GB9903261D0 - Planar unbalanced magnetron sputtering cathode and coating system with the same - Google Patents
Planar unbalanced magnetron sputtering cathode and coating system with the sameInfo
- Publication number
- GB9903261D0 GB9903261D0 GBGB9903261.7A GB9903261A GB9903261D0 GB 9903261 D0 GB9903261 D0 GB 9903261D0 GB 9903261 A GB9903261 A GB 9903261A GB 9903261 D0 GB9903261 D0 GB 9903261D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- same
- magnetron sputtering
- coating system
- sputtering cathode
- unbalanced magnetron
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
- H01J37/3408—Planar magnetron sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Disintegrating Or Milling (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN98120365A CN1109127C (en) | 1998-10-09 | 1998-10-09 | Non-balance plane magnetic controlled sputtering cathode and film plating device thereof |
Publications (3)
Publication Number | Publication Date |
---|---|
GB9903261D0 true GB9903261D0 (en) | 1999-04-07 |
GB2342361A GB2342361A (en) | 2000-04-12 |
GB2342361B GB2342361B (en) | 2003-06-04 |
Family
ID=5226709
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB9903261A Expired - Fee Related GB2342361B (en) | 1998-10-09 | 1999-02-12 | Planar unbalanced magnetron sputtering cathode and coating system with the same |
Country Status (3)
Country | Link |
---|---|
CN (1) | CN1109127C (en) |
GB (1) | GB2342361B (en) |
IT (1) | IT1311701B1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114351104A (en) * | 2022-03-21 | 2022-04-15 | 山西金山磁材有限公司 | Magnetic flux device of magnetron sputtering planar target |
CN114574830A (en) * | 2022-03-11 | 2022-06-03 | 陕西理工大学 | Magnet arrangement for magnetron sputtering target cathode |
CN115011941A (en) * | 2022-06-06 | 2022-09-06 | 中国科学院电工研究所 | Permanent magnet selective coating method based on variable magnetic field magnetron sputtering coating device |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100846484B1 (en) * | 2002-03-14 | 2008-07-17 | 삼성전자주식회사 | Rotation magnetron in magnetron electrode and method of manufacturing the same and sputtering apparatus with the same |
DE102006020004B4 (en) * | 2006-04-26 | 2011-06-01 | Systec System- Und Anlagentechnik Gmbh & Co.Kg | Apparatus and method for homogeneous PVD coating |
JP4526582B2 (en) * | 2007-11-30 | 2010-08-18 | パナソニック株式会社 | Sputtering apparatus and sputtering method |
CN201614406U (en) * | 2008-08-27 | 2010-10-27 | 梯尔涂层有限公司 | Equipment for forming cladding layer of deposition material |
JP2010144199A (en) * | 2008-12-17 | 2010-07-01 | Canon Anelva Corp | Vacuum vessel, vacuum treatment apparatus having vacuum vessel, and method for manufacturing vacuum vessel |
US20120125766A1 (en) * | 2010-11-22 | 2012-05-24 | Zhurin Viacheslav V | Magnetron with non-equipotential cathode |
CN102586750A (en) * | 2012-03-14 | 2012-07-18 | 无锡康力电子有限公司 | Planar moving target mechanism |
CN105200381B (en) * | 2015-10-27 | 2018-06-12 | 中国科学院兰州化学物理研究所 | The auxiliary magnetic control sputtering film plating device of anodic field |
CN106435500B (en) * | 2016-09-30 | 2018-07-27 | 西南交通大学 | A kind of magnetic field sources for planar rondure magnetron sputtering cathode target |
CN109065429B (en) * | 2018-08-10 | 2020-05-05 | 成都极星等离子科技有限公司 | Ion source capable of reducing electron escape rate |
CN109706428A (en) * | 2019-02-25 | 2019-05-03 | 常州星宇车灯股份有限公司 | A kind of sputtering target assembly |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH648690A5 (en) * | 1980-10-14 | 1985-03-29 | Balzers Hochvakuum | CATHODE ARRANGEMENT FOR SPRAYING MATERIAL FROM A TARGET IN A CATHODE SPRAYING SYSTEM. |
US4517070A (en) * | 1984-06-28 | 1985-05-14 | General Motors Corporation | Magnetron sputtering cathode assembly and magnet assembly therefor |
KR950000011B1 (en) * | 1990-02-28 | 1995-01-07 | 니찌덴 아네루바 가부시끼가이샤 | Magnetron sputtering apparatus and thin film depositing method |
US5441614A (en) * | 1994-11-30 | 1995-08-15 | At&T Corp. | Method and apparatus for planar magnetron sputtering |
CN2232044Y (en) * | 1995-01-24 | 1996-07-31 | 郑世民 | Large return passage closed sputtering trace column magnetic control target |
CN1157335A (en) * | 1996-02-13 | 1997-08-20 | 王福贞 | Permanent-magnet controlled plane cathode arc source |
US5736019A (en) * | 1996-03-07 | 1998-04-07 | Bernick; Mark A. | Sputtering cathode |
CN2241698Y (en) * | 1996-03-08 | 1996-12-04 | 甘国工 | Plane magnetic control sputtering source |
US6081725A (en) * | 1996-10-30 | 2000-06-27 | Nec Corporation | Portable telephone system and control method therefor |
-
1998
- 1998-10-09 CN CN98120365A patent/CN1109127C/en not_active Expired - Fee Related
-
1999
- 1999-02-12 GB GB9903261A patent/GB2342361B/en not_active Expired - Fee Related
- 1999-07-16 IT IT1999PN000060A patent/IT1311701B1/en active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114574830A (en) * | 2022-03-11 | 2022-06-03 | 陕西理工大学 | Magnet arrangement for magnetron sputtering target cathode |
CN114574830B (en) * | 2022-03-11 | 2024-03-26 | 陕西理工大学 | Magnet arrangement structure for magnetron sputtering target cathode |
CN114351104A (en) * | 2022-03-21 | 2022-04-15 | 山西金山磁材有限公司 | Magnetic flux device of magnetron sputtering planar target |
CN115011941A (en) * | 2022-06-06 | 2022-09-06 | 中国科学院电工研究所 | Permanent magnet selective coating method based on variable magnetic field magnetron sputtering coating device |
Also Published As
Publication number | Publication date |
---|---|
CN1109127C (en) | 2003-05-21 |
ITPN990060A1 (en) | 2001-01-16 |
GB2342361B (en) | 2003-06-04 |
IT1311701B1 (en) | 2002-03-19 |
ITPN990060A0 (en) | 1999-07-16 |
CN1215094A (en) | 1999-04-28 |
GB2342361A (en) | 2000-04-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
REG | Reference to a national code |
Ref country code: HK Ref legal event code: WD Ref document number: 1025663 Country of ref document: HK |
|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20120212 |