CN120897970A - 粘着片和剥离方法 - Google Patents
粘着片和剥离方法Info
- Publication number
- CN120897970A CN120897970A CN202480023212.3A CN202480023212A CN120897970A CN 120897970 A CN120897970 A CN 120897970A CN 202480023212 A CN202480023212 A CN 202480023212A CN 120897970 A CN120897970 A CN 120897970A
- Authority
- CN
- China
- Prior art keywords
- adhesive sheet
- adhesive layer
- adhesive
- resin
- less
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/308—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive tape or sheet losing adhesive strength when being stretched, e.g. stretch adhesive
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023058461 | 2023-03-31 | ||
| JP2023-058461 | 2023-03-31 | ||
| PCT/JP2024/012979 WO2024204683A1 (ja) | 2023-03-31 | 2024-03-29 | 粘着シート及び剥離方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN120897970A true CN120897970A (zh) | 2025-11-04 |
Family
ID=92905837
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202480023212.3A Pending CN120897970A (zh) | 2023-03-31 | 2024-03-29 | 粘着片和剥离方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7620772B1 (https=) |
| KR (1) | KR20250169216A (https=) |
| CN (1) | CN120897970A (https=) |
| TW (1) | TW202502553A (https=) |
| WO (1) | WO2024204683A1 (https=) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004115766A (ja) | 2002-09-30 | 2004-04-15 | Dainippon Printing Co Ltd | 粘着シート |
| JP4690670B2 (ja) * | 2004-07-09 | 2011-06-01 | 王子タック株式会社 | 両面粘着シートおよびその製造方法 |
| JP2009096816A (ja) * | 2007-10-12 | 2009-05-07 | Lintec Corp | 粘着シート及びその製造方法 |
| KR101694181B1 (ko) * | 2015-04-15 | 2017-01-09 | 신화인터텍 주식회사 | 미세구조화된 표면을 갖는 접합 테이프, 이형라이너 및 접합 테이프의 제조방법 |
| WO2020049728A1 (ja) * | 2018-09-07 | 2020-03-12 | リンテック株式会社 | 剥離ライナー、剥離ライナーの作製方法、粘着シート、および粘着シートの作製方法 |
| JP7250468B6 (ja) * | 2018-10-12 | 2023-04-25 | 三井化学株式会社 | 電子装置の製造方法および粘着性フィルム |
| JP7817420B2 (ja) * | 2022-09-22 | 2026-02-18 | リンテック株式会社 | 粘着シート、および電子部品または半導体装置の製造方法 |
-
2024
- 2024-03-29 TW TW113112007A patent/TW202502553A/zh unknown
- 2024-03-29 WO PCT/JP2024/012979 patent/WO2024204683A1/ja not_active Ceased
- 2024-03-29 CN CN202480023212.3A patent/CN120897970A/zh active Pending
- 2024-03-29 JP JP2024569173A patent/JP7620772B1/ja active Active
- 2024-03-29 KR KR1020257034779A patent/KR20250169216A/ko active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| TW202502553A (zh) | 2025-01-16 |
| KR20250169216A (ko) | 2025-12-02 |
| JPWO2024204683A1 (https=) | 2024-10-03 |
| JP7620772B1 (ja) | 2025-01-23 |
| WO2024204683A1 (ja) | 2024-10-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI432547B (zh) | Crystallization - Dependent Belt and Semiconductor Wafer Manufacturing Method | |
| CN104303271B (zh) | 切割片 | |
| TWI657550B (zh) | Extensible sheet and method for manufacturing laminated wafer | |
| JP2011176327A (ja) | 半導体チップの製造方法 | |
| CN113165136B (zh) | 用于磨削背面的胶粘片及半导体晶片的制造方法 | |
| JP2011224853A (ja) | フィルム及び粘接着シート | |
| CN104508801B (zh) | 切割片及装置晶片的制造方法 | |
| CN119855880A (zh) | 粘合片 | |
| CN107236473A (zh) | 玻璃切割用粘着片材及其制造方法 | |
| US20250215276A1 (en) | Adhesive sheet and method for manufacturing electronic component or semiconductor device | |
| CN101669194A (zh) | 切片及芯片接合带和半导体芯片的制造方法 | |
| JP2009239190A (ja) | ダイシング・ダイボンディングテープ | |
| CN120897970A (zh) | 粘着片和剥离方法 | |
| JP5486829B2 (ja) | ダイシングテープ及びその製造方法、並びに半導体チップの製造方法 | |
| CN107236475A (zh) | 玻璃切割用粘着片材及其制造方法 | |
| JP2009295864A (ja) | 基材フィルムの製造方法及びダイシング・ダイボンディングテープ | |
| JPWO2015046069A1 (ja) | ダイシング−ダイボンディングテープ及び粘接着剤層付き半導体チップの製造方法 | |
| WO2026088902A1 (ja) | 電子部品貼付用粘着シート | |
| JP2012191061A (ja) | ダイシング−ダイボンディングテープ及び粘接着剤層付き半導体チップの製造方法 | |
| WO2026088901A1 (ja) | 電子部品製造方法及び電子部品加工装置 | |
| CN121909773A (zh) | 粘合片材和物体的处理方法 | |
| JP2013065625A (ja) | ダイシング−ダイボンディングテープ、粘接着剤層付き半導体チップの作製キット及び粘接着剤層付き半導体チップの製造方法 | |
| JP2014060201A (ja) | ダイシング−ダイボンディングテープ及び粘接着剤層付き半導体チップの製造方法 | |
| CN121925987A (zh) | 粘合片材和物体的处理方法 | |
| CN121909772A (zh) | 粘合片材和物体的处理方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |