JPWO2025057268A1 - - Google Patents
Info
- Publication number
- JPWO2025057268A1 JPWO2025057268A1 JP2025545315A JP2025545315A JPWO2025057268A1 JP WO2025057268 A1 JPWO2025057268 A1 JP WO2025057268A1 JP 2025545315 A JP2025545315 A JP 2025545315A JP 2025545315 A JP2025545315 A JP 2025545315A JP WO2025057268 A1 JPWO2025057268 A1 JP WO2025057268A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2023/033050 WO2025057268A1 (ja) | 2023-09-11 | 2023-09-11 | 半導体装置及び半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2025057268A1 true JPWO2025057268A1 (https=) | 2025-03-20 |
| JPWO2025057268A5 JPWO2025057268A5 (https=) | 2025-11-04 |
Family
ID=95021824
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025545315A Pending JPWO2025057268A1 (https=) | 2023-09-11 | 2023-09-11 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2025057268A1 (https=) |
| CN (1) | CN121816872A (https=) |
| WO (1) | WO2025057268A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06338584A (ja) * | 1993-05-31 | 1994-12-06 | Nec Corp | 半導体装置 |
| JP2005150596A (ja) * | 2003-11-19 | 2005-06-09 | Nissan Motor Co Ltd | 半導体装置及びその製造方法 |
| JP2005302951A (ja) * | 2004-04-09 | 2005-10-27 | Toshiba Corp | 電力用半導体装置パッケージ |
| JP4798020B2 (ja) * | 2007-02-26 | 2011-10-19 | 富士電機株式会社 | 半導体装置およびその製造方法 |
-
2023
- 2023-09-11 WO PCT/JP2023/033050 patent/WO2025057268A1/ja active Pending
- 2023-09-11 JP JP2025545315A patent/JPWO2025057268A1/ja active Pending
- 2023-09-11 CN CN202380102001.4A patent/CN121816872A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2025057268A1 (ja) | 2025-03-20 |
| CN121816872A (zh) | 2026-04-07 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250807 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250807 |