CN1228810C - 物理汽相沉积的方法和设备 - Google Patents
物理汽相沉积的方法和设备 Download PDFInfo
- Publication number
- CN1228810C CN1228810C CNB988043351A CN98804335A CN1228810C CN 1228810 C CN1228810 C CN 1228810C CN B988043351 A CNB988043351 A CN B988043351A CN 98804335 A CN98804335 A CN 98804335A CN 1228810 C CN1228810 C CN 1228810C
- Authority
- CN
- China
- Prior art keywords
- vacuum chamber
- coil
- shielding
- equipment
- plasma
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/02—Details
- H01J2237/022—Avoiding or removing foreign or contaminating particles, debris or deposits on sample or tube
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US84475697A | 1997-04-21 | 1997-04-21 | |
US08/844,757 | 1997-04-21 | ||
US08/837,551 | 1997-04-21 | ||
US08/844,756 | 1997-04-21 | ||
US08/837,551 US5800688A (en) | 1997-04-21 | 1997-04-21 | Apparatus for ionized sputtering |
US08/844,757 US5948215A (en) | 1997-04-21 | 1997-04-21 | Method and apparatus for ionized sputtering |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1265222A CN1265222A (zh) | 2000-08-30 |
CN1228810C true CN1228810C (zh) | 2005-11-23 |
Family
ID=27420268
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB988043351A Expired - Fee Related CN1228810C (zh) | 1997-04-21 | 1998-04-21 | 物理汽相沉积的方法和设备 |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP0978138A1 (de) |
JP (1) | JP3775689B2 (de) |
KR (1) | KR100322330B1 (de) |
CN (1) | CN1228810C (de) |
AU (1) | AU6977998A (de) |
TW (1) | TW460602B (de) |
WO (1) | WO1998048444A1 (de) |
Families Citing this family (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6565717B1 (en) | 1997-09-15 | 2003-05-20 | Applied Materials, Inc. | Apparatus for sputtering ionized material in a medium to high density plasma |
US6280563B1 (en) * | 1997-12-31 | 2001-08-28 | Lam Research Corporation | Plasma device including a powered non-magnetic metal member between a plasma AC excitation source and the plasma |
US6080287A (en) * | 1998-05-06 | 2000-06-27 | Tokyo Electron Limited | Method and apparatus for ionized physical vapor deposition |
US6287435B1 (en) * | 1998-05-06 | 2001-09-11 | Tokyo Electron Limited | Method and apparatus for ionized physical vapor deposition |
US6390019B1 (en) | 1998-06-11 | 2002-05-21 | Applied Materials, Inc. | Chamber having improved process monitoring window |
US6117279A (en) * | 1998-11-12 | 2000-09-12 | Tokyo Electron Limited | Method and apparatus for increasing the metal ion fraction in ionized physical vapor deposition |
US6585870B1 (en) | 2000-04-28 | 2003-07-01 | Honeywell International Inc. | Physical vapor deposition targets having crystallographic orientations |
SE519931C2 (sv) * | 2000-06-19 | 2003-04-29 | Chemfilt R & D Ab | Anordning och förfarande för pulsad, starkt joniserad magnetronsputtering |
US6592710B1 (en) * | 2001-04-12 | 2003-07-15 | Lam Research Corporation | Apparatus for controlling the voltage applied to an electrostatic shield used in a plasma generator |
DE10045544C2 (de) * | 2000-09-07 | 2002-09-12 | Siemens Ag | Verfahren zum Aufbringen einer Beschichtung auf eine Lampe |
US6831742B1 (en) | 2000-10-23 | 2004-12-14 | Applied Materials, Inc | Monitoring substrate processing using reflected radiation |
US6673199B1 (en) | 2001-03-07 | 2004-01-06 | Applied Materials, Inc. | Shaping a plasma with a magnetic field to control etch rate uniformity |
US7247221B2 (en) * | 2002-05-17 | 2007-07-24 | Applied Films Corporation | System and apparatus for control of sputter deposition process |
US7959984B2 (en) * | 2004-12-22 | 2011-06-14 | Lam Research Corporation | Methods and arrangement for the reduction of byproduct deposition in a plasma processing system |
US7820020B2 (en) * | 2005-02-03 | 2010-10-26 | Applied Materials, Inc. | Apparatus for plasma-enhanced physical vapor deposition of copper with RF source power applied through the workpiece with a lighter-than-copper carrier gas |
KR100720989B1 (ko) * | 2005-07-15 | 2007-05-28 | 주식회사 뉴파워 프라즈마 | 멀티 챔버 플라즈마 프로세스 시스템 |
US20070074968A1 (en) * | 2005-09-30 | 2007-04-05 | Mirko Vukovic | ICP source for iPVD for uniform plasma in combination high pressure deposition and low pressure etch process |
US7353771B2 (en) * | 2005-11-07 | 2008-04-08 | Mks Instruments, Inc. | Method and apparatus of providing power to ignite and sustain a plasma in a reactive gas generator |
KR100719703B1 (ko) * | 2005-12-29 | 2007-05-17 | 삼성에스디아이 주식회사 | 입자 빔을 이용한 증착 방법 및 장비 |
JP4963023B2 (ja) * | 2006-01-11 | 2012-06-27 | 株式会社アルバック | スパッタリング方法及びスパッタリング装置 |
US7837826B2 (en) * | 2006-07-18 | 2010-11-23 | Lam Research Corporation | Hybrid RF capacitively and inductively coupled plasma source using multifrequency RF powers and methods of use thereof |
DE102007037527B4 (de) * | 2006-11-10 | 2013-05-08 | Schott Ag | Verfahren zum Beschichten von Gegenständen mit Wechselschichten |
WO2008065745A1 (fr) * | 2006-11-28 | 2008-06-05 | Samco Inc. | Appareil de traitement au plasma |
WO2010134346A1 (ja) * | 2009-05-20 | 2010-11-25 | 株式会社アルバック | 成膜方法及び成膜装置 |
TWI443211B (zh) | 2010-05-05 | 2014-07-01 | Hon Hai Prec Ind Co Ltd | 鍍膜裝置 |
CN102234772B (zh) * | 2010-05-06 | 2014-03-26 | 鸿富锦精密工业(深圳)有限公司 | 镀膜装置 |
CN102300383B (zh) * | 2010-06-23 | 2013-03-27 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 一种电感耦合装置及应用该装置的等离子体处理设备 |
SG189129A1 (en) * | 2010-09-27 | 2013-05-31 | Beijing Nmc Co Ltd | Plasma processing apparatus |
CN102573429B (zh) * | 2010-12-09 | 2015-09-02 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 屏蔽装置、加工方法及设备、半导体设备 |
CN102543645B (zh) * | 2010-12-14 | 2015-07-01 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 法拉第屏蔽及等离子体加工设备 |
TWI556690B (zh) * | 2011-08-30 | 2016-11-01 | Emd Corp | An antenna for a plasma processing apparatus, and a plasma processing apparatus using the same |
CN103014745B (zh) * | 2011-09-28 | 2015-07-08 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 一种等离子体预清洗装置 |
CN103796413B (zh) * | 2012-11-01 | 2017-05-03 | 中微半导体设备(上海)有限公司 | 等离子反应器及制作半导体基片的方法 |
CN103820758B (zh) * | 2012-11-19 | 2016-08-31 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 物理气相沉积装置 |
CN105088156A (zh) * | 2014-05-05 | 2015-11-25 | 上海建冶环保科技股份有限公司 | 一种磁控溅射设备 |
CN105097401B (zh) | 2014-05-13 | 2017-06-06 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 一种反应腔室及半导体加工设备 |
US10431440B2 (en) * | 2015-12-20 | 2019-10-01 | Applied Materials, Inc. | Methods and apparatus for processing a substrate |
CN105572610B (zh) * | 2015-12-23 | 2018-03-20 | 中国人民解放军国防科学技术大学 | Mems多层线圈及其制备方法 |
CN108573846A (zh) * | 2017-03-09 | 2018-09-25 | 北京北方华创微电子装备有限公司 | 等离子体腔室及等离子体加工设备 |
TWI713414B (zh) * | 2017-10-23 | 2020-12-11 | 日商國際電氣股份有限公司 | 基板處理裝置、半導體裝置之製造方法及記錄媒體 |
US10867776B2 (en) * | 2018-05-09 | 2020-12-15 | Applied Materials, Inc. | Physical vapor deposition in-chamber electro-magnet |
KR102473872B1 (ko) * | 2018-11-02 | 2022-12-06 | 베이징 나우라 마이크로일렉트로닉스 이큅먼트 씨오., 엘티디. | 라이닝 어셈블리, 반응 챔버 및 반도체 가공 디바이스 |
CN109946734A (zh) * | 2019-03-20 | 2019-06-28 | 中国原子能科学研究院 | 一种低能量重核素离子气体电离室探测器 |
CN115704087A (zh) * | 2021-08-04 | 2023-02-17 | 北京北方华创微电子装备有限公司 | 磁控溅射设备 |
CN114302548B (zh) * | 2021-12-31 | 2023-07-25 | 中山市博顿光电科技有限公司 | 射频电离装置、射频中和器及其控制方法 |
CN114686831B (zh) * | 2022-03-11 | 2023-11-07 | 中国电子科技集团公司第四十八研究所 | 一种用于深孔pvd的金属自离子化装置及镀膜方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5241245A (en) * | 1992-05-06 | 1993-08-31 | International Business Machines Corporation | Optimized helical resonator for plasma processing |
JPH06120169A (ja) * | 1992-10-07 | 1994-04-28 | Hitachi Ltd | プラズマ生成装置 |
JP3094688B2 (ja) * | 1992-10-12 | 2000-10-03 | 富士電機株式会社 | 絶縁膜の製造方法 |
DE4235064A1 (de) * | 1992-10-17 | 1994-04-21 | Leybold Ag | Vorrichtung zum Erzeugen eines Plasmas mittels Kathodenzerstäubung |
JPH08316205A (ja) * | 1995-05-19 | 1996-11-29 | Hitachi Ltd | プラズマ処理方法及びプラズマ処理装置 |
US5763851A (en) | 1995-11-27 | 1998-06-09 | Applied Materials, Inc. | Slotted RF coil shield for plasma deposition system |
TW327236B (en) | 1996-03-12 | 1998-02-21 | Varian Associates | Inductively coupled plasma reactor with faraday-sputter shield |
US6254737B1 (en) * | 1996-10-08 | 2001-07-03 | Applied Materials, Inc. | Active shield for generating a plasma for sputtering |
-
1998
- 1998-04-21 KR KR1019997009690A patent/KR100322330B1/ko not_active IP Right Cessation
- 1998-04-21 JP JP54628098A patent/JP3775689B2/ja not_active Expired - Fee Related
- 1998-04-21 WO PCT/US1998/008033 patent/WO1998048444A1/en active IP Right Grant
- 1998-04-21 CN CNB988043351A patent/CN1228810C/zh not_active Expired - Fee Related
- 1998-04-21 AU AU69779/98A patent/AU6977998A/en not_active Abandoned
- 1998-04-21 EP EP98915648A patent/EP0978138A1/de not_active Withdrawn
- 1998-06-10 TW TW087109240A patent/TW460602B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2002504187A (ja) | 2002-02-05 |
CN1265222A (zh) | 2000-08-30 |
AU6977998A (en) | 1998-11-13 |
KR20010020136A (ko) | 2001-03-15 |
WO1998048444A1 (en) | 1998-10-29 |
JP3775689B2 (ja) | 2006-05-17 |
TW460602B (en) | 2001-10-21 |
EP0978138A1 (de) | 2000-02-09 |
KR100322330B1 (ko) | 2002-03-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20051123 Termination date: 20100421 |