CN121285649A - 蒸镀掩模以及电子器件的制造方法 - Google Patents

蒸镀掩模以及电子器件的制造方法

Info

Publication number
CN121285649A
CN121285649A CN202480037864.2A CN202480037864A CN121285649A CN 121285649 A CN121285649 A CN 121285649A CN 202480037864 A CN202480037864 A CN 202480037864A CN 121285649 A CN121285649 A CN 121285649A
Authority
CN
China
Prior art keywords
vapor deposition
substrate
opening
deposition mask
opening width
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202480037864.2A
Other languages
English (en)
Chinese (zh)
Inventor
佐野葵
碓冰数马
道浩之
茂木凉真
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Takahashi Holdings Co ltd
Original Assignee
Takahashi Holdings Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Takahashi Holdings Co ltd filed Critical Takahashi Holdings Co ltd
Publication of CN121285649A publication Critical patent/CN121285649A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/24—Deposition of silicon only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
CN202480037864.2A 2023-08-10 2024-08-08 蒸镀掩模以及电子器件的制造方法 Pending CN121285649A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023-130556 2023-08-10
JP2023130556 2023-08-10
PCT/JP2024/028534 WO2025033511A1 (ja) 2023-08-10 2024-08-08 蒸着マスク及び、電子デバイスの製造方法

Publications (1)

Publication Number Publication Date
CN121285649A true CN121285649A (zh) 2026-01-06

Family

ID=94534445

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202480037864.2A Pending CN121285649A (zh) 2023-08-10 2024-08-08 蒸镀掩模以及电子器件的制造方法

Country Status (4)

Country Link
JP (3) JP7708339B2 (https=)
KR (1) KR20250078513A (https=)
CN (1) CN121285649A (https=)
WO (1) WO2025033511A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20250078513A (ko) * 2023-08-10 2025-06-02 도판 홀딩스 가부시키가이샤 증착 마스크, 및 전자 디바이스의 제조 방법

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008189990A (ja) 2007-02-05 2008-08-21 Seiko Epson Corp 蒸着用マスクおよび蒸着用マスクの製造方法
US9142779B2 (en) * 2013-08-06 2015-09-22 University Of Rochester Patterning of OLED materials
CN108735915B (zh) 2017-04-14 2021-02-09 上海视涯技术有限公司 用于oled蒸镀的荫罩及其制作方法、oled面板的制作方法
JP7432133B2 (ja) 2019-03-25 2024-02-16 大日本印刷株式会社 マスク
JP2022184708A (ja) 2021-05-31 2022-12-13 キヤノン株式会社 蒸着マスク、及び有機電子デバイスの製造方法
US20250122606A1 (en) 2022-01-31 2025-04-17 Dai Nippon Printing Co., Ltd. Vapor deposition mask, framed vapor deposition mask, method of manufacturing vapor deposition mask, method of manufacturing organic device, and method of manufacturing framed vapor deposition mask
KR20250078513A (ko) * 2023-08-10 2025-06-02 도판 홀딩스 가부시키가이샤 증착 마스크, 및 전자 디바이스의 제조 방법

Also Published As

Publication number Publication date
JP2026012862A (ja) 2026-01-27
JP2025129320A (ja) 2025-09-04
KR20250078513A (ko) 2025-06-02
JPWO2025033511A1 (https=) 2025-02-13
WO2025033511A1 (ja) 2025-02-13
JP7708339B2 (ja) 2025-07-15

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