JPWO2025069231A1 - - Google Patents
Info
- Publication number
- JPWO2025069231A1 JPWO2025069231A1 JP2024520721A JP2024520721A JPWO2025069231A1 JP WO2025069231 A1 JPWO2025069231 A1 JP WO2025069231A1 JP 2024520721 A JP2024520721 A JP 2024520721A JP 2024520721 A JP2024520721 A JP 2024520721A JP WO2025069231 A1 JPWO2025069231 A1 JP WO2025069231A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
- H10P72/722—Details of electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
- H01J37/32724—Temperature
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0432—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0434—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/002—Cooling arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/004—Charge control of objects or beams
- H01J2237/0041—Neutralising arrangements
- H01J2237/0044—Neutralising arrangements of objects being observed or treated
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2023/035051 WO2025069231A1 (ja) | 2023-09-27 | 2023-09-27 | 半導体製造装置用部材 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2025069231A1 true JPWO2025069231A1 (https=) | 2025-04-03 |
| JP7686884B1 JP7686884B1 (ja) | 2025-06-02 |
| JPWO2025069231A5 JPWO2025069231A5 (https=) | 2025-09-03 |
Family
ID=95067609
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024520721A Active JP7686884B1 (ja) | 2023-09-27 | 2023-09-27 | 半導体製造装置用部材 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US12598952B2 (https=) |
| JP (1) | JP7686884B1 (https=) |
| CN (1) | CN121925993A (https=) |
| TW (1) | TW202514906A (https=) |
| WO (1) | WO2025069231A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7847690B1 (ja) * | 2025-04-23 | 2026-04-17 | 日本特殊陶業株式会社 | 保持装置 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6490145B1 (en) * | 2001-07-18 | 2002-12-03 | Applied Materials, Inc. | Substrate support pedestal |
| JP4557814B2 (ja) * | 2005-06-09 | 2010-10-06 | パナソニック株式会社 | プラズマ処理装置 |
| US9157730B2 (en) * | 2012-10-26 | 2015-10-13 | Applied Materials, Inc. | PECVD process |
| JP2019029384A (ja) | 2017-07-25 | 2019-02-21 | 新光電気工業株式会社 | セラミックス混合物、多孔質体及びその製造方法、静電チャック及びその製造方法、基板固定装置 |
| WO2020004478A1 (ja) * | 2018-06-29 | 2020-01-02 | 北陸成型工業株式会社 | 静電チャック |
| US11393708B2 (en) | 2018-12-21 | 2022-07-19 | Toto Ltd. | Electrostatic chuck |
| JP2020102620A (ja) * | 2018-12-21 | 2020-07-02 | Toto株式会社 | 静電チャック |
| JP7458195B2 (ja) | 2020-02-10 | 2024-03-29 | 東京エレクトロン株式会社 | 載置台、プラズマ処理装置及びクリーニング処理方法 |
| WO2022072370A1 (en) * | 2020-10-01 | 2022-04-07 | Lam Research Corporation | High temperature pedestal with extended electrostatic chuck electrode |
| JP7620578B2 (ja) * | 2022-01-07 | 2025-01-23 | 日本碍子株式会社 | 半導体製造装置用部材 |
| JP7569342B2 (ja) * | 2022-01-21 | 2024-10-17 | 日本碍子株式会社 | 半導体製造装置用部材 |
| US12243719B2 (en) * | 2022-06-28 | 2025-03-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Gas distribution ring for process chamber |
-
2023
- 2023-09-27 CN CN202380013864.4A patent/CN121925993A/zh active Pending
- 2023-09-27 JP JP2024520721A patent/JP7686884B1/ja active Active
- 2023-09-27 WO PCT/JP2023/035051 patent/WO2025069231A1/ja active Pending
-
2024
- 2024-04-08 US US18/628,923 patent/US12598952B2/en active Active
- 2024-07-19 TW TW113127085A patent/TW202514906A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| US12598952B2 (en) | 2026-04-07 |
| WO2025069231A1 (ja) | 2025-04-03 |
| JP7686884B1 (ja) | 2025-06-02 |
| CN121925993A (zh) | 2026-04-24 |
| US20250105043A1 (en) | 2025-03-27 |
| TW202514906A (zh) | 2025-04-01 |
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