CN121816872A - 半导体装置及半导体装置的制造方法 - Google Patents

半导体装置及半导体装置的制造方法

Info

Publication number
CN121816872A
CN121816872A CN202380102001.4A CN202380102001A CN121816872A CN 121816872 A CN121816872 A CN 121816872A CN 202380102001 A CN202380102001 A CN 202380102001A CN 121816872 A CN121816872 A CN 121816872A
Authority
CN
China
Prior art keywords
external terminal
semiconductor element
terminal
semiconductor device
main
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380102001.4A
Other languages
English (en)
Chinese (zh)
Inventor
大串直弘
宫本昇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN121816872A publication Critical patent/CN121816872A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CN202380102001.4A 2023-09-11 2023-09-11 半导体装置及半导体装置的制造方法 Pending CN121816872A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/033050 WO2025057268A1 (ja) 2023-09-11 2023-09-11 半導体装置及び半導体装置の製造方法

Publications (1)

Publication Number Publication Date
CN121816872A true CN121816872A (zh) 2026-04-07

Family

ID=95021824

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380102001.4A Pending CN121816872A (zh) 2023-09-11 2023-09-11 半导体装置及半导体装置的制造方法

Country Status (3)

Country Link
JP (1) JPWO2025057268A1 (https=)
CN (1) CN121816872A (https=)
WO (1) WO2025057268A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06338584A (ja) * 1993-05-31 1994-12-06 Nec Corp 半導体装置
JP2005150596A (ja) * 2003-11-19 2005-06-09 Nissan Motor Co Ltd 半導体装置及びその製造方法
JP2005302951A (ja) * 2004-04-09 2005-10-27 Toshiba Corp 電力用半導体装置パッケージ
JP4798020B2 (ja) * 2007-02-26 2011-10-19 富士電機株式会社 半導体装置およびその製造方法

Also Published As

Publication number Publication date
WO2025057268A1 (ja) 2025-03-20
JPWO2025057268A1 (https=) 2025-03-20

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