CN120897970A - 粘着片和剥离方法 - Google Patents

粘着片和剥离方法

Info

Publication number
CN120897970A
CN120897970A CN202480023212.3A CN202480023212A CN120897970A CN 120897970 A CN120897970 A CN 120897970A CN 202480023212 A CN202480023212 A CN 202480023212A CN 120897970 A CN120897970 A CN 120897970A
Authority
CN
China
Prior art keywords
adhesive sheet
adhesive layer
adhesive
resin
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202480023212.3A
Other languages
English (en)
Chinese (zh)
Inventor
大西乡
西岛健太
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of CN120897970A publication Critical patent/CN120897970A/zh
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00Adhesives based on unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/20Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/308Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive tape or sheet losing adhesive strength when being stretched, e.g. stretch adhesive

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
CN202480023212.3A 2023-03-31 2024-03-29 粘着片和剥离方法 Pending CN120897970A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023058461 2023-03-31
JP2023-058461 2023-03-31
PCT/JP2024/012979 WO2024204683A1 (ja) 2023-03-31 2024-03-29 粘着シート及び剥離方法

Publications (1)

Publication Number Publication Date
CN120897970A true CN120897970A (zh) 2025-11-04

Family

ID=92905837

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202480023212.3A Pending CN120897970A (zh) 2023-03-31 2024-03-29 粘着片和剥离方法

Country Status (5)

Country Link
JP (1) JP7620772B1 (https=)
KR (1) KR20250169216A (https=)
CN (1) CN120897970A (https=)
TW (1) TW202502553A (https=)
WO (1) WO2024204683A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004115766A (ja) 2002-09-30 2004-04-15 Dainippon Printing Co Ltd 粘着シート
JP4690670B2 (ja) * 2004-07-09 2011-06-01 王子タック株式会社 両面粘着シートおよびその製造方法
JP2009096816A (ja) * 2007-10-12 2009-05-07 Lintec Corp 粘着シート及びその製造方法
KR101694181B1 (ko) * 2015-04-15 2017-01-09 신화인터텍 주식회사 미세구조화된 표면을 갖는 접합 테이프, 이형라이너 및 접합 테이프의 제조방법
WO2020049728A1 (ja) * 2018-09-07 2020-03-12 リンテック株式会社 剥離ライナー、剥離ライナーの作製方法、粘着シート、および粘着シートの作製方法
JP7250468B6 (ja) * 2018-10-12 2023-04-25 三井化学株式会社 電子装置の製造方法および粘着性フィルム
JP7817420B2 (ja) * 2022-09-22 2026-02-18 リンテック株式会社 粘着シート、および電子部品または半導体装置の製造方法

Also Published As

Publication number Publication date
TW202502553A (zh) 2025-01-16
KR20250169216A (ko) 2025-12-02
JPWO2024204683A1 (https=) 2024-10-03
JP7620772B1 (ja) 2025-01-23
WO2024204683A1 (ja) 2024-10-03

Similar Documents

Publication Publication Date Title
TWI432547B (zh) Crystallization - Dependent Belt and Semiconductor Wafer Manufacturing Method
CN104303271B (zh) 切割片
TWI657550B (zh) Extensible sheet and method for manufacturing laminated wafer
JP2011176327A (ja) 半導体チップの製造方法
CN113165136B (zh) 用于磨削背面的胶粘片及半导体晶片的制造方法
JP2011224853A (ja) フィルム及び粘接着シート
CN104508801B (zh) 切割片及装置晶片的制造方法
CN119855880A (zh) 粘合片
CN107236473A (zh) 玻璃切割用粘着片材及其制造方法
US20250215276A1 (en) Adhesive sheet and method for manufacturing electronic component or semiconductor device
CN101669194A (zh) 切片及芯片接合带和半导体芯片的制造方法
JP2009239190A (ja) ダイシング・ダイボンディングテープ
CN120897970A (zh) 粘着片和剥离方法
JP5486829B2 (ja) ダイシングテープ及びその製造方法、並びに半導体チップの製造方法
CN107236475A (zh) 玻璃切割用粘着片材及其制造方法
JP2009295864A (ja) 基材フィルムの製造方法及びダイシング・ダイボンディングテープ
JPWO2015046069A1 (ja) ダイシング−ダイボンディングテープ及び粘接着剤層付き半導体チップの製造方法
WO2026088902A1 (ja) 電子部品貼付用粘着シート
JP2012191061A (ja) ダイシング−ダイボンディングテープ及び粘接着剤層付き半導体チップの製造方法
WO2026088901A1 (ja) 電子部品製造方法及び電子部品加工装置
CN121909773A (zh) 粘合片材和物体的处理方法
JP2013065625A (ja) ダイシング−ダイボンディングテープ、粘接着剤層付き半導体チップの作製キット及び粘接着剤層付き半導体チップの製造方法
JP2014060201A (ja) ダイシング−ダイボンディングテープ及び粘接着剤層付き半導体チップの製造方法
CN121925987A (zh) 粘合片材和物体的处理方法
CN121909772A (zh) 粘合片材和物体的处理方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination