JPWO2025023051A1 - - Google Patents
Info
- Publication number
- JPWO2025023051A1 JPWO2025023051A1 JP2025535729A JP2025535729A JPWO2025023051A1 JP WO2025023051 A1 JPWO2025023051 A1 JP WO2025023051A1 JP 2025535729 A JP2025535729 A JP 2025535729A JP 2025535729 A JP2025535729 A JP 2025535729A JP WO2025023051 A1 JPWO2025023051 A1 JP WO2025023051A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/66—Mercaptans
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023119049 | 2023-07-21 | ||
| PCT/JP2024/025149 WO2025023051A1 (ja) | 2023-07-21 | 2024-07-11 | エポキシ樹脂組成物、接着剤、封止材、硬化物、半導体装置及び電子部品 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2025023051A1 true JPWO2025023051A1 (https=) | 2025-01-30 |
Family
ID=94374962
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025535729A Pending JPWO2025023051A1 (https=) | 2023-07-21 | 2024-07-11 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2025023051A1 (https=) |
| KR (1) | KR20260038862A (https=) |
| CN (1) | CN121399182A (https=) |
| TW (1) | TW202506798A (https=) |
| WO (1) | WO2025023051A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2026048838A1 (ja) * | 2024-08-30 | 2026-03-05 | ナミックス株式会社 | 硬化剤組成物、それが収容された容器、熱硬化性組成物キット、熱硬化性組成物の製造方法、熱硬化性組成物の硬化物、ならびに硬化剤組成物の輸送及び保存方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3367532B2 (ja) | 1992-10-22 | 2003-01-14 | 味の素株式会社 | エポキシ樹脂組成物 |
| JP3367531B2 (ja) | 1992-10-22 | 2003-01-14 | 味の素株式会社 | エポキシ樹脂組成物 |
| JP2012153794A (ja) | 2011-01-26 | 2012-08-16 | Sakai Chem Ind Co Ltd | 樹脂組成物、樹脂硬化物および樹脂成形体 |
| WO2015060440A1 (ja) * | 2013-10-25 | 2015-04-30 | 味の素株式会社 | 耐熱性エポキシ樹脂組成物 |
| CN105473634B (zh) * | 2013-10-25 | 2017-08-04 | 味之素株式会社 | 柔性环氧树脂组合物 |
| JP2020120843A (ja) | 2019-01-30 | 2020-08-13 | 株式会社三洋物産 | 遊技機 |
| CN116218438A (zh) * | 2021-12-02 | 2023-06-06 | 3M创新有限公司 | 单组分环氧粘合剂组合物及其制备方法 |
| JP7723639B2 (ja) * | 2022-05-10 | 2025-08-14 | 四国化成工業株式会社 | チオール化合物及びその用途 |
| JP7236041B2 (ja) | 2022-08-24 | 2023-03-09 | 四国化成ホールディングス株式会社 | 硬化剤及びその用途 |
| CN115386324B (zh) * | 2022-09-21 | 2023-11-17 | 上海仁速新材料有限公司 | 一种环氧胶粘剂及其制备方法和应用 |
| JP2023126883A (ja) | 2023-07-04 | 2023-09-12 | 四国化成工業株式会社 | チオール化合物及びその用途 |
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2024
- 2024-07-11 JP JP2025535729A patent/JPWO2025023051A1/ja active Pending
- 2024-07-11 CN CN202480042250.3A patent/CN121399182A/zh active Pending
- 2024-07-11 TW TW113126053A patent/TW202506798A/zh unknown
- 2024-07-11 WO PCT/JP2024/025149 patent/WO2025023051A1/ja active Pending
- 2024-07-11 KR KR1020257043339A patent/KR20260038862A/ko active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| TW202506798A (zh) | 2025-02-16 |
| CN121399182A (zh) | 2026-01-23 |
| KR20260038862A (ko) | 2026-03-19 |
| WO2025023051A1 (ja) | 2025-01-30 |