CN1211178C - 减少集成电路焊接机焊接程序误差的系统与方法 - Google Patents

减少集成电路焊接机焊接程序误差的系统与方法 Download PDF

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Publication number
CN1211178C
CN1211178C CNB011172673A CN01117267A CN1211178C CN 1211178 C CN1211178 C CN 1211178C CN B011172673 A CNB011172673 A CN B011172673A CN 01117267 A CN01117267 A CN 01117267A CN 1211178 C CN1211178 C CN 1211178C
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CN
China
Prior art keywords
slave
master
image
alignment
program
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Expired - Lifetime
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CNB011172673A
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English (en)
Chinese (zh)
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CN1323672A (zh
Inventor
S·K·科杜里
D·J·博恩
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Texas Instruments Inc
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Texas Instruments Inc
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Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of CN1323672A publication Critical patent/CN1323672A/zh
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Publication of CN1211178C publication Critical patent/CN1211178C/zh
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Expired - Lifetime legal-status Critical Current

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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/4093—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by part programming, e.g. entry of geometrical information as taken from a technical drawing, combining this with machining and material information to obtain control information, named part programme, for the NC machine
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45026—Circuit board, pcb
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45029—Mount and solder parts on board
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45235—Dispensing adhesive, solder paste, for pcb
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/49—Nc machine tool, till multiple
    • G05B2219/49113—Align elements like hole and drill, centering tool, probe, workpiece
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Image Processing (AREA)
  • Wire Bonding (AREA)
CNB011172673A 2000-05-04 2001-04-30 减少集成电路焊接机焊接程序误差的系统与方法 Expired - Lifetime CN1211178C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US20191000P 2000-05-04 2000-05-04
US60/201,910 2000-05-04

Publications (2)

Publication Number Publication Date
CN1323672A CN1323672A (zh) 2001-11-28
CN1211178C true CN1211178C (zh) 2005-07-20

Family

ID=22747786

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB011172673A Expired - Lifetime CN1211178C (zh) 2000-05-04 2001-04-30 减少集成电路焊接机焊接程序误差的系统与方法

Country Status (5)

Country Link
US (1) US6629013B2 (enExample)
JP (1) JP2002016099A (enExample)
KR (1) KR100786421B1 (enExample)
CN (1) CN1211178C (enExample)
TW (1) TW542989B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7069102B2 (en) * 2000-05-16 2006-06-27 Texas Instruments Incorporated System and method to customize bond programs compensating integrated circuit bonder variability
US7021520B2 (en) * 2001-12-05 2006-04-04 Micron Technology, Inc. Stacked chip connection using stand off stitch bonding
SE0302985D0 (sv) * 2003-11-13 2003-11-13 Mydata Automation Ab A method for generating a jetting program
JP2005223202A (ja) * 2004-02-06 2005-08-18 Seiko Epson Corp 半導体装置の製造方法及びその製造装置
JP4709535B2 (ja) * 2004-11-19 2011-06-22 株式会社東芝 半導体装置の製造装置
KR101133130B1 (ko) * 2006-03-28 2012-04-06 삼성테크윈 주식회사 기준 본드 패드들을 이용한 본딩 좌표 보정 방법
TWI315089B (en) * 2006-10-30 2009-09-21 Advanced Semiconductor Eng Wire-bonding method for wire-bonding apparatus
GB2457676B (en) * 2008-02-21 2012-04-18 Rolls Royce Plc Performing a process on a workpiece
JP5685353B2 (ja) * 2008-02-29 2015-03-18 クリック アンド ソッファ インダストリーズ、インク． ワイヤーボンディング機械上でボンディング位置を教示し、ワイヤーループを検査する方法およびこの方法を実施する機器
TWI567839B (zh) * 2014-08-27 2017-01-21 矽品精密工業股份有限公司 打線構造及銲線形成方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2541489B2 (ja) * 1993-12-06 1996-10-09 日本電気株式会社 ワイヤボンディング装置
JP3101853B2 (ja) * 1994-04-27 2000-10-23 株式会社新川 ボンデイング座標のティーチング方法
JP3106345B2 (ja) * 1995-10-23 2000-11-06 株式会社新川 ワイヤボンディング装置
US6042247A (en) * 1997-07-11 2000-03-28 Texas Instruments Incorporated Efficient hybrid illuminator

Also Published As

Publication number Publication date
KR20010100971A (ko) 2001-11-14
CN1323672A (zh) 2001-11-28
TW542989B (en) 2003-07-21
US6629013B2 (en) 2003-09-30
JP2002016099A (ja) 2002-01-18
US20010044669A1 (en) 2001-11-22
KR100786421B1 (ko) 2007-12-17

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