49021Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
    • Y10T29/49032Fabricating head structure or component thereof
    • Y10T29/49048Machining magnetic material [e.g., grinding, etching, polishing]
    • Y10T29/49052Machining magnetic material [e.g., grinding, etching, polishing] by etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Power Engineering (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Magnetic Heads (AREA)
  • Hall/Mr Elements (AREA)
  • Thin Magnetic Films (AREA)
  • Magnetic Ceramics (AREA)
  • Measuring Magnetic Variables (AREA)

Abstract

底部自旋阀传感器使用用于氧化镍(NiO)反铁磁钉扎层(212)的籽晶层(201),目的是提高传感器的磁致电阻(dR/R)。自旋阀传感器可以是简单自旋阀或反平行(AP)自旋阀传感器。籽晶层是钽氧化物(TayOx)或铜(Cu)。

Description

具有空气支承表面的自旋阀传感器、磁头、磁盘驱动器及制造方法
技术领域
本发明涉及用于氧化镍(NiO)钉扎层的籽晶层,用于提高自旋阀传感器的磁致电阻,并且尤其涉及在底部自旋阀传感器的第一间隙层与氧化镍(NiO)钉扎层之间的籽晶层,用于提高传感器的磁致电阻。
背景技术
读出头使用自旋阀传感器来在移动的磁性媒体上感测磁场,这种媒体如旋转磁盘。传感器包括夹在铁磁被钉扎层与铁磁自由层之间的非磁性导电第一隔离层。反铁磁钉扎层与被钉扎层连接以把被钉扎层的磁矩钉扎成与作为面对磁性媒体的传感器的暴露表面的空气支承表面(ABS)成90度。第一和第二引线被连接于自旋阀传感器,用于把传感电流引导过那里。自由层的磁矩响应于来自移动磁性媒体的正向和负向磁场可自由地从零偏置点位置在正向和负向上旋转。零偏置位置是当传感器处于静态时,即传感电流被传导过传感器而没有从旋转磁盘引入的任何磁场时自由层的磁矩位置。在传感器的静态中磁矩优选平行于ABS。如果在静态中自由层磁矩基本不平行于ABS,则一产生旋转盘引入的正向和负向磁场将有不对称地读出信号。
隔离层厚度被选择成小于传导过传感器的电子的平均自由程。用这种设置,一部分传导电子被间隔层与被钉扎和自由层的界面分散。当被钉扎和自由层的磁矩彼此平行时,分散最小,当它们的磁矩反平行时,分散最大。分散的改变作为函数cos q而改变自旋阀传感器的电阻,其中q是被钉扎和自由层的磁矩之间的角度。自旋阀传感器具有比各向异性磁致电阻(AMR)传感器明显更高的磁致电阻。由于这一原因,有时将其称为巨磁致电阻(GMR)传感器。
偏置点在转变曲线上的位置受自由层上4个主要的力的影响,即:被钉扎层和自由层之间的铁磁耦合场(HFC)、来自被钉扎层的退磁场(Hdemag)、来自自旋阀传感器的除自由层之外的所有传导层的传感电流场(HSC)以及AMR效应的影响。AMR效应对偏置点的影响与磁影响相同并且可用强度和方向来定义。
底部自旋阀传感器通常使用氧化镍(NiO)钉扎层,用于把被钉扎层的磁矩钉扎成与ABS垂直。钉扎层直接形成在氧化铝(Al2O3)的第一间隙层上,被钉扎层直接形成于钉扎层上。随后形成的层是间隔层、自由层、第二间隙层和第二屏蔽层。在这个阶段自旋阀传感器具有磁致电阻dR/R,其中R是传感器电阻并且dR是施加应用磁场时传感器的电阻变化。接着,写入头形成于自旋阀传感器上。写入头的形成中,绝缘堆叠的多个光刻胶层在225度到250度进行6-11小时的硬烘烤。这个硬烘烤降低前面所述的传感器的磁致电阻。降低量决定传感器的热稳定性。
一直致力于制造带有克服写入头的硬烘烤循环的高磁致电阻的自旋阀传感器。高磁致电阻等同于提高自旋阀传感器对来自旋转盘的磁通的灵敏性,但是,另一个考虑是被钉扎层与自由层之间的铁磁耦合场(Hc)。要求把铁磁耦合场最小化,因为铁磁耦合场影响传感器的偏置点。为实现零偏置点,铁磁耦合必须由另外一个磁场相抵。施加在自由层上的传感电流场也必须被抵消。随着提高磁致电阻的研究继续进行,重要的是自旋阀传感器不被一些另外的因素恶化,这些因素如被钉扎层与自由层之间的高铁磁耦合。
美国专利No.5,793,207公开一种自旋阀传感器和通过绝缘材料制成的反铁磁层与不平补偿层电绝缘的硬偏置层。
通过把用于氧化镍(NiO)钉扎层的特定的籽晶层使用在底部自旋阀中可提高自旋阀的磁致电阻。在优选实施例中,直接在第一间隙层上形成钽氧化物(TayOx)籽晶层,并且把氧化镍(NiO)钉扎层直接形成于钽氧化物籽晶层上。接着是间隔层和自由层并且最后是写入头。在写入头结构中在烘烤步骤之后磁致电阻仅产生一个正常的下降。本发明可适用于反平行(AP)钉扎的底部自旋阀传感器,也可适用于前面提到的简单的底部自旋阀传感器。AP钉扎的底部自旋阀传感器使用被钉扎层,该被钉扎层具有位于第一和第二磁性膜之间的钌(Ru)膜,其中第一和第二磁性膜可以是钴(Co)。
发明内容
本发明的一个目标是提供一种带有改进的磁致电阻的自旋阀传感器。
本发明的另一个目标是提供一种改进的磁致电阻的而不降低传感器的其它性能因素的底部简单或AP钉扎的自旋阀传感器。
本发明还有一个目标是提供一种用于底部简单或AP钉扎的自旋阀传感器的氧化镍(NiO)钉扎层的籽晶层,其提高传感器的磁致电阻而不把被钉扎层与自由层之间的铁磁耦提高到可接受的等级之外。
为了实现上述目标,本发明提供了一种具有空气支承表面的自旋阀传感器,包括:氧化镍的反铁磁钉扎层;非磁性导电间隔层;铁磁自由层;被钉扎层;间隔层夹在被钉扎层与自由层之间;钽氧化物籽晶层;钉扎层夹在籽晶层与带有界面连接钉扎层的籽晶层的被钉扎层之间。
上述自旋阀传感器中,所述被钉扎层可以是反平行被钉扎层,包括:第一和第二铁磁膜;夹在第一和第二铁磁膜之间的钌间隔膜;第一铁磁膜与钉扎层连接,其磁矩被钉扎层钉扎在第一方向上;第二铁磁膜与间隔层连接,其磁矩被第一铁磁膜钉扎在与所述第一方向反平行的第二方向上。
其中籽晶层是TayOx,在氧存在的情况下被反应离子束溅射。
其中籽晶层包括暴露于氧中被氧化的TayOx。
根据本发明,还提供了一种具有空气支承表面的磁头,包括读出头,该读出头包括:响应施加的磁场的自旋阀传感器;第一和第二非磁性电绝缘间隙层;自旋阀传感器位于第一和第二间隙层之间;第一和第二导电引线被连接于自旋阀传感器,用于把传感电流传导过自旋阀传感器;第一和第二屏蔽层;第一和第二间隙层,位于第一和第二屏蔽层之间。
在上述磁头中,所述被钉扎层是反平行被钉扎层,包括:第一和第二铁磁膜;夹在第一和第二铁磁膜之间的钌间隔膜;第一铁磁膜与钉扎层连接,其磁矩被钉扎层钉扎在第一方向上;第二铁磁膜与间隔层连接,其磁矩被第一铁磁膜钉扎在与所述第一方向反平行的第二方向上。
本发明还提供了一种磁盘驱动器,包括至少一个具有空气支承表面的磁头,磁盘驱动器包括:包括组合的读出头和写入头的磁头;其中,读出头包括:响应施加的磁场的自旋阀传感器;第一和第二非磁性电绝缘间隙层;自旋阀传感器位于第一和第二间隙层之间;第一和第二导电引线被连接于自旋阀传感器,用于把传感电流传导过自旋阀传感器;第一和第二屏蔽层;第一和第二间隙层,位于第一和第二屏蔽层之间;所述写入头包括:第一和第二磁极件层和写入间隙层;第一和第二磁极件层由写入间隙层在空气支承表面处分开,并且在磁头中从空气支承表面后缩的后间隙处连接;绝缘叠层,具有至少第一和第二绝缘层;至少一个线圈层,埋置在绝缘叠层中;和绝缘叠层与至少一个线圈层位于第一和第二磁极件层之间;其中,第二屏蔽层和第一磁极件层是共用层;所述磁盘驱动器还包括:外壳;可旋转地支持在外壳中的磁盘;安装在外壳中的用于支持其空气支承表面面对磁盘的磁头的支持件,使得磁头与磁盘处于传感关系;用于旋转磁盘的装置;连接于支持件的定位装置,用于相对于所述磁盘把磁头移动到多个位置;连接于磁头、用于旋转磁盘的装置以及定位装置的处理装置,用于与组合的磁头交换信号,用于控制磁盘的移动并用于控制磁头的位置。
在上述磁盘驱动器中,被钉扎层是反平行被钉扎层,包括:第一和第二铁磁膜;夹在第一和第二铁磁膜之间的钌间隔膜;第一铁磁膜与钉扎层连接,其磁矩被钉扎层钉扎在第一方向上;第二铁磁膜与间隔层连接,其磁矩被第一铁磁膜钉扎在与所述第一方向反平行的第二方向上。
本发明最后提供了一种制造自旋阀传感器的方法,包括:形成钽氧化物的籽晶层;直接在籽晶层上形成氧化镍的反铁磁钉扎层;直接在钉扎层上形成铁磁被钉扎层;在被钉扎层上形成非磁性导电间隔层;在间隔层上形成铁磁自由层。
在上述方法中,所述被钉扎层是反平行被钉扎层,其结构包括:形成第一铁磁膜;在第一铁磁膜上形成钌间隔膜;和在钌膜上形成第二铁磁膜。
本发明的其它目标和优点在联系附图阅读下面的说明后将变得更明显。
附图说明
图1是例示的磁盘驱动器的平面图;
图2是沿着2-2面得到的滑动器端视图,磁头以虚线表示;
图3是磁盘驱动器的正视图,其中使用了多个盘和磁头;
图4是用于支持滑动器和磁头的例示悬置系统的等角投影图;
图5是沿着图2的面5-5得到的滑动器的ABS图示;
图6是沿着图2的面6-6看到的滑动器和磁头的部分正视图;
图7是沿着图6的面7-7得到的滑动器的部分ABS视图,以表示磁头的读出和写入元件;
图8是沿着图6的8-8面得到的视图,线圈层以上的所有材料都被去除;
图9是带有用于AFM层的本发明的钽氧化物籽晶层的简单底部自旋阀传感器的ABS图示;
图10是图9的等角投影图;
图11是带有用于AFM层的钽氧化物籽晶层的AP被钉扎的底部自旋阀传感器的ABS图示;
图12是图11的等角投影图;
图13A、13B和13C表示制造本发明的钽氧化物籽晶层的第一方法;
图14A和14B表示制造本发明的钽氧化物籽晶层的第二方法。
具体实施方式
磁盘驱动器
现参考附图,其中在整个附图中,相同的参考序号指代相同或类似的部件,在图1-3中表示出磁盘驱动器30。驱动器30包括支持并旋转磁盘34的主轴32。主轴32由电机控制器38所控制的电机36来旋转。把组合的读出和写入磁头40安装于由悬置件44和致动臂46支持的滑动器42上。在图3所示的大容量直接存取存储设备(DASD)中可使用多个盘、滑动器和悬置件。悬置件44和致动臂46把滑动器42定位成使得磁头40与磁盘34的表面处于传感关系。当盘34由电机36旋转时,滑动器被支持在盘34的表面与空气支承表面(ABS)48之间的薄空气(空气支承)气垫(通常是0.05微米)上。然后磁头40可被用于向盘34的表面上的多个环形磁道写入信息,同样用于从那里读出信息。处理电路50与头40交换代表这种信息的信号,提供用于旋转磁盘34的电机驱动信号,并提供用于将滑动器移动到各个磁道的控制信号。在图4中,表示出滑动器42安装于悬置件44上。上面描述的组件可安装于外壳55的框架54上,如图3所示。
图5是滑动器42和磁头40的ABS视图。滑动器具有支持磁头40的中央导轨56和侧导轨58和60。导轨56,58和60从横导轨62延伸。相对于磁盘34的旋转,横导轨62位于滑动器的前沿64并且磁头40位于滑动器的尾沿66。
磁头
图6是具有写入头部分70和读出头部分72的磁头40的横截面的侧视图,读出头部分使用本发明的自旋阀传感器74。图7是图6的ABS视图。传感器74位于第一和第二间隙层76和78之间,间隙层位于第一和第二屏蔽层80和82之间。响应于外部磁场,传感器74的电阻改变。传导过传感器的传感电流IS(看图9)引起这些电阻改变,表现为电势改变。然后通过图3所示的处理电路50把这些电势改变处理为读回信号。
已有技术的磁头的写入头部分包括位于第一和第二绝缘层86和88之间的线圈层84。第三绝缘层90可用于平整磁头以消除由线圈层84引起的第二绝缘层中的起伏。第一、第二和第三绝缘层技术上称为“绝缘叠层”。线圈层84和第一、第二和第三绝缘层86,88和90位于第一和第二磁极件层92和94之间。第一和第二磁极件层92和94以后间隙96磁耦合并具有由写入间隙层102在ABS处将其分开的第一和第二磁极尖98和100。如图2和4所示,第一和第二焊料连接104和116在悬置件44上把来自传感器74的引线连接于引线112和124。第三和第四焊料连接118和106在悬置件上把来自线圈84的引线120和122(看图8)连接于引线126和114。应注意磁头40使用单层82/92来用于双重功能,即:作为用于读出头的第二屏蔽层以及作为用于写入头的第一磁极件。
这种类型的磁头在技术上称为“复合式磁头”。背负式磁头使用两个独立的层来用于这些功能。
本发明
图9和图10是读出头的自旋阀传感器200的示意图,其包括非磁性导电间隔层202,该间隔层202夹在铁磁自由层204与铁磁被钉扎层206之间。可具有镍铁(NiFe)第一被钉扎膜207和钴(Co)第二被钉扎膜208的被钉扎层206具有磁矩209(看图10),其优选通过反铁磁(AFM)层212被钉扎成与ABS 210垂直。各个其中间包括x的圆圈代表磁矩的方向是远离开读出器的。在静态中(传导过传感器200的但不从旋转磁盘引起任何磁引入的传感电流IS),自由层204的磁矩214优选平行于ABS 210。因此,当从旋转磁盘向自旋阀传感器200施加正负引入时,自由层的磁矩214分别从图10所示的平行位置向上或向下旋转。磁矩214的平行位置通常是自旋阀传感器的转变曲线上的零偏置点,并且当在静态中将它从这个平行位置向上或向下定位时,自旋阀传感器的偏置点不是零而是相对于零位置或正或负的某值。当磁矩214处于零偏置位置时,读出信号关于偏置点对称,但是当磁矩从平行位置向上或向下成一角度时,如图10所示,读出信号不对称。因此,要求当读出传感器200处于静态时,即接通传感电流IS却没有从旋转磁盘的磁性引入时,自由层的磁矩214位于零偏置点,其是图10所示的平行位置。
如上所述,当自旋阀读出传感器处于静态时,有各种作用力作用在自由层的磁矩214上。这些力包括自由层204和被钉扎层206之间的铁磁耦合场、来自被钉扎层206的退磁场、当传感电流IS从除自由层204之外的自旋阀传感器的所有导电层传导过传感器时的传感电流场以及AMR效应的影响。这些影响中较强的是来自间隔层202和被钉扎层206的传感电流场。AFM层212制造在第一间隙层216上,在图6中该第一间隙层216也表示为76。盖层218可以是钽(Ta),在制造图6所示的第二间隙层78之前制造在自由层204上。
AFM层可以是425埃的氧化镍(NiO),被钉扎膜207可以是8埃的镍铁(NiFe),被钉扎膜208可以是12埃的钴(Co),间隔层可以是22埃的铜(Cu),自由层204可以是70埃的镍铁(NiFe),盖层218可以是50埃的钽(Ta)。在制造写入头期间,传感器200经受230度10小时的退火。在制造磁头后,在垂直ABS的场存在的情况下通过在200度到250度进行10分钟的加热恢复AFM层212。这把AFM层212的磁性自旋设置在垂直方向上,其通过交换耦合把被钉扎膜207和208的磁矩钉扎在相同方向上,即垂直于ABS。
在本发明的一个实施例中,把钽氧化物(TayOx)籽晶层201使用在第一间隙层216和AFM层212之间,如图9和10所示。与没有钽氧化物籽晶层的简单底部自旋阀传感器相比,在传感器的淀积状态、恢复AFM层212后以及硬烘烤写入头的绝缘层后的情况下,钽氧化物籽晶层提高传感器200的磁致电阻(dR/R)。钽氧化物籽晶层201不明显提高被钉扎膜208和自由层204之间的铁磁耦合场。另外,由于钽氧化物是不导电的,在那里不分流传感电流,也没有施加于自由层204上的任何传感电流场来影响其偏置点。
在图11和12中,表示出反平行(AP)被钉扎的底部自旋阀300,其具有钽氧化物(TayOx)籽晶层301。在这个实施例中,间隔层302位于自由层304和AP被钉扎层306之间。AP被钉扎层306在美国专利No.5,701,223中进行了说明,包括位于在一侧与反铁磁(AFM)层312交换耦合的被钉扎膜310和311与在另一侧和间隔层302相邻的反铁磁被钉扎层317之间的8埃的钌(Ru)间隔层308。AFM层312把被钉扎膜310和311的磁矩318钉扎在垂直于ABS的一个方向上,并且AP钉扎的膜317的磁矩320被钉扎在与ABS垂直的相反方向上。各个其中带点的圆圈代表磁矩的方向朝向读出器。被钉扎膜310可以是10埃的镍铁(NiFe),被钉扎膜311可以是24埃的钴(Co),间隔层308可以是8埃的钌(Ru),AP被钉扎膜317可以是24埃的钴(Co)。自由层304的磁矩322表示为平行于ABS。盖层324在制造图6所示的第二间隙层78和写入头70之前制造在自由层304上。
籽晶层301可以是35埃的钽氧化物(TayOx),AFM层312可以是425埃的氧化镍,间隔层302可以是22埃的铜(Cu),自由层304可以是70埃的镍铁(NiFe),盖层324可以是50埃的钽(Ta)。与没有使用这种籽晶层的底部AP钉扎的自旋阀传感器相比,在传感器的淀积状态、恢复AFM层212后以及硬烘烤写入头的绝缘层后的情况下,通过使用钽氧化物(TayOx)籽晶层提高自旋阀传感器300的磁致电阻。而且钽氧化物籽晶层不明显提高被钉扎层208和自由层204之间的铁磁耦合场。另外,钽氧化物籽晶层是不导电的,不分流任何传感电流,也不向自由层304上施加影响其偏置点的传感电流场。
制造图11和12的钽氧化物(TayOx)籽晶层401的方法如图15A,15B和15C所示。在图15A中,钽籽晶层401淀积在第一间隙层(G1)上。随后,籽晶层401接触氧,引起顶表面部分氧化。这些步骤可在溅射室(未示出)中完成,其中钽(Ta)籽晶层被溅射到第一间隙层(G1)上,如图15A所示,接着通过入口把氧引入到该室中以氧化籽晶层。接着是淀积氧化镍(NiO)AFM层412,如图15C所示。在这个实施例中dR/R是4.53%并且AP被钉扎层306与自由层304的铁磁耦合场(Hc)是4.0Oe或4.0×10-4T。
在图16A中,钽氧化物(Ta)籽晶层在氧(O2)存在的情况下被溅射淀积,这在技术上称为反应离子束溅射淀积。接着,在籽晶层401上淀积氧化镍(NiO)AFM层412,如图16B所示。在这个实施例中dR/R是4.65%并且铁磁耦合场(Hc)是4.0Oe或4.0×10-4T。
总结
可看到用于底部AP钉扎自旋阀传感器中的氧化镍(NiO)AFM层的钽氧化物(TayOx)籽晶层提高dR/R。相信钽氧化物籽晶层通过使其微结构从顶部到底部更均匀而改善了氧化镍(NiO)钉扎层。还认为它改善了晶粒尺寸和其结构。应理解对上述各层可使用其它厚度。无论钽氧化物籽晶层的厚度如何,它将改善AFM氧化镍(NiO)钉扎层的微结构,提高传感器的dR/R。本发明还包括在不使用AP被钉扎层的自旋阀传感器中使用钽氧化物籽晶层,如图9和10所示。

Claims (10)

1.一种具有空气支承表面的自旋阀传感器,包括:
氧化镍的反铁磁钉扎层;
非磁性导电间隔层;
铁磁自由层;
被钉扎层;
间隔层夹在被钉扎层与自由层之间;
钽氧化物籽晶层;
钉扎层夹在籽晶层与带有界面连接钉扎层的籽晶层的被钉扎层之间。
2.根据权利要求1的自旋阀传感器,其中被钉扎层是反平行被钉扎层,包括:
第一和第二铁磁膜;
夹在第一和第二铁磁膜之间的钌间隔膜;
第一铁磁膜与钉扎层连接,其磁矩被钉扎层钉扎在第一方向上;
第二铁磁膜与间隔层连接,其磁矩被第一铁磁膜钉扎在与所述第一方向反平行的第二方向上。
3.根据权利要求1或2的自旋阀传感器,其中籽晶层是TayOx,其在氧存在的情况下被反应离子束溅射。
4.根据权利要求1或2的自旋阀传感器,其中籽晶层包括暴露于氧中被氧化的TayOx。
5.一种具有空气支承表面的磁头,包括读出头,该读出头包括:
响应施加的磁场的自旋阀传感器;
第一和第二非磁性电绝缘间隙层;
自旋阀传感器位于第一和第二间隙层之间;
第一和第二导电引线被连接于自旋阀传感器,用于把传感电流传导过自旋阀传感器;
第一和第二屏蔽层;
第一和第二间隙层,位于第一和第二屏蔽层之间;
其中,所述自旋阀传感器具有空气支承表面,它包括:氧化镍的反铁磁钉扎层;非磁性导电间隔层;铁磁自由层;被钉扎层;间隔层夹在被钉扎层与自由层之间;钽氧化物籽晶层;钉扎层夹在籽晶层与带有界面连接钉扎层的籽晶层的被钉扎层之间。
6.根据权利要求5的磁头,其中被钉扎层是反平行被钉扎层,包括:
第一和第二铁磁膜;
夹在第一和第二铁磁膜之间的钌间隔膜;
第一铁磁膜与钉扎层连接,其磁矩被钉扎层钉扎在第一方向上;
第二铁磁膜与间隔层连接,其磁矩被第一铁磁膜钉扎在与所述第一方向反平行的第二方向上。
7.一种磁盘驱动器,包括至少一个具有空气支承表面的磁头,磁盘驱动器包括:
包括组合的读出头和写入头的磁头;
其中,读出头包括:
响应施加的磁场的自旋阀传感器;
第一和第二非磁性电绝缘间隙层;
自旋阀传感器位于第一和第二间隙层之间;
第一和第二导电引线被连接于自旋阀传感器,用于把传感电流传导过自旋阀传感器;
第一和第二屏蔽层;
第一和第二间隙层,位于第一和第二屏蔽层之间;
写入头包括:
第一和第二磁极件层和写入间隙层;
第一和第二磁极件层由写入间隙层在空气支承表面处分开,并且在磁头中从空气支承表面后缩的后间隙处连接;
绝缘叠层,具有至少第一和第二绝缘层;
至少一个线圈层,埋置在绝缘叠层中;和
绝缘叠层与至少一个线圈层位于第一和第二磁极件层之间;
第二屏蔽层和第一磁极件层是共用层;
外壳;
可旋转地支持在外壳中的磁盘;
安装在外壳中的用于支持其空气支承表面面对磁盘的磁头的支持件,使得磁头与磁盘处于传感关系;
用于旋转磁盘的装置;
连接于支持件的定位装置,用于相对于所述磁盘把磁头移动到多个位置;
连接于磁头、用于旋转磁盘的装置以及定位装置的处理装置,用于与组合的磁头交换信号,用于控制磁盘的移动并用于控制磁头的位置;
其中,所述自旋阀传感器具有空气支承表面,它包括:氧化镍的反铁磁钉扎层;非磁性导电间隔层;铁磁自由层;被钉扎层;间隔层夹在被钉扎层与自由层之间;钽氧化物籽晶层;钉扎层夹在籽晶层与带有界面连接钉扎层的籽晶层的被钉扎层之间。
8.根据权利要求7的磁盘驱动器,其中被钉扎层是反平行被钉扎层,包括:
第一和第二铁磁膜;
夹在第一和第二铁磁膜之间的钌间隔膜;
第一铁磁膜与钉扎层连接,其磁矩被钉扎层钉扎在第一方向上;
第二铁磁膜与间隔层连接,其磁矩被第一铁磁膜钉扎在与所述第一方向反平行的第二方向上。
9.一种制造自旋阀传感器的方法,包括:
形成钽氧化物的籽晶层;
直接在籽晶层上形成氧化镍的反铁磁钉扎层;
直接在钉扎层上形成铁磁被钉扎层;
在被钉扎层上形成非磁性导电间隔层;
在间隔层上形成铁磁自由层。
10.根据权利要求9的方法,其中被钉扎层是反平行被钉扎层,其结构包括:
形成第一铁磁膜;
在第一铁磁膜上形成钌间隔膜;和
在钌膜上形成第二铁磁膜。
CNB998141038A 1998-12-04 1999-11-26 具有空气支承表面的自旋阀传感器、磁头、磁盘驱动器及制造方法 Expired - Fee Related CN1254789C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/205,470 1998-12-04
US09/205,470 US6201671B1 (en) 1998-12-04 1998-12-04 Seed layer for a nickel oxide pinning layer for increasing the magnetoresistance of a spin valve sensor
US09/205470 1998-12-04

Publications (2)

Publication Number Publication Date
CN1329742A CN1329742A (zh) 2002-01-02
CN1254789C true CN1254789C (zh) 2006-05-03

Family

ID=22762316

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB998141038A Expired - Fee Related CN1254789C (zh) 1998-12-04 1999-11-26 具有空气支承表面的自旋阀传感器、磁头、磁盘驱动器及制造方法

Country Status (13)

Country Link
US (2) US6201671B1 (zh)
EP (1) EP1135772B1 (zh)
JP (1) JP2002532815A (zh)
KR (1) KR100469533B1 (zh)
CN (1) CN1254789C (zh)
AT (1) ATE343201T1 (zh)
AU (1) AU1285900A (zh)
CA (1) CA2340094A1 (zh)
DE (1) DE69933692T2 (zh)
HK (1) HK1042157A1 (zh)
HU (1) HUP0104477A3 (zh)
RU (1) RU2231134C2 (zh)
WO (1) WO2000034946A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102809731A (zh) * 2011-06-01 2012-12-05 宇能电科技股份有限公司 自旋阀磁阻传感器

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6469878B1 (en) * 1999-02-11 2002-10-22 Seagate Technology Llc Data head and method using a single antiferromagnetic material to pin multiple magnetic layers with differing orientation
US6404606B1 (en) * 1999-11-05 2002-06-11 International Business Machines Corporation Seed layer structure for a platinum manganese pinning layer in a spin valve sensor
US6496337B1 (en) * 2000-03-20 2002-12-17 Headway Technologies, Inc. Copper alloy GMR recording head
US6661622B1 (en) * 2000-07-17 2003-12-09 International Business Machines Corporation Method to achieve low and stable ferromagnetic coupling field
US6775903B2 (en) 2001-09-17 2004-08-17 Headway Technolog Method for fabricating a top magnetoresistive sensor element having a synthetic pinned layer
US6636400B2 (en) 2001-09-18 2003-10-21 International Business Machines Corporation Magnetoresistive head having improved hard biasing characteristics through the use of a multi-layered seed layer including an oxidized tantalum layer and a chromium layer
US20030137039A1 (en) * 2001-11-16 2003-07-24 Tdk Corporation Packaging substrate and manufacturing method thereof, integrated circuit device and manufacturing method thereof, and saw device
US6581272B1 (en) 2002-01-04 2003-06-24 Headway Technologies, Inc. Method for forming a bottom spin valve magnetoresistive sensor element
US6624985B1 (en) 2002-01-07 2003-09-23 International Business Machines Corporation Pinning layer seeds for CPP geometry spin valve sensors
US7007373B2 (en) 2002-11-18 2006-03-07 Hitachi Global Storage Technologies Netherlands B.V. Method of manufacturing enhanced spin-valve sensor with engineered overlayer
US7227727B2 (en) * 2003-05-07 2007-06-05 Hitachi Global Storage Technologies Netherlands B.V. Method and apparatus for a side-by-side thin film head with minimal separation between the read and write structures
US6993827B2 (en) * 2003-06-12 2006-02-07 Headway Technologies, Inc. Method of making a bottom spin valve
JP2005123412A (ja) * 2003-10-16 2005-05-12 Anelva Corp 磁気抵抗多層膜製造方法及び製造装置
JP2005353671A (ja) * 2004-06-08 2005-12-22 Fujitsu Ltd 磁気抵抗効果膜および磁気抵抗効果ヘッド
TWI283477B (en) * 2004-11-16 2007-07-01 Ind Tech Res Inst Magnetic random access memory with lower switching field
CN100377868C (zh) * 2005-03-24 2008-04-02 中国科学院物理研究所 用于磁性/非磁性/磁性多层薄膜的核心复合膜及其用途
US8130474B2 (en) 2005-07-18 2012-03-06 Hitachi Global Storage Technologies Netherlands B.V. CPP-TMR sensor with non-orthogonal free and reference layer magnetization orientation
JP5038117B2 (ja) * 2007-12-14 2012-10-03 キヤノンアネルバ株式会社 トンネル型磁気抵抗多層膜製造方法
US8760817B2 (en) * 2009-05-22 2014-06-24 HGST Netherlands B.V. Three-terminal design for spin accumulation magnetic sensor
JP2012119613A (ja) * 2010-12-03 2012-06-21 Alps Electric Co Ltd 磁気検出素子及びそれを用いた磁気センサ
CN102288927A (zh) * 2011-06-28 2011-12-21 钱正洪 巨磁阻自旋阀磁敏传感器及其制造方法
US8822046B2 (en) * 2012-04-30 2014-09-02 Seagate Technology Llc Stack with wide seed layer
MX363407B (es) 2012-12-10 2019-03-22 Biogen Ma Inc Anticuerpos del antigeno 2 de celulas dendriticas anti-sangre y usos de los mismos.
KR102127043B1 (ko) * 2018-04-17 2020-06-25 고려대학교 산학협력단 자기 소자

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR960002611B1 (ko) 1991-09-30 1996-02-23 가부시키가이샤 도시바 강 자성막
US5820770A (en) * 1992-07-21 1998-10-13 Seagate Technology, Inc. Thin film magnetic head including vias formed in alumina layer and process for making the same
JPH0766033A (ja) * 1993-08-30 1995-03-10 Mitsubishi Electric Corp 磁気抵抗素子ならびにその磁気抵抗素子を用いた磁性薄膜メモリおよび磁気抵抗センサ
JP2860233B2 (ja) * 1993-09-09 1999-02-24 株式会社日立製作所 巨大磁気抵抗効果型磁気ヘッドおよびそれを用いた磁気記録再生装置
US5408377A (en) * 1993-10-15 1995-04-18 International Business Machines Corporation Magnetoresistive sensor with improved ferromagnetic sensing layer and magnetic recording system using the sensor
US5841611A (en) * 1994-05-02 1998-11-24 Matsushita Electric Industrial Co., Ltd. Magnetoresistance effect device and magnetoresistance effect type head, memory device, and amplifying device using the same
US5620574A (en) * 1994-08-26 1997-04-15 Stormedia, Inc. Method of fabricating sputter induced, micro-texturing of thin film, magnetic disc media
US5606478A (en) * 1994-12-08 1997-02-25 International Business Machines Corporation Ni45 Fe55 metal-in-gap thin film magnetic head
SG46731A1 (en) 1995-06-30 1998-02-20 Ibm Spin valve magnetoresistive sensor with antiparallel pinned layer and improved exchange bias layer and magnetic recording system using the senor
US5627704A (en) * 1996-02-12 1997-05-06 Read-Rite Corporation Thin film giant magnetoresistive CPP transducer with flux guide yoke structure
US5909345A (en) * 1996-02-22 1999-06-01 Matsushita Electric Industrial Co., Ltd. Magnetoresistive device and magnetoresistive head
US5742162A (en) 1996-07-17 1998-04-21 Read-Rite Corporation Magnetoresistive spin valve sensor with multilayered keeper
JP2856165B2 (ja) * 1996-08-12 1999-02-10 日本電気株式会社 磁気抵抗効果素子及びその製造方法
US5793207A (en) 1996-10-09 1998-08-11 International Business Machines Corporation Disk drive with a thermal asperity reduction circuitry using a spin valve sensor
JPH10154311A (ja) * 1996-11-21 1998-06-09 Nec Corp 磁気抵抗効果素子およびシールド型磁気抵抗効果センサ
US5768069A (en) * 1996-11-27 1998-06-16 International Business Machines Corporation Self-biased dual spin valve sensor
AUPO803597A0 (en) * 1997-07-15 1997-08-07 Silverbrook Research Pty Ltd Image creation method and apparatus (IJ06)
US5966800A (en) * 1997-07-28 1999-10-19 Read-Rite Corporation Method of making a magnetic head with aligned pole tips and pole layers formed of high magnetic moment material
US6245450B1 (en) * 1997-11-17 2001-06-12 Matsushita Electric Industrial Co., Ltd. Exchange coupling film magnetoresistance effect device magnetoresistance effective head and method for producing magnetoresistance effect device
JP2995170B2 (ja) * 1998-03-12 1999-12-27 ティーディーケイ株式会社 薄膜磁気ヘッドおよびその製造方法
US6204997B1 (en) * 1998-05-19 2001-03-20 Tdk Corporation Thin film magnetic head with a plurality of engaged thin-film coils and method of manufacturing the same
US6063244A (en) * 1998-05-21 2000-05-16 International Business Machines Corporation Dual chamber ion beam sputter deposition system
US6319728B1 (en) * 1998-06-05 2001-11-20 Applied Materials, Inc. Method for treating a deposited film for resistivity reduction
US6355562B1 (en) * 1998-07-01 2002-03-12 Advanced Technology Materials, Inc. Adhesion promotion method for CVD copper metallization in IC applications
US6185078B1 (en) * 1998-08-21 2001-02-06 International Business Machines Corporation Spin valve read head with antiferromagnetic oxide film as longitudinal bias layer and portion of first read gap
US6185080B1 (en) * 1999-03-29 2001-02-06 International Business Machines Corporation Dual tunnel junction sensor with a single antiferromagnetic layer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102809731A (zh) * 2011-06-01 2012-12-05 宇能电科技股份有限公司 自旋阀磁阻传感器
CN102809731B (zh) * 2011-06-01 2015-01-21 宇能电科技股份有限公司 自旋阀磁阻传感器

Also Published As

Publication number Publication date
KR100469533B1 (ko) 2005-02-02
DE69933692T2 (de) 2007-08-23
CN1329742A (zh) 2002-01-02
KR20010089473A (ko) 2001-10-06
DE69933692D1 (de) 2006-11-30
US6631549B1 (en) 2003-10-14
EP1135772B1 (en) 2006-10-18
WO2000034946A1 (en) 2000-06-15
US6201671B1 (en) 2001-03-13
CA2340094A1 (en) 2000-06-15
HUP0104477A2 (hu) 2002-03-28
RU2231134C2 (ru) 2004-06-20
JP2002532815A (ja) 2002-10-02
HUP0104477A3 (en) 2002-05-28
ATE343201T1 (de) 2006-11-15
EP1135772A1 (en) 2001-09-26
AU1285900A (en) 2000-06-26
HK1042157A1 (zh) 2002-08-02

Similar Documents

Publication Publication Date Title
CN1254789C (zh) 具有空气支承表面的自旋阀传感器、磁头、磁盘驱动器及制造方法
CN1208757C (zh) 电流垂直于平面结构的磁阻磁头
CN1113334C (zh) 有纵向和横向偏压的磁隧道结磁阻读出磁头
CN1237511C (zh) 带有低本征单轴各向异性自由层的巨磁致电阻传感器
CN1268010C (zh) 隧道结和垂直于平面电荷磁记录传感器及其制造方法
CN1109330C (zh) 磁隧道结传感器用的低磁矩/高矫顽力固定层
US6208491B1 (en) Spin valve with improved capping layer structure
US11222656B1 (en) Method to reduce baseline shift for a SOT differential reader
US8373948B2 (en) Tunnel magnetoresistance (TMR) structures with MGO barrier and methods of making same
US11615809B2 (en) SOT differential reader and method of making same
CN100347747C (zh) 差动cpp gmr磁头
CN1967893A (zh) 在磁阻传感器中用于改进交换偏置结构的斜角蚀刻的衬层
CN1595676A (zh) 磁电阻效应元件、磁头、磁悬挂组件和磁还原设备
US6788502B1 (en) Co-Fe supermalloy free layer for magnetic tunnel junction heads
CN101046973A (zh) 垂直磁记录头中用于二次杂散场减小的两梯级角凹陷
JP2004517433A (ja) スピン・バルブ・センサおよびその製造方法
CN1913190A (zh) 具有用于钉扎改善的各向异性被钉扎层的磁致电阻传感器
KR100330526B1 (ko) 거대 자기저항을 구비한 역평행 피고정 판독 헤드
US6178072B1 (en) Keeper layer without sense current shunting in a giant magnetoresistive (GMR) head
CN1288628C (zh) 具有反平行耦合的引线/传感器重叠区的磁阻传感器
CN1129892C (zh) 用于磁性稳定自旋阀传感器的高矫顽力多层膜硬磁性层
CN1479387A (zh) 具有“电流垂直于平面”结构的磁阻元件
JP2001094173A (ja) 磁気センサー、磁気ヘッド及び磁気ディスク装置
CN1299257C (zh) 电流垂直于平面结构的磁电阻元件
KR100276845B1 (ko) 낮은 강자성 결합 상수를 갖는 스핀 밸브 센서

Legal Events

Date Code Title Description
C06 Publication
C10 Entry into substantive examination
PB01 Publication
SE01 Entry into force of request for substantive examination
ASS Succession or assignment of patent right

Owner name: HITACHI GST

Free format text: FORMER OWNER: INTERNATIONAL BUSINESS MACHINE CORP.

Effective date: 20040107

C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20040107

Address after: Amsterdam

Applicant after: Hitachi Global Storage Tech

Address before: American New York

Applicant before: International Business Machines Corp.

C14 Grant of patent or utility model
GR01 Patent grant
REG Reference to a national code

Ref country code: HK

Ref legal event code: WD

Ref document number: 1042157

Country of ref document: HK

C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee