JP7686884B1 - 半導体製造装置用部材 - Google Patents

半導体製造装置用部材 Download PDF

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Publication number
JP7686884B1
JP7686884B1 JP2024520721A JP2024520721A JP7686884B1 JP 7686884 B1 JP7686884 B1 JP 7686884B1 JP 2024520721 A JP2024520721 A JP 2024520721A JP 2024520721 A JP2024520721 A JP 2024520721A JP 7686884 B1 JP7686884 B1 JP 7686884B1
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JP
Japan
Prior art keywords
plug
raised portion
hole
semiconductor manufacturing
gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024520721A
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English (en)
Japanese (ja)
Other versions
JPWO2025069231A5 (https=
JPWO2025069231A1 (https=
Inventor
靖也 井上
達也 久野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Publication of JPWO2025069231A1 publication Critical patent/JPWO2025069231A1/ja
Application granted granted Critical
Publication of JP7686884B1 publication Critical patent/JP7686884B1/ja
Publication of JPWO2025069231A5 publication Critical patent/JPWO2025069231A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H01J37/32724—Temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/002—Cooling arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/004—Charge control of objects or beams
    • H01J2237/0041—Neutralising arrangements
    • H01J2237/0044—Neutralising arrangements of objects being observed or treated

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
JP2024520721A 2023-09-27 2023-09-27 半導体製造装置用部材 Active JP7686884B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/035051 WO2025069231A1 (ja) 2023-09-27 2023-09-27 半導体製造装置用部材

Publications (3)

Publication Number Publication Date
JPWO2025069231A1 JPWO2025069231A1 (https=) 2025-04-03
JP7686884B1 true JP7686884B1 (ja) 2025-06-02
JPWO2025069231A5 JPWO2025069231A5 (https=) 2025-09-03

Family

ID=95067609

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024520721A Active JP7686884B1 (ja) 2023-09-27 2023-09-27 半導体製造装置用部材

Country Status (5)

Country Link
US (1) US12598952B2 (https=)
JP (1) JP7686884B1 (https=)
CN (1) CN121925993A (https=)
TW (1) TW202514906A (https=)
WO (1) WO2025069231A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7847690B1 (ja) * 2025-04-23 2026-04-17 日本特殊陶業株式会社 保持装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6490145B1 (en) * 2001-07-18 2002-12-03 Applied Materials, Inc. Substrate support pedestal
JP2006344766A (ja) * 2005-06-09 2006-12-21 Matsushita Electric Ind Co Ltd プラズマ処理装置
WO2020004478A1 (ja) * 2018-06-29 2020-01-02 北陸成型工業株式会社 静電チャック
JP2020102620A (ja) * 2018-12-21 2020-07-02 Toto株式会社 静電チャック
JP2021128956A (ja) * 2020-02-10 2021-09-02 東京エレクトロン株式会社 載置台、プラズマ処理装置及びクリーニング処理方法
JP2023101194A (ja) * 2022-01-07 2023-07-20 日本碍子株式会社 半導体製造装置用部材
JP2023106928A (ja) * 2022-01-21 2023-08-02 日本碍子株式会社 半導体製造装置用部材

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9157730B2 (en) * 2012-10-26 2015-10-13 Applied Materials, Inc. PECVD process
JP2019029384A (ja) 2017-07-25 2019-02-21 新光電気工業株式会社 セラミックス混合物、多孔質体及びその製造方法、静電チャック及びその製造方法、基板固定装置
US11393708B2 (en) 2018-12-21 2022-07-19 Toto Ltd. Electrostatic chuck
WO2022072370A1 (en) * 2020-10-01 2022-04-07 Lam Research Corporation High temperature pedestal with extended electrostatic chuck electrode
US12243719B2 (en) * 2022-06-28 2025-03-04 Taiwan Semiconductor Manufacturing Company, Ltd. Gas distribution ring for process chamber

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6490145B1 (en) * 2001-07-18 2002-12-03 Applied Materials, Inc. Substrate support pedestal
JP2006344766A (ja) * 2005-06-09 2006-12-21 Matsushita Electric Ind Co Ltd プラズマ処理装置
WO2020004478A1 (ja) * 2018-06-29 2020-01-02 北陸成型工業株式会社 静電チャック
JP2020102620A (ja) * 2018-12-21 2020-07-02 Toto株式会社 静電チャック
JP2021128956A (ja) * 2020-02-10 2021-09-02 東京エレクトロン株式会社 載置台、プラズマ処理装置及びクリーニング処理方法
JP2023101194A (ja) * 2022-01-07 2023-07-20 日本碍子株式会社 半導体製造装置用部材
JP2023106928A (ja) * 2022-01-21 2023-08-02 日本碍子株式会社 半導体製造装置用部材

Also Published As

Publication number Publication date
US12598952B2 (en) 2026-04-07
WO2025069231A1 (ja) 2025-04-03
CN121925993A (zh) 2026-04-24
US20250105043A1 (en) 2025-03-27
TW202514906A (zh) 2025-04-01
JPWO2025069231A1 (https=) 2025-04-03

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