JPWO2024202254A1 - - Google Patents
Info
- Publication number
- JPWO2024202254A1 JPWO2024202254A1 JP2025509710A JP2025509710A JPWO2024202254A1 JP WO2024202254 A1 JPWO2024202254 A1 JP WO2024202254A1 JP 2025509710 A JP2025509710 A JP 2025509710A JP 2025509710 A JP2025509710 A JP 2025509710A JP WO2024202254 A1 JPWO2024202254 A1 JP WO2024202254A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023058789 | 2023-03-31 | ||
| PCT/JP2023/043300 WO2024202254A1 (ja) | 2023-03-31 | 2023-12-04 | 積層構造体およびプリント基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024202254A1 true JPWO2024202254A1 (https=) | 2024-10-03 |
| JPWO2024202254A5 JPWO2024202254A5 (https=) | 2025-11-05 |
Family
ID=92903883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025509710A Pending JPWO2024202254A1 (https=) | 2023-03-31 | 2023-12-04 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2024202254A1 (https=) |
| CN (1) | CN121038955A (https=) |
| WO (1) | WO2024202254A1 (https=) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3037519B2 (ja) * | 1992-11-06 | 2000-04-24 | 三菱伸銅株式会社 | 導電性積層フィルムおよびその製造方法 |
| BE1008038A5 (fr) * | 1994-01-31 | 1996-01-03 | Lucien Diego Laude | Procede de metallisation de matieres plastiques, et produits ainsi obtenus. |
| JP3929925B2 (ja) * | 2003-04-10 | 2007-06-13 | 東レエンジニアリング株式会社 | 金属張り液晶ポリエステル基材の製造方法 |
| JP2006135179A (ja) * | 2004-11-08 | 2006-05-25 | Hitachi Maxell Ltd | 配線基板用フィルム基材の作製方法及びフレキシブルプリント基板 |
| JP2006351646A (ja) * | 2005-06-14 | 2006-12-28 | Tokai Rubber Ind Ltd | 回路基板およびその製造方法 |
| JP2008221488A (ja) * | 2007-03-08 | 2008-09-25 | Kanto Gakuin Univ Surface Engineering Research Institute | 液晶ポリマーフィルム金属張積層板 |
-
2023
- 2023-12-04 CN CN202380096736.0A patent/CN121038955A/zh active Pending
- 2023-12-04 WO PCT/JP2023/043300 patent/WO2024202254A1/ja not_active Ceased
- 2023-12-04 JP JP2025509710A patent/JPWO2024202254A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024202254A1 (ja) | 2024-10-03 |
| CN121038955A (zh) | 2025-11-28 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250822 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250822 |