TW202502553A - 黏著片及剝離方法 - Google Patents
黏著片及剝離方法 Download PDFInfo
- Publication number
- TW202502553A TW202502553A TW113112007A TW113112007A TW202502553A TW 202502553 A TW202502553 A TW 202502553A TW 113112007 A TW113112007 A TW 113112007A TW 113112007 A TW113112007 A TW 113112007A TW 202502553 A TW202502553 A TW 202502553A
- Authority
- TW
- Taiwan
- Prior art keywords
- adhesive sheet
- adhesive layer
- adhesive
- resin
- less
- Prior art date
Links
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/308—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive tape or sheet losing adhesive strength when being stretched, e.g. stretch adhesive
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023058461 | 2023-03-31 | ||
| JP2023-058461 | 2023-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202502553A true TW202502553A (zh) | 2025-01-16 |
Family
ID=92905837
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW113112007A TW202502553A (zh) | 2023-03-31 | 2024-03-29 | 黏著片及剝離方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7620772B1 (https=) |
| KR (1) | KR20250169216A (https=) |
| CN (1) | CN120897970A (https=) |
| TW (1) | TW202502553A (https=) |
| WO (1) | WO2024204683A1 (https=) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004115766A (ja) | 2002-09-30 | 2004-04-15 | Dainippon Printing Co Ltd | 粘着シート |
| JP4690670B2 (ja) * | 2004-07-09 | 2011-06-01 | 王子タック株式会社 | 両面粘着シートおよびその製造方法 |
| JP2009096816A (ja) * | 2007-10-12 | 2009-05-07 | Lintec Corp | 粘着シート及びその製造方法 |
| KR101694181B1 (ko) * | 2015-04-15 | 2017-01-09 | 신화인터텍 주식회사 | 미세구조화된 표면을 갖는 접합 테이프, 이형라이너 및 접합 테이프의 제조방법 |
| WO2020049728A1 (ja) * | 2018-09-07 | 2020-03-12 | リンテック株式会社 | 剥離ライナー、剥離ライナーの作製方法、粘着シート、および粘着シートの作製方法 |
| JP7250468B6 (ja) * | 2018-10-12 | 2023-04-25 | 三井化学株式会社 | 電子装置の製造方法および粘着性フィルム |
| JP7817420B2 (ja) * | 2022-09-22 | 2026-02-18 | リンテック株式会社 | 粘着シート、および電子部品または半導体装置の製造方法 |
-
2024
- 2024-03-29 TW TW113112007A patent/TW202502553A/zh unknown
- 2024-03-29 WO PCT/JP2024/012979 patent/WO2024204683A1/ja not_active Ceased
- 2024-03-29 CN CN202480023212.3A patent/CN120897970A/zh active Pending
- 2024-03-29 JP JP2024569173A patent/JP7620772B1/ja active Active
- 2024-03-29 KR KR1020257034779A patent/KR20250169216A/ko active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| KR20250169216A (ko) | 2025-12-02 |
| JPWO2024204683A1 (https=) | 2024-10-03 |
| JP7620772B1 (ja) | 2025-01-23 |
| CN120897970A (zh) | 2025-11-04 |
| WO2024204683A1 (ja) | 2024-10-03 |
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