CN121399182A - 环氧树脂组合物、粘接剂、密封材料、固化物、半导体装置及电子部件 - Google Patents

环氧树脂组合物、粘接剂、密封材料、固化物、半导体装置及电子部件

Info

Publication number
CN121399182A
CN121399182A CN202480042250.3A CN202480042250A CN121399182A CN 121399182 A CN121399182 A CN 121399182A CN 202480042250 A CN202480042250 A CN 202480042250A CN 121399182 A CN121399182 A CN 121399182A
Authority
CN
China
Prior art keywords
component
epoxy resin
resin composition
thiol
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202480042250.3A
Other languages
English (en)
Chinese (zh)
Inventor
大坪广大
重田望
岩谷一希
永田理惠子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Namics Corp
Original Assignee
Namics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Namics Corp filed Critical Namics Corp
Publication of CN121399182A publication Critical patent/CN121399182A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/66—Mercaptans
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CN202480042250.3A 2023-07-21 2024-07-11 环氧树脂组合物、粘接剂、密封材料、固化物、半导体装置及电子部件 Pending CN121399182A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023119049 2023-07-21
JP2023-119049 2023-07-21
PCT/JP2024/025149 WO2025023051A1 (ja) 2023-07-21 2024-07-11 エポキシ樹脂組成物、接着剤、封止材、硬化物、半導体装置及び電子部品

Publications (1)

Publication Number Publication Date
CN121399182A true CN121399182A (zh) 2026-01-23

Family

ID=94374962

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202480042250.3A Pending CN121399182A (zh) 2023-07-21 2024-07-11 环氧树脂组合物、粘接剂、密封材料、固化物、半导体装置及电子部件

Country Status (5)

Country Link
JP (1) JPWO2025023051A1 (https=)
KR (1) KR20260038862A (https=)
CN (1) CN121399182A (https=)
TW (1) TW202506798A (https=)
WO (1) WO2025023051A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026048838A1 (ja) * 2024-08-30 2026-03-05 ナミックス株式会社 硬化剤組成物、それが収容された容器、熱硬化性組成物キット、熱硬化性組成物の製造方法、熱硬化性組成物の硬化物、ならびに硬化剤組成物の輸送及び保存方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3367532B2 (ja) 1992-10-22 2003-01-14 味の素株式会社 エポキシ樹脂組成物
JP3367531B2 (ja) 1992-10-22 2003-01-14 味の素株式会社 エポキシ樹脂組成物
JP2012153794A (ja) 2011-01-26 2012-08-16 Sakai Chem Ind Co Ltd 樹脂組成物、樹脂硬化物および樹脂成形体
WO2015060440A1 (ja) * 2013-10-25 2015-04-30 味の素株式会社 耐熱性エポキシ樹脂組成物
CN105473634B (zh) * 2013-10-25 2017-08-04 味之素株式会社 柔性环氧树脂组合物
JP2020120843A (ja) 2019-01-30 2020-08-13 株式会社三洋物産 遊技機
CN116218438A (zh) * 2021-12-02 2023-06-06 3M创新有限公司 单组分环氧粘合剂组合物及其制备方法
JP7723639B2 (ja) * 2022-05-10 2025-08-14 四国化成工業株式会社 チオール化合物及びその用途
JP7236041B2 (ja) 2022-08-24 2023-03-09 四国化成ホールディングス株式会社 硬化剤及びその用途
CN115386324B (zh) * 2022-09-21 2023-11-17 上海仁速新材料有限公司 一种环氧胶粘剂及其制备方法和应用
JP2023126883A (ja) 2023-07-04 2023-09-12 四国化成工業株式会社 チオール化合物及びその用途

Also Published As

Publication number Publication date
TW202506798A (zh) 2025-02-16
KR20260038862A (ko) 2026-03-19
WO2025023051A1 (ja) 2025-01-30
JPWO2025023051A1 (https=) 2025-01-30

Similar Documents

Publication Publication Date Title
CN112689652B (zh) 环氧树脂组合物
TWI826714B (zh) 環氧樹脂組成物
CN112689651B (zh) 环氧树脂组合物
JP2019156965A (ja) エポキシ樹脂組成物
KR102187495B1 (ko) 에폭시 수지 조성물
CN121399182A (zh) 环氧树脂组合物、粘接剂、密封材料、固化物、半导体装置及电子部件
CN121443668A (zh) 环氧树脂组合物、粘接剂、密封材料、固化物、半导体装置及电子部件
JP6651161B1 (ja) エポキシ樹脂組成物
JP2024064648A (ja) 樹脂組成物、接着剤、封止材、硬化物、半導体装置及び電子部品
JP2020164628A (ja) 樹脂組成物
JP2021031666A (ja) エポキシ樹脂組成物
JP2024147840A (ja) エポキシ樹脂組成物
KR102187518B1 (ko) 에폭시 수지 조성물
JP7808702B2 (ja) 硬化性組成物、硬化物、及び熱可塑性樹脂
WO2024090259A1 (ja) 樹脂組成物、接着剤、封止材、硬化物、半導体装置及び電子部品

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination