AU4855696A - Rotatable magnetron with curved or segmented end magnets - Google Patents

Rotatable magnetron with curved or segmented end magnets

Info

Publication number
AU4855696A
AU4855696A AU48556/96A AU4855696A AU4855696A AU 4855696 A AU4855696 A AU 4855696A AU 48556/96 A AU48556/96 A AU 48556/96A AU 4855696 A AU4855696 A AU 4855696A AU 4855696 A AU4855696 A AU 4855696A
Authority
AU
Australia
Prior art keywords
curved
end magnets
rotatable magnetron
segmented end
segmented
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU48556/96A
Inventor
Henry Byorum
John P Lehan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Linde LLC
Original Assignee
BOC Group Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOC Group Inc filed Critical BOC Group Inc
Publication of AU4855696A publication Critical patent/AU4855696A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3452—Magnet distribution
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3455—Movable magnets

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
AU48556/96A 1995-01-12 1996-01-11 Rotatable magnetron with curved or segmented end magnets Abandoned AU4855696A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US37202395A 1995-01-12 1995-01-12
US372023 1995-01-12
PCT/US1996/000409 WO1996021750A1 (en) 1995-01-12 1996-01-11 Rotatable magnetron with curved or segmented end magnets

Publications (1)

Publication Number Publication Date
AU4855696A true AU4855696A (en) 1996-07-31

Family

ID=23466389

Family Applications (1)

Application Number Title Priority Date Filing Date
AU48556/96A Abandoned AU4855696A (en) 1995-01-12 1996-01-11 Rotatable magnetron with curved or segmented end magnets

Country Status (4)

Country Link
EP (1) EP0805880A4 (en)
JP (1) JPH10512326A (en)
AU (1) AU4855696A (en)
WO (1) WO1996021750A1 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1072055B1 (en) * 1998-04-16 2005-12-07 Bekaert Advanced Coatings NV. Means for controlling target erosion and sputtering in a magnetron
DE69937948D1 (en) 1999-06-21 2008-02-21 Bekaert Advanced Coatings N V Magnetron with movable magnet arrangement to compensate the erosion profile
IE20000425A1 (en) * 1999-08-19 2001-03-07 Praxair Technology Inc Low permeability non-planar ferromagnetic sputter targets
DE102004007813A1 (en) * 2004-02-18 2005-09-08 Applied Films Gmbh & Co. Kg Sputtering device with a magnetron and a target
EP1774563A1 (en) 2004-07-01 2007-04-18 Cardinal CG Company Cylindrical target with oscillating magnet from magnetron sputtering
DE102009005512B4 (en) 2009-01-20 2017-01-26 Von Ardenne Gmbh Method for operating a tubular magnetron arrangement for sputtering
EP2306490A1 (en) * 2009-10-02 2011-04-06 Applied Materials, Inc. Magnet arrangement for a target backing tube and target backing tube comprising the same
WO2011056581A2 (en) * 2009-10-26 2011-05-12 General Plasma, Inc. Rotary magnetron magnet bar and apparatus containing the same for high target utilization
US8398834B2 (en) * 2010-04-02 2013-03-19 NuvoSun, Inc. Target utilization improvement for rotatable magnetrons
EP2407999B1 (en) * 2010-07-16 2014-09-03 Applied Materials, Inc. Magnet arrangement for a target backing tube, target backing tube including the same, cylindrical target assembly and sputtering system
KR101959742B1 (en) * 2011-01-06 2019-03-19 스퍼터링 컴포넌츠 인코포레이티드 Sputtering apparatus
DE102011077297A1 (en) * 2011-02-15 2012-08-16 Von Ardenne Anlagentechnik Gmbh Magnetron sputtering device comprises a target and a magnetic system that are movable with respect to each other
KR101654660B1 (en) * 2012-07-11 2016-09-07 캐논 아네르바 가부시키가이샤 Sputtering device and magnet unit
WO2014039426A1 (en) 2012-09-04 2014-03-13 Sputtering Components, Inc. Sputtering apparatus
DE102012109424A1 (en) 2012-10-04 2014-04-10 Von Ardenne Anlagentechnik Gmbh Sputtering magnetron and method for dynamic magnetic field influencing

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2707144A1 (en) * 1976-02-19 1977-08-25 Sloan Technology Corp Cathode sputtering device with magnetic equipment - which can be displaced to move the area of sputtering over an extended surface by relative movement
US4525264A (en) * 1981-12-07 1985-06-25 Ford Motor Company Cylindrical post magnetron sputtering system
EP0451642B1 (en) * 1990-03-30 1996-08-21 Applied Materials, Inc. Sputtering system
WO1991020091A1 (en) * 1990-06-16 1991-12-26 General Vacuum Equipment Limited Metallizing apparatus
US5427665A (en) * 1990-07-11 1995-06-27 Leybold Aktiengesellschaft Process and apparatus for reactive coating of a substrate
FR2668171B1 (en) * 1990-10-18 1992-12-04 Cit Alcatel CATHODE SPRAY DEPOSITION MACHINE.
US5364518A (en) * 1991-05-28 1994-11-15 Leybold Aktiengesellschaft Magnetron cathode for a rotating target
DE4117367C2 (en) * 1991-05-28 1999-11-04 Leybold Ag Method for generating a homogeneous removal profile on a rotating target of a sputtering device

Also Published As

Publication number Publication date
EP0805880A1 (en) 1997-11-12
JPH10512326A (en) 1998-11-24
WO1996021750A1 (en) 1996-07-18
EP0805880A4 (en) 1998-05-06

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