CN120435940A - 薄膜压电器件 - Google Patents
薄膜压电器件Info
- Publication number
- CN120435940A CN120435940A CN202480006259.9A CN202480006259A CN120435940A CN 120435940 A CN120435940 A CN 120435940A CN 202480006259 A CN202480006259 A CN 202480006259A CN 120435940 A CN120435940 A CN 120435940A
- Authority
- CN
- China
- Prior art keywords
- film
- piezoelectric
- electrode layer
- substrate
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
- H10N30/2047—Membrane type
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02015—Characteristics of piezoelectric layers, e.g. cutting angles
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
- H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
- H03H9/174—Membranes
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
- H03H9/56—Monolithic crystal filters
- H03H9/564—Monolithic crystal filters implemented with thin-film techniques
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
- H10N30/2041—Beam type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
- H10N30/2041—Beam type
- H10N30/2042—Cantilevers, i.e. having one fixed end
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
- H10N30/706—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings characterised by the underlying bases, e.g. substrates
- H10N30/708—Intermediate layers, e.g. barrier, adhesion or growth control buffer layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
- H10N30/8536—Alkaline earth metal based oxides, e.g. barium titanates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
- H10N30/8542—Alkali metal based oxides, e.g. lithium, sodium or potassium niobates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
- H10N30/8548—Lead-based oxides
- H10N30/8554—Lead-zirconium titanate [PZT] based
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H2003/023—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks the resonators or networks being of the membrane type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
- H10N30/076—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by vapour phase deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
- H10N30/077—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition
- H10N30/078—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition by sol-gel deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
- H10N30/079—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing using intermediate layers, e.g. for growth control
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023-137419 | 2023-08-25 | ||
| JP2023137419 | 2023-08-25 | ||
| PCT/JP2024/030191 WO2025047653A1 (ja) | 2023-08-25 | 2024-08-26 | 薄膜圧電デバイス |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN120435940A true CN120435940A (zh) | 2025-08-05 |
Family
ID=94819097
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202480006259.9A Pending CN120435940A (zh) | 2023-08-25 | 2024-08-26 | 薄膜压电器件 |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP4626210A1 (https=) |
| JP (1) | JP7713272B1 (https=) |
| CN (1) | CN120435940A (https=) |
| WO (1) | WO2025047653A1 (https=) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4327942B2 (ja) | 1999-05-20 | 2009-09-09 | Tdk株式会社 | 薄膜圧電素子 |
| JP5300184B2 (ja) * | 2006-07-18 | 2013-09-25 | キヤノン株式会社 | 圧電体、圧電体素子、圧電体素子を用いた液体吐出ヘッド及び液体吐出装置 |
| JP2013115534A (ja) | 2011-11-28 | 2013-06-10 | Seiko Epson Corp | 単結晶ウェハーの製造方法、単結晶ウェハー、振動素子、及び圧電デバイス |
| WO2013164955A1 (ja) * | 2012-05-01 | 2013-11-07 | コニカミノルタ株式会社 | 圧電素子 |
| JP6498821B1 (ja) * | 2018-06-13 | 2019-04-10 | アドバンストマテリアルテクノロジーズ株式会社 | 膜構造体及びその製造方法 |
| JP7415426B2 (ja) * | 2019-10-16 | 2024-01-17 | Tdk株式会社 | 電子デバイス用素子 |
-
2024
- 2024-08-26 CN CN202480006259.9A patent/CN120435940A/zh active Pending
- 2024-08-26 WO PCT/JP2024/030191 patent/WO2025047653A1/ja active Pending
- 2024-08-26 JP JP2024563284A patent/JP7713272B1/ja active Active
- 2024-08-26 EP EP24859686.8A patent/EP4626210A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2025047653A1 (https=) | 2025-03-06 |
| JP7713272B1 (ja) | 2025-07-25 |
| WO2025047653A1 (ja) | 2025-03-06 |
| EP4626210A1 (en) | 2025-10-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101490316B (zh) | 压电物质、压电元件及使用压电元件的液体排出头和液体排出设备 | |
| CN113574690B (zh) | 膜结构体、压电体膜及超导体膜 | |
| JP5041765B2 (ja) | エピタキシャル酸化物膜、圧電膜、圧電膜素子、圧電膜素子を用いた液体吐出ヘッド及び液体吐出装置 | |
| US10608162B2 (en) | Stacked film, electronic device substrate, electronic device, and method of fabricating stacked film | |
| JP5024399B2 (ja) | 圧電薄膜素子、圧電薄膜デバイス及び圧電薄膜素子の製造方法 | |
| Niu et al. | Integration-friendly, chemically stoichiometric BiFeO3 films with a piezoelectric performance challenging that of PZT | |
| US20080012908A1 (en) | Piezoelectric element, manufacturing method for piezoelectric body, and liquid jet head | |
| JP6313188B2 (ja) | 圧電素子の製造方法、圧電素子 | |
| JP5241087B2 (ja) | 圧電体、圧電素子、圧電素子を用いた液体吐出ヘッド、液体吐出装置及び圧電素子の製造方法 | |
| JP5398131B2 (ja) | 圧電体素子、圧電体の製造方法及び液体噴射ヘッド | |
| JP2009094139A (ja) | 圧電アクチュエータ及びそれを用いた液体吐出ヘッド | |
| JP5241086B2 (ja) | 圧電体、圧電素子、圧電素子を用いた液体吐出ヘッドおよび液体吐出装置 | |
| JP7713272B1 (ja) | 薄膜圧電デバイス | |
| US20230309409A1 (en) | Piezoelectric element and mems mirror | |
| US10211043B2 (en) | Stacked film, electronic device substrate, electronic device, and method of fabricating stacked film | |
| JP2007112069A (ja) | 液体吐出ヘッド | |
| JP5131674B2 (ja) | 圧電体とその製造方法、圧電素子とそれを用いた液体吐出ヘッド及び液体吐出装置 | |
| US20240180043A1 (en) | Heterojunction semiconductor flexible substrate, manufactring method thereof, and electronic device using the same | |
| TWI914558B (zh) | 複合基板、壓電元件及複合基板之製造方法 | |
| US20250268107A1 (en) | Composite substrate | |
| CN121176190A (zh) | 层叠构造体及其使用和制造装置 | |
| JP2026013260A (ja) | 積層構造体及び電子デバイス | |
| WO2018042946A1 (ja) | 圧電体膜及びそれを備えた圧電素子 | |
| CN121176191A (zh) | 层叠构造体及其使用和制造装置 | |
| WO2011099231A1 (ja) | 圧電薄膜素子、圧電薄膜デバイス及び圧電薄膜素子の製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |