CN121038955A - 层叠结构体和印刷基板 - Google Patents

层叠结构体和印刷基板

Info

Publication number
CN121038955A
CN121038955A CN202380096736.0A CN202380096736A CN121038955A CN 121038955 A CN121038955 A CN 121038955A CN 202380096736 A CN202380096736 A CN 202380096736A CN 121038955 A CN121038955 A CN 121038955A
Authority
CN
China
Prior art keywords
recess
resin base
base material
metal
metal layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380096736.0A
Other languages
English (en)
Chinese (zh)
Inventor
荒川裕介
难波亮太郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of CN121038955A publication Critical patent/CN121038955A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
CN202380096736.0A 2023-03-31 2023-12-04 层叠结构体和印刷基板 Pending CN121038955A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023058789 2023-03-31
JP2023-058789 2023-03-31
PCT/JP2023/043300 WO2024202254A1 (ja) 2023-03-31 2023-12-04 積層構造体およびプリント基板

Publications (1)

Publication Number Publication Date
CN121038955A true CN121038955A (zh) 2025-11-28

Family

ID=92903883

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380096736.0A Pending CN121038955A (zh) 2023-03-31 2023-12-04 层叠结构体和印刷基板

Country Status (3)

Country Link
JP (1) JPWO2024202254A1 (https=)
CN (1) CN121038955A (https=)
WO (1) WO2024202254A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3037519B2 (ja) * 1992-11-06 2000-04-24 三菱伸銅株式会社 導電性積層フィルムおよびその製造方法
BE1008038A5 (fr) * 1994-01-31 1996-01-03 Lucien Diego Laude Procede de metallisation de matieres plastiques, et produits ainsi obtenus.
JP3929925B2 (ja) * 2003-04-10 2007-06-13 東レエンジニアリング株式会社 金属張り液晶ポリエステル基材の製造方法
JP2006135179A (ja) * 2004-11-08 2006-05-25 Hitachi Maxell Ltd 配線基板用フィルム基材の作製方法及びフレキシブルプリント基板
JP2006351646A (ja) * 2005-06-14 2006-12-28 Tokai Rubber Ind Ltd 回路基板およびその製造方法
JP2008221488A (ja) * 2007-03-08 2008-09-25 Kanto Gakuin Univ Surface Engineering Research Institute 液晶ポリマーフィルム金属張積層板

Also Published As

Publication number Publication date
JPWO2024202254A1 (https=) 2024-10-03
WO2024202254A1 (ja) 2024-10-03

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