CN1215094A - Non-balance plane magnetic controlled sputtering cathode and film plating device thereof - Google Patents
Non-balance plane magnetic controlled sputtering cathode and film plating device thereof Download PDFInfo
- Publication number
- CN1215094A CN1215094A CN98120365.5A CN98120365A CN1215094A CN 1215094 A CN1215094 A CN 1215094A CN 98120365 A CN98120365 A CN 98120365A CN 1215094 A CN1215094 A CN 1215094A
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- CN
- China
- Prior art keywords
- vacuum chamber
- sputtering cathode
- permanent magnet
- magnetic
- controlled sputtering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000005291 magnetic effect Effects 0.000 title claims abstract description 74
- 238000004544 sputter deposition Methods 0.000 title claims abstract description 29
- 238000007747 plating Methods 0.000 title description 2
- 230000005294 ferromagnetic effect Effects 0.000 claims abstract description 9
- 238000001816 cooling Methods 0.000 claims abstract description 5
- 239000007888 film coating Substances 0.000 claims description 14
- 238000009501 film coating Methods 0.000 claims description 14
- 230000002093 peripheral effect Effects 0.000 claims description 13
- 239000013077 target material Substances 0.000 abstract 3
- 238000000151 deposition Methods 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- 238000001771 vacuum deposition Methods 0.000 abstract 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 12
- 229910052742 iron Inorganic materials 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 238000010849 ion bombardment Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
- H01J37/3408—Planar magnetron sputtering
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Disintegrating Or Milling (AREA)
Abstract
The present invention designs a non-equilibrium plane magnetic control sputtering cathode, including target material, non-ferromagnetic backplate, permanent magnet and pole shoe. Two permanent magnets with their N-S axises are parallel to target surface are placed between the target material and non-ferromagnetic backplate, the N-poles of permanent magnets positioned at two sides are opposite, and between the permanent magnets and target material, there is a water-cooling channel. The magnetic control sputtering cathodes are uniformly distributed around the vacuum chamber of the vacuum deposition equipment, and the centre of the vacuum chamber is equipped with electromagnet. Said invention packs whole vacuum chamber with fully-enclosed magnetic netted-cage to make whole deposition space implement electronic control to prevent the electrons from escaping to the vacuum chamber wall (anode) so as to raise the gas ionization rate of whole vacuum chamber.
Description
The present invention relates to a kind of non-balance plane magnetic controlled sputtering cathode and film coating apparatus thereof, belong to technical field of vacuum plating.
The non-balance plane magnetic controlled sputtering cathode of present industrial application, what adopt in HTC type film coating apparatus as Dutch Hao Shi company (Hauzer TechnoCoating) is that electro-magnet is to strengthen the peripheral pole of common magnetic control sputtering cathode, the non-balance magnetically controlled sputter negative electrode that is constituted, as shown in Figure 1.Among Fig. 1, the 1st, electro-magnet, the 2nd, target, the 3rd, permanent magnet, the 4th, vacuum chamber.Be characterized in: adopt permanent magnet to produce magnetic field, the N-S axis normal of permanent magnet is in target surface, and peripheral permanent magnet is opposite with the polarity of heart portion permanent magnet; Adopt pure iron (or soft steel) backboard to connect peripheral permanent magnet and heart portion permanent magnet.
The vacuum coater of existing at present equipment non-balance plane magnetic controlled sputtering cathode is put on market.The HTC1000-4 ABS film coating apparatus that for example Dutch Hao Shi company produces, this device are to have arranged 4 non-balance magnetically controlled sputter negative electrodes as shown in Figure 1 around vacuum chamber.See Fig. 2, among Fig. 2, the 1st, electro-magnet, the 2nd, target, the 3rd, permanent magnet, the 5th, the runway magnetic line of force, the 6th, disperse magnetic line of force, the 7th, planet chamber work rest.Two non-balance magnetically controlled sputter negative electrodes adjacent one another are, its polarity of the magnetic field is opposite.So the magnetic line of force of each self defocusing is connected with each other, come about beam electrons at the inboard formation of vacuum-chamber wall magnetic force gauze.The magnetic force gauze of about beam electrons concentrates near the vacuum-chamber wall, this geographic ionization level is improved, but to the higher zone of internal vacuum chamber plated film speed, just influence on the contrary not quite for the zone that more needs to improve ionization level.In addition, the magnetic force gauze of about beam electrons does not seal at the upper and lower end of vacuum chamber, and electronics is escaped easily thus.
The objective of the invention is to design a kind of non-balance plane magnetic controlled sputtering cathode and film coating apparatus thereof, make totally-enclosed magnetic line of force cylinder mould be crowded with whole vacuum chambers, in the control of the plated film space of whole vacuum chamber realization to electronics, make electronics be difficult to escape into vacuum-chamber wall (anode), to improve the gas ionization level of whole true chamber.
The non-balance plane magnetic controlled sputtering cathode of the present invention's design comprises target, non-ferromagnetic body backboard, permanent magnet, pole shoe.The N-S axis of permanent magnet is parallel to target surface and is positioned between target and the non-ferromagnetic body backboard, the magnetic pole of the same magnetic of the permanent magnet of the left and right sides is relative, heart portion pole shoe is positioned between the permanent magnet of both sides, and the outside of permanent magnet is peripheral pole shoe, between permanent magnet and the target water-cooling channel is arranged.
The present invention utilizes above-mentioned non-balance plane magnetic controlled sputtering cathode to design film coating apparatus, be evenly distributed with aforesaid negative electrode around the vacuum chamber of this device, the vacuum chamber center is provided with electro-magnet, the magnetic pole of electro-magnet is right by opposite polar phase with magnetic control sputtering cathode, is placed between negative electrode and the electro-magnet by the workpiece of plated film.
The non-balance plane magnetic controlled sputtering cathode of the present invention's design, the magnetic line of force part that its heart portion pole shoe sends enters target surface, is the runway magnetic line of force, constitutes runway magnetic field; Another part is for dispersing magnetic line of force, thereby the magnetic line of force of realizing the non-balance magnetically controlled sputter negative electrode distributes.
The negative electrode of the present invention's design is applied to film coating apparatus, at vacuum chamber center fixture electro-magnet, its advantage is further to make the emission magnetic line of force of non-balance magnetically controlled sputter negative electrode to extend to the centre of vacuum chamber, accepts ion bombardment in the plasma body thereby the workpiece of whole vacuum chamber can both be immersed in.
Above-mentioned center electro-magnet is in floating potential or adds that the negative bias that is lower than the sputter threshold value is to reflect before emission magnetic line of force spiral and then the electronics of the center of arrival electro-magnet.
The film coating apparatus of the present invention's design makes totally-enclosed magnetic line of force cage be crowded with whole vacuum chambers, realizes the control to electronics in whole plated film space, makes electronics be difficult to escape into vacuum-chamber wall (anode), to improve the gas ionization level of whole true chamber.
Description of drawings:
Fig. 1 is the structural representation of bold and unconstrained scholar's non-balance plane magnetic controlled sputtering cathode of prior art.
Fig. 2 is bold and unconstrained scholar's film coating apparatus synoptic diagram of prior art.
Fig. 3 is the structural representation of the non-balance plane magnetic controlled sputtering cathode that designs of the present invention.
Fig. 4 is the synoptic diagram that utilizes the designed film coating apparatus of negative electrode of the present invention.
Fig. 5 is the top closure situation synoptic diagram of peripheral magnetic line of force cylinder mould.
Introduce content of the present invention in detail below in conjunction with accompanying drawing.
Among Fig. 3, the 11st, target, the 12nd, peripheral pole shoe, its material are pure iron, the 13rd, permanent magnet, the 14th, non-ferromagnetic backplate, its material is a tetrafluoroethylene, the 15th, water-cooling channel, the 16th, heart portion pole shoe, its material is a pure iron, the 17th, and strong plasma area, the 18th, disperse magnetic line of force, the 19th, the runway magnetic line of force.
Among Fig. 4, the 21st, vacuum chamber, the 22nd, electromagnetic core portion pole shoe, its material is a pure iron, the 23rd, magnet coil, the 24th, the peripheral pole shoe of electro-magnet, its material is a pure iron, the 25th, the electro-magnet backboard, its material is a pure iron, the 26th, and peripheral magnetic line of force (constituting the magnetic line of force cylinder mould), the 27th, heart portion magnetic line of force (constituting heart portion magnetic line of force cylinder mould), the 28th, runway magnetic line of force, the 29th, the non-balance plane magnetic controlled sputtering cathode that the present invention designs.
Among Fig. 5, the 21st, vacuum chamber, the 26th, peripheral magnetic line of force cylinder mould, the 28th, runway magnetic line of force, the 29th, the non-balance plane magnetic controlled sputtering cathode that the present invention designs, the 30th, electro-magnet.
As shown in Figure 3, the non-balance plane magnetic controlled sputtering cathode of the present invention's design comprises target 11, non-ferromagnetic body backboard 14, permanent magnet 13, pole shoe 12 and 16.The N-S axis of permanent magnet is parallel to target surface and is positioned between target 11 and the non-ferromagnetic body backboard 14, the N of both sides permanent magnet is extremely relative, heart portion pole shoe 16 is positioned between the permanent magnet of both sides, and the outside of permanent magnet is peripheral pole shoe 12, and water-cooling channel 15 is arranged between permanent magnet and the target.
As shown in Figure 4, the film coating apparatus of the non-balance plane magnetic controlled sputtering cathode of the present invention's design, be evenly distributed with four tool non-balance plane magnetic controlled sputtering cathodes around the vacuum chamber of this device, the vacuum chamber center is provided with electro-magnet, the N of electro-magnet, the N of S magnetic pole and magnetic control sputtering cathode, the S magnetic pole is right by opposite polar phase.
To adopt electromagnet be for the ease of by regulating its magneticstrength to satisfy the desired ionization level in various degree of various coating process to center magnet among the present invention.Under the certain condition of technology, also can simply adopt permanent magnet.Whole layout shown in Figure 4 can mark off four identical unit, and each unit comprises a non-balance plane magnetic controlled sputtering cathode and an electro-magnet.The magnetic field of electro-magnet is similar to the design's non-balance plane magnetic controlled sputtering cathode, promptly comprises runway magnetic field and heart portion divergent magnetic field two portions.The runway magnetic field of each non-balance plane magnetic controlled sputtering cathode is over against the runway magnetic field of an electro-magnet, but polarity is opposite.In each unit, the two the divergent magnetic field acting in conjunction of non-balance plane magnetic controlled sputtering cathode and electromagnet constitutes a peripheral magnetic line of force cylinder mould and a heart portion magnetic line of force cylinder mould, and all is top and all sealings of bottom.Fig. 5 represents the encapsulation situations at the top (or bottom) of peripheral magnetic line of force cylinder mould, can avoid electronics to escape into vacuum-chamber wall (being anode) from the vacuum chamber top and bottom like this.As shown in the figure, whole film coating apparatus has 8 totally-enclosed magnetic line of force cages and is crowded with whole vacuum chambers, realizes the control to electronics in whole plated film space, makes electronics be difficult to escape into vacuum-chamber wall (anode), to improve the gas ionization level of whole true chamber.
Each unit independently has the non-balance magnetically controlled sputter function, can install separately in film coating apparatus, also can a plurality of any assemblings, and be the situation of 4 unit assemblings as Fig. 4.
Claims (2)
1, a kind of non-balance plane magnetic controlled sputtering cathode comprises target, non-ferromagnetic body backboard, permanent magnet, pole shoe; The N-S axis that it is characterized in that two permanent magnets is parallel to target surface and is positioned between target and the non-ferromagnetic back plate, the N of both sides permanent magnet is extremely relative, heart portion pole shoe is positioned between the permanent magnet, and the outside of permanent magnet is the peripheral pole shoe of S, between permanent magnet and the target water-cooling channel is arranged.
2, a kind of film coating apparatus that non-balance plane magnetic controlled sputtering cathode as claimed in claim 1 is housed, the vacuum chamber that it is characterized in that this device is distributed with non-balance plane magnetic controlled sputtering cathode all around, the vacuum chamber center is provided with electro-magnet, the N of electro-magnet, the N of S magnetic pole and non-balance plane magnetic controlled sputtering cathode, the S magnetic pole is right by opposite polar phase.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN98120365A CN1109127C (en) | 1998-10-09 | 1998-10-09 | Non-balance plane magnetic controlled sputtering cathode and film plating device thereof |
| GB9903261A GB2342361B (en) | 1998-10-09 | 1999-02-12 | Planar unbalanced magnetron sputtering cathode and coating system with the same |
| IT1999PN000060A IT1311701B1 (en) | 1998-10-09 | 1999-07-16 | IONIC PULVERIZATION CATHODE FOR MAGNETRON UNBALKED PLATFORM AND COATING SYSTEM WITH THE SAME |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN98120365A CN1109127C (en) | 1998-10-09 | 1998-10-09 | Non-balance plane magnetic controlled sputtering cathode and film plating device thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1215094A true CN1215094A (en) | 1999-04-28 |
| CN1109127C CN1109127C (en) | 2003-05-21 |
Family
ID=5226709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN98120365A Expired - Fee Related CN1109127C (en) | 1998-10-09 | 1998-10-09 | Non-balance plane magnetic controlled sputtering cathode and film plating device thereof |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN1109127C (en) |
| GB (1) | GB2342361B (en) |
| IT (1) | IT1311701B1 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1303245C (en) * | 2002-03-14 | 2007-03-07 | 三星电子株式会社 | Sputtering device and its electrode and manufacturing method of the electrode |
| CN101445915B (en) * | 2007-11-30 | 2012-01-04 | 松下电器产业株式会社 | Sputtering apparatus and sputtering method |
| CN101752221B (en) * | 2008-12-17 | 2014-07-30 | 佳能安内华股份有限公司 | Vacuum vessel, vacuum vessel manufacturing method, vacuum processing apparatus, and electronic device manufacturing method |
| CN105200381A (en) * | 2015-10-27 | 2015-12-30 | 中国科学院兰州化学物理研究所 | Anode field assisted magnetron sputtering coating apparatus |
| CN109065429A (en) * | 2018-08-10 | 2018-12-21 | 成都极星等离子科技有限公司 | A kind of ion source reducing electron escape rate |
| CN109706428A (en) * | 2019-02-25 | 2019-05-03 | 常州星宇车灯股份有限公司 | A kind of sputtering target assembly |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102006020004B4 (en) * | 2006-04-26 | 2011-06-01 | Systec System- Und Anlagentechnik Gmbh & Co.Kg | Apparatus and method for homogeneous PVD coating |
| CN201614406U (en) * | 2008-08-27 | 2010-10-27 | 梯尔涂层有限公司 | Equipment for forming cladding layer of deposition material |
| US20120125766A1 (en) * | 2010-11-22 | 2012-05-24 | Zhurin Viacheslav V | Magnetron with non-equipotential cathode |
| CN102586750A (en) * | 2012-03-14 | 2012-07-18 | 无锡康力电子有限公司 | Planar moving target mechanism |
| CN106435500B (en) * | 2016-09-30 | 2018-07-27 | 西南交通大学 | A kind of magnetic field sources for planar rondure magnetron sputtering cathode target |
| CN114574830B (en) * | 2022-03-11 | 2024-03-26 | 陕西理工大学 | Magnet arrangement structure for magnetron sputtering target cathode |
| CN114351104B (en) * | 2022-03-21 | 2022-06-07 | 山西金山磁材有限公司 | Magnetic flux device of magnetron sputtering planar target |
| CN115011941B (en) * | 2022-06-06 | 2024-08-23 | 中国科学院电工研究所 | Permanent magnet selective coating method based on variable magnetic field magnetron sputtering coating device |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH648690A5 (en) * | 1980-10-14 | 1985-03-29 | Balzers Hochvakuum | CATHODE ARRANGEMENT FOR SPRAYING MATERIAL FROM A TARGET IN A CATHODE SPRAYING SYSTEM. |
| US4517070A (en) * | 1984-06-28 | 1985-05-14 | General Motors Corporation | Magnetron sputtering cathode assembly and magnet assembly therefor |
| KR950000011B1 (en) * | 1990-02-28 | 1995-01-07 | 니찌덴 아네루바 가부시끼가이샤 | Magnetron sputtering apparatus and thin film depositing method |
| US5441614A (en) * | 1994-11-30 | 1995-08-15 | At&T Corp. | Method and apparatus for planar magnetron sputtering |
| CN2232044Y (en) * | 1995-01-24 | 1996-07-31 | 郑世民 | Large return passage closed sputtering trace column magnetic control target |
| CN1157335A (en) * | 1996-02-13 | 1997-08-20 | 王福贞 | Permanent-magnet controlled plane cathode arc source |
| US5736019A (en) * | 1996-03-07 | 1998-04-07 | Bernick; Mark A. | Sputtering cathode |
| CN2241698Y (en) * | 1996-03-08 | 1996-12-04 | 甘国工 | Plane magnetic control sputtering source |
| US6081725A (en) * | 1996-10-30 | 2000-06-27 | Nec Corporation | Portable telephone system and control method therefor |
-
1998
- 1998-10-09 CN CN98120365A patent/CN1109127C/en not_active Expired - Fee Related
-
1999
- 1999-02-12 GB GB9903261A patent/GB2342361B/en not_active Expired - Fee Related
- 1999-07-16 IT IT1999PN000060A patent/IT1311701B1/en active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1303245C (en) * | 2002-03-14 | 2007-03-07 | 三星电子株式会社 | Sputtering device and its electrode and manufacturing method of the electrode |
| CN101445915B (en) * | 2007-11-30 | 2012-01-04 | 松下电器产业株式会社 | Sputtering apparatus and sputtering method |
| CN101752221B (en) * | 2008-12-17 | 2014-07-30 | 佳能安内华股份有限公司 | Vacuum vessel, vacuum vessel manufacturing method, vacuum processing apparatus, and electronic device manufacturing method |
| CN105200381A (en) * | 2015-10-27 | 2015-12-30 | 中国科学院兰州化学物理研究所 | Anode field assisted magnetron sputtering coating apparatus |
| CN109065429A (en) * | 2018-08-10 | 2018-12-21 | 成都极星等离子科技有限公司 | A kind of ion source reducing electron escape rate |
| CN109706428A (en) * | 2019-02-25 | 2019-05-03 | 常州星宇车灯股份有限公司 | A kind of sputtering target assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| ITPN990060A0 (en) | 1999-07-16 |
| CN1109127C (en) | 2003-05-21 |
| GB2342361A (en) | 2000-04-12 |
| GB9903261D0 (en) | 1999-04-07 |
| IT1311701B1 (en) | 2002-03-19 |
| GB2342361B (en) | 2003-06-04 |
| ITPN990060A1 (en) | 2001-01-16 |
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Legal Events
| Date | Code | Title | Description |
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| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C53 | Correction of patent of invention or patent application | ||
| CB02 | Change of applicant information |
Applicant after: Fan Yudian Applicant after: Wang Baihai Applicant after: Huang Chixiong Applicant after: George Ponassus Applicant before: Fan Yudian Applicant before: Wang Baihai Applicant before: Huang Chixiong |
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| COR | Change of bibliographic data |
Free format text: CORRECT: APPLICANT; FROM: FAN YUDIAN; WANG BAIHAI; HUANG CHIXIONG TO: FAN YUDIAN; WANG BAIHAI; HUANG CHIXIONG; VICTORIA DUHANING |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |