CN121925993A - 半导体制造装置用部件 - Google Patents

半导体制造装置用部件

Info

Publication number
CN121925993A
CN121925993A CN202380013864.4A CN202380013864A CN121925993A CN 121925993 A CN121925993 A CN 121925993A CN 202380013864 A CN202380013864 A CN 202380013864A CN 121925993 A CN121925993 A CN 121925993A
Authority
CN
China
Prior art keywords
plug
semiconductor manufacturing
manufacturing apparatus
ceramic plate
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380013864.4A
Other languages
English (en)
Chinese (zh)
Inventor
井上靖也
久野达也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Publication of CN121925993A publication Critical patent/CN121925993A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H01J37/32724—Temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/002—Cooling arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/004—Charge control of objects or beams
    • H01J2237/0041—Neutralising arrangements
    • H01J2237/0044—Neutralising arrangements of objects being observed or treated

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
CN202380013864.4A 2023-09-27 2023-09-27 半导体制造装置用部件 Pending CN121925993A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/035051 WO2025069231A1 (ja) 2023-09-27 2023-09-27 半導体製造装置用部材

Publications (1)

Publication Number Publication Date
CN121925993A true CN121925993A (zh) 2026-04-24

Family

ID=95067609

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380013864.4A Pending CN121925993A (zh) 2023-09-27 2023-09-27 半导体制造装置用部件

Country Status (5)

Country Link
US (1) US12598952B2 (https=)
JP (1) JP7686884B1 (https=)
CN (1) CN121925993A (https=)
TW (1) TW202514906A (https=)
WO (1) WO2025069231A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7847690B1 (ja) * 2025-04-23 2026-04-17 日本特殊陶業株式会社 保持装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6490145B1 (en) * 2001-07-18 2002-12-03 Applied Materials, Inc. Substrate support pedestal
JP4557814B2 (ja) * 2005-06-09 2010-10-06 パナソニック株式会社 プラズマ処理装置
US9157730B2 (en) * 2012-10-26 2015-10-13 Applied Materials, Inc. PECVD process
JP2019029384A (ja) 2017-07-25 2019-02-21 新光電気工業株式会社 セラミックス混合物、多孔質体及びその製造方法、静電チャック及びその製造方法、基板固定装置
WO2020004478A1 (ja) * 2018-06-29 2020-01-02 北陸成型工業株式会社 静電チャック
US11393708B2 (en) 2018-12-21 2022-07-19 Toto Ltd. Electrostatic chuck
JP2020102620A (ja) * 2018-12-21 2020-07-02 Toto株式会社 静電チャック
JP7458195B2 (ja) 2020-02-10 2024-03-29 東京エレクトロン株式会社 載置台、プラズマ処理装置及びクリーニング処理方法
WO2022072370A1 (en) * 2020-10-01 2022-04-07 Lam Research Corporation High temperature pedestal with extended electrostatic chuck electrode
JP7620578B2 (ja) * 2022-01-07 2025-01-23 日本碍子株式会社 半導体製造装置用部材
JP7569342B2 (ja) * 2022-01-21 2024-10-17 日本碍子株式会社 半導体製造装置用部材
US12243719B2 (en) * 2022-06-28 2025-03-04 Taiwan Semiconductor Manufacturing Company, Ltd. Gas distribution ring for process chamber

Also Published As

Publication number Publication date
US12598952B2 (en) 2026-04-07
WO2025069231A1 (ja) 2025-04-03
JP7686884B1 (ja) 2025-06-02
US20250105043A1 (en) 2025-03-27
TW202514906A (zh) 2025-04-01
JPWO2025069231A1 (https=) 2025-04-03

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